SMG2322N [SECOS]

N-Channel Enhancement MOSFET; N沟道增强型MOSFET
SMG2322N
型号: SMG2322N
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

N-Channel Enhancement MOSFET
N沟道增强型MOSFET

文件: 总4页 (文件大小:567K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SMG2322N  
2.5A, 30V, RDS(ON) 85 m  
N-Channel Enhancement MOSFET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen & lead-free  
DESCRIPTION  
SC-59  
These miniature surface mount MOSFETs utilize a  
high cell density trench process to provide low RDS(on)  
and to ensure minimal power loss and heat dissipation.  
A
L
3
3
Top View  
C B  
1
1
2
FEATURES  
2
K
F
E
Low RDS(on) provides higher efficiency and extends  
battery life.  
D
Low thermal impedance copper leadframe SC-59  
saves board space.  
H
J
G
Fast switching speed.  
High performance trench technology.  
Millimeter  
Min. Max.  
Millimeter  
Min. Max.  
0.10 REF.  
0.40 REF.  
REF.  
REF.  
A
B
C
D
2.70  
2.25  
1.30  
1.00  
3.10  
3.00  
1.70  
1.40  
G
H
J
0.10  
0.20  
APPLICATION  
K
0.45  
0.55  
E
F
1.70  
0.35  
2.30  
0.50  
L
0.85  
1.15  
DC-DC converters and power management in portable  
and battery-powered products such as computers, printers,  
PCMCIA cards, cellular and cordless telephones.  
PACKAGE INFORMATION  
Package  
MPQ  
LeaderSize  
SC-59  
3K  
7’ inch  
ABSOLUTE MAXIMUM RATINGS(TA=25°C unless otherwise specified)  
Parameter  
Symbol  
Rating  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
30  
±20  
2.5  
V
V
TA=25°C  
TA=70°C  
Continuous Drain Current 1  
ID  
A
2
Pulsed Drain Current 2  
IDM  
IS  
10  
A
A
Continuous Source Current (Diode Conduction) 1  
TA=25°C  
TA=70°C  
Operating Junction and Storage Temperature Range  
0.46  
1.25  
0.8  
Power Dissipation 1  
PD  
W
TJ, TSTG  
-55~150  
°C  
Thermal Resistance Rating  
t5 sec  
RθJA  
150  
200  
Maximum Junction to Ambient 1  
°C/W  
Steady-State  
Notes:  
1. Surface Mounted on 1” x 1” FR4 Board.  
2. Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
12-Apr-2011 Rev. B  
Page 1 of 4  
SMG2322N  
2.5A, 30V, RDS(ON) 85 m  
N-Channel Enhancement MOSFET  
Elektronische Bauelemente  
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)  
Parameter  
Symbol  
Min. Typ. Max. Unit  
Static  
Test Condition  
Gate-Threshold Voltage  
VGS(th)  
IGSS  
1
-
1.5  
4
3
100  
1
V
VDS=VGS, ID=250μA  
Gate-Body Leakage  
nA  
VDS=0, VGS=8V  
-
-
VDS=16V, VGS=0  
VDS=20V, VGS=0, TJ=55°C  
VDS=5V, VGS=4.5V  
VGS=10V, ID=2.5A  
VGS=4.5V, ID=1.7A  
VDS=5V,,ID=3A  
Zero Gate Voltage Drain Current  
On-State Drain Current 1  
Drain-Source On-Resistance 1  
IDSS  
ID(ON)  
μA  
A
-
-
10  
-
6
-
-
62  
102  
3.5  
0.65  
85  
125  
-
RDS(ON)  
mΩ  
-
Forward Transconductance 1  
Diode Forward Voltage  
gFS  
-
S
V
VSD  
-
-
IS=0.46A, VGS=0  
Dynamic 2  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-On Delay Time  
Rise Time  
Qg  
Qgs  
-
-
-
-
-
-
-
-
-
-
3.5  
7
2
ID=2.5A  
nC  
pF  
V
V
DS=10V  
GS=4.5V  
0.8  
1.0  
720  
165  
60  
Qgd  
2
Ciss  
1500  
400  
200  
20  
VDS=15V  
GS=0  
V
Coss  
Crss  
Td(ON)  
Tr  
f=1MHz  
10  
ID=1A, VDD=10V  
VGEN=4.5V  
RG=6Ω  
13  
30  
nS  
Turn-Off Delay Time  
Td(OFF)  
Tf  
14  
30  
Fall Time  
Notes:  
4
20  
1. Pulse testPW 300 us duty cycle 2%.  
2. Guaranteed by design, not subject to production testing.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
12-Apr-2011 Rev. B  
Page 2 of 4  
SMG2322N  
2.5A, 30V, RDS(ON) 85 m  
N-Channel Enhancement MOSFET  
Elektronische Bauelemente  
CHARACTERISTIC CURVE  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
12-Apr-2011 Rev. B  
Page 3 of 4  
SMG2322N  
2.5A, 30V, RDS(ON) 85 m  
N-Channel Enhancement MOSFET  
Elektronische Bauelemente  
CHARACTERISTIC CURVE  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
12-Apr-2011 Rev. B  
Page 4 of 4  

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