SEL6210SB [SANKEN]

Optoelectronic Device;
SEL6210SB
型号: SEL6210SB
厂家: SANKEN ELECTRIC    SANKEN ELECTRIC
描述:

Optoelectronic Device

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中文:  中文翻译
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Round-type contact mount LEDs (for automatic insertion)  
SEL6010 series (Standard type)  
SEL6014 series (Wide viewing angle)  
SEL6210R  
Outline drawing A  
SEL6414E  
Outline drawing B  
4.5±0.5  
3.5 1.0min  
Cathode  
23.0min  
(1.7)  
5.5±0.5  
3.5 1.0min  
Cathode  
23.0min  
(1.6)  
3.5±0.1  
2.5±0.1  
0.4±0.1  
Resin heap  
0.8max  
0.4±0.1  
Resin heap  
0.8max  
SEL6015 series (Narrow viewing angle)  
Absolute maximum ratings (Ta=25°C)  
SEL6915A  
Outline drawing C  
Symbol  
IF  
Unit  
mA  
mA  
V
Ratings  
30  
100  
3.5 1.0min  
Cathode  
23.0min  
IFP  
(1.7)  
3.5±0.1  
Resin burr  
0.3max  
VR  
3
Top  
Tstg  
°C  
–30 to +85  
°C  
–30 to +100  
0.4±0.1  
Resin heap  
0.8max  
SEL6000 series LEDs pack-  
aged on tapes can withstand  
shocks caused by insertion ma-  
chines; Thus, they can be con-  
tact-mounted automatically on  
circuit boards.  
Recommended dimensions of  
insertion holes on printed cir-  
cuit boards  
Cathode mark  
ø
0.9 1.0  
External dimensions: Unit: mm Tolerance: ±0.3  
2.54mm  
Viewing angle  
SEL6010 series  
SEL6014 series  
SEL6015 series  
0°  
0°  
0°  
30°  
30°  
30°  
30°  
30°  
30°  
60°  
60°  
60°  
60°  
60°  
60°  
90°  
100%  
90°  
100%  
90°  
100%  
90°  
100%  
90°  
100%  
90°  
100%  
50  
0
50  
50  
0
50  
50  
0
50  
Viewing angle of a non-diffused lens  
Viewing angle of a non-diffused lens  
Viewing angle of a non-diffused lens  
0°  
30°  
30°  
60°  
60°  
90°  
100%  
90°  
100%  
50  
0
50  
Viewing angle of a diffused lens  
18  
Electro-optical characteristics (Ta=25°C)  
Display  
form  
Emitting  
color  
Outline  
VF  
(V)  
IR  
IV  
λp  
(nm) typ  
∆λ  
Type of lens  
Type No.  
(µA)  
(mcd)  
Condition  
IF  
Condition  
VR  
Condition  
IF  
drawing  
(ø: mm)  
typ  
1.9  
max  
max  
typ  
12  
25  
15  
45  
5
(mA)  
(V)  
(mA)  
3.1  
3.1  
3.1  
3.1  
3.1  
3.1  
3.1  
3.1  
3.1  
3.1  
3.1  
3.1  
3.5  
3.5  
3.5  
3.5  
3.5  
3.1  
3.1  
3.1  
3.1  
3.1  
Red tinted, diffused  
Red tinted, non-diffused  
Green tinted, diffused  
SEL6210R  
SEL6210S  
SEL6410G  
SEL6410E  
SEL6510G  
SEL6510C  
SEL6710Y  
SEL6710K  
SEL6810D  
SEL6810A  
SEL6910D  
SEL6910A  
SEL6214S  
SEL6414E  
SEL6514C  
SEL6814A  
SEL6914A  
SEL6215S  
SEL6415E  
SEL6515C  
SEL6815A  
SEL6915A  
630  
35  
High intensity red  
Green  
20  
10  
560  
555  
570  
610  
587  
Green tinted, non-diffused  
Green tinted, diffused  
20  
Pure green 2.0  
Yellow  
Un-tinted, non-diffused  
Yellow tinted, diffused  
16  
5
A
2.5  
10  
50  
3
40  
35  
Yellow tinted, non-diffused  
Orange tinted, diffused  
Orange tinted, non-diffused  
Orange tinted, diffused  
Orange tinted, non-diffused  
Red tinted, non-diffused  
Green tinted, non-diffused  
Un-tinted, non-diffused  
Orange tinted, non-diffused  
Orange tinted, non-diffused  
Red tinted, non-diffused  
Green tinted, non-diffused  
Un-tinted, non-diffused  
Orange tinted, non-diffused  
Orange tinted, non-diffused  
15  
4
Amber  
1.9  
10  
6.5  
14  
10  
12  
6
33  
35  
20  
Orange  
630  
560  
555  
610  
587  
630  
560  
555  
610  
587  
High intensity red 1.9  
20  
10  
Green  
2.0  
Pure green  
2.5  
2.5  
10  
10  
50  
50  
3
3
B
C
5
35  
33  
35  
Amber  
1.9  
5
Orange  
30  
50  
18  
30  
40  
High intensity red 1.9  
Green  
2.0  
20  
Pure green  
20  
Amber  
1.9  
35  
33  
Orange  
Using contact mount LEDs packaged on tapes  
1. Printed circuit board  
2. Insertion conditions  
3. Soldering conditions  
One-side printed circuit board is recommended.  
If there are several SMD parts on the same printed circuit board, insert the LEDs after the adhesive for  
other SMD parts hardened.  
Use low insertion pusher pressure, as much as possible.  
Cut and clinch: Panasert T pattern is recommended.  
For N pattern, make the clinching angle of the LED’s anode as small as possible.  
Preheating must be less than 90°C (temperature on printed circuit board’s bottom surface) for no more  
than two minutes  
Solder dipping must be made at a temperature of 250°C for no more than 3 seconds.  
19  

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