SMDA12C-5.TBT [SEMTECH]
Bidirectional TVS Array for Protection of Five Lines; 双向TVS阵列为保护五行型号: | SMDA12C-5.TBT |
厂家: | SEMTECH CORPORATION |
描述: | Bidirectional TVS Array for Protection of Five Lines |
文件: | 总7页 (文件大小:159K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMDA05C-5 THRU SMDA24C-5
Bidirectional TVS Array
for Protection of Five Lines
PROTECTION PRODUCTS
Features
Description
The SMDAxxC-5 series of transient voltage suppres-
sors are designed to protect components which are
connected to data and transmission lines from voltage
surges caused by electrostatic discharge (ESD), electri-
cal fast transients (EFT), and lightning.
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Small SO-8 surface mount package
Protects five I/O lines
Working voltages: 5V, 12V, 15V and 24V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The SMDAxxC-5 is designed to provide
transient suppression on multiple data lines and I/O
ports. The low profile SO-8 design allows the user to
protect up to five data and I/O lines with one package.
Mechanical Characteristics
JEDEC SO-8 package
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
The SMDAxxC-5 TVS diode array will meet the surge
requirements of IEC 61000-4-2 (Formerly IEC 801-2),
Level 4, “Human Body Model” for air and contact
discharge.
Applications
RS-232 and RS-422 Data Lines
Microprocessor Based Equipment
LAN/WAN Equipment
Notebooks, Desktops, and Servers
Instrumentation
Peripherals
Set Top Box
Serial and Parallel Ports
Schematic and PIN Configuration
SO-8 (Top View)
www.semtech.com
Revision 08/15/06
1
SMDA05C-5 THRU SMDA24C-5
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Peak Pulse Power (tp = 8/20µs)
Lead Soldering Temperature
Operating Temperature
Symbol
Ppk
Value
300
Units
Watts
°C
TL
260 (10 sec.)
-55 to +125
-55 to +150
TJ
°C
Storage Temperature
TSTG
°C
Electrical Characteristics
SMDA05C-5
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
5
V
V
It = 1mA
6
VRWM = 5V, T=25°C
IPP = 1A, tp = 8/20µs
tp = 8/20µs
20
9.8
17
µA
V
VC
Maximum Peak Pulse Current
Junction Capacitance
IPP
A
Cj
Between I/O Pins and
Ground
350
pF
VR = 0V, f = 1MHz
SMDA12C-5
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
12
It = 1mA
16.7
V
VRWM = 12V, T=25°C
IPP = 1A, tp = 8/20µs
tp = 8/20µs
1
µA
V
VC
19
Maximum Peak Pulse Current
Junction Capacitance
IPP
12
A
Cj
Between I/O Pins and
Ground
120
pF
VR = 0V, f = 1MHz
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2004 Semtech Corp.
2
SMDA05C-5 THRU SMDA24C-5
PROTECTION PRODUCTS
Electrical Characteristics
SMDA15C-5
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
15
It = 1mA
16.7
V
VRWM = 15V, T=25°C
IPP = 1A, tp = 8/20µs
tp = 8/20µs
1
µA
V
VC
24
10
75
Maximum Peak Pulse Current
Junction Capacitance
IPP
A
Cj
Between I/O Pins and
Ground
pF
VR = 0V, f = 1MHz
SMDA24C-5
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
24
It = 1mA
26.7
V
VRWM = 24V, T=25°C
IPP = 1A, tp = 8/20µs
tp = 8/20µs
1
43
5
µA
V
VC
Maximum Peak Pulse Current
Junction Capacitance
IPP
A
Cj
Between I/O Pins and
Ground
50
pF
VR = 0V, f = 1MHz
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2004 Semtech Corp.
3
SMDA05C-5 THRU SMDA24C-5
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
100
90
80
70
60
50
40
30
20
10
0
1
0.1
0.01
0
25
50
75
100
125
150
0.1
1
10
100
1000
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
Pulse Waveform
110
100
90
80
70
60
50
40
30
20
10
0
Waveform
Parameters:
tr = 8µs
td = 20µs
e-t
td = IPP/2
0
5
10
15
20
25
30
Time (µs)
ESD Pulse Waveform (Per IEC 61000-4-2)
IEC 61000-4-2 Discharge Parameters
Level
First
Peak
Peak
Test
Test
Peak
Current
Current
Voltage
(Contact
Voltage
(Air
Current at 30 ns at 60 ns
Discharge) Discharge)
(A)
7.5
(A)
4
(A)
8
(kV)
(kV)
1
2
3
4
2
2
15
22.5
30
8
4
6
8
4
6
8
4
8
12
16
15
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2004 Semtech Corp.
4
SMDA05C-5 THRU SMDA24C-5
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Five Data Lines
Circuit Diagram
The SMDAxxC-5 is designed to protect up to 5 data or
I/O lines. They are bidirectional devices and may be
used on lines where the signal polarities are above and
below ground.
The SMDAxxC-5 TVS arrays employ a monolithic struc-
ture. Therefore, the working voltage (VRWM) and break-
down voltage (VBR) specifications apply to the differen-
tial voltage between any two data line pins. For ex-
ample, the SMDA24C-5 is designed for a maximum
voltage excursion of ±12V between any two data lines.
The device is connected as follows:
Connection Diagram
z
Pins 1, 2, 3, 4, and 5 are connected to the lines
that are to be protected. Pin 8 is connected to
ground. The ground connections should be made
directly to the ground plane for best results. The
path length is kept as short as possible to reduce
the effects of parasitic inductance in the board
traces. Pins 6 and 7 are not connected.
DATA IN
DATA OUT
8
7
6
5
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
4
1
2
3
z
z
z
z
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
DATA IN
DATA OUT
z
z
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
www.semtech.com
2004 Semtech Corp.
5
SMDA05C-5 THRU SMDA24C-5
PROTECTION PRODUCTS
Outline Drawing - SO-8
A
h
D
E
e
DIMENSIONS
N
INCHES
MILLIMETERS
h
DIM
A
MIN NOM MAX MIN NOM MAX
H
E/2
2X
-
-
-
-
-
-
-
-
-
-
.053
.069 1.35
.010 0.10
.065 1.25
.020 0.31
.010 0.17
1.75
0.25
1.65
0.51
0.25
A1 .004
A2 .049
E1
c
GAGE
b
c
D
.012
.007
PLANE
1
2
.189 .193 .197 4.80 4.90 5.00
0.25
L
(L1)
E1 .150 .154 .157 3.80 3.90 4.00
ccc
C
01
E
e
.236 BSC
6.00 BSC
2X N/2 TIPS
e/2
B
.050 BSC
1.27 BSC
-
0.50
-
DETAIL A
h
.010
.020 0.25
L
.016 .028 .041 0.40 0.72 1.04
(.041)
(1.04)
L1
N
8
8
D
-
-
01
aaa
bbb
ccc
0°
8°
0°
8°
aaa C
.004
.010
.008
0.10
0.25
0.20
A2
A
SEE DETAIL A
SEATING
PLANE
SIDE VIEW
C
A1
bxN
bbb
C
A-B D
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
REFERENCE JEDEC STD MS-012, VARIATION AA.
4.
Land Pattern - SO-8
X
DIMENSIONS
DIM
INCHES
MILLIMETERS
(.205)
(5.20)
3.00
1.27
0.60
2.20
7.40
C
G
P
X
Y
Z
.118
.050
.024
.087
.291
(C)
G
Y
Z
P
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.
REFERENCE IPC-SM-782A, RLP NO. 300A.
www.semtech.com
2004 Semtech Corp.
6
SMDA05C-5 THRU SMDA24C-5
PROTECTION PRODUCTS
Ordering Information
Lead
Finish
Part Number
Qty per Reel
Reel Size
SMDA05C-5.TB
SMDA12C-5.TB
SMDA15C-5.TB
SMDA24C-5.TB
SMDA05C-5.TBT
SMDA12C-5.TBT
SMDA15C-5.TBT
SMDA24C-5.TBT
SMDA05C-5
SnPb
500
500
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
N/A
SnPb
SnPb
500
SnPb
500
Pb Free
Pb Free
Pb Free
Pb Free
SnPb
500
500
500
500
95/Tube
95/Tube
95/Tube
95/Tube
95/Tube
95/Tube
95/Tube
95/Tube
SMDA12C-5
SnPb
N/A
SMDA15C-5
SnPb
N/A
SMDA24C-5
SnPb
N/A
SMDA05C-5.T
SMDA12C-5.T
SMDA15C-5.T
SMDA24C-5.T
Pb Free
Pb Free
Pb Free
Pb Free
N/A
N/A
N/A
N/A
Note: Lead-free devices are RoHS/WEEE Compliant
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2004 Semtech Corp.
7
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