uClamp2271P.TNT [SEMTECH]
High-Power uClamp;
| 型号： | uClamp2271P.TNT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | High-Power uClamp 局域网 二极管 |
| 文件： | 总14页 (文件大小：826K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
μClamp0571P - μClamp3671P
High-Power μClamp®
1-Line Surge Protection
PROTECTION PRODUCTS
Description
Features
•
•
•
•
•
•
•
•
•
•
Transient protection for high-speed data lines to
IEC 61000-4-2 (ESD) 30kV (air), 30kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 20 - 80A (8/20μs)
Protects one data or power line
Low leakage current
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to EOS,
lightning, CDE, and ESD. They feature large cross-
sectional area junctions for conducting high transient
currents. These devices offer desirable characteristics
for board level protection including fast response time,
low operating and clamping voltage, and no device
degradation.
High peak pulse current capability
Operating voltage options: 5V, 8V, 10V, 12V, 15V,
18V, 22V, 26V, 36V
Solid-state silicon-avalanche technology
The μClamp®xx71P series are in 2-pin SGP1610N2
package measuring 1.6 x 1.0 mm with a nominal
height of 0.57mm. The leads are finished with leadfree
NiPdAu. They may be used to protect 5V, 8V, 10V, 12V,
15V, 18V, 22V, 26V, and 36V systems. They feature
high surge current capability and low clamping
voltage making them ideal for use in harsh transient
environments.
Mechanical Characteristics
•
•
•
•
•
•
SGP1610N2 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.6 x 1.0 x 0.57 mm
Lead Finish: NiPdAu
Marking: Marking code
Packaging: Tape and Reel
Applications
•
•
•
•
•
Cellular Handsets & Accessories
USB Voltage Bus
Battery Protection
Digital Lines
Proximity Sensors
Package Dimension
Schematic & Pin Configuration
A
1.60
B
1
1.00
0.50
2
SGP1610N2 (Bottom View)
Nominal Dimensions (mm)
μClamp0571P - μClamp3671P
1 of 14
Semtech
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Final Datasheet
Revision date
Rev 8.0
1/11/2018
Absolute Maximum Rating
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
PPK
1200-1500
W
ESD per IEC 61000-4-2 (Air)1
30
30
VESD
kV
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
TJ
-40 to +125
-55 to +150
OC
OC
TSTG
Electrical Characteristics (T=25OC unless otherwise specified)
µClamp0571P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
5
V
IBR = 1mA, Pin 1 to 2
VRWM = 5V
6
7
9
V
T = 25OC
<10
100
80
10
nA
A
Ipp
tp = 8/20μs, Pin 1 to 2
IPP = 40A
IPP = 80A
Clamping Voltage
VC
tp = 8/20μs
V
15
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
0.05
Ω
VR = 0V, f = 1MHz
675
pF
µClamp0871P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
8
V
IBR = 1mA, Pin 1 to 2
VRWM = 8V
9.5
11
13
100
65
15
V
T = 25OC
<10
nA
A
Ipp
tp = 8/20μs, Pin 1 to 2
IPP = 10A
IPP = 65A
Clamping Voltage
VC
tp = 8/20μs
V
23
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
0.05
Ω
VR = 0V, f = 1MHz
475
pF
μClamp0571P - μClamp3671P
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Semtech
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Electrical Characteristics (T=25OC unless otherwise specified)
µClamp1071P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
10
V
IBR = 1mA, Pin 1 to 2
VRWM = 10V, Pin 1 to 2 T = 25OC
tp = 8/20μs , Pin 1 to 2
12
13.5 15.5
V
<10
100
60
nA
A
Ipp
IPP = 10A
tp = 8/20μs
17
Clamping Voltage
VC
V
IPP = 60A
25
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
0.05
Ω
VR = 0V, f = 1MHz
350
pF
µClamp1271P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
12
19
100
45
V
IBR = 1mA, Pin 1 to 2
VRWM = 12V, Pin 1 to 2
tp = 8/20μs , Pin 1 to 2
14
16
V
T = 25OC
<10
nA
A
Ipp
IPP = 10A
IPP = 45A
22
Clamping Voltage
VC
tp = 8/20μs
V
30
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
0.05
Ω
VR = 0V, f = 1MHz
275
pF
μClamp0571P - μClamp3671P
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Semtech
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
µClamp1571P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
15
V
IBR = 1mA, Pin 1 to 2
VRWM = 15V, Pin 1 to 2
tp = 8/20μs , Pin 1 to 2
17.5 20
<10
23
V
T = 25OC
100
40
nA
A
Ipp
IPP = 10A
IPP = 40A
25
tp = 8/20μs
Pin 1 to 2
Clamping Voltage
VC
V
40
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
0.05
Ω
VR = 0V, f = 1MHz
220
pF
µClamp1871P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
18
V
IBR = 1mA, Pin 1 to 2
VRWM = 18V, Pin1 to 2
tp = 8/20μs , Pin 1 to 2
20
22
25
V
T = 25OC
<10
100
35
nA
A
Ipp
IPP = 10A
IPP = 35A
28
Clamping Voltage
VC
tp = 8/20μs
V
45
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
0.10
Ω
VR = 0V, f = 1MHz
225
pF
μClamp0571P - μClamp3671P
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Semtech
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
µClamp2271P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
22
V
IBR = 1mA, Pin 1 to 2
VRWM = 22V, Pin 1 to 2
tp = 8/20μs , Pin 1 to 2
25.5 29
<10
33.5
100
25
V
T = 25OC
nA
A
Ipp
IPP = 10A
IPP = 25A
40
Clamping Voltage
VC
tp = 8/20μs, Pin 1 to 2
V
55
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
0.10
Ω
VR = 0V, f = 1MHz
165
pF
µClamp2671P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
26
V
IBR = 1mA, Pin 1 to 2
VRWM = 5V
29
32
35
100
23
50
V
T = 25OC
<10
nA
A
Ipp
tp = 8/20μs , Pin 1 to 2
IPP = 10A
IPP = 23A
Clamping Voltage
VC
tp = 8/20μs
V
65
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
0.15
Ω
VR = 0V, f = 1MHz
155
pF
μClamp0571P - μClamp3671P
5 of 14
Semtech
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
µClamp3671P
Parameter
Symbol Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Peak Pulse Current
VRWM
VBR
IR
Pin 1 to 2
36
44
100
18
V
IBR = 1mA, Pin 1 to 2
VRWM = 36V
37
V
T = 25OC
<10
0.29
nA
A
Ipp
tp = 8/20μs , Pin 1 to 2
IPP = 2A
IPP = 18A
48
Clamping Voltage
VC
tp = 8/20μs
V
80
Dynamic Resistance2,3
Junction Capacitance
RDYN
CJ
tp = 0.2/100ns
Ω
VR = 0V, f = 1MHz
150
pF
Notes
1) Measured with a 40dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane.
2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
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Semtech
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Typical Characteristics
Clamping Voltage vs. Peak Pulse Current (tp = 8/20 μs)
Non-Repetitive Peak Pulse Power vs. Pulse Time
75
100
Transmission Line Pulse Test (TLP)
Settings:
70
65
60
55
50
45
40
35
30
25
20
15
10
5
TA = 25OC
µClamp3671P
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
1 = 70ns to t2 = 90ns
t
µClamp2271P
10
µClamp1571P
1500W @ 20µS
1350W @ 20µS
µClamp1271P
µClamp1071P
1
µClamp0871P
1200W @ 20µS
µClamp0571P
0.1
0
0.1
1
10
100
1000
0
10
20
30
40
50
60
70
80
90
Pulse Duration - tp (µs)
Peak Pulse Current - IPP (A)
TLP Characteristic
Forward Voltage vs. Peak Pulse Current (tp = 8/20 μs)
6
40
35
30
25
20
15
10
5
TA = 25OC
Waveform: tp= 8x20us
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
µClamp1071P
5
4
3
2
1
0
µClamp0871P
µClamp0571P
µClamp1271P
µClamp1571P
µClamp2271P
µClamp3671P
0
0
5
10
15
20
25
30
35
40
45
50
55
0
10
20
30
40
50
60
70
80
90
Peak Pulse Current - IPP (A)
Clamping Voltage (V)
ESD Clamping - µClamp0571P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp0571P
(-8kV Contact per IEC 61000-4-2)
35
15
UC0571P_P8_ESD
Measured with 50 Ohm scope input
10
5
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
30
25
20
15
10
5
0
-5
-10
-15
-20
-25
-30
-35
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
0
UC0571P_AR_N8_ESD
-5
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
μClamp0571P - μClamp3671P
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Semtech
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Typical Characteristics (Continued)
ESD Clamping - µClamp0871P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp0871P
(-8kV Contact per IEC 61000-4-2)
40
10
5
35
30
25
20
15
10
0
-5
-10
-15
-20
-25
-30
-35
-40
Measured with 50 Ohm scope input
5
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-5
-10
0
10
20
30
Time (ns)
40
50
60
70
80
-10
-10
-10
0
10
20
30
40
50
60
70
80
80
80
Time (ns)
ESD Clamping - µClamp1071P
(-8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp1071P
(+8kV Contact per IEC 61000-4-2)
50
40
30
20
10
0
10
0
-10
-20
-30
-40
-50
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
0
10
20
30
40
50
60
70
-10
0
10
20
30
Time (ns)
40
50
60
70
80
Time (ns)
ESD Clamping - µClamp1271P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp1271P
(-8kV Contact per IEC 61000-4-2)
50
40
30
20
10
0
10
5
0
-5
-10
-15
-20
-25
-30
-35
-40
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
0
10
20
30
40
50
60
70
Time (ns)
Time (ns)
μClamp0571P - μClamp3671P
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Typical Characteristics (Continued)
ESD Clamping - µClamp1571P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp1571P
(-8kV Contact per IEC 61000-4-2)
60
10
5
50
40
30
20
0
-5
-10
-15
-20
-25
-30
-35
-40
10
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
0
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
ESD Clamping - µClamp1871P
(-8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp1871P
(+8kV Contact per IEC 61000-4-2)
60
50
40
30
20
10
0
20
10
0
-10
-20
-30
-40
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
Time (ns)
40
50
60
70
80
Time (ns)
ESD Clamping - µClamp2271P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp2271P
(-8kV Contact per IEC 61000-4-2)
70
60
50
40
30
20
10
0
10
5
0
-5
-10
-15
-20
-25
-30
-35
-40
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
μClamp0571P - μClamp3671P
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Typical Characteristics (Continued)
ESD Clamping - µClamp2671P
(+8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp2671P
(-8kV Contact per IEC 61000-4-2)
80
10
5
70
60
50
40
30
20
0
-5
-10
-15
-20
-25
-30
-35
-40
Measured with 50 Ohm scope input
10
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
Time (ns)
40
50
60
70
80
Time (ns)
ESD Clamping - µClamp3671P
(-8kV Contact per IEC 61000-4-2)
ESD Clamping - µClamp3671P
(+8kV Contact per IEC 61000-4-2)
90
80
70
60
50
40
30
20
10
0
10
5
0
-5
-10
-15
-20
-25
-30
-35
-40
Measured with 50 Ohm scope input
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-10
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
Time (ns)
40
50
60
70
80
Time (ns)
μClamp0571P - μClamp3671P
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Application Information
Stencil Opening
Land Pad ( Follow drawing )
Assembly Guidelines
The table below provides Semtech’s recommended
assembly guidelines for mounting this device. The
figure at the right details Semtech’s recommended
aperture based on the below recommendations. Note
that these are only recommendations and should
serve only as a starting point for design since there
are many factors that affect the assembly process. The
exact manufacturing parameters will require some
experimentation to get the desired solder application.
1.600
0.700
1.000
1.025
Assembly Parameter
Solder Stencil Design
Aperture shape
Recommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
All Dimensions are in mm.
Stencil opening
Solder Stencil Thickness 0.125 mm (0.005”)
Land Pad.
Component
Solder Paste Type
Type 3 size sphere or smaller
per JEDEC J-STD-020
Solder Reflow Profile
Recommended Mounting Pattern
PCB Solder Pad Design Non-Solder mask defined
PCB Pad Finish
OSP OR NiAu
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Outline Drawing - SGP1610N2
A
D
B
E
DIMENSIONS
MILLIMETERS
MIN NOM MAX
DIM
A
0.45
0.50 0.55
A1 0.000 0.015 0.05
b
D
E
e
0.35
1.55
0.95
0.40 0.45
1.60
1.00
1.65
1.05
1.10 BSC
L
0.85
0.90 0.95
TOP VIEW
2
N
aaa
0.08
0.10
bbb
A
SEATING
PLANE
aaa C
C
A1
D/2
0.025-0.075
E/2
LxN
R0.100
Pin 1 ID
bxN
bbb
C
A B
e/2
e
BOTTOM VIEW
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SGP1610N2
DIMENSIONS
DIM MILLIMETERS
(1.225)
0.60
1.00
0.625
1.85
C
G
X
Y
Z
Z
G
(C)
Y
X
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
μClamp0571P - μClamp3671P
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Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Marking Code
06
Tape and Reel Specification
PIN 1 Location
(Towards Sprocket Holes)
Ordering Information
Part Number
Marking Code Working Voltage Qty per Reel
μClamp0571P.TNT 06
μClamp0871P.TNT 11
μClamp1071P.TNT 12
μClamp1271P.TNT 16
μClamp1571P.TNT 18
μClamp1871P.TNT 24
μClamp2271P.TNT 26
μClamp2671P.TNT 30
μClamp3671P.TNT 37
5V
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8V
10V
12V
15V
18V
22V
26V
36V
μClamp0571P - μClamp3671P
13 of 14
Semtech
www.semtech.com
Final Datasheet
Revision Date
Rev 8.0
1/11/2018
Important Notice
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided
as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves
the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before
placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications
applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS,
DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY,
LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD
TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized
application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against
all claims, costs damages and attorney fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be
marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described
in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of
its products for any particular purpose. All rights reserved.
© Semtech 2017
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
μClamp0571P - μClamp3671P
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Semtech
Final Datasheet
Revision date
8.0
1/11/2018
相关型号：
UCLAMP2801T.TCT
Trans Voltage Suppressor Diode, 240W, 28V V(RWM), Unidirectional, 1 Element, Silicon,
SEMTECH
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