SMF05C.TG [SEMTECH]
Trans Voltage Suppressor Diode, 100W, 5V V(RWM), Unidirectional, 5 Element, Silicon, PLASTIC, SC-70, 6 PIN;
| 型号： | SMF05C.TG |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Trans Voltage Suppressor Diode, 100W, 5V V(RWM), Unidirectional, 5 Element, Silicon, PLASTIC, SC-70, 6 PIN 二极管 电视 |
| 文件： | 总8页 (文件大小：180K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMF05 and SMF12
TVS Diode Array
For ESD and Latch-Up Protection
PROTECTION PRODUCTS
Features
Description
The SMF series TVS arrays are designed to protect sen-
sitive electronics from damage or latch-up due to ESD
and other voltage-induced transient events. They are
designed for use in applications where board space is at
a premium. Each device will protect up to four lines.
They are unidirectional devices and may be used on lines
where the signal polarities are above ground.
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Small package for use in portable electronics
Protects four I/O lines
Working voltage: 5V and 12V
Low leakage current
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sec-
tional area junctions for conducting high transient cur-
rents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
EIAJ SC70-5L package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
The SMF series devices may be used to meet the immu-
nity requirements of IEC 61000-4-2, level 4. The small
SC70 package makes them ideal for use in portable elec-
tronics such as cell phones, PDA’s, notebook comput-
ers, and digital cameras.
Packaging : Tape and Reel
Applications
Cellular Handsets and Accessories
Cordless Phones
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Circuit Diagram
Schematic & PIN Configuration
1
3
4
5
1
2
3
5
4
2
SC70-5L (Top View)
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Revision 01/22/08
1
SMF05 and SMF12
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
200
1.5
Units
Watts
V
Peak Pulse Power (tp = 8/20µs)
Peak Forward Voltage (IF = 1A, tp=8/20µs)
VFP
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
20
15
VESD
kV
Lead Soldering Temperature
Operating Temperature
Storage Temperature
TL
TJ
260 (10 seconds)
-55 to +125
oC
oC
oC
TSTG
-55 to +150
Electrical Characteristics
SMF05
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
5
V
V
It = 1mA
6
VRWM = 5V, T=25°C
IPP = 1A, tp = 8/20µs
IPP = 12A, tp = 8/20µs
tp = 8/20µs
10
9.5
12.5
12
µA
V
VC
Clamping Voltage
VC
V
Peak Pulse Current
IPP
A
Junction Capacitance
Cj
Between I/O pins and
Ground
150
175
pF
VR = 0V, f = 1MHz
SMF12
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Peak Pulse Current
Junction Capacitance
12
It = 1mA
13.3
V
VRWM = 12V, T=25°C
IPP = 1A, tp = 8/20µs
IPP = 8A, tp = 8/20µs
tp = 8/20µs
1
µA
V
VC
19
25
8
VC
V
IPP
A
Cj
Between I/O pins and
Ground
60
75
pF
VR = 0V, f = 1MHz
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2008 Semtech Corp.
2
SMF05 and SMF12
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
10
1
0.1
0.01
0
25
50
75
100
125
150
0.1
1
10
100
1000
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
Pulse Waveform
Clamping Voltage vs. Peak Pulse Current
110
100
90
80
70
60
50
40
30
20
10
0
30
Waveform
Parameters:
tr = 8µs
25
20
15
10
5
td = 20µs
e-t
SMF12
SMF05
td = IPP/2
Waveform
Parameters:
tr = 8µs
td = 20µs
0
0
2
4
6
8
10
12
14
0
5
10
15
20
25
30
Peak Pulse Current - IPP (A)
Time (µs)
Capacitance vs. Reverse Voltage
SMF05 Insertion Loss S21
CH1S21 LOG
6 dB / REF 0 dB
160
140
120
100
80
SMF05
60
40
20
f = 1MHz
0
0
1
2
3
4
5
6
Reverse Voltage - VR (V)
3
.
STOP 000000000MHz
.
START 030 MHz
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2008 Semtech Corp.
3
SMF05 and SMF12
PROTECTION PRODUCTS
Typical Characteristics (Continued)
SMF05 ESD Clamping
(8kV Contact per IEC 61000-4-2)
SMF12 ESD Clamping
(8kV Contact per IEC 61000-4-2)
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2008 Semtech Corp.
4
SMF05 and SMF12
PROTECTION PRODUCTS
Applications Information
SMF Circuit Diagram
Device Connection for Protection of Four Data Lines
The SMFxx is designed to protect up to four unidirec-
tional data lines. The device is connected as follows:
1
3
4
5
1. Unidirectional protection of four I/O lines is
achieved by connecting pins 1, 3, 4, and 5 to the
data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
2
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Protection of Four Unidirectional Lines
z
z
z
z
Place the SMFxx near the input terminals or con-
nectors to restrict transient coupling.
Minimize the path length between the SMFxx and
the protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
z
z
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
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2008 Semtech Corp.
5
SMF05 and SMF12
PROTECTION PRODUCTS
Typical Applications
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2008 Semtech Corp.
6
SMF05 and SMF12
PROTECTION PRODUCTS
Outline Drawing - SC70 5L
DIMENSIONS
INCHES
MILLIMETERS
A
DIM
MIN NOM MAX MIN NOM MAX
e1
-
-
-
-
-
-
D
E
A
A1
A2
b
.043
1.10
0.10
H
.000
.004 0.00
N
.028 .035 .039 0.70 0.90 1.00
c
GAGE
-
-
-
-
.006
.003
.012 0.15
.009 0.08
0.30
0.22
2X E/2
PLANE
c
D
EI
.075 .079 .083 1.90 2.00 2.10
0.15
L
(L1)
E1 .045 .049 .053 1.15 1.25 1.35
01
E
e
.083 BSC
.026 BSC
.051
2.10 BSC
0.65 BSC
1.30 BSC
1
2
ccc
C
e1
L
2X N/2 TIPS
e
DETAIL A
.010 .014 .018 0.26 0.36 0.46
(.017)
(0.42)
L1
N
B
5
5
-
-
01
0°
8°
0°
8°
D
aaa
.004
.004
.012
0.10
0.10
0.30
bbb
ccc
aaa C
A2
A
SEE DETAIL A
SEATING
PLANE
SIDE VIEW
C
A1
bxN
bbb
C
A-B D
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
REFERENCE JEDEC STD MO-203, VARIATION AA.
4.
Land Pattern - SC70 5L
X
DIMENSIONS
DIM
INCHES
(.073)
.039
MILLIMETERS
(1.85)
1.00
0.65
0.40
0.85
2.70
C
G
P
X
Y
Z
C
G
Z
.026
.016
.033
Y
.106
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
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2008 Semtech Corp.
7
SMF05 and SMF12
PROTECTION PRODUCTS
Marking Codes
Marking
Part Number
Code
SMF05
SMF12
F05
F12
Ordering Information
Part Number
SMF05.TC
Lead Finish
Qty per Reel
3,000
Reel Size
7 Inch
SnPb
SnPb
SMF12.TC
3,000
7 Inch
SMF05.TCT
SMF12.TCT
Pb free
Pb free
3,000
7 Inch
3,000
7 Inch
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2008 Semtech Corp.
8
相关型号：
SMF05C.TGT
Trans Voltage Suppressor Diode, 100W, Unidirectional, 5 Element, Silicon, PLASTIC, SC-70, 6 PIN
SEMTECH
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