ECLAMP2384P [SEMTECH]

ESD/EMI Protection for Color LCD Interfaces; ESD / EMI保护彩色液晶显示器接口


型号：	ECLAMP2384P
厂家：	SEMTECH CORPORATION
描述：	ESD/EMI Protection for Color LCD Interfaces ESD / EMI保护彩色液晶显示器接口显示器 CD
文件：	总8页 (文件大小：209K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EClamp2384P

ESD/EMI Protection

for Color LCD Interfaces

PRELIMINARY

PROTECTION PRODUCTS - EMIClamp^TM

Features

Description

The EClamp^TM2384P is a low pass filter array with

integrated TVS diodes. It is designed to suppress

unwanted EMI/RFI signals and provide electrostatic

discharge (ESD) protection in portable electronic

equipment. This state-of-the-art device utilizes solid-

state silicon-avalanche technology for superior clamp-

ing performance and DC electrical characteristics.

They have been optimized for protection of color

LCD panels in cellular phones and other portable

electronics.

Bidirectional EMI/RFI filter with integrated TVS

for ESD protection

ESD protection to IEC 61000-4-2 (ESD) Level 4,

±15kV (air), ±8kV (contact)

Filter performance: 30dB minimum attenuation

800MHz to 2.7GHz

TVS working voltage: 5V

Resistor: 200Ω +/− 15%

Typical Capacitance: 12pF (VR = 2.5V)

Protection and filtering for four lines

Solid-state technology

The device consists of four identical circuits comprised

of TVS diodes for ESD protection, and a resistor -

capacitor network for EMI/RFI filtering. A series

resistor value of 200Ω and a capacitance value of 12pF

are used to achieve 30dB minimum attenuation from

800MHz to 2.7GHz. The TVS diodes provide effective

suppression of ESD voltages in excess of ±15kV (air

discharge) and ±8kV (contact discharge) per IEC 61000-

4-2, level 4.

Mechanical Characteristics

SLP2116P8 8-pin package

RoHS/WEEE Compliant

Nominal Dimensions: 2.1 x 1.6 x 0.58 mm

Lead Pitch: 0.5mm

Lead finish: NiPd

Marking: Marking Code

Packaging: Tape and Reel per EIA 481

The EClamp2384P is in a 8-pin, RoHS/WEEE compliant,

SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm.

The leads are spaced at a pitch of 0.5mm and are

finished with lead-free NiPd. The small package makes it

ideal for use in portable electronics such as cell phones,

digital still cameras, and PDAs.

Applications

Color LCD Protection

Cell Phone CCD Camera Lines

Clamshell Cell Phones

Package Configuration

Circuit Diagram (Each Line)

2.10

200 Ω

OUT

1.60

0.50 BSC

12pF 12pF

GND

0.58

Device Schematic (4X)

8 Pin SLP package (Bottom Side View)

Nominal Dimensions in mm

www.semtech.com

Revision 1/25/2006

EClamp2384P

PRELIMINARY

PROTECTION PRODUCTS

Maximum Ratings

Rating

Symbol

Value

Units

ESD per IEC 61000-4-2 (Air)

ESD per IEC 61000-4-2 (Contact)

+/- 17

+/- 12

V_ESD

Junction Temperature

Operating Temperature

Storage Temperature

T_J

125

^oC

T_op

-40 to +85

^oC

T_STG

-55 to +150

Electrical Characteristics (T = 25^oC)

Parameter

Symbol

V_RWM

V_BR

Conditions

Minimum

Typical

Maximum

Units

TVS Reverse Stand-Off Voltage

TVS Reverse Breakdown Voltage

TVS Reverse Leakage Current

Total Series Resistance

Capacitance

I_t= 1mA

V_RWM= 3.0V

Each Line

I_R

0.5

230

µA

170

200

Ohms

C_1,C₂

Each Line

V_R= 2.5V, f = 1MHz

Total Capacitance

C_in

Input to Gnd,

Each Line

V_R= 2.5V, f = 1MHz

www.semtech.com

2006 Semtech Corp.

EClamp2384P

PRELIMINARY

PROTECTION PRODUCTS

Typical Characteristics

Typical Insertion Loss S21 (Each Line)

Analog Crosstalk (Each Line)

CH1S21 LOG

20 dB /REF 0 dB

CH1 S21 LOG

6 dB / REF 0 dB

1: -12.305 dB

106.6 MHz

2: -35.996 dB

800 MHz

0 dB

3: -38.349 dB

1.8 GHz

-6 dB

-12 dB

-18 dB

-24 dB

-30 dB

-36 dB

-42 dB

-48 dB

4: -36.250 dB

2.7 GHz

MHz

100

STOP 000000000 MHz

START. 030MHz

MHz

START 030 MHz

MHz

GHz

STOP 000 000000 MHz

ESD Clamping (+8kV Contact)

ESD Clamping (-8kV Contact)

Capacitance vs. Reverse Voltage

(Normalized to 2.5 volts)

1.5

0.5

f = 1 MHz

0.5

1.5

2.5

3.5

4.5

Reverse Voltage - V_R(V)

www.semtech.com

2006 Semtech Corp.

EClamp2384P

PRELIMINARY

PROTECTION PRODUCTS

Device Connection

Figure 1 - Pin Identification and Configuration

(Top Side View)

The EClamp2384P is comprised of four identical

circuits each consisting of a low pass filter for EMI/RFI

suppression and dual TVS diodes for ESD protection.

The device is in a 8-pin SLP package. Electrical con-

nection is made to the 8 pins located at the bottom of

the device. A center tab serves as the ground connec-

tion. The device has a flow through design for easy

layout. Pin connections are noted in Figure 1. All path

lengths should be kept as short as possible to minimize

the effects of parasitic inductance in the board traces.

Recommendations for the ground connection are given

below.

In 1

In 2

In 3

In 4

Out 1

Out 2

Out 3

Out 4

Gnd

Ground Connection Recommendation

1 - 4

Identification

Input Lines

Output Lines

Ground

Parasitic inductance present in the board layout will

affect the filtering performance of the device. As

frequency increases, the effect of the inductance

becomes more dominant. This effect is given by

Equation 1.

5 - 8

Center Tab

Equation 1: The Impedance of an Inductor at

Frequency XLF

Figure 2 - Inductance of Rectangular Wire Loops

XLF(L,f) = 2*π*f *L

Ground

Via 1

Ground

Via 2

Where:

L= Inductance (H)

f = Frequency (Hz)

Signal Layer

Via connections to the ground plane form rectangular

wire loops or ground loop inductance as shown in

Figure 2. Ground loop inductance can be reduced by

using multiple vias to make the connection to the

ground plane. Bringing the ground plane closer to the

signal layer (preferably the next layer) also reduces

ground loop inductance. Multiple vias in the device

ground pad will result in a lower inductive ground loop

over two exterior vias. Vias with a diameter d are

separated by a distance y run between layers sepa-

rated by a distance x. The inductance of the loop path

is given by Equation 2. Thus, decreasing distance x

and y will reduce the loop inductance and result in

better high frequency filter characteristics.

Ground Layer

Layer

Equation 2: Inductance of Rectangular Wire Loop

2*y

−9

2*x

LRECT(d,x, y) = 10.16*10 *

[

x *ln

[

]

+ y*ln

[

]

Where:

d = Diameter of the wire (in)

x = Length of wire loop (in)

y = Breath of wire loop (in)

www.semtech.com

2006 Semtech Corp.

EClamp2384P

PRELIMINARY

PROTECTION PRODUCTS

Applications Information

Figure 3 shows the recommended device layout. The

ground pad vias have a diameter of 0.008 inches (0.20

mm) while the two external vias have a diameter of

0.010 inches (0.250mm). The internal vias are spaced

approximately evenly from the center of the pad. The

designer may choose to use more vias with a smaller

diameter (such as 0.005 inches or 0.125mm) since

changing the diameter of the via will result in little

change in inductance (i.e. the log function in Equation 2

in highly insensitive to parameter d) . Figure 4 shows a

typical insertion loss (S21) plot for the device using

Semtech’s filter evaluation board with 50 Ohm traces

and the recommended via configuration.

Figure 4 - Filter Characteristics Using Recommended

Layout with Internal Vias

CH1 S21 LOG

6 dB / REF 0 dB

1: -12.305 dB

106.6 MHz

2: -35.996 dB

800 MHz

0 dB

3: -38.349 dB

1.8 GHz

-6 dB

-12 dB

-18 dB

4: -36.250 dB

2.7 GHz

-24 dB

-30 dB

-36 dB

-42 dB

-48 dB

Figure 3 - Recommended Layout Using Ground Vias

MHz

100

MHz

START 030 MHz

MHz

GHz

STOP 000 000000 MHz

www.semtech.com

2006 Semtech Corp.

EClamp2384P

PRELIMINARY

PROTECTION PRODUCTS

Applications Information - Spice Model

Line In

0.5nH

Line Out

200

EClamp2384P Spice Model

Table 1 - EClamp2384P Spice Parameters

Parameter

Unit

Amp

Volt

Ohm

Amp

Farad

sec

D1 (TVS)

5.15E-15

7.53

D2 (TVS)

5.15E-15

7.53

0.75

IBV

CJO

0.426

1E-3

0.426

1E-3

23E-12

2.541E-9

0.256

1.1

23E-12

2.541E-9

0.256

1.1

1.11

www.semtech.com

2006 Semtech Corp.

EClamp2384P

PRELIMINARY

PROTECTION PRODUCTS

Outline Drawing - SLP2116P8

DIMENSIONS

INCHES MILLIMETERS

DIM

MIN NOM MAX MIN NOM MAX

.020

.026 0.50 0.58 0.65

.023

.001

PIN 1

INDICATOR

.003

.002 0.00

0.05

(.006)

(0.15)

(LASER MARK)

.007 .010 .012 0.20 0.25 0.30

.079 .083 .087 2.00 2.10 2.20

1.70

.061 .067 .071 1.55

1.80

1.50 1.60 1.70

.059 .063 .067

SEATING

PLANE

0.40

0.50

.010 .016 .020 0.25

.020 BSC

0.50 BSC

aaa C

0.33

.011 .013 .015 0.28

0.38

aaa

.003

.004

0.08

0.10

bbb

LxN

bxN

E/2

bbb

C A B

D/2

NOTES:

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.

Land Pattern - SLP2116P8

DIMENSIONS

DIM

INCHES

MILLIMETERS

.071

.060

.018

.035

.020

.012

.025

.085

1.80

1.52

0.45

0.89

0.50

0.30

0.63

2.15

(C)

NOTES:

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

www.semtech.com

2006 Semtech Corp.

EClamp2384P

PRELIMINARY

PROTECTION PRODUCTS

Marking

Ordering Information

Qty per

Reel

Part Number

Reel Size

EClamp2384P.TCT

3000

7 Inch

2384P

PIN 1

EMIClamp and EClamp are marks of Semtech Corporation

INDICATOR

Tape and Reel Specification

Pin 1 Location

User Direction of feed

Device Orientation in Tape

1.96 +/-0.05 mm

2.31 +/-0.05 mm

0.74 +/-0.05 mm

Tape

(MAX)

B, (Max)

Width

T(MAX)

1.5 + 0.1 mm

- 0.0 mm

(0.59 +.005

- .000)

1.750±.10

(.069±.004)

4.0±0.1

(.157±.00-

4.0±0.1

(.157±.00-

8.0 mm

+ 0.3 mm

- 0.1 mm

0.8 mm

±0.05

(.031)

3.5±0.05

(.138±.002)

2.0±0.05m-

(.079±.002)

4.2 mm

8 mm

2.4 mm

(.094)

0.4 mm

(.016)

(.165)

(.312±.012)

Contact Information

Semtech Corporation

Protection Products Division

200 Flynn Rd., Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804

www.semtech.com

2006 Semtech Corp.

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