SC633 [SEMTECH]
Fixed 5.3V Output Charge Pump Regulator; 固定5.3V输出电荷泵稳压器
| 型号： | SC633 |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Fixed 5.3V Output Charge Pump Regulator |
| 文件： | 总15页 (文件大小：514K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SC633
Fixed 5.3V Output
Charge Pump Regulator
POWER MANAGEMENT
Features
Description
Input voltage range — 2.9V to 5.5V
VOUT tolerance — 5.3V 3ꢁ
The SC633 is a high-current voltage regulator using
Semtech’s proprietary low-noise charge pump technol-
ogy. Performance is optimized for use in single Li-Ion
battery cell applications. The regulator provides the per-
formance of a linear, low drop-out (LDO) voltage regulator
when the input is greater than 5.3V. Unlike an LDO, drop-
out is avoided when the input is less than 5.3V. Instead, a
charge pump is activated to provide voltage boost and
the head-room needed for voltage regulation.
Continuous output current — 275mA, VIN=3V
Peak output current — 400mA
Three charge pump modes — ꢀx, ꢀ.5x and 2x
Output ripple ≤ 40mVPP for IOUT ≤ 400mA
Short circuit, over-voltage, and over-temperature
protection
Soft-start functionality
Shutdown current — 0.ꢀµA, typical
Ultra thin package — 2 x 2 x 0.6 (mm)
Lead-free and halogen-free
Only two 2.2µF bucket capacitors are required to deliver
the full output current. The charge pump provides a low
EMI solution compared to inductive boost regulators.
WEEE and RoHS compliant
Applications
The SC633’s charge pump has three modes of operation:
2x, ꢀ.5x, and ꢀx modes. The 2x and ꢀ.5x modes deliver
current to the load in each of two phases. The ꢀx mode
turns off the charge pump, delivering current through an
LDO. When active, the charge pump provides low-ripple
operation at 200kHz, which is typically less than 30mVpp
at the output. The SC633 is capable of delivering 275mA
continuous current, with peak current to 400mA. A 22µF
output capacitor is used for decoupling the load and for
smoothing mode transitions. Hysteresis is provided to
prevent chatter between charge pump modes.
Mobile phones
MP3 players
USB On-The-Go
Multi-LED backlit LCDs
Compact flash/CF+ products
PMPs
Digital video cameras
Digital still cameras
PDAs
Typical Application Circuit
VOUT = 5.3V @ 275m A
IN
O UT
CIN
22µF
COUT
22µF
VBAT
SC633
Chip
enable
C1+
C1-
EN
C1
2.2µF
C2+
C 2-
C2
2.2µF
G ND
US Patent: 7,808,220
ꢀ
Rev 2.0
SC633
Pin Configuration
Ordering Information
Device
Package
SC633ULTRT(ꢀ)(2)
MLPD-UT-8 2x2
Evaluation Board
SC633EVB
Notes:
(ꢀ) Available in tape and reel only. A reel contains 3,000 devices.
(2) Lead-free packaging only. Device is WEEE and RoHS compliant,
and halogen-free.
C2-
C2+
O UT
EN
G ND
C1+
C 1-
IN
1
2
3
4
8
7
6
5
TO P VIEW
Device Options
T
Part Num
SC630A
nnn
K0A
Features
ꢀ MHz, 3.3V, smaller Cin and Cout
SC632A
SC632
SC630
SC633
K2A
632
630
633
ꢀ MHz, 5V, smaller Cin and Cout
200 kHz, 5.0V
MLPD-UT-8; 2x2, 8 LEAD
θJA = 68°C/W
200 kHz, 3.3V
200 kHz, 5.3V
Marking Information
nnn
yw
nnn=Part Number
Oyw = Pin 1 and Datecode
2
SC633
Absolute Maximum Ratings
Recommended Operating Conditions
IN (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0
OUT (V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0
Cꢀ+, C2+ (V) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VOUT + 0.3)
Pin Voltage — All Other Pins (V) . . . . . . . . . -0.3 to (VIN + 0.3)
OUT pin — Short Circuit Duration . . . . . . . . . . Continuous
ESD Protection Level(2) (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ambient Temperature Range (°C) . . . . . . . . -40 ≤ TA ≤ +85
IN (V) ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.9 ≤ VIN ≤ 5.5
Thermal Information
Thermal Resistance, Junction to Ambient(ꢀ) (°C/W) . . . . 68
Maximum Junction Temperature (°C) . . . . . . . . . . . . . . +ꢀ50
Storage Temperature Range (°C). . . . . . . . . . . . -65 to +ꢀ50
Peak IR Reflow Temperature (ꢀ0s to 30s) (°C) . . . . . . . +260
Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters
specified in the Electrical Characteristics section is not recommended.
NOTES
(ꢀ) Calculated from package in still air, mounted to 3 x 4.5 (in), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD5ꢀ standards.
(2) Tested according to JEDEC standard JESD22-Aꢀꢀ4-B.
Electrical Characteristics
Unless otherwise specified: TA = +25°C for Typ, -40°C to +85°C for Min and Max; Cꢀ = C2 = 2.2µF (ESR < 0.03Ω); CIN = COUT = 22µF; VIN = 2.9V to 5.5V
Parameter
Symbol
VOUT
Condition
VIN = 4.2V, IOUT = ꢀmA
IOUT ≤ 400mA
Min
Typ Max
Units
V
Output Voltage
Output Voltage Ripple
5.ꢀ4
5.3
40
5.46
VPP
mV
Peak Load - thermally limited(ꢀ),
TJ <ꢀ50°C, 3.3V ≤ VIN ≤ 5.0V
400
275
mA
mA
Maximum Output Current
IOUT
Continuous Load,
3.ꢀ0V ≤ VIN ≤ 4.2V
Shutdown Current
ISD
IQ
Shutdown (EN = GND), VIN = 3.6V
EN high, IOUT = ꢀmA, Vin=4.2V
VIN = 3.2V
0.ꢀ
ꢀ.5
2
µA
mA
kHz
Total Quiescent Current
Charge Pump Frequency
2.5
260
fPUMP
ꢀ40
200
(EN transitions from low to high),
5.ꢀ4V ≤ VOUT ≤ 5.46V, No load
Start-Up Time
tSU
400
µs
Line Regulation
ΔVLINE
ΔVLOAD
VIH
IOUT = ꢀmA, 2.85V ≤ VIN ≤ 4.2V
VIN =4.2V, ꢀmA ≤ IOUT ≤ 400mA
VIN = 5.5V
2ꢀ
mV
mV
V
Load Regulation
37.5
EN Input High Threshold
ꢀ.6
3
SC633
Electrical Characteristics (continued)
Parameter
Symbol
Condition
VIN = 2.7V
Min
Typ Max
Units
V
EN Input Low Threshold
EN Input High Current
EN Input Low Current
VIL
IIH
IIL
0.4
2
VIN = 5.5V
µA
µA
Ω
VIN = 5.5V
2
ꢀx mode
0.25
2.85
2.9
Open-Loop Output Resistance
Mode Transition Voltage (2)
ROUT
ꢀ.5x mode, VIN = 3.7V
2x mode, VIN = 3.ꢀV
IOUT = 200mA
IOUT = 200mA
Ω
Ω
VTRANS ꢀX
5.32
3.86
V
VTRANS ꢀ.5X
V
Fault Protection
Short-Circuit Current
ISC
VOUT = 0V, IOUT = IIN
VOUT > 2V, ꢀx mode
VOUT > 2V, ꢀ.5x and 2x modes
VOUT ≤ 2V, IOUT = IIN
300
0.6
ꢀ.2
600
ꢀ.2
2.0
700
ꢀ65
20
980
2.0
2.8
mA
A
Input Current Limit
ILIMIT
A
mA
°C
°C
TOTP
THYS
Rising Threshold
Over Temperature
Notes:
Hysteresis(3)
(ꢀ) Thermal limitation is dependent upon the thermal performance of the printed circuit board in support of the package standard of 68° C/W.
(2) Voltage at the IN pin where a mode transition takes place in the charge pump with VIN falling.
(3) Guaranteed by design — not tested in production.
4
SC633
Typical Characteristics
Line Regulation
Load Regulation
PSRR versus Frequency — 1.0x Mode
PSRR versus Frequency — 1.5x Mode
Vin=5.5V, Vout=5.3V, 50mA, ꢀX mode
Vin=4.7V, Vout=5.3V, 50mA, ꢀ.5X mode
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
Quiescent Current
PSRR versus Frequency — 2x Mode
Vin=3.5V, Vout=5.3V, 50mA, 2X mode
VOUT = 5.3V, IOUT = 0mA
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
5
SC633
Typical Characteristics (continued)
Efficiency — 50mA
Efficiency — 10mA
Efficiency — 200mA
Efficiency — 100mA
Efficiency — 400mA
Efficiency — 300mA
6
SC633
Typical Characteristics (continued)
Ripple — 1.5x Mode
VIN = 4.2V, VOUT= 5.3V, IOUT = 400mA
Ripple — 1x Mode
VIN = 5.5V, VOUT = 5.3V, IOUT = 400mA
VOUT -PP (20mV/div)
VOUT -PP (50mV/div)
IOUT (200mA/div)
IOUT (200mA/div)
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
Time (4µs/div)
Time (4µs/div)
Ripple — 2x Mode
VIN = 3.3V, VOUT = 5.3V, IOUT = 400mA
Startup (No Load)
VIN = 3.6V, IOUT = 0mA
VOUT -PP
VEN (ꢀV/div)–
VOUT (2V/div)–
(ꢀ00mV/div)
IOUT (200mA/div)
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
Time (100µs/div)
Time (4µs/div)
Mode Transition at Load =240mA
Startup (400mA)
Vin = 3V to 5.5V, Vout=5.3V, IOUT = 240mA
VIN = 5V, IOUT = 400mA
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
IOUT (200mA/div)
VIN (ꢀV/div, Chꢀ)–
VEN (ꢀV/div)–
IOUT (200mA/div)
VOUT (200mV/div)–
–
VOUT (2V/div)–
–
CIN=COUT=22µF (0805)
Cꢀ=C2=2.2µF (0603)
Time (200µs/div)
7
SC633
Pin Descriptions
Pin
ꢀ
Pin Name
GND
Cꢀ+
Pin Function
Ground — connect to ground plane with multiple vias
Positive terminal of bucket capacitor ꢀ
Negative terminal of bucket capacitor ꢀ
Input supply voltage
2
3
Cꢀ-
4
IN
5
EN
Chip enable — active-high
Output
6
OUT
C2+
7
Positive terminal of bucket capacitor 2
Negative terminal of bucket capacitor 2
8
C2-
This pad is for heat sinking and is not connected internally. It must be connected to a ground plane using
multiple vias.
T
Thermal Pad
8
SC633
Block Diagram
IN 4
LDO
2 C1+
200kHz
3
C1-
7
8
C2+
C2-
Logic
Control
EN
5
CHARGE
PUMP
6
O UT
Reference
Voltage
G enerator
1 G ND
9
SC633
Applications Information
output current related to the operation efficiency. The
following derating curve is obtained based on efficiency
at input voltage of 5V and 3.3V. For any input conditions,
due to the mode hysteresis, SC633 operation mode might
be determined from its previous operation voltage, it
could be in ꢀX, ꢀ.5X, or 2X mode. The low efficiency
should always be used for worst case consideration. In
this case, at VIN =3.3V, SC633 operates in 2X mode. At VIN
=5V, SC633 operates either in 2X or ꢀ.5X mode. In the
derating curve below, the DC operating points beneath
each curve are in the safe operating temperature range
of the MLP package.
General Description
The SC633 is a 5.3V output charge pump regulator
designed to support up to peak current of 400mA (TA ≤
55°C, 3.3V ≤ VIN ≤ 4.2V) and 275mA (TA ≤ 85°C, 3.ꢀ5V ≤ VIN
≤ 5.5V) of continuous current for powering 5.0V devices in
portable handheld equipment including Compact Flash
and CF+ products.
The SC633 has three operating modes — ꢀx, ꢀ.5x, and 2x.
The ꢀx mode is a linear series regulation mode with a low
open-loop output resistance of only 250mW. The ꢀx mode
functions as a low-noise series linear regulator. The ꢀ.5x
and 2x modes are a low noise, constant frequency, con-
stant duty cycle switch mode, using two bucket capacitors.
One bucket supports the full output current while the
other bucket charges from the input. The two buckets
exchange roles in the next phase, supplying continuous
output current in both phases and reducing the need for
a large output decoupling capacitor. The constant fre-
quency, constant duty cycle operation also produces
predictable constant frequency harmonics.
Thermal Resistance
The SC633 package is thermally efficient when the circuit
board layout connects the thermal pad through multiple
vias to the ground plane. The thermal resistance rating is
dependent upon the connection between the thermal
pad and the ground plane. A layout that is done correctly
should keep the junction temperature below the over-
temperature limit while operating the SC633 within the
specified electrical conditions. A poor layout may allow
the junction temperature to reach the over temperature
limit, so it is important to maintain adequate ground plane
around the device to maximize heat transfer to the PCB.
Maximum Continuous Output
Mode Transition
As input voltage varies, the SC633 will experience mode
transitions. The transition threshold changes with input
voltage and load conditions. The mode change hysteresis
at several load current conditions are shown in the oper-
ating curves on page 6. Mode transition will bring output
voltage dip or overshoots. The output voltage deviation
in mode transition can be improved by using larger
output capacitors if the output voltage going beyond the
regulation range.
Temperature Derating
The maximum power dissipation of the package can be
calculated by the difference between the junction tem-
perature of ꢀ50 degree and the ambient temperature
divided by the thermal impedance 68 °C/W. The higher
the ambient temperature, the lower the maximum allow-
able power dissipation. At a given VIN condition, the
allowable power dissipation will correlates to the specific
Mode Transition Hysteresis
Hysteresis is provided to prevent chatter between charge
pump modes for input steps of up to ꢀ20mV. Decouple
the input to prevent steps greater than ꢀ20mV, for
ꢀ0
SC633
Applications Information (continued)
optimum transient performance, when the input voltage
reaches the mode transition thresholds.
that prevents the device from re-enabling until the junc-
tion temperature is reduced by 20°C.
Protection Circuitry
Capacitor Selection
The SC633 is designed to use low-ESR ceramic capacitors
for the input and output bypass capacitors as well as the
charge pump bucket capacitors. Ideal performance is
achieved when the bucket capacitors are exactly equal.
The value of input and output decoupling capacitors will
vary with system requirements. For best ripple perfor-
mance CIN and COUT are normally 22µF and the bucket
capacitors Cꢀ and C2 are 2.2µF. For low profile designs, two
ꢀ0µF capacitors may be used in place of each 22µF.
The SC633 also provides protection circuitry that prevents
the device from operating in an unspecified state. These
functions include:
• Over-Current Protection (OCP)
• Short-Circuit Current Protection (SCCP)
• Over-Temperature Protection (OTP)
Over-Current Protection
Over-current protection is provided to limit the output
current. WhenVOUT is greater than 2V, OCP limits the output
to ꢀA typical. The threshold at 2V allows the device to
recover from excessive voltage droop during an over
current.
When selecting capacitors for an application, first consider
the DC voltage characteristic of the capacitor. The value
of capacitance at the DC operating voltage may be con-
siderably lower than the rated value. The following table
lists recommended capacitor values which have been
chosen to minimize the impact of this limitation.
Short-Circuit Current Protection
Short-circuit current protection is provided to limit the
current that can be sourced when the output is shorted to
ground. When a short circuit forces VOUT to drop below 2V,
the SCCP detects the condition and limits the output
current to 600mA (typical).
Table 1 — Recommended Capacitors
Value Case
Capacitor
Notes
μF
Size
Typical output VPP ≤ 20mV in all
charge pump modes
CIN , COUT
22
0805
Over-Temperature Protection
Typical input ripple ≤ ꢀ00mV in all
charge pump modes
The over-temperature circuit helps prevent the device
from overheating and experiencing a catastrophic failure.
When the junction temperature exceeds ꢀ65°C, the device
is disabled. It remains disabled until the junction tempera-
ture drops below this threshold. Hysteresis is included
Required for the full rated output
current
2.2
2.2
0603
0402
CBUCKET
CBUCKET
Useful for load current up to
300mA
NOTE: Use only X5R type capacitors, with a 6.3V rating or higher
The highest capacitance values in the smallest package
sizes will tend to have poor DC voltage characteristics.
The highest value 0402 size capacitor retains as little as
35ꢁ of its rated value at 5VDC. The same value chosen in
the next larger package size, 0603, will retain about 60ꢁ
of its rated value at 5VDC.
ꢀꢀ
SC633
Applications Information (continued)
2. Place the input and output decoupling capacitors
as close as possible to the device and connect these
capacitors’ground pads together to the ground plane
using multiple vias through a short wide copper
area.
PCB Layout Considerations
Poor layout can degrade the performance of the regula-
tor and can be a contributory factor in EMI problems,
ground bounce, thermal issues, and resistive voltage
losses. Poor regulation and instability can result.
3. Connect pin ꢀ directly to the copper area under the
thermal pad.
The following design rules are recommended:
4. The thermal pad at the center of the device is not
electrically connected. Connect this pad to the
ground plane using multiple vias.
5. Use a ground plane to further reduce noise
interference on sensitive circuit nodes.
ꢀ. Place the bucket capacitors as close to the device as
possible and on the same side of the board. Use short
wide copper areas between the capacitor pins and
the device pins.
SC633
C2
C2-
GND
C2+
OUT
EN
C1+
C1
C1-
IN
CO UT
CIN
EN
ꢀ2
SC633
Outline Drawing — MLPD-UT-8 2x2
B
A
D
DIM ENSIO NS
INCHES M ILLIM ETERS
M IN NO M M AX M IN NO M M AX
DIM
-
-
-
A
.020
.000
.024 0.50
.002 0.00
0.60
0.05
E
PIN 1
INDICATO R
-
A1
A2
b
D
D1
E
(.006)
(0.1524)
(LASER M ARK)
.007
.075
.061
.075
.026
.010
.079
.067
.079
.031
.012 0.18
.083 1.90
.071 1.55
.083 1.90
.035 0.65
0.25 0.30
2.00 2.10
1.70 1.80
2.00 2.10
0.80 0.90
E1
e
.020 BSC
0.50 BSC
A
C
SEATING
PLANE
L
N
aaa
.012
.014 .016
8
.003
.004
0.30
0.40
0.35
8
0.08
0.10
aaa
C
A2
A1
bbb
D1
1
2
LxN
E/2
E1
N
bxN
bbb
C
A B
e
e/2
D/2
NO TES:
1.
2. CO PLANARITY APPLIES TO THE EXPO SED PAD AS W ELL AS THE TERM INALS.
CO NTRO LLING DIM ENSIO NS ARE IN M ILLIM ETERS (ANG LES IN DEG REES).
ꢀ3
SC633
Land Pattern — MLPD-UT-8 2x2
H
DIM ENSIO NS
INCHES
R
DIM
M ILLIM ETERS
(.077)
.047
.067
.031
.020
.006
.012
.030
.106
(1.95)
1.20
1.70
0.80
0.50
0.15
0.30
0.75
2.70
C
G
H
K
P
R
X
Y
Z
Z
(C)
K
G
Y
P
X
NO TES:
1.
CO NTRO LLING DIM ENSIO NS ARE IN M ILLIM ETERS (ANG LES IN DEG REES).
2. THIS LAND PATTERN IS FO R REFERENCE PURPO SES O NLY.
CO NSULT YO UR M ANUFACTURING G RO UP TO ENSURE YO UR
CO M PANY'S M ANUFACTURING G UIDELINES ARE M ET.
3. THERM AL VIAS IN THE LAND PATTERN O F THE EXPO SED PAD
SHALL BE CO NNECTED TO A SYSTEM G RO UND PLANE.
FAILURE TO DO SO M AY CO M PRO M ISE THE THERM AL AND/O R
FUNCTIO NAL PERFO RM ANCE O F THE DEVICE.
ꢀ4
SC633
© Semtech 20ꢀ3
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Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 930ꢀ2
Phone: (805) 498-2ꢀꢀꢀ Fax: (805) 498-3804
www.semtech.com
ꢀ5
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