SSD408 [SECOS]

N-Channel Enhancement Mode Power Mos.FET; N沟道增强模式电源Mos.FET
SSD408
型号: SSD408
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

N-Channel Enhancement Mode Power Mos.FET
N沟道增强模式电源Mos.FET

文件: 总4页 (文件大小:430K)
中文:  中文翻译
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SSD408  
Ω
18A, 30V,RDS(ON)18m  
Elektronische Bauelemente  
N-Channel Enhancement Mode PowerMos.FET  
RoHS Compliant Product  
Description  
TO-252  
The SSD408 uses advanced trench technology to provide  
excellent on-resistance and low gate charge.  
The TO-252 package is universally preferred for all commercial-industrial  
surface mount applications and suited for use as a load switch or in  
PWM applications.  
Features  
* Simple Drive Requirement  
* Lower On-resistance  
* Fast Switching Characteristic  
D
Millimeter  
Millimeter  
Min.  
0.50  
2.20  
0.45  
0
0.90  
5.40  
0.80  
REF.  
REF.  
Min.  
Max.  
6.80  
5.50  
7.20  
2.80  
Max.  
0.70  
2.40  
0.55  
0.15  
1.50  
5.80  
1.20  
A
B
C
D
E
F
6.40  
5.20  
6.80  
2.20  
G
H
J
K
L
G
2.30 REF.  
0.70  
0.60  
0.90  
0.90  
M
R
S
S
Absolute Maximum Ratings  
Parameter  
Symbol  
VDS  
Ratings  
Unit  
V
Drain-Source Voltage  
30  
Gate-Source Voltage  
VGS  
±20  
V
Continuous Drain Current, VGS@10V  
Continuous Drain Current, VGS@10V  
Pulsed Drain Current1  
ID @TC=25к  
ID @TC=100к  
IDM  
18  
A
14  
A
70  
A
Total Power Dissipation  
PD @TC=25к  
60  
0.4  
W
Linear Derating Factor  
W/к  
mJ  
A
Single Pulse Avalanche Energy2  
Single Pulse Avalanche Current  
Operating Junction and Storage Temperature Range  
EAS  
IAS  
60  
35  
Tj, Tstg  
-55 ~ +175  
к
Thermal Data  
Parameter  
Symbol  
Rthj-c  
Value  
2.5  
Unit  
к/W  
к/W  
Thermal Resistance Junction-case  
Thermal Resistance Junction-ambient  
Max.  
Max.  
Rthj-a  
50  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 1 of 4  
SSD408  
Ω
18A, 30V,RDS(ON)18m  
Elektronische Bauelemente  
N-Channel Enhancement Mode PowerMos.FET  
Electrical Characteristics (Tj = 25к unless otherwise specified)  
Parameter  
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
Forward Transconductance  
Gate-Source Leakage Current  
Drain-  
Symbol Min.  
Typ.  
Max.  
Unit  
Test Conditions  
VGS=0, ID=250uA  
30  
-
-
V
BVDSS  
VGS(th)  
gfs  
1.0  
-
-
2.5  
V
VDS=VGS, ID=250uA  
VDS=5V, ID=18A  
VGS= ±20V  
25  
-
-
S
-
±100  
nA  
uA  
uA  
IGSS  
-
-
1
5
18  
27  
25  
-
VDS=30V, VGS=0  
VDS=24V, VGS=0  
VGS=10V, ID=18A  
VGS=4.5V, ID=10A  
IDSS  
Drain-Source Leakage Current(Tj=55к)  
-
-
-
-
Static Drain-Source On-Resistance3  
m  
RDS(ON)  
-
-
Total Gate Charge3  
Gate-Source Charge  
Gate-Drain (“Miller”) Change  
Turn-on Delay Time3  
Rise Time  
-
19.8  
2.5  
3.5  
4.5  
3.9  
17.4  
3.2  
Qg  
Qgs  
Qgd  
Td(on)  
Tr  
ID=18A  
VDS=15V  
nC  
-
VGS=10V  
-
-
-
-
VDS=15V  
GS=10V  
-
-
V
ns  
RG=3ꢀ  
RL=0.82ꢀ  
Turn-off Delay Time  
Fall Time  
-
-
Td(off)  
Tf  
-
-
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
-
1040 1250  
Ciss  
Coss  
Crss  
VGS=0V  
VDS=15V  
f=1.0MHz  
pF  
-
180  
110  
-
-
-
Source-Drain Diode  
Parameter  
Forward On Voltage3  
Symbol Min.  
Typ.  
Max.  
Unit  
V
Test Conditions  
-
-
-
1.0  
18  
-
VSD  
IS=1A, VGS=0V  
Continuous Source Current (Body Diode)  
Reverse Recovery Time3  
Reverse Recovery Charge  
-
-
-
A
IS  
Trr  
Qrr  
19  
8
ns  
nC  
IS=18A, VGS=0V  
dI/dt=100A/s  
-
Notes: 1. Pulse width limited by safe operating area.  
2. Staring Tj=25к, VDD=25V, L=0.1mH, RG=25.  
3. Pulse widthЉ300us, duty cycleЉ2%.  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 2 of 4  
SSD408  
Ω
18A, 30V,RDS(ON)18m  
Elektronische Bauelemente  
N-Channel Enhancement Mode PowerMos.FET  
Characteristics Curve  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
Fig 3. On-Resistance v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
10  
1
0.1  
0.01  
0.001  
0.0001  
0.00001  
Fig 6. Type Power Dissipation  
Fig 5. Maximum Drain Current  
v.s. Case Temperature  
http://www.SeCoSGmbH.com/  
01-Jun-2002 Rev. A  
Any changing of specification will not be informed individual  
Page 3 of 4  
SSD408  
Ω
18A, 30V,RDS(ON)18m  
Elektronische Bauelemente  
N-Channel Enhancement Mode PowerMos.FET  
Fig 7. Maximum Safe Operating Area  
Fig 8. Effective Transient Thermal Impedance  
Fig 10. Typical Capacitance Characteristics  
Fig 9. Gate Charge Characteristics  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Fig 11. Normalized Maximum Transient Thermal Impedance  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 4 of 4  

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