SKIIP232GH120-210CTVU [SEMIKRON]
Half Bridge Based Peripheral Driver, 250A;
| 型号： | SKIIP232GH120-210CTVU |
| 厂家： | 
SEMIKRON INTERNATIONAL |
| 描述： | Half Bridge Based Peripheral Driver, 250A 驱动 接口集成电路 |
| 文件： | 总3页 (文件大小：100K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SKiiP 232 GH 120 - 210 CTV
Absolute Maximum Ratings
SKiiPPACK
SK integrated intelligent
Power PACK
Symbol Conditions 1)
Values
3000
Units
V
4)
Visol
AC, 1min
single phase bridge
SKiiP
Top ,Tstg
Operating / stor. temperature
-25...+85
°C
232 GH 120 - 210 CTV 7,9)
IGBT and Inverse Diode
VCES
1200
900
200
V
V
A
°C
A
Preliminary Data
Case S2
5)
VCC
IC
Tj
Operating DC link voltage
IGBT
IGBT + Diode
Diode
3)
-40...+150
200
IF
IFM
IFSM
Diode, tp < 1 ms
Diode, Tj = 150 °C, 10ms; sin
400
1440
10
A
A
I2t (Diode) Diode, Tj = 150 °C, 10ms
Driver
kAs2
VS1
VS2
fsmax
dV/dt
Stabilized Power Supply
Non-stabilized Power Supply
Switching frequency
18
30
20
75
V
V
kHz
kV/µs
Primary to secondary side
Characteristics
Symbol Conditions 1)
min.
typ.
max.
Units
Features
IGBT11)
V(BR)CES
• Short circuit protection, due to
evaluation of current sensor
signals
Driver without supply
V
mA
mA
≥VCES
−
−
10
−
0,4
−
1,38
10,5
3,2
3,05
60/98
ICES
VGE = 0,
CE = VCES
Tj = 25 °C
Tj = 125 °C
−
−
−
−
−
−
−
V
• Isolated power supply
• Low thermal impedance
• Optimal thermal management
with integrated heatsink
• Pressure contact technology
with increased power cycling
capability, compact design
• Low stray inductance
• High power, small losses
• Over-temperature protection
VTO
rT
VCesat
VCesat
Tj = 125 °C
Tj = 125 °C
IC = 175A,
IC = 175A,
V
−
−
−
−
−
mΩ
V
V
Tj = 125 °C
Tj = 25 °C
Eon + Eoff VCC=600/900V,IC=200A
Tj = 125 °C
mJ
CCHC
LCE
per Phase, AC side
Top, Bottom
1,4
15
nF
nH
−
−
−
−
Inverse Diode 2)
1)
Theatsink = 25 °C, unless
VF = VEC IF= 175A;
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
2,45
2,55
8
0,91
5,7
V
V
mJ
V
−
−
−
−
−
−
−
−
−
−
otherwise specified
CAL = Controlled Axial Lifetime
VF= VEC
IF= 175A;
2)
Eon + Eoff IF= 200A;
Technology (soft and fast)
without driver
Driver input to DC link /
3)
VTO
rT
Tj = 125 °C
Tj = 125 °C
4)
mΩ
AC output to DC link / AC
output to heatsink
with Semikron-DC link (low
inductance)
other heatsinks on request
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
options available for driver:
Thermal Characteristics
10)
Rthjs
Rthjs
Rthsa
per IGBT
per Diode
P16 heatsink; see case S2
0,129
0,375
44
K/W
K/W
K/KW
−
−
−
−
−
−
5)
10)
6,10)
6)
Driver
IS1
IS2
7)
Supply current 15V-supply
Supply current 24V-supply
Interlock-time
230+230*fs /fsmax+2,5*IAC/A
170+180*fs /fsmax+1,9*IAC/A
2,3
mA
mA
µs
9)
tinterlock-driver
SKiiPPACK protection
U - DC link voltage sense
F – Fiber optic connector
“s” referenced to temperature
ITRIPSC
ITRIPLG
TTRIP
Short circuit protection
250
58
115
920
A
A
°C
V
10)
Ground fault protection
Over-temp. protection
UDC-protection
sensor
11)
9)
NPT-technology with homo-
genous current-distribution
UDCTRIP
Mechanical Data
M1
M2
DC terminals, SI Units
AC terminals, SI Units
4
8
6
10
Nm
Nm
−
−
by SEMIKRON
0898
B 7 − 49
PIN-array - H-bridge driver SKiiPPACK type „GH”
X1:
Pin
1
signal
remark
shield
connected to GND, when shielded cable is used
positive 15V CMOS logic; 10 kΩ impedance
positive 15V CMOS logic; 10 kΩ impedance
positive 15V CMOS logic; 10 kΩ impedance
positive 15V CMOS logic; 10 kΩ impedance
2
BOT HB 1 IN4)
TOP HB 1 IN4)
BOT HB 2 IN4)
TOP HB 2 IN4)
reserved
3
4
5
6
7
Overtemp. OUT 1)
LOW = NO ERROR = ϑDCB < 115 + 5°C
open collector Output; max. 30 V / 15 mA
„low“ output voltage < 0,6 V
„high“ output voltage max. 30 V
8
ERROR OUT 1)
LOW = NO ERROR; open collector Output; max.
30 V / 15 mA
propagation delay 1 µs,
min. pulsewidth error-memory-reset 8 µs
9
GND
GND for power supply and
GND for digital signals
10
11
12
GND
+ 15 VDC IN
+ 15 VDC IN
15 VDC + 4 % power supply
don´t supply with 15 V, when using + 24 VDCIN
supply voltage monitoring threshold 13 V
13
14
+ 24 VDC IN
+ 24 VDC IN
24 VDC (20 - 30 V) power supply
don´t supply with 24 V, when using + 15 VDC
supply voltage monitoring threshold 15,6 V
15
UDC analog OUT
UDC when using option „U”
actual DC-link voltage, 9,0 V refer to UDCmax
16
17
18
Temp. analog OUT
GND aux2)
max. output current 5 mA
GND for analog signals
I analog OUT HB 1
current actual value, 8,0 V refer to 100 % IC
overcurrent trip level 10 V
125 %; IC @ 25 °C
SKiiP is source
SKiiP is sink
current value > 0
current value < 0
19
20
I analog OUT HB 2
GND aux2)
current actual value, 8,0 V refer to 100 % IC
overcurrent trip level 10 V 125 %; IC @ 25 °C
SKiiP is source
SKiiP is sink
current value > 0
current value < 0
X10: halfbridge 1 (HB1) OUT X11: halfbridge 2 (HB2) OUT
Pin Signal
Pin Signal
1
2
1
2
Temp.-Sensor (HB2)1
Temp.-Sensor (HB2)2
8
Collector 1=TOP (HB1)
8
Collector 1=TOP (HB2)
11 Gate 1=TOP (HB1)
12 Emitter 1=TOP (HB1)
13 Collector 2=BOT (HB1)
11 Gate 1=TOP (HB2)
12 Emitter 1=TOP (HB2)
13 Collector 2=BOT (HB2)
1) Open collector output, external pull
up resistor necessary
2) GND aux = reference for analog
output signals
16 Gate 2=BOT (HB1)
17 Emitter 2=BOT (HB1)
16 Gate 2=BOT (HB2)
17 Emitter 2=BOT (HB2)
4) „high“ (min) 11,2 V
„low“ (max) 5,4 V
© by SEMIKRON
0898
B 7 – 7
Case S2
SKiiPPACK 2 - GB; GH
Weight without heatsink: 1,85 kg
P16: 4,7 kg
SKiiPPACK 2 - GB with F-option
© by SEMIKRON
0898
B 7 – 2
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