SEMIX202GB066HDS_08 [SEMIKRON]

Trench IGBT Modules; 沟道IGBT模块
SEMIX202GB066HDS_08
型号: SEMIX202GB066HDS_08
厂家: SEMIKRON INTERNATIONAL    SEMIKRON INTERNATIONAL
描述:

Trench IGBT Modules
沟道IGBT模块

双极性晶体管
文件: 总5页 (文件大小:356K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMiX202GB066HDs  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
IGBT  
VCES  
600  
274  
V
A
A
A
A
V
Tc = 25 °C  
Tc = 80 °C  
IC  
Tj = 175 °C  
207  
ICnom  
ICRM  
VGES  
200  
ICRM = 2xICnom  
400  
-20 ... 20  
SEMiX®2s  
VCC = 360 V  
VGE 15 V  
Tj = 150 °C  
VCES 600 V  
tpsc  
6
µs  
°C  
Trench IGBT Modules  
Tj  
-40 ... 175  
Inverse diode  
SEMiX202GB066HDs  
Tc = 25 °C  
Tc = 80 °C  
IF  
291  
214  
A
A
Tj = 175 °C  
Preliminary Data  
IFnom  
IFRM  
IFSM  
Tj  
200  
A
Features  
• Homogeneous Si  
• Trench = Trenchgate technology  
• VCE(sat) with positive temperature  
coefficient  
IFRM = 2xIFnom  
tp = 10 ms, sin 180°, Tj = 25 °C  
400  
A
1000  
A
-40 ... 175  
°C  
Module  
It(RMS)  
Tstg  
• UL recognised file no. E63532  
600  
-40 ... 125  
4000  
A
°C  
V
Typical Applications  
Visol  
AC sinus 50Hz, t = 1 min  
• Matrix Converter  
• Resonant Inverter  
• Current Source Inverter  
Characteristics  
Symbol Conditions  
IGBT  
min.  
typ.  
max.  
Unit  
Remarks  
• Case temperature limited to TC=125°C  
max.  
• Product reliability results are valid for  
Tj=150°C  
• For short circuit: Soft RGoff  
recommended  
IC = 200 A  
VCE(sat)  
Tj = 25 °C  
1.45  
1.70  
1.9  
2.1  
V
V
V
GE = 15 V  
Tj = 150 °C  
chiplevel  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
VCE0  
rCE  
0.9  
0.85  
2.8  
1
V
V
0.9  
4.5  
6.0  
6.5  
0.45  
• Take care of over-voltage caused by  
stray inductance  
mΩ  
mΩ  
V
VGE = 15 V  
4.3  
VGE(th)  
ICES  
VGE=VCE, IC = 3.2 mA  
Tj = 25 °C  
V
5
5.8  
0.15  
mA  
mA  
nF  
nF  
nF  
nC  
VGE = 0 V  
CE = 600 V  
Tj = 150 °C  
f = 1 MHz  
f = 1 MHz  
f = 1 MHz  
Cies  
Coes  
Cres  
QG  
12.3  
0.77  
0.37  
1600  
1.00  
65  
VCE = 25 V  
GE = 0 V  
V
VGE = - 8 V...+ 15 V  
Tj = 25 °C  
RGint  
td(on)  
tr  
ns  
VCC = 300 V  
IC = 200 A  
Tj = 150 °C  
80  
ns  
Eon  
6
mJ  
ns  
R
R
G on = 4.2 Ω  
G off = 4.2 Ω  
td(off)  
tf  
545  
95  
ns  
Eoff  
8
mJ  
K/W  
K/W  
Rth(j-c)  
Rth(j-s)  
per IGBT  
per IGBT  
0.21  
GB  
© by SEMIKRON  
Rev. 18 – 02.12.2008  
1
SEMiX202GB066HDs  
Characteristics  
Symbol Conditions  
Inverse diode  
min.  
typ.  
max.  
Unit  
IF = 200 A  
VF = VEC  
Tj = 25 °C  
1.4  
1.4  
1.6  
1.6  
V
V
V
GE = 0 V  
Tj = 150 °C  
chiplevel  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
VF0  
rF  
0.9  
0.75  
1.5  
1
1.1  
0.95  
2.5  
V
V
0.85  
2.0  
2.8  
205  
28  
mΩ  
mΩ  
A
SEMiX®2s  
2.3  
3.3  
IF = 200 A  
di/dtoff = 3900 A/µs  
IRRM  
Qrr  
µC  
V
V
GE = -8 V  
CC = 300 V  
Trench IGBT Modules  
Tj = 150 °C  
Err  
6.5  
mJ  
Rth(j-c)  
Rth(j-s)  
per diode  
per diode  
0.27  
K/W  
K/W  
SEMiX202GB066HDs  
Preliminary Data  
Module  
LCE  
18  
0.7  
nH  
mΩ  
mΩ  
K/W  
Nm  
Nm  
Nm  
g
Features  
• Homogeneous Si  
TC = 25 °C  
RCC'+EE'  
res., terminal-chip  
TC = 125 °C  
1
• Trench = Trenchgate technology  
• VCE(sat) with positive temperature  
coefficient  
Rth(c-s)  
Ms  
per module  
0.045  
to heat sink (M5)  
3
5
5
• UL recognised file no. E63532  
to terminals (M6)  
Mt  
2.5  
Typical Applications  
w
250  
• Matrix Converter  
• Resonant Inverter  
• Current Source Inverter  
Temperature sensor  
0,493  
±5%  
R100  
Tc=100°C (R25=5 k)  
kΩ  
Remarks  
• Case temperature limited to TC=125°C  
max.  
R(T)=R100exp[B100/125(1/T-1/T100)];  
T[K];  
3550  
±2%  
B100/125  
K
• Product reliability results are valid for  
Tj=150°C  
• For short circuit: Soft RGoff  
recommended  
• Take care of over-voltage caused by  
stray inductance  
GB  
2
Rev. 18 – 02.12.2008  
© by SEMIKRON  
SEMiX202GB066HDs  
Fig. 1 Typ. output characteristic, inclusive RCC'+ EE'  
Fig. 2 Rated current vs. temperature IC = f (TC)  
Fig. 4 Typ. turn-on /-off energy = f (RG)  
Fig. 6 Typ. gate charge characteristic  
Fig. 3 Typ. turn-on /-off energy = f (IC)  
Fig. 5 Typ. transfer characteristic  
© by SEMIKRON  
Rev. 18 – 02.12.2008  
3
SEMiX202GB066HDs  
Fig. 7 Typ. switching times vs. IC  
Fig. 8 Typ. switching times vs. gate resistor RG  
Fig. 9 Typ. transient thermal impedance  
Fig. 10 Typ. CAL diode forward charact., incl. RCC'+EE'  
Fig. 11 Typ. CAL diode peak reverse recovery current  
Fig. 12 Typ. CAL diode recovery charge  
4
Rev. 18 – 02.12.2008  
© by SEMIKRON  
SEMiX202GB066HDs  
SEMiX 2s  
GB  
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX  
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied  
is made regarding delivery, performance or suitability.  
© by SEMIKRON  
Rev. 18 – 02.12.2008  
5

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