STR6A163HZ [SANKEN]
Off-Line PWM Controllers with Integrated Power MOSFET;
| 型号： | STR6A163HZ |
| 厂家： | 
SANKEN ELECTRIC |
| 描述： | Off-Line PWM Controllers with Integrated Power MOSFET |
| 文件： | 总25页 (文件大小：708K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Off-Line PWM Controllers with Integrated Power MOSFET
STR6A100HZ Series
Data Sheet
Description
Package
The STR6A100HZ series are power ICs for switching
power supplies, incorporating a MOSFET and a current
mode PWM controller IC.
DIP8
The operation mode is automatically changed, in
response to load, to the fixed switching frequency, to the
switching frequency control, and to the burst oscillation
mode. Thus the power efficiency is improved.
The product achieves high cost-performance power
supply systems with few external components.
Not to Scale.
STR6A100HZ Series
Features
Electrical Characteristics
fOSC(AVG) = 100 kHz
● Improving circuit efficiency (Since the step drive
control can keep VRM of secondary rectification
diodes low, the circuit efficiency can be improved by
low VF)
● Current Mode Type PWM Control
● Brown-In and Brown-Out Function
● No Load Power Consumption, PIN < 25mW
● Automatically changed operation mode in response to
load conditions
- Fixed switching frequency mode, 100 kHz (typ.) in
normal opetation.
- Green mode, 25 kHz (typ.) to 100 kHz (typ.) in
middle to light load.
MOSFET
RDS(ON)(max.)
6.0 Ω
Products
VDSS(min.)
STR6A169HZ
STR6A161HZ
STR6A163HZ
700 V
3.95 Ω
2.3 Ω
Output Power, POUT
*
Adapter
Open frame
Products
AC85
~265V
AC85
~265V
AC230V
AC230V
STR6A169HZ
STR6A161HZ
STR6A163HZ
17 W
20.5 W
25 W
11 W
15 W
20 W
30 W
35 W
40 W
19.5 W
23.5 W
28 W
- Burst oscillation mode in light loat.
● Random Switching Function
● Slope Compensation Function
● Leading Edge Blanking Function
● Bias Assist Function
* The output power is actual continues power that is measured at
50 °C ambient. The peak output power can be 120 to 140 % of the
value stated here. Core size, ON Duty, and thermal design affect the
output power. It may be less than the value stated here.
● Protections
- Two Types of Overcurrent Protection (OCP):
Pulse-by-Pulse, built-in compensation circuit to
minimize OCP point variation on AC input voltage
- Overload Protection with timer (OLP): Ato restart
- Overvoltage Protection (OVP): Latch shutdown
- Thermal Shutdown (TSD): Latch shutdown
Application
● White goods
● Office Automation Equipment
● Audio Visual Equipment
● Industrial Equipment
Typical Application
● Other Switched Mode Power Supplies
BR1
D51
VAC
T1
P
RA
RB
C1
U1
ROCP
C51
1
8
7
S/OCP
BR
D/ST
D/ST
S
C4
2
3
4
RC
GND
C3
D2
5
VCC
FB/OLP
STR6A100HZ
D
C2
PC1
CY
TC_STR6A100xZ_1_R1
STR6A100HZ-DSJ Rev.1.0
Mar. 25, 2016
SANKEN ELECTRIC CO.,LTD.
http://www.sanken-ele.co.jp/en/
1
© SANKEN ELECTRIC CO.,LTD. 2014
STR6A100HZ Series
CONTENTS
Description ------------------------------------------------------------------------------------------------------1
1. Absolute Maximum Ratings-----------------------------------------------------------------------------3
2. Electrical Characteristics --------------------------------------------------------------------------------4
3. Performance Curves --------------------------------------------------------------------------------------5
3.1. Derating Curves -------------------------------------------------------------------------------------5
3.2. MOSFET Safe Operating Area Curves---------------------------------------------------------6
3.3. Ambient Temperature versus Power Dissipation Curve ------------------------------------6
3.4. Transient Thermal Resistance Curves ----------------------------------------------------------7
4. Block Diagram ---------------------------------------------------------------------------------------------8
5. Pin Configuration Definitions---------------------------------------------------------------------------8
6. Typical Application ---------------------------------------------------------------------------------------9
7. External Dimensions------------------------------------------------------------------------------------ 10
8. Marking Diagram --------------------------------------------------------------------------------------- 10
9. Operational Description ------------------------------------------------------------------------------- 11
9.1. Startup Operation--------------------------------------------------------------------------------- 11
9.1.1. Without Brown-In / Brown-Out Function -------------------------------------------- 11
9.1.2. With Brown-In / Brown-Out Function-------------------------------------------------- 11
9.2. Undervoltage Lockout (UVLO) ---------------------------------------------------------------- 12
9.3. Bias Assist Function------------------------------------------------------------------------------- 12
9.4. Soft Start Function-------------------------------------------------------------------------------- 12
9.5. Constant Output Voltage Control-------------------------------------------------------------- 13
9.6. Leading Edge Blanking Function -------------------------------------------------------------- 14
9.7. Random Switching Function -------------------------------------------------------------------- 14
9.8. Step Drive Control -------------------------------------------------------------------------------- 14
9.9. Operation Mode ----------------------------------------------------------------------------------- 14
9.10. Brown-In and Brown-Out Function----------------------------------------------------------- 15
9.10.1. DC Line Detection--------------------------------------------------------------------------- 15
9.10.2. AC Line Detection--------------------------------------------------------------------------- 16
9.11. Overcurrent Protection (OCP) ----------------------------------------------------------------- 16
9.11.1. Overcurrent Protection Operation------------------------------------------------------- 16
9.11.2. Input Compensation Function ------------------------------------------------------------ 17
9.12. Overload Protection (OLP)---------------------------------------------------------------------- 17
9.13. Overvoltage Protection (OVP)------------------------------------------------------------------ 18
9.14. Thermal Shutdown (TSD) ----------------------------------------------------------------------- 18
10. Design Notes---------------------------------------------------------------------------------------------- 18
10.1. External Components ---------------------------------------------------------------------------- 18
10.1.1. Input and Output Electrolytic Capacitor----------------------------------------------- 19
10.1.2. S/OCP Pin Peripheral Circuit ------------------------------------------------------------ 19
10.1.3. BR Pin peripheral circuit ------------------------------------------------------------------ 19
10.1.4. FB/OLP Pin Peripheral Circuit ---------------------------------------------------------- 19
10.1.5. VCC Pin Peripheral Circuit--------------------------------------------------------------- 19
10.1.6. Snubber Circuit------------------------------------------------------------------------------ 19
10.1.7. Phase Compensation------------------------------------------------------------------------ 19
10.1.8. Transformer---------------------------------------------------------------------------------- 20
10.2. PCB Trace Layout and Component Placement --------------------------------------------- 20
11. Pattern Layout Example------------------------------------------------------------------------------- 22
12. Reference Design of Power Supply ------------------------------------------------------------------ 23
IMPORTANT NOTES ------------------------------------------------------------------------------------- 25
STR6A100HZ-DSJ Rev.1.0
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© SANKEN ELECTRIC CO.,LTD. 2014
STR6A100HZ Series
1. Absolute Maximum Ratings
● Current polarities are defined as follows: a current flow going into the IC (sinking) is positive current (+); and a
current flow coming out of the IC (sourcing) is negative current (−).
● Unless specifically noted, TA = 25°C, 7 pin and 8 pin are shorted.
Parameter
Symbol
IDPEAK
Conditions
Single pulse
Pins
Rating
1.8
Units
A
Remarks
STR6A169HZ
STR6A161HZ
STR6A163HZ
STR6A169HZ
STR6A161HZ
STR6A163HZ
STR6A169HZ
STR6A161HZ
STR6A163HZ
Drain Peak Current (1)
8 − 1
2.5
4.0
1.8
TA =
− 40 ~ 125 °C
Maximum Switching Current (2)
Avalanche Energy (3)(4)
IDMAX
8 − 1
8 − 1
2.5
A
4.0
ILPEAK=1.8A
ILPEAK=1.78A
ILPEAK=2.15A
24
EAS
36
mJ
53
S/OCP Pin Voltage
VS/OCP
VBR
IBR
1 − 3
2 − 3
2 − 3
4 − 3
4 − 3
5 − 3
8 − 3
8 − 1
5 − 3
−
− 2 to 6
− 0.3 to 7.5
1.0
V
V
BR Pin Voltage
BR Pin Sink Current
mA
V
FB/OLP Pin Voltage
FB/OLP Pin Sink Current
VCC Pin Voltage
VFB
IFB
IFB ≤ 1mA
− 0.3 to 14
1.0
mA
V
VCC
VD/ST
PD1
−0.3 to 32
− 1 to VDSS
1.35
D/ST Pin Voltage
V
MOSFET Power Dissipation(5)
Control Part Power Dissipation
Operating Ambient Temperature
Storage Temperature
Junction Temperature
W
W
°C
°C
°C
(6)
PD2
1.2
TOP
Tstg
Tj
− 40 to 125
− 40 to 125
150
−
−
(1) See Section 3.2, MOSFET Safe Operating Area Curves.
(2) The Maximum Switching Current is the drain current determined by the drive voltage of the IC and threshold voltage
of the MOSFET, VGS(th)
.
(3) See Figure 3-2 Avalanche Energy Derating Coefficient Curve.
(4) Single pulse, VDD = 99 V, L = 20 mH.
(5) See 3.3, Ambient Temperature versus Power Dissipation Curve.
(6) When embedding this hybrid IC onto the printed circuit board (copper area in a 15 mm × 15 mm).
STR6A100HZ-DSJ Rev.1.0
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© SANKEN ELECTRIC CO.,LTD. 2014
STR6A100HZ Series
2. Electrical Characteristics
● Current polarities are defined as follows: a current flow going into the IC (sinking) is positive current (+); and a
current flow coming out of the IC (sourcing) is negative current (−).
● Unless specifically noted, TA = 25°C, 7 pin and 8 pin are shorted.
Parameter
Symbol
Conditions
Pins
Min.
Typ. Max. Units
Remarks
Power Supply Startup Operation
Operation Start Voltage
Operation Stop Voltage(*)
Circuit Current in Operation
VCC(ON)
VCC(OFF)
ICC(ON)
VST(ON)
5 − 3
5 − 3
5 − 3
13.8
7.6
−
15.0
8.5
16.2
9.2
V
V
VCC = 12 V
1.5
3.0
mA
Startup Circuit Operation
Voltage
8 – 3
5 − 3
5 − 3
40
47
55
V
mA
V
VCC = 13.5 V
VD/ST = 100 V
Startup Current
ICC(ST)
−4.05 −2.50 −1.08
Startup Current Biasing
Threshold Voltage
ICC = −500 µA
VCC(BIAS)
8.0
9.6
10.5
Normal Operation
Average Switching
Frequency
Switching Frequency
Modulation Deviation
fOSC(AVG)
8 – 3
8 − 3
90
100
8.4
110
kHz
kHz
Δf
−
−
VCC = 12 V
Maximum Feedback Current
Minimum Feedback Current
Light Load Operation
IFB(MAX)
IFB(MIN)
4 − 3
4 − 3
−170 −130
−85
−5
µA
µA
−21
−13
FB/OLP Pin Starting Voltage
of Frequency Decreasing
FB/OLP Pin Ending Voltage
of Frequency Decreasing
Minimum Switching
fOSC(AVG)× 0.9
fOSC(MIN)× 1.1
VFB(FDS)
VFB(FDE)
fOSC(MIN)
1 − 8
1 − 8
5 − 8
2.88
2.48
18
3.60
3.10
25
4.32
3.72
32
V
V
kHz
Frequency
Standby Operation
FB/OLP Pin Oscillation Stop
Threshold Voltage
VFB(OFF)
4 − 3
1.61
1.77
1.92
V
Brown-In / Brown-Out Function
Brown-In Threshold Voltage
VBR(IN)
2 – 3
2 − 3
2 − 3
5.43
4.65
6.5
5.60
4.80
6.9
5.77
4.95
7.3
V
V
V
Brown-Out Threshold Voltage VBR(OUT)
IBR = 100 µA
BR Pin Clamp Voltage
VBR(CLAMP)
VBR(DIS)
BR Function Disabling
Threshold Voltage
2 − 3
0.4
0.6
0.8
V
Protection
Maximum ON Duty
Leading Edge Blanking Time
DMAX
tBW
8 − 3
70
75
80
%
ns
−
330
−
−
OCP Compensation
Coefficient
DPC
DDPC
25.8
36
mV/μs
−
−
−
−
−
OCP Compensation ON Duty
−
%
(*) VCC(BIAS) > VCC(OFF) always.
STR6A100HZ-DSJ Rev.1.0
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STR6A100HZ Series
Parameter
Symbol
VOCP(L)
Conditions
Pins
Min.
Typ. Max. Units
Remarks
OCP Threshold Voltage at
Zero ON Duty
OCP Threshold Voltage at
36% ON Duty
OCP Threshold Voltage in
Leading Edge Blanking Time
1 − 3
0.735 0.795 0.855
0.843 0.888 0.933
V
V
V
VOCP(H)
1 − 3
1 − 3
VOCP(LEB)
−
1.69
−
OLP Threshold Voltage
OLP Delay Time
VFB(OLP)
tOLP
4 − 3
4 − 3
5 − 3
4 − 3
5 − 3
6.8
55
7.3
75
7.8
90
V
ms
µA
V
OLP Operation Current
FB/OLP Pin Clamp Voltage
OVP Threshold Voltage
ICC(OLP)
VFB(CLAMP)
VCC(OVP)
260
11.8
29.1
−
−
10.5
27.0
13.5
31.2
V
Thermal Shutdown Operating
Temperature
Tj(TSD)
125
145
°C
−
−
MOSFET
Drain-to-Source Breakdown
Voltage
IDS = 300 µA
VDS = 700 V
VDSS
IDSS
8 − 1
8 − 1
700
−
−
V
Drain Leakage Current
−
−
−
−
−
−
−
−
−
−
300
6.0
µA
Ω
STR6A169HZ
STR6A161HZ
STR6A163HZ
IDS = 0.4 A
On-Resistance
RDS(ON)
8 − 1
8 − 1
−
3.95
2.3
Ω
Ω
Switching Time
tf
250
ns
Thermal Resistance
Channel to Case
θch-C
−
−
22
°C/W
3. Performance Curves
3.1. Derating Curves
100
80
60
40
20
0
100
80
60
40
20
0
0
25
50
75
100 125 150
25
50
75
100
125
150
Ambient Temperature, TA (°C )
JunctionTemperature,Tj (°C)
Figure 3-1 SOA Temperature Derating Coefficient
Curve
Figure 3-2 Avalanche Energy Derating Coefficient
Curve
STR6A100HZ-DSJ Rev.1.0
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STR6A100HZ Series
3.2. MOSFET Safe Operating Area Curves
● When the IC is used, the safe operating area curve should be multiplied by the temperature derating coefficient
derived from Figure 3-1.
● The broken line in the safe operating area curve is the drain current curve limited by on-resistance.
● Unless otherwise specified, TA = 25 °C, Single pulse.
● STR6A161HZ
● STR6A163HZ
10
10
0.1ms
0.1ms
1
1
1ms
1ms
0.1
0.1
0.01
1
0.01
1
10
100
1000
10
100
1000
Drain-to-Source Voltage (V)
Drain-to-Source Voltage (V)
● STR6A169HZ
10
0.1ms
1
1ms
0.1
0.01
1
10
100
1000
Drain-to-Source Voltage (V)
3.3. Ambient Temperature versus Power Dissipation Curve
1.6
1.4
1.2
1
PD1=1.35W
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
Ambient Temperature, TA (°C )
STR6A100HZ-DSJ Rev.1.0
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STR6A100HZ Series
3.4. Transient Thermal Resistance Curves
● STR6A161HZ
100
10
1
0.1
0.01
1µ
10µ
100µ
1m
10m
100m
1s
Time (s)
● STR6A163HZ
100
10
1
0.1
0.01
1µ
10µ
100µ
1m
10m
100m
1s
Time (s)
● STR6A169HZ
100
10
1
0.1
0.01
1µ
10µ
100µ
1m
10m
100m
1s
Time (s)
STR6A100HZ-DSJ Rev.1.0
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© SANKEN ELECTRIC CO.,LTD. 2014
STR6A100HZ Series
4. Block Diagram
VCC
5
D/ST
7,8
Startup
UVLO
REG
VREG
OVP
TSD
BR
2
Brown-in
Brown-out
DRV
PWM OSC
VREG
S
Q
R
OCP
VCC
Drain peak current
compensation
OLP
S/OCP
1
Feedback
control
FB/OLP
4
LEB
GND
3
Slope
compensation
BD_STR6A100xZ_R1
5. Pin Configuration Definitions
Pin
1
Name
Descriptions
MOSFET source and Overcurrent Protection
(OCP) signal input
S/OCP
D/ST
D/ST
1
2
3
4
S/OCP
8
7
6
2
3
BR
Brown-In and Brown-Out detection voltage input
Ground
BR
GND
GND
Constant voltage control signal input and
Overload Protection (OLP) signal input
Power supply voltage input for control part and
Overvoltage Protection (OVP) signal input
4
5
FB/OLP
FB/OLP
VCC
5
VCC
6
7
8
−
(Pin removed)
D/ST
MOSFET drain and startup current input
STR6A100HZ-DSJ Rev.1.0
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© SANKEN ELECTRIC CO.,LTD. 2014
STR6A100HZ Series
6. Typical Application
● The following drawings show circuits enabled and disabled the Brown-In/Brown-Out Function.
● The PCB traces of the D/ST pins should be as wide as possible, in order to enhance thermal dissipation.
● In applications having a power supply specified such that the D/ST pins have large transient surge voltages, a clamp
snubber circuit of a capacitor-resistor-diode (CRD) combination should be added on the primary winding P, or a
damper snubber circuit of a capacitor (C) or a resistor-capacitor (RC) combination should be added between the D/ST
pin and the S/OCP pin.
CRD Clamp snubber
C（RC）
damper snubber
L51
BR1
C1
D51
VOUT
(+)
T1
VAC
RA
RB
R54
R51
R1
C6
PC1
R52
C5
P
R55
C51
D1
S
C53
U1
ROCP
1
8
7
S/OCP
D/ST
D/ST
C52 R53
C4
2
3
4
R2
D2
C2
BR
U51
R56
RC
(-)
GND
FB/OLP
D
5
VCC
C3
PC1
STR6A100HZ
CY
TC_STR6A100xZ_2_R1
Figure6-1 Typical application circuit (enabled Brown-In/Brown-Out Function, DC line detection)
CRD Clamp snubber
C（RC）
damper snubber
L51
BR1
C1
D51
VOUT
(+)
T1
VAC
R54
R51
R1
C6
PC1
R52
C5
P
R55
C51
D1
S
C53
U1
ROCP
1
8
7
S/OCP
D/ST
D/ST
C52 R53
2
3
4
R2
D2
C2
BR
U51
R56
(-)
GND
FB/OLP
D
5
VCC
C3
PC1
STR6A100HZ
CY
TC_STR6A100xZ_3_R1
Figure6-2 Typical application circuit (disabled Brown-In/Brown-Out Function)
STR6A100HZ-DSJ Rev.1.0
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© SANKEN ELECTRIC CO.,LTD. 2014
STR6A100HZ Series
7. External Dimensions
● DIP8
NOTES:
1) Dimension is in millimeters
2) Pb-free. Device composition compliant with the RoHS directive
8. Marking Diagram
8
6 A 1 × × H
Part Number
S K Y M D Z
Lot Number
Y is the last digit of the year of manufacture (0 to 9)
M is the month of the year (1 to 9, O, N or D)
D is a period of days,
1 : 1st to 10th
1
2 : 11th to 20th
3 : 21st to 31st
Control Number
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STR6A100HZ Series
9. Operational Description
9.1.2. With Brown-In / Brown-Out
Function
All the characteristic values given in this section are
typical values, unless they are specified as minimum or
maximum.
Current polarities are defined as follows: a current
flow going into the IC (sinking) is positive current (+);
and a current flow coming out of the IC (sourcing) is
negative current (−).
When BR pin voltage is more than VBR(DIS) = 0.6 V
and less than VBR(IN) = 5.60 V, the Bias Assist Function
(see Section 9.3) is disabled. Thus, VCC pin voltage
repeats increasing to VCC(ON) and decreasing to VCC(OFF)
(shown in Figure 9-3). When BR pin voltage becomes
VBR(IN) or more, the IC starts switching operation.
BR1
T1
9.1. Startup Operation
VAC
Figure 9-1 shows the circuit around IC.
C1
P
The IC incorporates the startup circuit. The circuit is
connected to D/ST pin. When D/ST pin voltage reaches
to Startup Circuit Operation Voltage VST(ON) = 47 V, the
startup circuit starts operation.
During the startup process, the constant current,
ICC(ST) = −2.50 mA, charges C2 at VCC pin. When VCC
pin voltage increases to VCC(ON) = 15.0 V, the control
circuit starts operation. During the IC operation, the
voltage rectified the auxiliary winding voltage, VD, of
Figure 9-1 becomes a power source to the VCC pin.
After switching operation begins, the startup circuit
turns off automatically so that its current consumption
becomes zero.
7､8
D/ST
D2 R2
5
3
U1
VCC
D
C2
VD
GND
BR
2
Figure 9-1 VCC pin peripheral circuit
(Without Brown-In / Brown-Out)
The approximate value of auxiliary winding voltage is
about 15 V to 20 V, taking account of the winding turns
of D winding so that VCC pin voltage becomes
Equation (1) within the specification of input and output
voltage variation of power supply.
VCC pin
voltage
VCC(ON)
ꢆꢁꢇꢈꢉꢊ ꢆ ꢋ ꢋ
ꢆꢁꢇꢏꢐꢊ ꢆ
ꢁ
ꢁ
ꢀꢀ ꢂꢃꢄꢅ
ꢀꢀ
ꢀꢀ ꢌꢍꢎ
tSTART
Drain current,
ID
(1)
⇒ꢑꢒꢊꢓꢔꢁ ꢆ ꢋ ꢋ ꢕꢖꢊꢒꢔꢁ ꢆ
ꢀꢀ
The oscillation start timing of IC depends on
Brown-In / Brown-Out Function (See Section 9.10).
Figure 9-2 Startup operation
(Without Brown-In / Brown-Out)
9.1.1. Without Brown-In / Brown-Out
Function (BR pin voltage is
VCC pin
voltage
tSTART
VBR(DIS) = 0.6 V or less)
VCC(ON)
VCC(OFF)
When VCC pin voltage increases to VCC(ON), the IC
starts switching operation, As shown in Figure 9-2.
The startup time of IC is determined by C2 capacitor
value. The approximate startup time tSTART (shown in
Figure 9-2) is calculated as follows:
BR pin
voltage
VBR(IN)
ꢀꢀꢁꢌꢝꢆ ꢞ
ꢀꢀꢁꢃꢝꢘꢆ
Drain current,
ID
ꢗꢅꢘꢄꢙꢘ ꢚ ꢛꢕꢜ
(2)
ꢟꢠꢀꢀꢁꢅꢘꢆ
ꢟ
where,
tSTART : Startup time of IC (s)
VCC(INT): Initial voltage on VCC pin (V)
Figure 9-3 Startup operation
(With Brown-In / Brown-Out)
STR6A100HZ-DSJ Rev.1.0
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© SANKEN ELECTRIC CO.,LTD. 2014
STR6A100HZ Series
voltage may become more than the target voltage due to
the delay of feedback circuit. In this case, the FB pin
voltage is decreased by the feedback control. When the
FB pin voltage decreases to VFB(OFF) or less, the IC stops
switching operation and VCC pin voltage decreases.
When VCC pin voltage decreases to VCC(BIAS), the Bias
Assist Function is activated and the startup failure is
prevented.
9.2. Undervoltage Lockout (UVLO)
Figure 9-4 shows the relationship of VCC pin voltage
and circuit current ICC. When VCC pin voltage decreases
to VCC(OFF) = 8.5 V, the control circuit stops operation by
Undervoltage Lockout (UVLO) circuit, and reverts to
the state before startup.
Circuit current, ICC
VCC pin
voltage
Startup success
Target operating
IC starts operation
VCC(ON)
voltage
Increase with rising of
output voltage
VCC(BIAS)
Stop
Start
Bias assist period
VCC(OFF)
Startup failure
VCC pin
voltage
VCC（OFF）
VCC（ON）
Time
Figure 9-5 VCC pin voltage during startup period
Figure 9-4 Relationship between
VCC pin voltage and ICC
9.4. Soft Start Function
Figure 9-6 shows the behavior of VCC pin voltage
and drain current during the startup period.
9.3. Bias Assist Function
By the Bias Assist Function, the startup failure is
prevented. The Bias Assist Function is activated, in both
of following condition:
the FB pin voltage is FB/OLP Pin Oscillation Stop
Threshold Voltage, VFB(OFF)= 1.77 V or less
Startup of IC Startup of SMPS
VCC pin
voltage
Normal opertion
tSTART
VCC(ON)
VCC(OFF)
and the VCC voltage decreases to the Startup Current
Biasing Threshold Voltage, VCC(BIAS) = 9.6 V.
When the Bias Assist Function is activated, the VCC
pin voltage is kept almost constant voltage, VCC(BIAS) by
providing the startup current, ICC(ST), from the startup
circuit. Thus, the VCC pin voltage is kept more than
Time
Soft start period
approximately 8.75 ms (fixed)
D/ST pin
current, ID
VCC(OFF)
.
Limited by OCP operation
Since the startup failure is prevented by the Bias
Assist Function, the value of C2 connected to VCC pin
can be small. Thus, the startup time and the response
time of the OVP become shorter.
The operation of the Bias Assist Function in startup is
as follows. It is necessary to check and adjust the startup
process based on actual operation in the application, so
that poor starting conditions may be avoided.
tLIM < tOLP (min.)
Time
Figure 9-6 VCC and ID behavior during startup
Figure 9-5 shows VCC pin voltage behavior during
the startup period.
The IC activates the soft start circuitry during the
startup period. Soft start time is fixed to around 8.75 ms.
during the soft start period, over current threshold is
increased step-wisely (7 steps). This function reduces
the voltage and the current stress of MOSFET and
secondary side rectifier diode.
Since the Leading Edge Blanking Function (see
Section 9.6) is deactivated during the soft start period,
there is the case that ON time is less than the leading
edge blanking time, tBW = 330 ns.
After VCC pin voltage increases to VCC(ON) = 15.0 V
at startup, the IC starts the operation. Then circuit
current increases and VCC pin voltage decreases. At the
same time, the auxiliary winding voltage VD increases in
proportion to output voltage. These are all balanced to
produce VCC pin voltage.
When VCC pin voltage is decrease to VCC(OFF) = 8.5 V
in startup operation, the IC stops switching operation
and a startup failure occurs.
After the soft start period, D/ST pin current, ID, is
When the output load is light at startup, the output
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limited by the Overcurrent Protection (OCP), until the
output voltage increases to the target operating voltage.
● Light load conditions
When load conditions become lighter, the output
voltage, VOUT, increases. Thus, the feedback current
from the error amplifier on the secondary-side also
increases. The feedback current is sunk at the FB/OLP
pin, transferred through a photo-coupler, PC1, and the
FB/OLP pin voltage decreases. Thus, VSC decreases,
and the peak value of VROCP is controlled to be low,
and the peak drain current of ID decreases.
This period is given as tLIM
.
When tLIM is longer than the OLP Delay Time, tOLP
,
the output power is limited by the Overload Protection
(OLP).
Thus, it is necessary to adjust the value of output
capacitor and the turn ratio of auxiliary winding D so
that the tLIM is less than tOLP = 55 ms (min.).
This control prevents the output voltage from
increasing.
9.5. Constant Output Voltage Control
● Heavy load conditions
The IC achieves the constant voltage control of the
power supply output by using the current-mode control
method, which enhances the response speed and
provides the stable operation.
The FB/OLP pin voltage is internally added the slope
compensation at the feedback control (see Section
4.Functionnal Block Diagram), and the target voltage,
When load conditions become greater, the IC
performs the inverse operation to that described above.
Thus, VSC increases and the peak drain current of ID
increases.
This control prevents the output voltage from
decreasing.
VSC, is generated. The IC compares the voltage, VROCP
,
In the current mode control method, when the drain
current waveform becomes trapezoidal in continuous
operating mode, even if the peak current level set by the
target voltage is constant, the on-time fluctuates based
on the initial value of the drain current.
of a current detection resistor with the target voltage,
VSC, by the internal FB comparator, and controls the
peak value of VROCP so that it gets close to VSC, as
shown in Figure 9-7 and Figure 9-8.
This results in the on-time fluctuating in multiples of
the fundamental operating frequency as shown in Figure
9-9. This is called the subharmonics phenomenon.
In order to avoid this, the IC incorporates the Slope
Compensation Function. Because the target voltage is
added a down-slope compensation signal, which reduces
the peak drain current as the on-duty gets wider relative
to the FB/OLP pin signal to compensate VSC, the
subharmonics phenomenon is suppressed.
U1
S/OCP
1
GND FB/OLP
3
4
PC1
IFB
ROCP
C3
VROCP
Even if subharmonic oscillations occur when the IC
has some excess supply being out of feedback control,
such as during startup and load shorted, this does not
affect performance of normal operation.
Figure 9-7
FB/OLP pin peripheral circuit
Target voltage including
Slope Compensation
Target voltage
without Slope Compensation
VSC
-
+
VROCP
Voltage on both
sides of ROCP
FB Comparator
tON1
T
tON2
T
Drain current,
ID
T
Figure 9-9 Drain current, ID, waveform
in subharmonic oscillation
Figure 9-8 Drain current, ID, and FB comparator
operation in steady operation
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9.6. Leading Edge Blanking Function
ID
The constant voltage control of output of the IC uses
the peak-current-mode control method.
Time
Time
Time
In peak-current-mode control method, there is a case
that the power MOSFET turns off due to unexpected
response of FB comparator or Overcurrent Protection
circuit (OCP) to the steep surge current in turning on a
power MOSFET.
In order to prevent this response to the surge voltage
in turning-on the power MOSFET, the Leading Edge
Blanking, tBW = 330 ns is built-in. During tBW, the OCP
threshold voltage becomes VOCP(LEB) = 1.69 V which is
higher than the normal OCP threshold voltage (see
Section 9.11).
Reducing surge voltage
VD51
Time
Without step drive
control
With step drive
control
Figure 9-11 ID and VD51 waveforms
9.9. Operation Mode
9.7. Random Switching Function
As shown in Figure 9-12, when the output power is
decreasing, together with the decrease of the drain
current ID of the internal power MOSFET, the operation
mode is automatically changed to the fixed switching
frequency mode (100 kHz), to the Green mode
controlled the switching frequency (25 kHz to 100 kHz),
and to the burst oscillation mode controlled by an
internal oscillator. In the Green mode, the number of
switching is reduced. In the burst oscillation mode, the
switching operation is stopped during a constant period.
Thus, the switching loss is reduced, and the power
efficiency is improved.
When the output load becomes lower, FB/OLP pin
voltage decreases. When FB/OLP pin voltage decreases
to VFB(FDS) = 3.60 V or less, the green mode is activated
and the oscillation frequency starts decreasing. When
FB/OLP pin voltage becomes VFB(FDE) = 3.10 V, the
oscillation frequency stops decreasing. At this point, the
oscillation frequency becomes fOSC(MIN) = 25 kHz.
When FB/OLP pin voltage further decreases and
becomes the standby operation point, the burst
oscillation mode is activated. As shown in Figure 9-13,
the burst oscillation mode consists of switching period
and non-switching period. The oscillation frequency
during switching period is the Minimum Frequency,
fOSC(MIN) = 25 kHz.
The IC modulates its switching frequency randomly
by superposing the modulating frequency on fOSC(AVG) in
normal operation. This function reduces the conduction
noise compared to others without this function, and
simplifies noise filtering of the input lines of power
supply.
9.8. Step Drive Control
Figure 9-10 shows a flyback control circuit. The both
end of secondary rectification diode (D51) is generated
surge voltage when a power MOSFET turns on. Thus,
VRM of D51 should be set in consideration of the surge.
The IC optimally controls the gate drive of the
internal power MOSFET (Step drive control) depending
on the load condition. The step drive control reduces the
surge voltage of D51 when the power MOSFET turns on
(See Figure 9-11). Since VRM of D51 can be set to lower
value than usual, the price reduction and the increasing
circuit efficiency are achieved by using a diode of low
VF.
VD51
BR1
T1
VAC
D51
Generally, to improve efficiency under light load
conditions, the frequency of the burst mode becomes
just a few kilohertz. Because the IC suppresses the peak
drain current well during burst mode, audible noises can
be reduced.
P1
S1
C1
C51
ID
5-8
D/ST
U1
The OCP detection usually has some detection delay
time. The higher the AC input voltage is, the steeper the
slope of ID is. Thus, the peak drain current at the burst
oscillation mode becomes high at a high AC input
voltage.
S/OCP
1
ROCP
Figure 9-10 Flyback control circuit
It is necessary to consider that the burst frequency
becomes low at a high AC input.
If the VCC pin voltage decreases to VCC(BIAS) = 9.6 V
during the transition to the burst mode, the Bias Assist
function is activated and stabilizes the standby mode,
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because the Startup Current, ICC(ST), is provided to the
VCC pin so that the VCC pin voltage does not decrease
to VCC(OFF). However, if the Bias Assist function is
always activated during steady-state operation including
standby mode, the power loss increases. Therefore, the
VCC pin voltage should be more than VCC(BIAS), for
example, by adjusting the turns ratio of the auxiliary
winding and secondary-side winding and/or reducing the
value of R2 (see Section 10.1).
BR pin voltage
VBR(IN)
VBR(OUT)
tOLP
Drain current,
ID
Figure 9-14 BR pin voltage and drain current
waveforms
Switching
frequency
fOSC
fOSC(AVG)
There are two types of detection method as follows:
Normal
operation
fOSC(MIN)
Green mode
Burst oscillation
9.10.1. DC Line Detection
Figure 9-15 shows BR pin peripheral circuit of DC
line detection. There is a ripple voltage on C1 occurring
at a half period of AC cycle. In order to detect each peak
of the ripple voltage, the time constant of RC and C4
should be shorter than a half period of AC cycle.
Standby power
Output power, PO
Figure 9-12 Relationship between PO and fOSC
Since the cycle of the ripple voltage is shorter than
tOLP, the switching operation does not stop when only the
bottom part of the ripple voltage becomes lower than
Switching period
ID
Non-switching period
VBR(OUT)
.
Thus it minimizes the influence of load conditions on
the voltage detection.
Time
fOSC(MIN)
BR1
VAC
Figure 9-13 Switching waveform at burst oscillation
RA
C1
U1
VDC
RB
2
9.10. Brown-In and Brown-Out Function
BR
GND
3
RC
C4
This function stops switching operation when it
detects low input line voltage, and thus prevents
excessive input current and overheating.
This function turns on and off switching operation
according to the BR pin voltage detecting the AC input
voltage. When BR pin voltage becomes more than
VBR(DIS) = 0.6 V, this function is activated.
Figure 9-14 shows waveforms of the BR pin voltage
and the drain currnet.
Even if the IC is in the operating state that the VCC
pin voltage is VCC(OFF) or more, when the AC input
voltage decreases from steady-state and the BR pin
voltage falls to VBR(OUT) = 4.80 V or less for the OLP
Delay Time, tOLP = 75 ms, the IC stops switching
operation.
When the AC input voltage increases and the BR pin
voltage reaches VBR(IN) = 5.60 V or more in the operating
state that the VCC pin voltage is VCC(OFF) or more, the IC
starts switching operation.
Figure 9-15 DC line detection
<< The components around BR pin >>
● RA and RB are a few megohms. Because of high
voltage applied and high resistance, it is
recommended to select a resistor designed against
electromigration or use a combination of resistors in
series for that to reduce each applied voltage,
according to the requirement of the application.
● RC is a few hundred kilohms
● C4 is 470 pF to 2200 pF for high frequency noise
reduction
When the Brown-In and Brown-Out Function is
unnecessary, connect the BR pin trace to the GND pin
trace so that the BR pin voltage is VBR(DIS) or less.
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Neglecting the effect of both input resistance and
forward voltage of rectifier diode, the reference value of
C1 voltage when Brown-In and Brown-Out Function is
activated is calculated as follows:
<< The components around BR pin >>
● RA and RB are a few megohms. Because of high
voltage applied and high resistance, it is
recommended to select a resistor designed against
electromigration or use a combination of resistors in
series for that to reduce each applied voltage,
according to the requirement of the application.
● RC is a few hundred kilohms
● RS must be adjusted so that the BR pin voltage is
more than VBR(DIS) = 0.6 V when the VCC pin
voltage is VCC(OFF) = 8.5 V
ꢦꢄ ꢥ ꢦꢂ
ꢚ ꢂꢙꢁꢘꢢꢆ ꢣ ꢤꢑ ꢥ
ꢧ
(3)
ꢡꢀꢁꢌꢎꢆ
ꢦꢀ
where,
VDC(OP): C1 voltage when Brown-In and Brown-Out
Function is activated
VBR(TH): Any one of threshold voltage of BR pin
(see Table 9-1)
● C4 is 0.22 μF to 1 μF for averaging AC input voltage
and high frequency noise reduction
Table 9-1 BR pin threshold voltage
Neglecting the effect of input resistance is zero, the
reference effective value of AC input voltage when
Brown-In and Brown-Out Function is activated is
calculated as follows:
Value
(Typ.)
Parameter
Symbol
VBR(IN)
Brown-In Threshold Voltage
5.60 V
ꢪ
ꢦꢄ ꢥ ꢦꢂ
ꢦꢀ
Brown-Out Threshold Voltage VBR(OUT)
4.80 V
ꢚ
ꢣ ꢂꢙꢁꢘꢢꢆ ꢣ ꢤꢑ ꢥ
ꢧ
(5)
ꢄꢀꢁꢌꢎꢆꢙꢨꢅ
ꢕ
ꢩ
VDC(OP) can be expressed as the effective value of AC
input voltage using Equation (4).
where,
VAC(OP)RMS: The effective value of AC input voltage
when Brown-In and Brown-Out Function is
activated
VBR(TH): Any one of threshold voltage of BR pin (see
Table 9-1)
ꢑ
ꢚ
ꢣ
(4)
ꢄꢀꢁꢌꢎꢆꢙꢨꢅ
ꢡꢀꢁꢌꢎꢆ
ꢕ
ꢩ
RA, RB, RC and C4 should be selected based on actual
operation in the application.
RA, RB, RC and C4 should be selected based on actual
operation in the application.
9.10.2. AC Line Detection
Figure 9-16 shows BR pin peripheral circuit of AC
line detection. In order to detect the AC input voltage
(after half-wave rectification), the time constant of RC
and C4 should be longer than the period of AC cycle.
Thus the response of BR pin detection becomes slow
compared with the DC line detection. This method
detects the AC input voltage, and thus it minimizes the
influence from load conditions. Also, this method is free
of influence from C1 charging and discharging time.
9.11. Overcurrent Protection (OCP)
9.11.1. Overcurrent Protection Operation
Overcurrent Protection (OCP) detects each drain peak
current level of a power MOSFET on pulse-by-pulse
basis, and limits the output power when the current level
reaches to OCP threshold voltage.
During Leading Edge Blanking Time, the OCP
threshold voltage becomes VOCP(LEB) = 1.69 V which is
higher than the normal OCP threshold voltage as shown
in Figure 9-17. Changing to this threshold voltage
prevents the IC from responding to the surge voltage in
turning-on the power MOSFET. This function operates
as protection at the condition such as output windings
shorted or unusual withstand voltage of secondary-side
rectifier diodes.
When power MOSFET turns on, the surge voltage
width of S/OCP pin should be less than tBW, as shown in
Figure 9-17. In order to prevent surge voltage, pay extra
attention to ROCP trace layout (see Section 10.2).
In addition, if a C (RC) damper snubber of Figure
9-18 is used, reduce the capacitor value of damper
BR1
VAC
RA
5
RS
VCC
U1
RB
VDC
C1
2
BR
C4
GND
3
RC
Figure 9-16 AC line detection (after half-wave
rectification)
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snubber.
tBW
ꢌꢀꢎꢫ ꢚ ꢌꢀꢎꢁꢬꢆ ꢥ ꢭꢮꢛ ꢣ ꢯꢰꢱꢏꢇꢲ
VOCP(LEB)
VOCP
ꢯꢰꢭꢳꢗꢴ
ꢵꢌꢅꢀꢁꢄꢍꢶꢆ
ꢚ ꢌꢀꢎꢁꢬꢆ ꢥ ꢭꢮꢛ ꢣ
(6)
’
where,
VOCP(L) :OCP Threshold Voltage at Zero ON Duty
DPC :OCP Compensation Coefficient
ONTime :On-time of power MOSFET
ONDuty :On duty of power MOSFET
fOSC(AVG) :Average PWM Switching Frequency
Surge pulse voltage width at turning-on
Figure 9-17 S/OCP pin voltage
1.0
C（RC）
Damper snubber
T1
VOCP(H)
VOCP(L)
D51
C51
C1
U1
7, 8
D/ST
C（RC）
Damper snubber
DDPC=36%
DMAX=75%
S/OCP
1
0.5
0
ROCP
50
100
ON Duty (%)
Figure 9-19 Relationship between ON Duty and Drain
Current Limit after compensation
Figure 9-18 Damper snubber
9.11.2. Input Compensation Function
9.12. Overload Protection (OLP)
ICs with PWM control usually have some propagation
delay time. The steeper the slope of the actual drain
current at a high AC input voltage is, the larger the
detection voltage of actual drain peak current is,
compared to VOCP. Thus, the peak current has some
variation depending on the AC input voltage in OCP
state.
Figure 9-20 shows the FB/OLP pin peripheral circuit,
and Figure 9-21 shows each waveform for OLP
operation.
When the peak drain current of ID is limited by OCP
operation, the output voltage, VOUT, decreases and the
feedback current from the secondary photo-coupler
becomes zero. Thus, the feedback current, IFB, charges
C3 connected to the FB/OLP pin and the FB/OLP pin
voltage increases. When the FB/OLP pin voltage
increases to VFB(OLP) = 7.3 V or more for the OLP delay
time, tOLP = 75 ms or more, the OLP function is
activated, the IC stops switching operation.
In order to reduce the variation of peak current in
OCP state, the IC incorporates
Compensation Function.
a built-in Input
The Input Compensation Function is the function of
correction of OCP threshold voltage depending with AC
input voltage, as shown in Figure 9-19.
When AC input voltage is low (ON Duty is broad),
the OCP threshold voltage is controlled to become high.
The difference of peak drain current become small
compared with the case where the AC input voltage is
high (ON Duty is narrow).
The compensation signal depends on ON Duty. The
relation between the ON Duty and the OCP threshold
voltage after compensation VOCP' is expressed as
Equation (6). When ON Duty is broader than 36 %, the
VOCP' becomes a constant value VOCP(H) = 0.888 V
During OLP operation, the intermittent operation by
VCC pin voltage repeats and reduces the stress of parts
such as the power MOSFET and secondary side rectifier
diode.
When the OLP function is activated, the IC stops
switching operation, and the VCC pin voltage decreases.
During OLP operation, the Bias Assist Function is
disabled. When the VCC pin voltage decreases to
VCC(OFF)SKP (about 9 V), the startup current flows, and
the VCC pin voltage increases. When the VCC pin
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voltage increases to VCC(ON), the IC starts operation, and
the circuit current increases. After that, the VCC pin
voltage decreases. When the VCC pin voltage decreases
to VCC(OFF) = 8.5 V, the control circuit stops operation.
Skipping the UVLO operation of VCC(OFF) (see Section
9.2), the intermittent operation makes the non-switching
interval longer and restricts the temperature rise of the
power MOSFET.
can be detected because the VCC pin voltage is
proportional to output voltage. The approximate value of
output voltage VOUT(OVP) in OVP condition is calculated
by using Equation (7).
ꢚ
ꢌꢷꢘꢁꢝꢌꢙꢨꢄꢬꢆ ꢣ ꢕꢸꢊꢑꢔꢁ ꢆ
(7)
ꢌꢷꢘꢁꢌꢍꢎꢆ
ꢀꢀꢁꢝꢌꢙꢨꢄꢬꢆ
When the abnormal condition is removed, the IC
returns to normal operation automatically.
where,
VOUT(NORMAL): Output voltage in normal operation
VCC(NORMAL): VCC pin voltage in normal operation
U1
VCC
5
GND FB/OLP
9.14. Thermal Shutdown (TSD)
4
3
When the temperature of control circuit increases to
Tj(TSD) = 145 °C or more, Thermal Shutdown (TSD) is
activated, and the IC stops switching operation at the
latched state. In order to keep the latched state, when
VCC pin voltage decreases to VCC(BIAS), the bias assist
function is activated and VCC pin voltage is kept to over
D2 R2
PC1
C3
C2
D
the VCC(OFF)
.
Releasing the latched state is done by turning off the
input voltage and by dropping the VCC pin voltage
Figure 9-20 FB/OLP pin peripheral circuit
below VCC(OFF)
.
Non-switching
interval
Non-switching
interval
VCC pin voltage
VCC(ON)
10. Design Notes
VCC(OFF)SKP
VCC(OFF)
tOLP
tOLP
tOLP
FB/OLP pin voltage
VFB(OLP)
10.1. External Components
Take care to use properly rated, including derating as
necessary and proper type of components.
CRD clamp snubber
Drain current,
ID
BR1
T1
VAC
R1
C6
RA
RB
C1
P
D1
Figure 9-21 OLP operational waveforms
D2 R2
5
8
7
D/ST D/ST NC VCC
U1
D
C2
9.13. Overvoltage Protection (OVP)
C5
When a voltage between VCC pin and GND terminal
increases to VCC(OVP) = 29.1 V or more, Overvoltage
Protection (OVP) is activated and the IC stops switching
operation at the latched state. In order to keep the
latched state, when VCC pin voltage decreases to
VCC(BIAS), the bias assist function is activated and VCC
S/OCP BR
FB/OLP
4
GND
3
C（RC）
Damper snubber
1
2
PC1
C4
C3
RC
ROCP
pin voltage is kept to over the VCC(OFF)
Releasing the latched state is done by turning off the
input voltage and by dropping the VCC pin voltage
.
Figure 10-1 The IC peripheral circuit
below VCC(OFF)
.
When the VCC pin voltage is provided by using
auxiliary winding of transformer, the overvoltage
conditions such as output voltage detection circuit open
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because the variation of the auxiliary winding voltage is
affected by the transformer structural design。
10.1.1. Input and Output Electrolytic
Capacitor
Apply proper derating to ripple current, voltage, and
temperature rise. Use of high ripple current and low
impedance types, designed for switch mode power
supplies, is recommended.
Without R2
VCC pin voltage
With R2
10.1.2. S/OCP Pin Peripheral Circuit
Output current, IOUT
In Figure 10-1, ROCP is the resistor for the current
detection. A high frequency switching current flows to
ROCP, and may cause poor operation if a high
inductance resistor is used. Choose a low inductance and
high surge-tolerant type.
Figure 10-2 Variation of VCC pin voltage and power
10.1.6. Snubber Circuit
If the surge voltage of VDS is large, the circuit should
be added as follows (see Figure 10-1);
10.1.3. BR Pin peripheral circuit
● A clamp snubber circuit of a capacitor-resistor- diode
(CRD) combination should be added on the primary
winding P.
● A damper snubber circuit of a capacitor (C) or a
resistor-capacitor (RC) combination should be added
between the D/ST pin and the S/GND pin. When the
damper snubber circuit is added, this components
should be connected near D/ST pin and S/OCP pin.
Because RA and RB (see Figure 10-1) are applied high
voltage and are high resistance, the following should be
considered according to the requirement of the
application:
● Select a resistor designed against electromigration, or
● Use a combination of resistors in series for that to
reduce each applied voltage
See the section 9.10 about the AC input voltage
detection function and the components around BR pin.
10.1.7. Phase Compensation
A
typical phase compensation circuit with a
10.1.4. FB/OLP Pin Peripheral Circuit
secondary shunt regulator (U51) is shown in Figure
10-3.
C3 is for high frequency noise reduction and phase
compensation, and should be connected close to these
pins. The value of C3 is recommended to be about 2200
pF to 0.01 µF, and should be selected based on actual
operation in the application.
C52 and R53 are for phase compensation. The value
of C52 and R53 are recommended to be around 0.047μF
to 0.47μF and 4.7 kΩ to 470 kΩ, respectively. They
should be selected based on actual operation in the
application.
10.1.5. VCC Pin Peripheral Circuit
L51
T1
VOUT
(+)
D51
The value of C2 is generally recommended to be 10
µF to 47 μF (see Section 9.1 Startup Operation, because
the startup time is determined by the value of C2).
R54
R51
In actual power supply circuits, there are cases in
which the VCC pin voltage fluctuates in proportion to
the output current, IOUT (see Figure 10-2), and the
Overvoltage Protection (OVP) on the VCC pin may be
activated. This happens because C2 is charged to a peak
voltage on the auxiliary winding D, which is caused by
the transient surge voltage coupled from the primary
winding when the power MOSFET turns off.
PC1
R52
R55
C51
S
C53
C52 R53
U51
R56
For alleviating C2 peak charging, it is effective to add
some value R2, of several tenths of ohms to several
ohms, in series with D2 (see Figure 10-1). The optimal
value of R2 should be determined using a transformer
matching what will be used in the actual application,
(-)
Figure 10-3 Peripheral circuit around secondary shunt
regulator (U51)
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STR6A100HZ Series
10.1.8. Transformer
Margin tape
Apply proper design margin to core temperature rise
by core loss and copper loss.
Because the switching currents contain high
frequency currents, the skin effect may become a
consideration.
P1 S1 P2 S2 D
Margin tape
Choose a suitable wire gauge in consideration of the
RMS current and a current density of 4 to 6 A/mm2.
If measures to further reduce temperature are still
necessary, the following should be considered to
increase the total surface area of the wiring:
Winding structural example (a)
Margin tape
P1 S1 D S2 S1 P2
● Increase the number of wires in parallel.
● Use litz wires.
Margin tape
● Thicken the wire gauge.
Winding structural example (b)
In the following cases, the surge of VCC pin voltage
becomes high.
Figure 10-4 Winding structural examples
● The surge voltage of primary main winding, P, is high
(low output voltage and high output current power
supply designs)
● The winding structure of auxiliary winding, D, is
susceptible to the noise of winding P.
10.2. PCB Trace Layout and Component
Placement
Since the PCB circuit trace design and the component
layout significantly affects operation, EMI noise, and
power dissipation, the high frequency PCB trace should
be low impedance with small loop and wide trace.
In addition, the ground traces affect radiated EMI noise,
and wide, short traces should be taken into account.
Figure 10-5 shows the circuit design example.
When the surge voltage of winding D is high, the
VCC pin voltage increases and the Overvoltage
Protection (OVP) may be activated. In transformer
design, the following should be considered;
● The coupling of the winding P and the secondary
output winding S should be maximized to reduce the
leakage inductance.
(1) Main Circuit Trace Layout
This is the main trace containing switching currents,
and thus it should be as wide trace and small loop as
possible.
If C1 and the IC are distant from each other, placing
a capacitor such as film capacitor (about 0.1 μF and
with proper voltage rating) close to the transformer
or the IC is recommended to reduce impedance of
the high frequency current loop.
● The coupling of the winding D and the winding S
should be maximized.
● The coupling of the winding D and the winding P
should be minimized.
In the case of multi-output power supply, the coupling
of the secondary-side stabilized output winding, S1, and
the others (S2, S3…) should be maximized to improve
the line-regulation of those outputs.
Figure 10-4 shows the winding structural examples of
two outputs.
(2) Control Ground Trace Layout
Since the operation of IC may be affected from the
large current of the main trace that flows in control
ground trace, the control ground trace should be
separated from main trace and connected at a single
point grounding of point A in Figure 10-5 as close to
the ROCP pin as possible.
● Winding structural example (a):
S1 is sandwiched between P1 and P2 to maximize the
coupling of them for surge reduction of P1 and P2.
D is placed far from P1 and P2 to minimize the
coupling to the primary for the surge reduction of D.
(3) VCC Trace Layout
This is the trace for supplying power to the IC, and
thus it should be as small loop as possible. If C2 and
the IC are distant from each other, placing a
capacitor such as film capacitor Cf (about 0.1 μF to
1.0 μF) close to the VCC pin and the GND pin is
recommended.
● Winding structural example (b)
P1 and P2 are placed close to S1 to maximize the
coupling of S1 for surge reduction of P1 and P2.
D and S2 are sandwiched by S1 to maximize the
coupling of D and S1, and that of S1 and S2. This
structure reduces the surge of D, and improves the
line-regulation of outputs.
STR6A100HZ-DSJ Rev.1.0
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STR6A100HZ Series
(4) ROCP Trace Layout
as wide trace and small loop as possible. If this trace
is thin and long, inductance resulting from the loop
may increase surge voltage at turning off the power
MOSFET. Proper rectifier smoothing trace layout
helps to increase margin against the power MOSFET
breakdown voltage, and reduces stress on the clamp
snubber circuit and losses in it.
ROCP should be placed as close as possible to the
S/OCP pin. The connection between the power
ground of the main trace and the IC ground should
be at a single point ground (point A in Figure 10-5)
which is close to the base of ROCP
.
(5) Peripheral components of the IC
(7) Thermal Considerations
The components for control connected to the IC
should be placed as close as possible to the IC, and
should be connected as short as possible to the each
pin.
Because the power MOSFET has a positive thermal
coefficient of RDS(ON), consider it in thermal design.
Since the copper area under the IC and the D/ST pin
trace act as a heatsink, its traces should be as wide as
possible.
(6) Secondary Rectifier Smoothing Circuit Trace Layout
This is the trace of the rectifier smoothing loop,
carrying the switching current, and thus it should be
(1)Main trace should be wide
trace and small loop
(6)Main trace of secondary side should
be wide trace and small loop
(4)ROCP should be as close to S/OCP pin
as possible.
T1
D51
(7)Trace of D/ST pin should be
wide for heat release
R1
C1
C6
RA
RB
P
C5
C51
D1
S
U1
A
ROCP
C4
1
8
7
S/OCP
D/ST
D/ST
2
3
4
BR
D2
R2
RC
(2) Control GND trace
should be connected at
a single point as close
to the ROCP as possible
GND
5
D
VCC
FB/OLP
C2
PC1 C3
(5)The components
connected to the IC
should be as close to
the IC as possible, and
should be connected as
short as possible
CY
(3) Loop of the power supply should be small
Figure 10-5 Peripheral circuit example around the IC
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STR6A100HZ Series
11. Pattern Layout Example
The following show the PCB pattern layout example and the schematic of circuit using STR6A100HZ series.
Figure 11-1 PCB circuit trace layout example
1
L1
P2
1
BR1
T1
D51
C54
VOUT(+)
C1
F1
JP3
R54
R55
R51
R1
C4
D1
2
S
C2
C3
P1
P1
R52
PC1
C53
C51
JP4
JP1
C52 R53
U2
R4
R5
R6
D2
R2
R56
5
8
D/ST
7
2
VOUT(-)
D/ST
VCC
D
U1
C9
C8
C7
STR6A100
GND
S/OCP BR
FB/OLP
4
JP2
R7
1
2
3
JP5
JP6
R3
C6
PC1
C5
C10
PSA50123 rev.1.0
Figure 11-2 Circuit schematic for PCB circuit trace layout
STR6A100HZ-DSJ Rev.1.0
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STR6A100HZ Series
12. Reference Design of Power Supply
As an example, the following show the power supply specification, the circuit schematic, the bill of materials, and
the transformer specification.
● Circuit schematic
使用 IC
STR6A163HZ
AC85V～AC265V
21 W
14 V
1.5 A (max.)
入力電圧
最大出力電力
出力電圧
出力電流
● Circuit schematic
See Figure 11-2.
● Transformer specification
▫ Primary inductance, LP
▫ Core size
：700 μH
：EI-22
▫ Al-value
：231 nH/N2 (Center gap of about 0.23 mm)
▫ Winding specification
Number of
turns (T)
Winding
Symbol
P1
Wire diameter(mm)
Construction
Single-layer,
solenoid winding
Primary winding 1
30
2UEW-φ0.23
Single-layer,
solenoid winding
Space winding
Single-layer,
Primary winding 2
Auxiliary winding
Output winding 1
P2
D
25
10
9
2UEW-φ0.23
2UEW-φ0.23
TEX-φ0.0.26 × 2
S1
solenoid winding
Single-layer,
solenoid winding
Output winding 2
S2
9
TEX-φ0.0.26 × 2
VDC
(+) 14V
P1
P2
P1
VOUT
S1
S2
S2
D
(-)
D/ST
VCC
S1
P2
D
Bobbin
GND
● Start at this pin
Cross-section view
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© SANKEN ELECTRIC CO.,LTD. 2014
STR6A100HZ Series
Bill of materials
Recommended
Sanken Parts
Recommended
Sanken Parts
Symbol
Part type
Ratings(1)
600 V, 1 A
Symbol
Part type
Ratings(1)
10 mH
(2)
BR1
Diode bridge
Film, X2
L1
CM inductor
Photo-coupler
Metal oxide
General
(2)
C1
0.1 μF, 275 V
82 μF, 400 V
Open
PC1
PC123 相当
470 kΩ, 1 W
4.7 Ω
(3)
C2
C3
C4
C5
Electrolytic
Electrolytic
Ceramic
R1
R2
R3
1000 pF, 630 V
1000 pF
General
1 Ω, 1 W
2.2 MΩ
2.2 MΩ
Short
(3)
Ceramic
R4
General
(2)
(3)
C6
Ceramic
0.01 μF
R5
General
(3)
C7
Electrolytic
Ceramic
22 μF, 50 V
Open
R6
General
(2)
(3)
C8
R7
General
330 kΩ
2.2 kΩ
(2)
C9
Ceramic
Open
R51
R52
General
C10
C51
C52
C53
C54
Ceramic, Y1
Electrolytic
Ceramic
2200 pF, 250 VAC
1000 μF, 25V
0.22 μF, 50V
Open
General
1.5 kΩ
(2)
R53
General
10 kΩ
R54
R55
R56
General, 1%
General, 1%
General, 1%
6.8 kΩ
Electrolytic
Ceramic
39 kΩ
Open
10 kΩ
See the
specification
D1
D2
D51
F1
Fast recovery
Fast recovery
Schottky
1000V, 0.5A
200 V, 1 A
EG01C
T1
U1
U2
Transformer
IC
AL01Z
－
STR6A163HZ
VREF=2.5V
TL431or equiv
100 V, 10 A
FMEN-210A
Shunt regulator
Fuse
AC250V, 2 A
(1) Unless otherwise specified, the voltage rating of capacitor is 50 V or less and the power rating of resistor is 1/8 W or less.
(2) It is necessary to be adjusted based on actual operation in the application.
(3) Resistors applied high DC voltage and of high resistance are recommended to select resistors designed against electromigration or
use combinations of resistors in series for that to reduce each applied voltage, according to the requirement of the application.
STR6A100HZ-DSJ Rev.1.0
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STR6A100HZ Series
IMPORTANT NOTES
● All data, illustrations, graphs, tables and any other information included in this document as to Sanken’s products listed herein (the
“Sanken Products”) are current as of the date this document is issued. All contents in this document are subject to any change
without notice due to improvement, etc. Please make sure that the contents set forth in this document reflect the latest revisions
before use.
● The Sanken Products are intended for use as components of general purpose electronic equipment or apparatus (such as home
appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products,
please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to
Sanken. If considering use of the Sanken Products for any applications that require higher reliability (transportation equipment and
its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety devices, etc.), you
must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal,
on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the Sanken Products. Any use
of the Sanken Products without the prior written consent of Sanken in any applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
● In the event of using the Sanken Products by either (i) combining other products or materials therewith or (ii) physically,
chemically or otherwise processing or treating the same, you must duly consider all possible risks that may result from all such
uses in advance and proceed therewith at your own responsibility.
● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the
occurrence of any failure or defect in semiconductor products at a certain rate. You must take, at your own responsibility,
preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which
the Sanken Products are used, upon due consideration of a failure occurrence rate or derating, etc., in order not to cause any human
injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please refer
to the relevant specification documents and Sanken’s official website in relation to derating.
● No anti-radioactive ray design has been adopted for the Sanken Products.
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● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples and
evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of use of the
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● All technical information described in this document (the “Technical Information”) is presented for the sole purpose of reference
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● You must not use the Sanken Products or the Technical Information for the purpose of any military applications or use, including
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the falling thereof, out of Sanken’s distribution network.
● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is
error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting
from any possible errors or omissions in connection with the contents included herein.
● Please refer to the relevant specification documents in relation to particular precautions when using the Sanken Products, and refer
to our official website in relation to general instructions and directions for using the Sanken Products.
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