RClamp3328P.TNT [SEMTECH]
Low Capacitance RClamp® 8-Line ESD Protection;
| 型号： | RClamp3328P.TNT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Low Capacitance RClamp® 8-Line ESD Protection |
| 文件： | 总9页 (文件大小：328K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RClamp3328P
Low Capacitance RClamp®
8-Line ESD Protection
PROTECTION PRODUCTS - RailClamp®
Features
Description
The RClamp®3328P provides low voltage ESD protec-
tion for high-speed ports. It features a high maximum
ESD withstand voltage of ±25kV contact and ±30kV
air discharge per IEC 61000-4-2. RClamp3328P is
designed to minimize both the ESD peak clamping and
the TLP clamping. Peak ESD clamping voltage is
extremely low and approximately the same at each pin.
The dynamic resistance is among the industry’s lowest
at 0.35 Ohms (typical). Maximum capacitance on each
line to ground is 0.65pF. This allows the
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20s)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects eight high-speed lines
Low capacitance: 0.65pF Maximum (I/O to Ground)
Low ESD clamping voltage
Low dynamic resistance: 0.35 Ohms (Typ)
Solid-state silicon-avalanche technology
RClamp3328P to be used in applications operating in
excess of 5GHz without signal attenuation. These
devices are manufactured using Semtech’s proprietary
low voltage EPD technology for superior characteritics
at operating voltages up to 3.3 volts. Each device will
protect up to eight lines (four high-speed pairs).
Mechanical Characteristics
SGP3810N9 9-pin package (3.8 x 1.0 x 0.50mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Pitch: 0.4mm (intra-pair), 0.50mm (pair-to-
pair)
Lead finish: NiPdAu
Marking: Marking Code
The RClamp3328P is in a 9-pin SGP3810N9 package. It
measures 3.8 x 1.0mm with a nominal height of 0.50mm.
Intra-pair lead pitch is 0.40mm while the pair-to-pair pitch
is 0.5mm. The innovative flow through package design
simplifies pcb layout and allows matched trace lengths
for consistant impedance between high speed differen-
tial lines.
Packaging: Tape and Reel
Applications
HDMI 1.3/1.4
V-By-One
USB 3.0
eDP
MHL
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device provides the highest level of ESD protection for
applications such as USB 3.0, HDMI and V-By-One inter-
faces.
LVDS Interfaces
eSATA Interfaces
Dimensions
Circuit Diagram
3.80
0.40 BSC
1.00
1
2
4
5
3
6
7
8
9
0.50 BSC
0.50
Nominal Dimensions in mm (Bottom View)
8-Line Protection
www.semtech.com
Revision 7/18/2013
1
RClamp3328P
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
Units
Watts
A
Peak Pulse Power (tp = 8/20s)
Peak Pulse Current (tp = 8/20s)
75
5
IPP
ESD per IEC 61000-4-2 (Air)1
VESD
+/- 30
+/- 25
kV
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
TJ
-55 to +125
-55 to +150
°C
°C
TSTG
Electrical Characteristics (T=25oC)
Parameter
Reverse Stand-Off Voltage
Punch-Through Voltage
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
3.3
Units
Any I/O to GND
V
V
VPT
IPT = 2A
Any I/O to GND
3.8
4.8
0.005
5.2
5.5
Reverse Leakage Current
Clamping Voltage
IR
VRWM = 3.3V,
Any I/O to GND
0.100
7
A
V
VC
VC
VC
VC
IPP = 1A, tp = 8/20s
Any I/O to GND
Clamping Voltage
IPP = 5A, tp = 8/20s
8.2
10.5
V
Any I/O to GND
ESD Clamping Voltage2
ESD Clamping Voltage2
IPP = 16A,
tlp = 0.2/100ns
11.8
11.7
V
IPP = -16A,
V
tlp = 0.2/100ns
Dynamic Resistance (Positive)2,3
Dynamic Resistance(negative)2,3
Junction Capacitance
RD
RD
Cj
tp = 100ns
tp = 100ns
0.35
0.50
0.40
Ohms
Ohms
pF
VR = 0V, f = 1MHz,
Any I/O to GND
0.65
0.4
VR = 0V, f = 1MHz,
Between I/O pins
0.30
pF
Notes
1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path
connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
www.semtech.com
© 2013 Semtech Corporation
2
RClamp3328P
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
8/20us Pulse Waveform
10
110
100
90
80
70
60
50
40
30
20
10
0
DR040412-75
Waveform
Parameters:
tr = 8μs
td = 20μs
1
e-t
td = IPP/2
0.1
0.01
0
5
10
15
20
25
30
0.1
1
10
100
1000
Time (μs)
Pulse Duration - tp (μs)
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
Junction Capacitance vs. Reverse Voltage
(Between any I/O and Ground)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
9
8
7
6
5
4
3
2
1
0
Waveform
Parameters:
tr = 8μs
td = 20μs
f = 1 MHz
0
1
2
3
4
5
6
0
0.5
1
1.5
2
2.5
3
Reverse Voltage - VR (V)
Peak Pulse Current - IPP (A)
TLP Characteristic (Positive)
TLP Characteristic (Negative)
30
25
20
15
10
5
0
-5
-10
-15
-20
-25
-30
Transmission Line Pulse Test
(TLP) Settings:
p = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
Transmission Line Pulse Test
(TLP) Settings:
t
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t
1 = 70ns to t2 = 90ns
t
1 = 70ns to t2 = 90ns
0
0
5
10
15
20
-25
-20
-15
-10
-5
0
TLP Voltage (V)
TLP Voltage (V)
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© 2013 Semtech Corporation
3
RClamp3328P
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
75
20
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
65
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
0
55
-20
-40
45
35
25
15
5
-60
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
-80
-5
-100
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
Typical Insertion Loss S21
Analog Crosstalk
0
-20
0
-3
-6
-40
-60
-80
-9
-100
-120
-140
-12
-15
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
1.00E+07
1.00E+08
1.00E+09
1.00E+10
Frequency (Hz)
Frequency (Hz)
www.semtech.com
© 2013 Semtech Corporation
4
RClamp3328P
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
Assembly Parameter
Recommendation
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. Semtech's recommended assem-
bly guidelines for mounting this device are shown in
the Table. The figure below details Semtech’s recom-
mended aperture based on the below recommenda-
tions. Note that these are only recommendations and
should serve only as a starting point for design since
there are many factors that affect the assembly
process. The exact manufacturing parameters will
require some experimentation to get the desired
solder application.
Solder Stencil Design
Laser cut, Electro-polished
Rectangular with rounded
corners
Aperture shape
Solder Stencil Thickness
Solder Paste Type
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Stencil Opening
0.250
Land Pad ( Follow Drawing)
0.700
0.350
1.000
3.800
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Recommended Mounting Pattern
www.semtech.com
© 2013 Semtech Corporation
5
RClamp3328P
PROTECTION PRODUCTS
Applications Information
HDMIꢀ
Connector
RClamp7538P
RClamp3328P
Land Pad
Trace
Via
Device Outline
HDMI 1.4 Layout and Eye Diagram with RClamp3328P
www.semtech.com
© 2013 Semtech Corporation
6
RClamp3328P
PROTECTION PRODUCTS
Outline Drawing - SGP3810N9
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.475 0.50 0.525
A
D
B
E
DIM
A
A1 0.00 0.02 0.05
PIN 1
INDICATOR
(LASER MARK)
0.15 0.20 0.25
3.70 3.80 3.90
0.90 1.00 1.10
0.80 BSC
0.90 BSC
0.25 0.30 0.35
9
b
D
E
e
e1
L
N
aaa
0.08
0.10
bbb
A
aaa C
A1
D/2
e1
e
LxN
E/2
(0.025-0.075)
e/2
bxN
bbb
C A B
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS(ANGLES IN DEGREES).
Land Pattern - SGP3810N9
P1
P/2
DIMENSIONS
DIM
MILLIMETERS
(0.85)
0.25
0.80
0.90
0.20
0.60
1.45
C
G
P
P1
X
(C)
G
Z
Y
Y
Z
P
X
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS(ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONL.Y
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com
© 2013 Semtech Corporation
7
RClamp3328P
PROTECTION PRODUCTS
Marking Code
Ordering Information
Device to
Device
Pitch
Qty per
Reel
Reel
Size
Part Number
3328P
PIN 1
YYWW
INDICATOR
RClamp3328P.TZT
RClamp3328P.TNT
4mm
2mm
7 Inch
7 Inch
5,000
10,000
YYWW = Date Code
RailClamp and RClamp are trademarks of Semtech Corporation.
Carrier Tape Specification
Notes:ꢀ
Notes:ꢀ
1)ꢀPinꢀ1ꢀtowardsꢀsprocketꢀholes
2)ꢀEveryꢀotherꢀpocketꢀpopulated
1)ꢀPinꢀ1ꢀtowardsꢀsprocketꢀholes
2)ꢀEveryꢀpocketꢀpopulated
Device Orientation in Tape (5K Piece Option)
Device Orientation in Tape (10K Piece Option)
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© 2013 Semtech Corporation
8
RClamp3328P
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2013 Semtech Corporation
9
相关型号：
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SEMTECH
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