SC1214 [SEMTECH]
High Speed, Combi-SenseTM Two-Phase, Synchronous MOSFET Driver; 高速，组合式SenseTM两相同步MOSFET驱动器
| 型号： | SC1214 |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | High Speed, Combi-SenseTM Two-Phase, Synchronous MOSFET Driver |
| 文件： | 总8页 (文件大小：170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SC1214
High Speed, Combi-SenseTM
Two-Phase, Synchronous MOSFET Driver
POWER MANAGEMENT
Description
Features
ꢀ High efficiency
ꢀ +12V gate drive voltage
ꢀ High peak drive current
ꢀ Adaptive non-overlapping gate drives provide
shoot-through protection
ꢀ Support Combi-SenseTM and VID-on-fly operations
ꢀ Fast rise and fall times (15ns typical with 3000pf
load)
ꢀ Ultra-low (<30ns) propagation delay (BG going low)
ꢀ Floating top gate drive
ꢀ Crowbar function for over voltage protection
ꢀ High frequency (to 1.5 MHz) operation allows use
of small inductors and low cost ceramic capacitors
ꢀ Under-voltage-lockout
The SC1214 is a high speed, Combi-SenseTM, two-phase
driver designed to drive high-side and low-side MOSFETs
in two synchronous Buck converters. The driver com-
bined with Combi-Sense PWM controllers, such as
Semtech SC2643VX or SC2643, provides a cost effec-
tive two-phase voltage regulator for advanced micro-
processors
The Combi-SenseTM is a technique to sense the inductor
current for peak current mode control of voltage regula-
tor without using sensing resistor. It provides the follow-
ing advantages:
- No costly precision sensing resistor
- Lossless current sensing
- High level noise free signal
- Fast response
ꢀ Low quiescent current
- Suitable for wide range of duty cycle
The detailed explanation of the technique can be found
in the Applications Information section.
A 30ns max propagation delay from input transition to
the gate of the power FET’s guarantees operation at high
switching frequencies. Internal overlap protection circuit
prevents shoot-through from Vin to PGND in the main
and synchronous MOSFETs. The adaptive overlap pro-
tection circuit ensures the bottom FET does not turn on
until the top FET source has reached 1V, to prevent cross-
conduction.
Applications
ꢀ Intel Pentium® processor power supplies
ꢀ AMD AthlonTM and AMD-K8TM processor power
supplies
ꢀ High current low voltage DC-DC converters
High current drive capability allows fast switching, thus
reducing switching losses at high (up to 1.5MHz) frequen-
cies without causing thermal stress on the driver.
Under-voltage-lockout and over-temperature shutdown
features are included for proper and safe operation.
Timed latches and improved robustness are built into
the housekeeping functions such as the Under Voltage
Lockout and adaptive Shoot-through protection circuitry
to prevent false triggering and to assure safe operation.
The SC1214 is offered in a TSSOP-20 package.
1
www.semtech.com
May 9, 2005
SC1214
POWER MANAGEMENT
Typical Application Circuit
SC1214
11
12
13
14
15
16
17
18
19
20
10
9
DRN2
PGND
TG2
BG2
VREG2
VIN2
VPN2
NC
8
BST2
CO2
7
6
NC
5
VPN1
VIN1
VREG1
BG1
4
CO1
3
BST1
TG1
2
1
PGND
DRN1
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2005 Semtech Corp.
2
SC1214
POWER MANAGEMENT
Absolute Maximum Ratings
Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified
in the Electrical Characteristics section is not implied.
Parameter
Symbol
Conditions
Maximum
Units
VI N Supply Voltage
VI N
VBST-DRN, VTG-DRN
VBST-PGND
VBST-PULSE
VDRN-PGND
VDRN-PULSE
VBG-PGND
VREG-PGND
VPN
16
11
V
V
BST, TG to DRN
BST to PGND
40
V
BST to PGND Pulse
DRN to PGND
tPULSE < 100ns
tPULSE < 200ns
45
V
-2 to 30
-5 to 35
11
V
DRN to PGND Pulse
BG to PGND
V
V
VREG to PGND
11
V
VPN to PGND
16
V
VPN to PGND Pulse
PWM Input
VPN-PULSE
CO
tPULSE < 100ns
20
V
-0.3 to 8.5
1.76
V
Continuous Power Dissipation
Thermal Resistance Junction to Case
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering) 10 Sec.
PD
TA = 25°C, TJ =125°C
W
°C/W
°C
°C
°C
17
TJ
0 to +150
-65 to +150
300
TSTG
TLEAD
NOTE:
(1) This device is ESD sensitive. Use of standard ESD handling precautions is required.
Electrical Characteristics
Unless specified: TA = 25°C; VIN = 12V; VREG = 8.5V
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Power Supply
Supply Voltage
VI N
9
12
15
V
Quiescent Current, Operating
Under Voltage Lockout
Start Threshold of VREG Voltage
Hysteresis
Iq_op
3.0
mA
VREG_START
VhysUVLO
4
4.3
V
160
mV
Internal LDO
LDO Output
VREG
VI N = 9V to 15V
VI N = 5V to 8.8V
8.5
0.3
V
V
Drop Out Voltage
VDROP
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2005 Semtech Corp.
3
SC1214
POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless specified: TA = 25°C; VIN = 12V; VREG = 8.5V
Parameter
Symbol
Conditions
Min
Typ
Max
Units
CO1, CO2
Logic High Input Voltage
Logic Low Input Voltage
Thermal Shutdown
Over Temperature Trip Point
Hysteresis
VCO_H
VCO_L
2.0
V
V
0.8
TOTP
155
10
°C
°C
THYST
High Side Driver (TG1, TG2)
RSRC_TG
RSINK_TG
tR_TG
1.5
1.0
15
10
37
30
3.0
2.0
Output Impedance
Ohm
VBST - VDRN = 8.5V
Rise Time
CL = 3.3nF, VBST - VDRN = 8.5V
CL = 3.3nF, VBST - VDRN = 8.5V
VBST - VDRN = 8.5V
ns
ns
ns
ns
Fall Time
tF_TG
Propagation Delay, TG Going High
Propagation Delay, TG Going Low
Low-Side Driver (BG1, BG2)
tPDH_TG
tPDL_TG
VBST - VDRN = 8.5V
RSRC_BG
RSINK_BG
tR_BG
1.5
1.5
10
10
20
27
75
3.0
3.0
Output Impedance
VREG = 8.5V
Ohm
Rise Time
CL = 3.3nF, VREG = 8.5V
CL = 3.3nF, VREG = 8.5V
VREG = 8.5V
ns
ns
ns
ns
ns
Fall Time
tF_BG
Propagation Delay, BG Going High
Propagation Delay, BG Going Low
BG1, BG2 Minimum Off-time(1)
Under-Voltage-Lockout Time Delay
tPDH_BG
tPDL_BG
tOFF_BG
VREG = 8.5V
V
V
REG ramping up
tPDH_UVLO
tPDL_UVLO
2
2
µs
µs
REG ramping down
NOTE:
(1) Guaranteed by design.
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2005 Semtech Corp.
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SC1214
POWER MANAGEMENT
Timing Diagrams
CO
DRN
TG
1.0V
tPDL_TG tF_TG
tPDH_TG
1.4V
tR_TG
BG
tPDL_BG
tF_BG
tPDH_BG
tR_BG
Rising Edge Transition
Falling Edge Transition
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2005 Semtech Corp.
5
SC1214
POWER MANAGEMENT
Ordering Information
Pin Configurations
Device
Package
TSSOP-20
TSSOP-20
Temp. Range( Tj)
0 - 125°C
Top View
SC1214TSTR(1)
SC1214TSTRT(1)(2)
DRN1
1
0 - 125°C
PGND
BG1
VREG1
VIN1
VPN1
NC
CO2
BST2
TG2
20
19
18
17
16
15
14
13
12
11
TG1
BST1
CO1
2
3
4
Note:
(1) Only available in tape and reel packaging. A reel
contains 2500 devices.
(2) Lead free product. This product is fully WEEE and RoHS
compliant.
NC
5
VPN2
VIN2
VREG2
BG2
6
7
8
9
PGND
DRN2
10
(20-Pin TSSOP)
Pin Descriptions
Pin#
Pin Name
Pin Function
Output gate drive for the switching (top) MOSFET.
2,12
TG1, TG2
The power phase node (or switching node) of the synchronous buck converter. This pin can be
subjected to a negative spike up to -VREG relative to PGND without affecting operation.
1,11
DRN1, DRN2
Bootstrap pin. A capacitor is connected between BST and DRN pins to develop the floating
bootstrap voltage for the high-side MOSFET. The capacitor value is typically 1µF (ceramic).
3, 13
18,8
4,14
BST1, BST2
VREG1,VREG2 LDO output. Decouple with 1µF to 4.7µF (ceramic) with lead length no more than 0.2" (5mm).
Logic level PWM input signal to the SC1214 supplied by external controller. An internal
CO1, CO2
50kohm resistor is connected from this pin to PGND.
Virtual Phase Node. Connect an RC between this pin and the output sense point to Enable
VPN1, VPN2
16,6
Combi-Sense TM operation. See the Typical Application Circuit.
10, 20
19,9
PGND
Ground. Keep these pins close to the synchronous MOSFETs source.
BG1, BG2
Output gate drive for the synchronous (bottom) MOSFET.
Supply power for low gate drive, LDO and the internal Combi-Sense TM circuitry. Connect to
input power rail of the converter.
17,7
VIN1,VIN2
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2005 Semtech Corp.
6
SC1214
POWER MANAGEMENT
Block Diagram
VIN1,2
LDO
VREG1,2
UVLO
LOGIC
VPN1,2
BST1,2
TG1,2
CONTROL
&
OVERLAP
PROT ECTION
CIRCUIT
CO1,2
PGND
DRN1,2
BG1,2
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2005 Semtech Corp.
7
SC1214
POWER MANAGEMENT
Outline Drawing - TSSOP-20
DIMENSIONS
INCHES MILLIMETERS
A
DIM
A
D
E
MIN NOM MAX MIN NOM MAX
e
-
-
-
-
-
-
-
-
-
-
-
-
.047
1.20
0.15
1.05
0.30
0.20
N
A1 .002
A2 .031
.006 0.05
.042 0.80
.012 0.19
.007 0.09
2X E/2
b
.007
.003
c
E1
D
.251 .255 .259 6.40 6.50 6.60
E1 .169 .173 .177 4.30 4.40 4.50
PIN 1
E
.252 BSC
.026 BSC
6.40 BSC
0.65 BSC
INDICATOR
e
L
L1
N
.018 .024 .030 0.45 0.60 0.75
(.039)
(1.0)
ccc
C
1 2 3
e/2
20
20
2X N/2 TIPS
-
-
01
0°
8°
0°
8°
B
aaa
.004
.004
.008
0.10
0.10
0.20
bbb
ccc
D
aaa
SEATING
C
A2
A
D
PLANE
H
C
A1
bxN
c
bbb
C
A-B
GAGE
PLANE
0.25
L
01
(L1)
DETAIL
A
SEE DETAIL
A
SIDE VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MO-153, VARIATION AC.
Land Pattern - TSSOP-20
X
DIMENSIONS
DIM
INCHES
(.222)
.161
MILLIMETERS
(5.65)
4.10
0.65
0.40
1.55
7.20
C
G
P
X
Y
Z
(C)
G
Y
Z
.026
.016
.061
.283
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2005 Semtech Corp.
8
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