SI-3000LU_11 [SANKEN]
Surface-Mount, Low Current Consumption, Low Dropout Voltage; 表面贴装，低消耗电流，低压差
| 型号： | SI-3000LU_11 |
| 厂家： | 
SANKEN ELECTRIC |
| 描述： | Surface-Mount, Low Current Consumption, Low Dropout Voltage |
| 文件： | 总2页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1-1-4 Linear Regulator ICs
SI-3000LU Series Surface-Mount, Low Current Consumption, Low Dropout Voltage
■Features
■Absolute Maximum Ratings
(Ta=25°C)
• Compact surface-mount package (SOT89-5)
Parameter
Symbol
Ratings
18
Unit
V
DC Input Voltage
VIN
• Output current: 250 mA
Output control terminal voltage
DC Output Current
VC
VIN
V
• Low current consumption lq (OFF) ≤ 1µA (VC =
IO
250
mA
W
0 V)
*1
Power Dissipation
PD
0.75
*2
Junction Temperature
Tj
–40 to +135
–40 to +125
146
°C
• Low dropout voltage: VDIF ≤ 0.5 V (at IO = 250
*2
Storage Temperature
Tstg
°C
mA)
*1
Thermal Resistance (Junction to Ambient Air)
θ j-a
°C/W
• Output voltage range (1.5V to 15V)
*1: When mounted on glass-epoxy board 40 × 40 mm (copper laminate area 2%).
*2: Thermal protection circuits may operate if the junction temperature exceeds 135°C.
• Built-in drooping-type-overcurrent and thermal
protection circuits
■Applications
• Auxiliary power supplies for PC
• Battery-driven electronic equipment
■Recommended Operating Conditions
Ratings
Parameter
Symbol
Unit
min.
*2, *3
max.
VO+2*1
250
Input Voltage
VIN
IO
V
DC Output Current
0
mA
°C
Operating Ambient Temperature
Top
–20
85
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO.
Calculate these values referring to the reference data on page 67.
*2: Refer to the Dropout Voltage parameter.
*3: For the SI-3012LU, set the input voltage to Vin ≥ 2.4 V, and secure the minimum voltage as explained in "Setting DC Input Voltage" section in Linear Regulator Application Note.
■Electrical Characteristics
(Ta=25°C, VC=2V, unless otherwise specified)
Ratings
Parameter
Symbol
SI-3012LU(Variable)
Unit
V
min.
typ.
max.
VADJ
1.210
1.250
1.290
Reference Voltage
Conditions
VIN=VO+1V, IO =10mA
V
DIF
0.3
0.5
10
Conditions
I
I
O
O
=100mA(V
O
=3.3V)
=3.3V)
Dropout Voltage
V
Conditions
=250mA(V
O
∆VLINE
Line Regulation
Load Regulation
V
IN=V
=10mA( VO
O
+1 to V
O
+5V,
mV
mV
Conditions
∆VLOAD
I
O
=3.3V)
20
V
IN=VO +1V,
Conditions
IO
=1 to 250mA( V
O=3.3V)
Temperature Coefficient of
Reference Voltage
∆V
O/∆Ta
0.3
mV/°C
Tj=0 to 100°C
Conditions
RREJ
55
Ripple Rejection
dB
V
IN=V
O
+1V,
O
Conditions
f=100 to 120H
Z( V =3.3V)
I
q
150
1
Quiescent Circuit
Current
µA
V
V
IN=V
O+1V, IO=0mA
Conditions
C=2V, R2=100kΩ
I
q
(OFF)
Circuit Current at Output OFF
µA
mA
V
Conditions
V
IN=VO+1V,VC=0V
Overcurrent Protection
Starting Current*1
I
S1
260
2.0
Conditions
, IH
VIN=VO +1V
Control Voltage (Output ON)*2
Control Voltage (Output OFF)*2
VC
V
C
, IL
0.8
40
V
C
I
C
, IH
Control Current (Output ON)
Control Current (Output OFF)
µA
µA
Terminal
Conditions
, IL
Conditions
VC=2V
0
I
C
–5
V
C=0V
*1: Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = 3.3 V, and IO = 10 mA.
*2: Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
ICs
66
SI-3000LU Series
■External Dimensions (SOT89-5)
(Unit : mm)
4.5±0.05
1.6±0.05
0.4±0.03
Pin Assignment
q ADJ
w GND
e VC
4.2±0.05
t
4.2±0.05
4.2±0.05
r
0.1±0.05
φ
r VIN
t VO
4.7±0.05
4.2±0.05
4.2±0.05
Plastic Mold Package Type
Flammability: UL94V-0
q
w
e
Product Mass: Approx. 0.05g
1.5±0.05
1.5±0.05
■Block Diagram
SI-3012LU
V
IN
VO
4
3
5
1
V
C
ADJ
TSD
+
–
2
GND
REF
■Typical Connection Diagram
SI-3012LU
CO: Output capacitor (10 µF or larger)
VIN
VO
For SI-3000LU series, Co has to be a low ESR capacitor such as a
ceramic capacitor.
4
3
5
1
R
1
2
CIN
+
CIN: Input capacitor (10 µF approx.)
A
DJ
Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V)
2
•
VIN
R
GND
R1 and R2: Resistors for output setting
The output voltage can be set by connecting R1 and R2 as shown in the
diagram on the left.
VC
R2: 100 kΩ is recommended
R1=(VO–VADJ)/(VADJ/R2)
■Reference Data
Copper Laminate Area vs Power Dissipation
Tj=100°C PCB size 40×40
• A monolithic ICs mounts an inner frame stage that is connected to the GND
pin (pin 2). Therefore, enlarging the copper laminate area connected to the
GND pin improves heat radiation effect.
1
Ta=25°C
0.9
Ta=40°C
Ta=60°C
0.8
• Obtaining the junction temperature
Ta=85°C
0.7
Measure the temperature TC at the lead part of the GND pin (pin 2) with a
thermocouple, etc. Then, substitute this value in the following formula to
obtain the junction temperature.
0.6
0.5
0.4
0.3
0.2
0.1
0
Case temperature Tc
measurement point
Tj=PD×θj–c+Tc (θj–c=5°C/W)
10
100
1000
Copper Laminate Area (mm2)
ICs
67
相关型号：
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5-Terminal, Multi-Function, Full-Mold, Low Dropout Voltage Dropper Type with Reset Function
SANKEN
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