ECLAMP2388K.TCT [SEMTECH]

ESD/EMI Protection for Color LCD Interfaces; ESD / EMI保护彩色液晶显示器接口


型号：	ECLAMP2388K.TCT
厂家：	SEMTECH CORPORATION
描述：	ESD/EMI Protection for Color LCD Interfaces ESD / EMI保护彩色液晶显示器接口数据线路滤波器显示器过滤器 CD LTE
文件：	总8页 (文件大小：162K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EClamp2388K

ESD/EMI Protection

for Color LCD Interfaces

PRELIMINARY

PROTECTION PRODUCTS - EMIClamp^TM

Features

Description

The EClamp^TM2388K is a low pass filter array with

integrated TVS diodes. It is designed to suppress un-

wanted EMI/RFI signals and provide electrostatic dis-

charge (ESD) protection in portable electronic equip-

ment. This state-of-the-art device utilizes solid-state

silicon-avalanche technology for superior clamping

performance and DC electrical characteristics. It has

been optimized for protection of color LCD panels

in cellular phones and other portable electronics.

Bidirectional EMI/RFI filter with integrated TVS

for ESD protection

ESD protection to IEC 61000-4-2 (ESD) Level 4,

±15kV (air), ±8kV (contact)

Filter performance: 30dB minimum attenuation

800MHz to 2.7GHz

TVS working voltage: 5V

Resistor: 200Ω +/− 15%

Typical Capacitance: 12pF (VR = 2.5V)

Protection and filtering for eight lines

Solid-state technology

The device consists of eight identical circuits comprised

of TVS diodes for ESD protection, and a resistor -

capacitor network for EMI/RFI filtering. A series

resistor value of 200Ω and a capacitance value of 12pF

are used to achieve 30dB minimum attenuation from

800MHz to 2.7GHz. The TVS diodes provide effective

suppression of ESD voltages in excess of ±15kV (air

discharge) and ±8kV (contact discharge) per IEC 61000-

4-2, level 4.

Mechanical Characteristics

SLP3313P16 16-pin package

RoHS/WEEE Compliant

Nominal Dimensions: 3.3 x 1.3 x 0.50 mm

Lead Pitch: 0.4mm

Lead finish: NiPdAu

Marking: Marking Code

Packaging: Tape and Reel per EIA 481

The EClamp2388K is in a 16-pin, RoHS/WEEE compli-

ant, SLP3313P16 package. It measures 3.3 x 1.3 x

0.50mm. The leads are spaced at a pitch of 0.4mm

and are finished with lead-free NiPdAu. The small

package makes it ideal for use in portable electronics

such as cell phones, digital still cameras, and PDAs.

Applications

Color LCD Protection

Cell Phone CCD Camera Lines

CDMA/GSM Cell Phones

Package Configuration

Circuit Diagram (Each Line)

3.30

200 Ω

OUT

1.30

12pF 12pF

0.40 BSC

GND

0.50

Device Schematic (8X)

16 Pin SLP package (Bottom Side View)

Nominal Dimensions in mm

www.semtech.com

Revision 05/23/2007

EClamp2388K

PRELIMINARY

PROTECTION PRODUCTS

Maximum Ratings

Rating

Symbol

Value

Units

ESD per IEC 61000-4-2 (Air)

ESD per IEC 61000-4-2 (Contact)

+/- 17

+/- 12

V_ESD

Junction Temperature

Operating Temperature

Storage Temperature

T_J

125

^oC

T_op

-40 to +85

^oC

T_STG

-55 to +150

Electrical Characteristics (T = 25^oC)

Parameter

Symbol

V_RWM

V_BR

Conditions

Minimum

Typical

Maximum

Units

TVS Reverse Stand-Off Voltage

TVS Reverse Breakdown Voltage

TVS Reverse Leakage Current

Total Series Resistance

Capacitance

I_t= 1mA

V_RWM= 3.0V

Each Line

I_R

0.5

230

μA

170

200

Ohms

C_1,C₂

Each Line

V_R= 2.5V, f = 1MHz

Total Capacitance

C_in

Input to Gnd,

Each Line

V_R= 2.5V, f = 1MHz

www.semtech.com

EClamp2388K

PRELIMINARY

PROTECTION PRODUCTS

Typical Characteristics

Typical Insertion Loss S21 (Each Line)

Analog Crosstalk (Each Line)

CH1S21 LOG

20 dB /REF 0 dB

CH1 S21 LOG

6 dB / REF 0 dB

1: -12.522 dB

109 MHz

2: -36.148 dB

800 MHz

0 dB

3: -33.534 dB

1.8 GHz

-6 dB

-12 dB

-18 dB

4: -30.380 dB

2.7 GHz

-24 dB

-30 dB

-36 dB

-42 dB

-48 dB

MHz

100

MHz

GHz

STOP 000 000000MHz

START. 030 MHz

GHz

STOP 000 000000 MHz

START 030 MHz

ESD Clamping (+8kV Contact)

ESD Clamping (-8kV Contact)

Note: Data is taken with a 10x attenuator

Normalized Capacitance vs. Reverse Voltage

(Normalized to 2.5 volts)

1.5

0.5

f = 1 MHz

0.5

1.5

2.5

3.5

4.5

Reverse Voltage - V_R(V)

www.semtech.com

EClamp2388K

PRELIMINARY

PROTECTION PRODUCTS

Applications Information

Device Connection

Figure 1 - Pin Identification and Configuration

(Top Side View)

The EClamp2388K is comprised of eight identical circuits

each consisting of a low pass filter for EMI/RFI suppres-

sion and dual TVS diodes for ESD protection. The device

is in a 16-pin SLP package. Electrical connection is

made to the 16 pins located at the bottom of the device.

A center tab serves as the ground connection. The

device has a flow through design for easy layout. Pin

connections are noted in Figure 1. All path lengths

should be kept as short as possible to minimize the

effects of parasitic inductance in the board traces.

Recommendations for the ground connection are given

below.

In 1

In 2

In 3

In 4

In 5

In 6

In 7

In 8

Out 1

Out 2

Out 3

Out 4

Out 5

Out 6

Out 7

Out 8

Gnd

Ground Connection Recommendation

Identification

Input Lines

Output Lines

Ground

Parasitic inductance present in the board layout will

affect the filtering performance of the device. As

frequency increases, the effect of the inductance

becomes more dominant. This effect is given by

Equation 1.

1 - 8

9 - 16

Center Tab

Equation 1: The Impedance of an Inductor at

Frequency XLF

Figure 2 - Inductance of Rectangular Wire Loops

XLF(L,f ) = 2*π*f *L

Ground

Via 1

Ground

Via 2

Where:

L= Inductance (H)

f = Frequency (Hz)

Signal Layer

Via connections to the ground plane form rectangular

wire loops or ground loop inductance as shown in

Figure 2. Ground loop inductance can be reduced by

using multiple vias to make the connection to the

ground plane. Bringing the ground plane closer to the

signal layer (preferably the next layer) also reduces

ground loop inductance. Multiple vias in the device

ground pad will result in a lower inductive ground loop

over two exterior vias. Vias with a diameter d are

separated by a distance y run between layers sepa-

rated by a distance x. The inductance of the loop path

is given by Equation 2. Thus, decreasing distance x

and y will reduce the loop inductance and result in

better high frequency filter characteristics.

Ground Layer

Layer

Equation 2: Inductance of Rectangular Wire Loop

2*y

LRECT(d,x, y) = 10.16*10⁻⁹*

[

x *ln

[ ]

+ y*ln

[

]

2*x

Where:

d = Diameter of the wire (in)

x = Length of wire loop (in)

y = Breath of wire loop (in)

www.semtech.com

EClamp2388K

PRELIMINARY

PROTECTION PRODUCTS

Applications Information

Figure 3 shows the recommended device layout. The

ground pad vias have a diameter of 0.008 inches (0.20

mm) while the two external vias have a diameter of

0.010 inches (0.250mm). The internal vias are spaced

approximately evenly from the center of the pad. The

designer may choose to use more vias with a smaller

diameter (such as 0.005 inches or 0.125mm) since

changing the diameter of the via will result in little

change in inductance (i.e. the log function in Equation 2

in highly insensitive to parameter d) . Figure 4 shows a

typical insertion loss (S21) plot for the device using

Semtech’s filter evaluation board with 50 Ohm traces

and the recommended via configuration.

Figure 4 - Filter Characteristics Using Recommended

Layout with Internal Vias

CH1 S21 LOG

6 dB / REF 0 dB

1: -12.522 dB

109 MHz

2: -36.148 dB

800 MHz

0 dB

3: -33.534 dB

1.8 GHz

-6 dB

-12 dB

-18 dB

-24 dB

-30 dB

-36 dB

-42 dB

-48 dB

4: -30.380 dB

2.7 GHz

MHz

100

MHz

Figure 3 - Recommended Layout Using Ground Vias

GHz

STOP 000 000000 MHz

START 030 MHz

www.semtech.com

EClamp2388K

PRELIMINARY

PROTECTION PRODUCTS

Applications Information - Spice Model

Line In

1.4nH

Line Out

1.4nH

200

EClamp2388K Spice Model

Table 1 - EClamp2388K Spice Parameters

Parameter

Unit

Amp

Volt

Ohm

Amp

Farad

sec

D1 (TVS)

5.15E-15

7.53

D2 (TVS)

5.15E-15

7.53

0.75

IBV

CJO

0.426

1E-3

0.426

1E-3

23E-12

2.541E-9

0.256

1.1

23E-12

2.541E-9

0.256

1.1

1.11

www.semtech.com

EClamp2388K

PRELIMINARY

PROTECTION PRODUCTS

Outline Drawing - SLP3313P16

DIMENSIONS

INCHES MILLIMETERS

MIN NOM MAX MIN NOM MAX

DIM

PIN 1

INDICATOR

(LASER MARK)

.018

A1 .000

.022 0.45 0.50 0.55

.002 0.00 0.02 0.05

(0.13)

.020

.001

(.005)

.006 .008 .010 0.15 0.20 0.25

3.25 3.30 3.375

.128 .130 .133

.110 .114 .118

.049 .051 .054

2.90

2.80

1.25 1.30 1.375

0.30 0.40

3.00

E1 .008

.012 .016 0.20

.016 BSC

0.40 BSC

SEATING

PLANE

.008 .010 .012 0.20 0.25 0.30

aaa C

.003

.004

0.08

0.10

aaa

bbb

LxN

E/2

bxN

bbb

C A B

e/2

D/2

NOTES:

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS

Land Pattern - SLP3313P16

DIMENSIONS

DIM

INCHES

MILLIMETERS

(.050)

.027

.012

.118

.016

.008

.023

.073

(1.27)

0.69

0.30

3.00

0.40

0.20

0.58

1.85

(C)

NOTES:

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

www.semtech.com

EClamp2388K

PRELIMINARY

PROTECTION PRODUCTS

Marking

Ordering Information

Qty per

Reel

Part Number

Reel Size

2388K

PIN 1

INDICATOR

EClamp2388K.TCT

3000

7 Inch

YYWW

EMIClamp and EClamp are marks of Semtech Corporation

Note: YYWW = Date Code

Tape and Reel Specification

Pin 1 Location

User Direction of feed

Device Orientation in Tape

1.51 +/-0.10 mm

3.51 +/-0.10 mm

0.66 +/-0.10 mm

Tape

(MAX)

B, (Max)

Width

T(MAX)

1.5 + 0.1 mm

- 0.0 mm

(0.59 +.005

- .000)

1.750±.10

(.069±.004)

4.0±0.1

(.157±.00-

4.0±0.1

(.157±.00-

12.0 mm

+ 0.3 mm

- 0.1 mm

1.0 mm

±0.05

(.039)

5.5±0.05

(.217±.002)

2.0±0.05m-

(.079±.002)

8.2 mm

12 mm

4.5 mm

(.177)

0.4 mm

(.016)

(.476)

(.472±.012)

Contact Information

Semtech Corporation

Protection Products Division

200 Flynn Rd., Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804

www.semtech.com

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