SSG4536C_15 [SECOS]

N & P-Ch Enhancement Mode Power MOSFET;
SSG4536C_15
型号: SSG4536C_15
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

N & P-Ch Enhancement Mode Power MOSFET

文件: 总2页 (文件大小:126K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSG4536C  
N-Ch: 7.1A, 30V, RDS(ON) 28 mΩ  
P-Ch: -6A, -30V, RDS(ON) 39 mΩ  
N & P-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen & lead-free  
DESCRIPTION  
SOP-8  
These miniature surface mount MOSFETs  
B
utilize a high cell density trench process to provide low  
RDS(on) and to ensure minimal power loss and heat  
dissipation.  
L
D
M
FEATURES  
Low RDS(on) provides higher efficiency and  
extends battery life.  
Low thermal impedance copper leadframe  
SOP-8 saves board space  
A
C
J
N
E
K
H
G
F
Fast switching speed  
High performance trench technology  
Millimeter  
Min. Max.  
5.8 6.20  
Millimeter  
REF.  
REF.  
Min.  
Max.  
A
B
C
D
E
F
H
J
K
L
M
N
0.35  
0.51  
4.80  
3.80  
0°  
5.00  
4.00  
8°  
0.375 REF.  
APPLICATION  
45°  
1.35  
0.10  
1.75  
0.25  
DC-DC converters and power management in  
0.50  
0.19  
0.93  
0.25  
0.25 REF.  
portable and battery-powered products such as computers,.  
printers, PCMCIA cards, cellular and cordless telephones  
G
1.27 TYP.  
Top View  
PACKAGE INFORMATION  
Package  
MPQ  
Leader Size  
SOP-8  
2.5K  
13 inch  
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)  
Rating  
Parameter  
Symbol  
Unit  
N-CH  
30  
P-CH  
-30  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
V
A
±20  
7.1  
5.8  
20  
±20  
-6  
TA = 25°C  
TA = 70°C  
Continuous Drain Current 1  
ID  
-4.9  
-20  
A
Pulsed Drain Current 2  
IDM  
IS  
A
A
Continuous Source Current (Diode Conduction) 1  
1.3  
-1.3  
TA = 25°C  
Total Power Dissipation 1  
2.1  
1.3  
W
W
°C  
PD  
TA = 70°C  
Operating Junction & Storage Temperature Range  
TJ, TSTG  
-55 ~ 150  
Thermal Resistance Ratings  
t10 sec  
Steady State  
62.5  
110  
°C / W  
°C / W  
Maximum Junction-to-Ambient 1  
RθJA  
Notes:  
1. Surface Mounted on 1” x 1” FR4 Board.  
2. Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
12-Sep-2012 Rev. A  
Page 1 of 2  
SSG4536C  
N-Ch: 7.1A, 30V, RDS(ON) 28 mΩ  
P-Ch: -6A, -30V, RDS(ON) 39 mΩ  
N & P-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)  
Parameter  
Ch  
Symbol  
Min.  
Typ.  
Static  
Max.  
Unit  
Teat Conditions  
N
P
N
P
N
P
N
P
1
-
-
-
VDS=VGS, ID=250µA  
Gate Threshold Voltage  
VGS(th)  
V
nA  
µA  
A
-1  
-
±100  
±100  
1
VDS=VGS, ID= -250µA  
VDS=0, VGS=20V  
-
-
Gate-Body Leakage Current  
Zero Gate Voltage Drain Current  
On-State Drain Current 1  
IGSS  
-
-
VDS=0, VGS= -20V  
VDS=24V, VGS=0  
-
-
IDSS  
-
-
-1  
VDS= -24V, VGS=0  
VDS=5V, VGS=10V  
VDS= -5V, VGS= -10V  
VGS=10V, ID=7.1A  
VGS=4.5V, ID=5.8A  
VGS= -10V, ID= -6A  
VGS= -4.5V, ID= -4.9A  
VDS=15V, ID=6.9A  
VDS= -15V, ID= -5.2A  
20  
-
-
ID(on)  
-20  
-
-
-
-
-
-
-
-
-
28  
42  
39  
59  
-
N
P
-
Drain-Source On-Resistance 1  
Forward Transconductance 1  
RDS(ON)  
mΩ  
-
-
N
P
25  
gfs  
S
10  
-
Dynamic 2  
N
P
N
P
N
P
N
P
N
P
N
P
N
P
-
-
-
-
-
-
-
-
-
-
-
-
-
-
4
10  
1.1  
2.2  
1.4  
1.7  
8
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Total Gate Charge  
Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
Turn-On Delay Time  
Rise Time  
Qg  
Qgs  
Qgd  
Td(on)  
Tr  
N-Channel  
ID=6.9A, VDS=15V, VGS=10V  
nC  
P-Channel  
ID= -5.2A, VDS= -15V, VGS= -10V  
10  
5
N-Channel  
VDD=15V, VGS=10V  
ID=1A, RGEN=6Ω  
2.8  
23  
53.6  
3
nS  
P-Channel  
VDD= -15V, VGS= -10V  
ID= -1A, RGEN= 6Ω  
Turn-Off Delay Time  
Td(off)  
Fall Time  
Notes  
Tf  
46  
1. Pulse testPW 300µs duty cycle 2%.  
2. Guaranteed by design, not subject to production testing.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
12-Sep-2012 Rev. A  
Page 2 of 2  

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