SCG4153_15 [SECOS]
N-Channel Enhancement Mode MOSFET;型号: | SCG4153_15 |
厂家: | SECOS HALBLEITERTECHNOLOGIE GMBH |
描述: | N-Channel Enhancement Mode MOSFET |
文件: | 总4页 (文件大小:683K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SCG4153
0.8A , 20V , RDS(ON) 310 mΩ
N-Channel Enhancement Mode MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
DESCRIPTION
SOT-523
These miniature surface mount MOSFETs utilize a high
cell density trench process to provide low RDS(on) and to
ensure minimal power loss and heat dissipation.
A
M
3
3
Top View
C B
MECHANICAL DATA
1
1
2
ꢀ
ꢀ
ꢀ
ꢀ
Trench Technology
Supper high density cell design
Excellent ON resistance
L
2
K
F
E
D
Extremely Low Threshold Voltage
H
G
J
Millimeter
Millimeter
Min. Max.
APPLICATION
REF.
REF.
Min.
Max.
A
B
C
D
E
F
1.5
1.45
0.7
1.7
1.75
0.9
G
H
J
K
L
-
0.1
ꢀ
DC-DC converter circuit
Load Switch
0.55 REF.
ꢀ
0.1
0.2
0.7
0.9
-
0.9
1.1
0.5 TYP.
0.25 0.325
0.15
0.35
M
MARKING
Top View
N3ꢀ
ꢀ
= Date Code
PACKAGE INFORMATION
Package
MPQ
3K
Leader Size
SOT-523
7 inch
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter Symbol
Rating
Unit
10S
Steady State
Drain – Source Voltage
VDS
VGS
20
±6
V
V
Gate – Source Voltage
TA= 25°C
TA= 70°C
TA= 25°C
TA= 70°C
TA= 25°C
TA= 70°C
TA= 25°C
TA= 70°C
0.88
0.71
0.37
0.23
0.76
0.6
0.8
Continuous Drain Current 1
ID
PD
ID
A
W
A
0.64
0.3
Power Dissipation 1
0.19
0.69
0.55
0.22
0.14
Continuous Drain Current 2
Power Dissipation 2
0.27
0.17
PD
W
Pulsed Drain Current 3
Lead Temperature
IDM
TL
1.4
A
°C
°C
260
Operating Junction & Storage Temperature Range
TJ, TSTG
150, -55~150
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
12-Mar-2013 Rev. A
Page 1 of 4
SCG4153
0.8A , 20V , RDS(ON) 310 mΩ
N-Channel Enhancement Mode MOSFET
Elektronische Bauelemente
THERMAL RESISTANCE RATINGS
Rating
Parameter
Symbol
Unit
Typ.
285
340
385
455
260
Max.
335
405
450
545
300
T≦10S
Junction-to-Ambient Thermal Resistance 1
Junction-to-Ambient Thermal Resistance 2
RθJA
Steady State
T≦10S
°C / W
RθJA
RθJC
Steady State
Steady State
Junction-to-Case Thermal Resistance
Note:
1. Surface mounted on FR4 Board using 1 square inch pad size, 1oz copper.
2. Surface mounted on FR4 board using minimum pad size, 1oz copper
3. Repetitive rating, pulse width limited by junction temperature, tp=10µs, Duty Cycle=1%
4. Repetitive rating, pulse width limited by junction temperature TJ=150°C.
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Teat Conditions
Static
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
V(BR)DSS
IDSS
20
-
-
-
1
V
µA
µA
V
VGS=0, ID=250µA
-
VDS=16V, VGS=0
IGSS
-
-
±5
1
VDS=0 , VGS= ±5V
VDS=VGS, ID=250µA
VGS=4.5V, ID=0.55A
VGS=2.5V, ID=0.45A
VGS=1.8V, ID=0.35A
VDS=10V, ID=0.4A
Gate-Threshold Voltage
VGS(TH)
0.45
0.55
220
260
320
1
-
-
-
-
310
360
460
-
Drain-Source On Resistance
Forward Transconductance
Diode Forward On–Voltage
RDS(ON)
mΩ
S
gFS
Body-Drain Diode Ratings
VSD 0.5 0.7
Dynamic Characteristics
1.5
V
IS=350mA, VGS=0
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Threshold Gate Charge
Gate-to-Source Charge
Gate-to-Drain Charge
Turn-on Delay Time
Rise Time
CISS
COSS
CRSS
QG(TOT)
QG(TH)
QGS
-
-
-
-
-
-
-
-
-
-
-
68
9
-
-
-
-
-
-
-
-
-
-
-
VDS=10V,
VGS=0,
f=100KHz
pF
nC
7.5
1.15
0.06
0.15
0.23
22
VDS=10V,
VGS=4.5V,
ID=0.55A
QGD
Td(ON)
Tr
Td(OFF)
Tf
VDD=10V,
I D=0.55A,
VGS=4.5V,
RG=6Ω.
80
nS
Turn-off Delay Time
Fall Time
700
380
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
12-Mar-2013 Rev. A
Page 2 of 4
SCG4153
0.8A , 20V , RDS(ON) 310 mΩ
N-Channel Enhancement Mode MOSFET
Elektronische Bauelemente
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
12-Mar-2013 Rev. A
Page 3 of 4
SCG4153
0.8A , 20V , RDS(ON) 310 mΩ
N-Channel Enhancement Mode MOSFET
Elektronische Bauelemente
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
12-Mar-2013 Rev. A
Page 4 of 4
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