ECLAMP2398P.TCT [SEMTECH]
ESD/EMI Protection for Color LCD Interfaces; ESD / EMI保护彩色液晶显示器接口
| 型号： | ECLAMP2398P.TCT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | ESD/EMI Protection for Color LCD Interfaces |
| 文件： | 总8页 (文件大小：214K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EClamp2398P
ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClampTM
Features
Description
The EClampTM2398P is a low pass (L-C) filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD and camera lines in cellular phones and other
portable electronics.
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 30dB minimum attenuation
800MHz to 2.7GHz
TVS working voltage: 5V
Inductor: 19nH (Typical)
Capacitance: 12pF (Typical at VR = 2.5V)
Protection and filtering for eight lines
Solid-state technology
The device consists of eight identical circuits comprised
of TVS diodes for ESD protection, and a 5-pole induc-
tor - capacitor network for EMI/RFI filtering. A typical
inductor value of 19nH and a capacitor value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC
61000-4-2, level 4.
Mechanical Characteristics
SLP4016P16 16-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
The EClamp2398P is in a 16-pin, RoHS/WEEE compli-
ant, SLP4016P16 package. It measures 4.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
Package Configuration
Circuit Diagram (Each Line)
4.00
1
2
L1
L2
IN
1.60
OUT
C1
C2
C3
0.50 BSC
GND
0.58
Device Schematic (8X)
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
www.semtech.com
Revision 1/18/2006
1
EClamp2398P
PROTECTION PRODUCTS
Maximum Ratings
Rating
Symbol
Value
Units
kV
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
+/- 20
+/- 15
VESD
Junction Temperature
Operating Temperature
Storage Temperature
TJ
125
oC
Top
-40 to +85
oC
oC
TSTG
-55 to +150
Electrical Characteristics (T=25oC)
Parameter
TVS Reverse Stand-Off Voltage
TVS Reverse Breakdown Voltage
TVS Reverse Leakage Current
DC Resistance
Symbol
VRWM
VBR
Conditions
Minimum
6
Typical
8
Maximum
Units
5
V
V
It = 1mA
10
0.1
IR
VRWM = 3.3V
µA
RDC
18
150
19
Ohms
MHz
nH
Filter Cut-Off Frequency
Inductance
fc
ZSource = ZLoad = 50 Ohms
L
Total Series Inductance
Capacitance
L1 + L2
Each Line
38
nH
C1 , C2 ,
C3
VR = 2.5V, f = 1MHz
10
30
12
15
45
pF
Total Capacitance
C1 + C2 +
C3
Input to Gnd,
Each Line
36
pF
VR = 2.5V, f = 1MHz
www.semtech.com
2006 Semtech Corp.
2
EClamp2398P
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
Analog Crosstalk (Each Line)
CH1S21 LOG
20 dB /REF 0 dB
CH1 S21 LOG
6 dB / REF 0 dB
1: -33.132 dB
800 MHz
0 dB
-6 dB
2: -36.460 dB
1.8 GHz
3: -31.558 dB
3 GHz
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
-54 dB
3
1
2
1
10
MHz
100
3
1
MHz
START 030 MHz
MHz
GHz
GHz
3
.
STOP 000000000 MHz
START. 030MHz
3
.
STOP 000 000000 MHz
.
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Capacitance vs. Reverse Voltage
(Normalized to 2.5 volts)
2
1.5
1
0.5
0
f = 1 MHz
4.5
0
0.5
1
1.5
2
2.5
3
3.5
4
5
Reverse Voltage - VR (V)
www.semtech.com
2006 Semtech Corp.
3
EClamp2398P
PROTECTION PRODUCTS
Applications Information
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2398P is comprised of eight identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the
bottom of the device. A center tab serves as the
ground connection. The device has a flow through
design for easy layout. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces. Recommendations for the ground
connection are given below.
1
16
In 1
In 2
In 3
In 4
In 5
In 6
In 7
In 8
Out 1
Out 2
Out 3
Out 4
Out 5
Out 6
Out 7
Out 8
Gnd
8
9
Ground Connection Recommendation
Pin
Identification
Input Lines
Output Lines
Ground
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
1 - 8
9 - 16
Center Tab
Equation 1: The Impedance of an Inductor at
Frequency XLF
Figure 2 - Inductance of Rectangular Wire Loops
XLF(L,f ) = 2*π*f *L
Ground
Via 1
Ground
Via 2
Where:
L= Inductance (H)
f = Frequency (Hz)
d
Signal Layer
x
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers sepa-
rated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
Ground Layer
Layer
y
Equation 2: Inductance of Rectangular Wire Loop
2*y
−9
2*x
d
LRECT(d,x, y) = 10.16*10 *
x *lnd + y*ln
[
]
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
www.semtech.com
2006 Semtech Corp.
4
EClamp2398P
PROTECTION PRODUCTS
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20
mm) while the two external vias have a diameter of
0.010 inches (0.250mm). The internal vias are spaced
approximately evenly from the center of the pad. The
designer may choose to use more vias with a smaller
diameter (such as 0.005 inches or 0.125mm) since
changing the diameter of the via will result in little
change in inductance (i.e. the log function in Equation 2
in highly insensitive to parameter d) . Figure 4 shows a
typical insertion loss (S21) plot for the device using
Semtech’s filter evaluation board with 50 Ohm traces
and the recommended via configuration.
CH1 S21 LOG
6 dB / REF 0 dB
1: -4.1029dB
150 MHz
0 dB
4
2: -34.337 dB
800 MHz
-6 dB
-12 dB
-18 dB
-24 dB
3: -37.930 dB
1.8 GHz
4: -34.395 dB
2.5 GHz
-30 dB
-36 dB
-42 dB
-48 dB
-54 dB
3
1
2
Figure 3 - Recommended Layout Using Ground Vias
1
10
MHz
100
MHz
3
1
MHz
START 030 MHz
GHz
GHz
3
.
STOP 000 000000 MHz
.
www.semtech.com
2006 Semtech Corp.
5
EClamp2398P
PROTECTION PRODUCTS
Applications Information - Spice Model
EClamp2398P Spice Model & Parameters
Line In
1.4nH
1.4nH
Line Out
L
38nH
Figure 1 - EClamp2398P Spice Model
Table 1 - EClamp2398P Spice Parameters
Parameter
Unit
Amp
Volt
Volt
Ohm
Amp
Farad
sec
--
D1 (TVS)
4.09E-15
7.435
D2 (TVS)
4.09E-15
7.435
IS
BV
VJ
0.743
0.743
RS
IBV
CJO
TT
0.584
1E-3
0.584
1E-3
31.3E-12
2.541E-9
0.23
31.3E-12
2.541E-9
0.23
M
N
--
1.1
1.1
EG
eV
1.11
1.11
www.semtech.com
2006 Semtech Corp.
6
EClamp2398P
PROTECTION PRODUCTS
Outline Drawing - SLP4016P16
B
E
A
D
DIMENSIONS
INCHES MILLIMETERS
DIM
A
MIN NOM MAX MIN NOM MAX
.020
.026 0.50 0.58 0.65
.002 0.00 .003 0.05
(0.15)
.023
.001
PIN 1
INDICATOR
A1 .000
A2
(.006)
(LASER MARK)
b
D
.007 .010 .012 0.20 0.25 0.30
3.90 4.00 4.10
3.20
.153 .157 .161
D1
E
.122 .126 .130 3.10
3.30
.059 .063 .067 1.50 1.60 1.70
A
SEATING
PLANE
E1 .010
e
0.40 0.50
.016 .020 0.25
.020 BSC
0.50 BSC
aaa C
A2
L
N
.011 .013 .015 0.28 0.33 0.38
C
16
16
A1
aaa
.003
.004
0.08
0.10
bbb
1
2
LxN
E/2
E1
N
bxN
e
bbb
C
A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
2.
Land Pattern - SLP4016P16
P
X
DIMENSIONS
DIM
INCHES
MILLIMETERS
B
C
F
.130
.060
.018
.035
.020
.012
.025
.085
3.30
1.52
0.45
0.89
0.50
0.30
0.63
2.15
(C)
F
G
Z
G
P
X
Y
Z
Y
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
www.semtech.com
2006 Semtech Corp.
7
EClamp2398P
PROTECTION PRODUCTS
Marking
Ordering Information
Qty per
Reel
Part Number
Reel Size
EClamp2398P.TCT
3000
7 Inch
PIN 1
INDICATOR
2398P
EMIClamp and EClamp are marks of Semtech Corporation
(LASER MARK)
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
B0
K0
1.78 +/-0.10 mm
4.30 +/-0.10 mm
0.74 +/-0.10 mm
Tape
K
(MAX)
B, (Max)
Width
D
D1
E
F
P
P0
P2
T(MAX)
W
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.750±.10
mm
(.069±.004)
4.0±0.1
mm
(.157±.00-
4)
4.0±0.1
mm
(.157±.00-
4)
12.0 mm
+ 0.3 mm
- 0.1 mm
1.0 mm
±0.05
(.039)
5.5±0.05
mm
(.217±.002)
2.0±0.05m-
m
(.079±.002)
8.2 mm
12 mm
4.5 mm
(.177)
0.4 mm
(.016)
(.476)
(.472±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2006 Semtech Corp.
8
相关型号：
©2020 ICPDF网 联系我们和版权申明