ECLAMP2384K.TCT [SEMTECH]
ESD/EMI Protection for Color LCD Interfaces; ESD / EMI保护彩色液晶显示器接口型号: | ECLAMP2384K.TCT |
厂家: | SEMTECH CORPORATION |
描述: | ESD/EMI Protection for Color LCD Interfaces |
文件: | 总8页 (文件大小:158K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
EClamp2384K
ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClampTM
Features
Description
The EClampTM2384K is a low pass filter array with
integrated TVS diodes. It is designed to suppress un-
wanted EMI/RFI signals and provide electrostatic dis-
charge (ESD) protection in portable electronic equip-
ment. This state-of-the-art device utilizes solid-state
silicon-avalanche technology for superior clamping
performance and DC electrical characteristics. It has
been optimized for protection of color LCD panels
in cellular phones and other portable electronics.
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 30dB minimum attenuation
800MHz to 2.7GHz
TVS working voltage: 5V
Resistor: 200Ω +/− 15%
Typical Capacitance: 12pF (VR = 2.5V)
Protection and filtering for four lines
Solid-state technology
The device consists of four identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 200Ω and a capacitance value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4.
Mechanical Characteristics
SLP1713P8 8-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.3 x 0.50 mm
Lead Pitch: 0.40mm
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
The EClamp2384K is in a 8-pin, RoHS/WEEE compliant,
SLP1713P8 package. It measures 1.7 x 1.3 x 0.50mm.
The leads are spaced at a pitch of 0.4mm and are
finished with lead-free NiPdAu. The small package
makes it ideal for use in portable electronics such as
cell phones, digital still cameras, and PDAs.
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
Package Configuration
Circuit Diagram (Each Line)
1.70
1
2
200 Ω
IN
OUT
1.30
12pF 12pF
0.40 BSC
GND
0.50
Device Schematic (4X)
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
www.semtech.com
Revision 11/15/2007
1
EClamp2384K
PROTECTION PRODUCTS
Maximum Ratings
Rating
Symbol
Value
Units
kV
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
+/- 17
+/- 12
VESD
Junction Temperature
Operating Temperature
Storage Temperature
TJ
125
oC
Top
-40 to +85
oC
oC
TSTG
-55 to +150
Electrical Characteristics (T = 25oC)
Parameter
Symbol
VRWM
VBR
Conditions
Minimum
6
Typical
8
Maximum
Units
TVS Reverse Stand-Off Voltage
TVS Reverse Breakdown Voltage
TVS Reverse Leakage Current
Total Series Resistance
Capacitance
5
V
V
It = 1mA
VRWM = 3.0V
Each Line
10
IR
0.5
230
15
μA
R
170
10
200
12
Ohms
pF
C1, C2
Each Line
VR = 2.5V, f = 1MHz
Total Capacitance
Cin
Input to Gnd,
Each Line
20
24
30
pF
VR = 2.5V, f = 1MHz
www.semtech.com
© 2007 Semtech Corp.
2
EClamp2384K
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
Analog Crosstalk (Each Line)
CH1S21 LOG
20 dB /REF 0 dB
CH1 S21 LOG
6 dB / REF 0 dB
1: -12.305 dB
106.6 MHz
2: -35.996 dB
800 MHz
0 dB
3: -38.349 dB
1.8 GHz
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
4: -36.250 dB
2.7 GHz
2
4
3
1
MHz
10
MHz
100
MHz
3
1
3
.
STOP 000000000 MHz
START. 030MHz
GHz
GHz
3
.
STOP 000 000000 MHz
.
START 030 MHz
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Note: Data is taken with a 10x attenuator
Note: Data is taken with a 10x attenuator
Normalized Capacitance vs. Reverse Voltage
(Normalized to 2.5 volts)
2
1.5
1
0.5
f = 1 MHz
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Reverse Voltage - VR (V)
www.semtech.com
© 2007 Semtech Corp.
3
EClamp2384K
PROTECTION PRODUCTS
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2384K is comprised of four identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is in a 8-pin SLP package. Electrical con-
nection is made to the 8 pins located at the bottom of
the device. A center tab serves as the ground connec-
tion. The device has a flow through design for easy
layout. Pin connections are noted in Figure 1. All path
lengths should be kept as short as possible to minimize
the effects of parasitic inductance in the board traces.
Recommendations for the ground connection are given
below.
1
4
8
5
In 1
In 2
In 3
In 4
Out 1
Out 2
Gnd
Out 3
Out 4
Ground Connection Recommendation
Pin
1 - 4
Identification
Input Lines
Output Lines
Ground
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
5 - 8
Center Tab
Equation 1: The Impedance of an Inductor at
Frequency XLF
Figure 2 - Inductance of Rectangular Wire Loops
XLF(L,f) = 2*π*f *L
Ground
Via 1
Ground
Via 2
Where:
L= Inductance (H)
f = Frequency (Hz)
d
Signal Layer
x
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers sepa-
rated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
Ground Layer
Layer
y
Equation 2: Inductance of Rectangular Wire Loop
2*y
LRECT(d,x, y) = 10.16*10−9 *
x *ln+ y*ln
[
]
2*x
d
d
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
www.semtech.com
© 2007 Semtech Corp.
4
EClamp2384K
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20
mm) while the two external vias have a diameter of
0.010 inches (0.250mm). The internal vias are spaced
approximately evenly from the center of the pad. The
designer may choose to use more vias with a smaller
diameter (such as 0.005 inches or 0.125mm) since
changing the diameter of the via will result in little
change in inductance (i.e. the log function in Equation 2
in highly insensitive to parameter d) . Figure 4 shows a
typical insertion loss (S21) plot for the device using
Semtech’s filter evaluation board with 50 Ohm traces
and the recommended via configuration.
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
CH1 S21 LOG
6 dB / REF 0 dB
1: -12.305 dB
106.6 MHz
2: -35.996 dB
800 MHz
0 dB
3: -38.349 dB
1.8 GHz
-6 dB
1
-12 dB
-18 dB
4: -36.250 dB
2.7 GHz
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
2
4
3
Figure 3 - Recommended Layout Using Ground Vias
1
MHz
10
MHz
100
MHz
3
1
GHz
GHz
3
.
STOP 000 000000 MHz
.
START 030 MHz
www.semtech.com
© 2007 Semtech Corp.
5
EClamp2384K
PROTECTION PRODUCTS
Applications Information - Spice Model
Line In
0.5nH
0.5nH
Line Out
200
EClamp2384K Spice Model
Table 1 - EClamp2384K Spice Parameters
Parameter
Unit
Amp
Volt
Volt
Ohm
Amp
Farad
sec
--
D1 (TVS)
5.15E-15
7.53
D2 (TVS)
IS
BV
VJ
5.15E-15
7.53
0.75
0.75
RS
IBV
CJO
TT
0.426
1E-3
0.426
1E-3
23E-12
2.541E-9
0.256
1.1
23E-12
2.541E-9
0.256
1.1
M
N
--
EG
eV
1.11
1.11
www.semtech.com
© 2007 Semtech Corp.
6
EClamp2384K
PROTECTION PRODUCTS
Outline Drawing - SLP1713P8
A
D
DIMENSIONS
INCHES MILLIMETERS
MIN NOM MAX MIN NOM MAX
B
E
DIM
A
PIN 1
INDICATOR
(LASER MARK)
.018
.022 0.45 0.50 0.55
.002 0.00 0.02 0.05
(0.13)
.020
.001
(.005)
A1 .000
A2
b
D
D1
E
E1
e
L
N
aaa
.006 .008 .010 0.15 0.20 0.25
.065 .067 .070 1.65 1.70 1.775
1.30
1.20
.047 .051 .055
.049 .051 .054 1.25 1.30 1.375
0.30
1.40
.008
0.40
.012 .016 0.20
.016 BSC
0.40 BSC
A
SEATING
PLANE
0.25
8
.008 .010 .012 0.20
0.30
aaa C
A2
8
.003
.004
C
0.08
0.10
A1
bbb
D1
1
2
LxN
E/2
E1
N
bxN
e/2
bbb
C A B
e
D/2
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
2.
Land Pattern - SLP1713P8
P
X
DIMENSIONS
DIM
INCHES
MILLIMETERS
(.050)
.027
.012
.055
.016
.008
.023
.073
(1.27)
0.69
0.30
1.40
0.40
0.20
0.58
1.85
C
G
H
K
P
X
Y
Z
G
Z
(C)
H
Y
K
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
www.semtech.com
© 2007 Semtech Corp.
7
EClamp2384K
PROTECTION PRODUCTS
Marking
Ordering Information
Qty per
Reel
Part Number
Reel Size
EClamp2384K.TCT
3000
7 Inch
2384K
PIN 1
INDICATOR
YYWW
EMIClamp and EClamp are marks of Semtech Corporation
Note: YYWW = Date Code
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
B0
K0
1.51 +/-0.05 mm
1.91 +/-0.05 mm
0.66 +/-0.05 mm
Tape
K
(MAX)
B, (Max)
Width
D
D1
E
F
P
P0
P2
T(MAX)
W
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.750±.10
mm
(.069±.004)
4.0±0.1
mm
(.157±.00-
4)
4.0±0.1
mm
(.157±.00-
4)
8.0 mm
+ 0.3 mm
- 0.1 mm
0.8 mm
±0.05
(.031)
3.5±0.05
mm
(.138±.002)
2.0±0.05m-
m
(.079±.002)
4.2 mm
8 mm
2.4 mm
(.094)
0.4 mm
(.016)
(.165)
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2007 Semtech Corp.
8
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