TS33010 [SEMTECH]
High Efficiency Synchronous 500mA DC/DC Buck Converter, 2 . 2 5Mhz;型号: | TS33010 |
厂家: | SEMTECH CORPORATION |
描述: | High Efficiency Synchronous 500mA DC/DC Buck Converter, 2 . 2 5Mhz |
文件: | 总14页 (文件大小:463K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TS33010
High Efficiency Synchronous 500mA
DC/DC Buck Converter, 2 . 2 5Mhz
TRIUNE PRODUCTS
Features
Description
•
Fixed output option has automatic low power PFM
mode for reduced quiescent current at light loads
2.25MHz +/- 10% fixed switching frequency
Fixed output voltages: 0.8V, 0.9V, 1.2V, 1.5V, 1.8V,
2.5V, and 3.3V with +/- 2% output tolerance
Input voltage range: 2.0V to 5.5V
The TS33010 is a DC/DC synchronous switching regulator
with fully integrated power switches, internal compensation,
and full fault protection. The switching frequency of
2.25MHz enables the use of extremely small filter
components, resulting in smaller board space and reduced
BOM costs.
•
•
•
•
Voltage mode PWM control with input voltage feed-
forward compensation
•
•
•
•
Voltage supervisor for VOUT reported at the PG pin
Input supply under voltage lockout
Soft start for controlled startup with no overshoot
Full protection for over-current, over-temperature,
and VOUT overvoltage
When the input current is greater than approximately 50mA,
the TS33010 utilizes PWM voltage mode feedback with input
voltage feed-forward to provide a wide input voltage range
without the need for external compensation.
•
•
•
•
•
•
Less than 200nA in shutdown mode
Multiple enable pins for flexible system sequencing
Low external component count
Junction operating temperature -40°C to 125°C
Packaged in a 16 pin QFN (3x3)
Product is lead-free, Halogen Free, RoHS / WEEE
compliant
When the input current is less than 50mA, the device
uses a PFM mode to provide increased efficiency at light
loads. The cross over between PFM and PWM modes is
automatic and has hysteresis to prevent oscillation
between the modes. Additionally, the nLP mode pin can
be used to force the device into PWM mode to reduce the
output ripple, if needed.
Applications
The TS33010 integrates a wide range of protection circuitry;
including input supply under-voltage lockout, output under-
voltage, output over-voltage, soft start, high side FET and
low side FET current limits.
•
Point of load
•
•
•
•
Systems with deep submicron ASICs/FPGAs
Set-top box
Communications equipment
Portable and handheld equipment
Typical Applications
Fixed Output
1.5μH
VOUT
VCC
VCC
VSW
10μF
VOUT
Sense
22μF
FB
VCC or VOUT
10 kohm
(optional)
nLP
EN
nLP
EN
PG
PG
TS33010
Final
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June 2, 2016
Pinout
(Top View)
Pin Description
Pin Name
VSW
Pin Function
Description
Pin
1
#
Switching Voltage Node
Connect to 1.5μH inductor. Short to Pins 12, 14, & 15
Input voltage supply. Short to Pins 3 & 11
Input voltage supply. Short to Pins 2 & 11
2
VCC
Input
Input
V
oltage
3
VCC
Voltage
4
5
6
GND
GND
Ground for the internal circuitry of the device
Feedback voltage for the regulator when used in adjustable mode.
Connect to the output voltage resistor divider for adjustable mode
and No Connection for fixed output modes
FB
Feedback Input
Output Voltage Sense. Requires kelvin connection to 10μF
output capacitor
VOUT Sense
Output Voltage
nLP nput
PG Output
Enable nput
Test Mode Output
Sense
Forcing this pin high prevents the device from going into Low
Power PFM mode operation
7
8
9
nLP
PG
EN
I
Power Good indicator Open-drain output.
Input high voltage enables the device. Input low disables the
device.
I
10
TEST OUT
Connect to GND. For internal testing use only.
11
12
VCC
VSW
Input
V
oltage
Input voltage supply. Short to Pins 2 & 3
Switching Voltage Node
Connect to 1.5μH inductor. Short to Pins 1, 14, & 15
GND supply for internal low-side FET/integrated diode. Short to
Pin 16
13
PGND
Power GND
14
15
VSW
VSW
S
witching Voltage Node
witching Voltage Node
Connect to 1.5μH inductor. Short to Pins 1, 12, & 15
Connect to 1.5μH inductor. Short to Pins 1, 12, & 14
S
GND supply for internal low-side FET/integrated diode. Short to
Pin 13
16
PGND
Power GND
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Functional Block Diagram
PG
nLP
EN
VCC
MONITOR
&
Under Voltage
Protection
CONTROL
Thermal
Protection
Oscillator
VCC
Over Current
Protection
Ramp
Generator
Vref
&
Softstart
Gate
Drive
VSW
1.5μH
VOUT
Gate Drive
Control
10μF
Comparator
Gate
Drive
Error Amp
PGND
RTOP
Compensation
Network
(Adjustable)
RBOT
(Adjustable)
Vout
Sense
FB
GND
(Adjustable)
(Adjustable)
Figure 1: TS33010 Block Diagram for fixed and adjustable mode devices
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Absolute Maximum Rating
Over operating free–air temperature range unless otherwise noted(1, 2)
Parameter
Value
-0.3 to 6.0
-1 to 6.0
-0.3 to 6.0
±2k
Unit
V
V
CC
VSW
V
EN, PG,FB, nLP, TEST OUT, VOUT
S
ense
V
Electrostatic Discharge – Human Body Model
Electrostatic Discharge – Charge Device Model
V
±500
V
Lead Temperature (soldering
,
10 seconds)
260
°C
Notes:
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating con-
ditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
Thermal Characteristics
Symbol
Parameter
Value
Unit
șJA
șJC
Thermal Resistance Junction to Air (Note 1)
Thermal Resistance Junction to Case (Note 1)
50
°C/W
°C/W
3.9
Note 1: Assumes QFN16 1 in2 area of 2 oz copper and 25°C ambient temperature.
Recommended Operating Conditions
S
ymbol
P
arameter
oltage
orage Temperature ange
Maximum Junction emper
Operating Junction Temperature Range
Min
2.0
Typ
Max
5.5
Unit
V
3.6
V
CC
Input Operating V
-65
150
150
125
°C
TS
St
R
TG
°C
TJ
T
ature
MAX
-40
°C
TJ
1.5
10
5
μH
μF
Pȍ
μF
LOUT
Output Filter Inductor Typical Value (Note 1,3)
Output Filter Capacitor Typical Value (Note 2,3)
Output Filter Capacitor ESR
3.3
0
13
20
COUT
COUT
-ESR
22
CBY
Input Supply Bypass Capacitor Typical Value (Note 2)
PASS
Note 1: For best performance, an inductor with a saturation current rating higher than the maximum Vout load requirement plus the inductor
current ripple. See the inductor current ripple calculations in inductor calculations sections.
Note 2: For best performance, a low ESR ceramic capacitor– X7R or X5R types should be used. Y5V should be avoided.
Note 3: Min and max listed are to account for +/-20% variation of the typical value. Typical values of 10μF and 1.5μH are recommended.
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C
haracteristics
Electrical characteristics, TJ = -40°C to 125°C, VCC = 3.6V (unless otherwise noted)
Symbol
Parameter
Condition
Min
Typ
Max
Unit
VCC Supply Voltage
I
= 0A, EN=VCC, nLP=5V,
LOAD
Quiescent current Normal Mode
ICC-NORM
7
mA
V
OUT=1.8V
I
=0A, EN=VCC, nLP=0V,
Quiescent current Low Power PFM
Mode
LOAD
ICC-LPM
25
45
5
μA
μA
V
OUT=1.8V
EN=0V
0.1
ICC-SHUTDOWN
Quiescent current Shutdown Mode
VCC Under Voltage Lockout
Input Supply Under Voltage
Threshold
VCCUV
1.6
50
1.75
2.5
VCC Increasing
V
Input Supply Under Voltage
Threshold Hysteresis
VCCUV_HYST
mV
OSC
FOSC
Oscillator Frequency
2
2.25
MHz
PG Open Drain Output
TPG
PG Release Timer
14
ms
μA
V
IOH-PG
VOL-PG
VPG=5V VCC=5V
IPG = -0.3mA
High-Level Output Leakage
Low-Level Output Voltage
0.1
0.1
0.4
EN / nLP Input Voltage Thresholds
VIH-EN/nLP
High Level Input Voltage
VCC=2V to 5V
VCC=2V to 5V
1.5
V
Low Level Input Voltage
Input Hysteresis
V
VIL-EN/nLP
VHYST-EN/nLP
VCC=2V to 5V
VEN=5V, VCC=5V
VEN=0V, VCC=5V
200
0.1
0.1
65
mV
μA
μA
.ȍ
IIN-EN
EN Input Leakage
nLP Pulldown Resistor
Pulldown to GND
nLPPD
Thermal Shutdown
Thermal Shutdown Junction
Temperature Voltage
190
15
TSD
°C
°C
TSD Hysteresis
TSDHYST
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Regulator Characteristics
Electrical characteristics, TJ = -40C to 125C, VCC = 3.6V (unless otherwise noted)
Symbol
Parameter
Condition
Min
Typ
Max
Unit
Switch Mode Regulator: L=1.5μH and C=10μF
Output Voltage Tolerance in PWM
Mode
VOUT-PWM
VOUT – 2%
VOUT
VOUT + 2%
V
IVSW = -500mA (Note 1)
150
95
Pȍ
Pȍ
High Side Switch On Resistance
Low Side Switch On Resistance
RDSON
I
VSW = 500mA (Note 1)
IOUT
IOUT
IOCDHS
IOCDLS
VOUT-LINE
Output Current
VCC 2.5V
500
300
mA
mA
A
Output Current
VCC < 2.5V
0.7
0.7
0.9
0.9
Over Current Detect HS
Over Current Detect LS
A
VCC = 2.5V to 5V,
VOUT = 1.8V, ILOAD = 300mA
(Note 2)
Output Line Regulation
Output Load Regulation
-15
15
mV
V
ILOAD = 10mA to 300mA,
VCC = 5V, VOUT = 1.8V
VOUT-LOAD
1.791
1.8
0.6
1.809
FB Switch Point (Note 3)
V
FBTH
FBTH-TOL
IFB
Feedback Reference
-1.5
1.5
%
Feedback Reference Tolerance
Feedback Input Current
100
1.2
nA
ms
TSS
Softstart Ramp Time
85% VOUT
2% VOUT
106% VOUT
2% VOUT
VOUT-PG
VOUT-PG_HYST
VOUT-OV
VOUT-OV_HYST
VOUT Power Good Threshold
VOUT Power Good Hysteresis
VOUT Over Voltage Threshold
VOUT Over Voltage Hysteresis
Note 1: R
Note 2:
Note 3:
is characterized at 500mA and tested at lower current in production.
Specified Output Line Reg is relative to nominal VCC.
FB is for adjustable part only.
TS33010
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Functional Description
Switching output, VSW
This voltage-mode Point of Load (POL) synchronous
step-down power supply product can be used in the
consumer, and industrial market segments. It includes
flexibility to be used for a wide range of output voltages
and is optimized for high efficiency power conversion
with low RDSON integrated synchronous switches. A
2.25MHz internal switching frequency facilitates low cost
LC filter combinations and improved transient response.
Additionally, the fixed output version, with integrated
Power on Reset and Fault circuitry enables a minimal
external component count to provide a complete power
supply solution for a variety of applications.
This is the switching node of the regulator. It should be
connected directly to the 1.5μH inductor with a wide, short
trace. It is switching between VCC and PGND at the
switching frequency.
Ground, GND
This ground is used for the majority of the device including
the analog reference, control loop, and other circuits.
Power Ground, PGND
This is a separate ground connection used for the low side
synchronous FET to isolate switching noise from the rest of
the device.
Detailed Pin Description
Unregulated input, VCC
Enable, EN
This terminal is the unregulated input voltage source for the
IC. It is recommended that a 22μF bypass capacitor be
placed close as possible to the VCC pins for best
performance. Since this is the main supply for the IC, good
layout practices need to be followed for this connection.
This is an input terminal to activate the entire device. This
will enable the internal reference, oscillator, etc, and allow
the fault detection circuitry to work correctly. Notice that
the EN needs to be low for the part to exhibit less than
200nA quiescent current. The input threshold is
TTL/CMOS compatible.
Feedback, FB
This is the voltage feedback input terminal for the
adjustable version. For the fixed mode versions, this pin
should be left floating and not connected.
Power Good Output, PG
This is an open drain, active high output. The switched
mode output voltage is monitored and the PG line will
remain
The connection on the PCB should be kept as short as
possible from the feedback resistors, kept away from the
low until the output voltage reaches the VOUT-UV
VSW
connections or other switching/high
threshold,
approximately 85% of the final regulation output. Once the
internal comparator detects the output voltage is above the
desired threshold, an internal 14ms delay timer is activated
and the PG line is de-asserted to high when this delay timer
expires. In the event the output voltage decreases below
VOUT- UV the PG line will be asserted low immediately and
frequency nodes, and should not be shared with any other
connection. This should minimize stray coupling, reduce
noise injection, and minimize voltage shift cause by output
load.
To choose the resistors for the adjustable version,
use the following equation:
remain low until the output rises above VOUT-UV and the delay
VOUT = 0.6 (1 + RTOP/RBOT
)
timer times out again. If EN is pulled low and the VCC input
undervoltage trips, the PG pin will immediately be pulled
low.
For stability, RTOP should be 270K Ohms to 330K Ohms.
Output Voltage Sense, VOUT Sense
nLow Power Mode Output, nLP
This is the input terminal for the voltage output feedback
and is needed for both adjustable and fixed voltage
versions. This should be connected to the main output
capacitor, and the same good layout practices should be
followed as for the FB connection. Keep this line as short
as possible, keep it away from the VSW and other
switching or high frequency traces, and do not share this
connection with any other connection
This is an input to force the PWM mode when light
load is on the output. The PFM low power mode has
higher output voltage ripple, which is some
applications may be unacceptable. If low ripple is
needed on the output this pin can be tied to VCC
input, or switched above 1.5V during operation to
force the device into normal PWM mode.
on the PCB.
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Internal Protection Details
Internal Current Limit
Current limit is always active when the regulator is
enabled. High side current limit will shorten the high side
on time and tri-state the high side. Additionally, low side
current limit will protect the low side FET and turn off the
switch if current limit is sensed on the low side switch.
Since the output is fully synchronous, the current limit is
protected on the low side in both the positive and negative
direction.
Soft Start
Soft start ensures current limit does not prevent regulator
startup and minimize overshoot at startup. The typical
startup time is 1.2ms. These values do not change with
output voltage, current limit settings, or adjustable/fixed
mode. The soft start is re-triggered with the any rising
edge that enables the regulator, including the EN input
pins, thermal shutdown, VCC Undervoltage, or a VCC
Power cycle.
Output Overvoltage
If the output of the regulator exceeds 106% of the
regulation voltage, the VSW outputs will tri-state to protect
the device from damage. This check occurs at the start of
each switching cycle. If it occurs during the middle of a
cycle, the switching for that cycle will complete, and the
VSW outputs will tri-state at the beginning of the next
cycle.
VCC Under-Voltage Lockout
The device is held in the off state until VCC reaches 1.60V.
There is a 50mV hysteresis on this input, which requires
the input to fall below 1.55V before the device will disable.
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External Component Selection
The internal compensation is optimized for a 10μF output capacitor and a 1.5μH inductor. To keep the output ripple low, a
low ESR (less than 20mOhm) ceramic is recommended. For optimal over-current protection, the inductor should be able to
handle 1A without saturation.
Application Using A Multi-Layer PCB
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be
followed when laying out this part on the PCB.
The following are guidelines for mounting the exposed pad IC on
a Multi-Layer PCB with ground aplane.
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Via's
Package Outline
Package and PCB Land Configuration
For a Multi-Layer PCB
JEDEC standard FR4 PCB Cross-section:
Package Solder Pad
(square)
Component Traces
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
2 Plane
1.0142 - 1.0502 mm
Ground Plane (1oz
Cu)
1.5748mm
Thermal Via
4
Plane
0.5246 - 0.5606 mm
Power Plane (1oz
Cu)
Thermal Isolation
Power plane only
0.0 - 0.071 mm Board Base
& Bottom Pad
Package Solder Pad
(bottom trace)
Multi-Layer Board (Cross-sectional View)
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to
the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal
vias, thickness of copper, etc.
TS33010
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Mold compound
Die
Epoxy Die attach
Exposed pad
Solder
5% - 10% Cu coverage
Single Layer, 2oz Cu
Thermal Vias with Cu plating
90% Cu coverage
Ground Layer, 1oz Cu
Signal Layer, 1oz Cu
Bottom Layer, 2oz Cu
20% Cu coverage
Note: NOT to Scale
The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad
package. Each application will have different requirements and limitations and therefore the user should use sufficient
copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for
ambient temperatures above 85°C. The de-rate value will depend on calculated worst case power dissipation and the
thermal management implementation in the application.
Application Using A Single Layer PCB
Use as much Copper Area
as possible for heat spread
Package Thermal Pad
Package Outline
Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single
layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance
attachment method (solder paste or thermal conductive epoxy).
In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat.
IMPORTANT
:
If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power
dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board.
TS33010
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Package Mechanical Drawings (all dimensions in mm)
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of
itch
Overall Height
tandoff
ontac
P
ins
N
e
16
P
0.50 BSC
0.90
A
0.80
0.00
1.00
0.05
S
A1
A3
D
0.02
C
t
T
hickness
0.20 REF
3.00 BSC
1.70
Overall Length
Exposed Pad Width
Overall Width
E2
E
1.55
1.80
3.00 BSC
1.70
Exposed Pad Length
D2
b
1.55
0.20
0.20
0.20
1.80
0.30
0.40
-
Contac
Contac
Contac
t
t
t
Width
0.25
Length
L
0.30
-t
o
-Exposed
Pad
K
-
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PCB Board Land Pattern
DIMENSIONS IN MILLIMETERS
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Contac
t
Pitch
E
0.50 BSC
Optional
Optional
C
en
t
er Pad Width
er Pad Length
W2
T2
C1
C2
X1
Y1
G
-
-
1.70
1.70
-
Cen
t
-
-
Contac
Contac
Contac
Contac
t
t
t
t
Pad Spacing
-
3.00
Pad Spacing
-
3.00
-
Pad Width(X8)
Pad Length (X8)
-
-
-
-
-
0.35
0.65
-
Distance Between
Pads
0.15
Notes:
Dimensions and tolerances per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact values shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information only.
TS33010
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Product Ordering Information
Part Number
Description
T
T
T
T
T
T
T
T
S33010-M008QFNR
S33010-M009QFNR
S33010-M012QFNR
S33010-M015QFNR
S33010-M018QFNR
S33010-M025QFNR
S33010-M033QFNR
S33010-M000QFNR
2.25MHz Sync Buck, 500mA - 0.8V
2.25MHz Sync Buck, 500mA - 0.9V
2.25MHz Sync Buck, 500mA - 1.2V
2.25MHz Sync Buck, 500mA - 1.5V
2.25MHz Sync Buck, 500mA - 1.8V
2.25MHz Sync Buck, 500mA - 2.5V
2.25MHz Sync Buck, 500mA - 3.3V
2.25MHz Sync Buck, 500mA - ADJ
TS33010
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IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as
a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time
of sale, and all sales are made inaccordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE
OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN
SOLELY AT THE CUSTOMER’S OWN RISK. Should
a customer purchase or use Semtech products for any such unauthorized application, the customer shall
indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney
fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. Triune Systems, L.L.C. is now
a wholly-owned subsidiary of Semtech
Corporation. The Triune Systems® name and logo, MPPT-lite™, and nanoSmart® are trademarks of Triune Systems, LLC. in the U.S.A. All other trademarks
and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or
discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or
implied, regarding the suitability of its products for any particular purpose. All rights reserved.
© Semtech 2015
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
TS33010
Final
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June 2, 2016
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