AWT722 [SEOUL]
surface-mount LED; 表面贴装LED
| 型号： | AWT722 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | surface-mount LED |
| 文件： | 总15页 (文件大小：610K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Specification
AWT722
SSC
Drawn
Approval
Approval
: SSC-QP-7-07-24 (Rev.00)
CONTENTS
1. Feature & Application
2. Absolute M axim um Ratings
3. Electro Characteristics
4. Optical characteristics
5. Color & Binning
6. Rank of AW T722
7. Outline Dim ension
8. Packing
9. Soldering
10. Precaution for use
: SSC-QP-7-07-24 (Rev.00)
AWT722
AWT722
Description
Features
This surface-mount LED comes
in PLCC standard package
dimension. It has a substrate
made up of a molded plastic
reflector sitting on top of a bent
lead frame. The die is attached
within the reflector cavity and
the cavity is encapsulated by
epoxy or silicone.
•
White colored SMT
package.
• Material : InGaN/SiC
• Encapsulating Resin :
Epoxy Resin
• Suitable for all SMT
assembly methods ;
Suitable for all
The package design coupled
with careful selection of
component materials allow these
products to perform with high
reliability in a larger
soldering methods
• RoHS Compliant
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
Applications
• Interior automotive
• Office Automation,
Electrical Appliances,
Industrial Equipment
: SSC-QP-7-07-24 (Rev.00)
2. Absolute maximum ratings
Parameter
Symbol
Value
342
Unit
mW
Power Dissipation
Pd
Forward Current
IF
90
mA
*2
Peak Forward Current
Reverse Voltage (per die)
Operating Temperature
Storage Temperature
IFM
100
5
mA
V
VR
Topr
Tstg
-40 ~ +85
-40 ~ +100
ºC
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric & Optical characteristics
Parameter
Symbol Condition
Min
2.8
Typ
3.2
Max
3.8
Unit
V
IF =20 mA
Forward Voltage (per die)
Reverse Current (per die)
VF
VR=5V
µA
mcd
lm
IR
IV
-
-
4600
11
10
*1
IF =60 mA
IF =60 mA
IF =60 mA
Luminance Intensity
-
-
-
-
Luminance Flux
Φ
V
Color Temperature
CCT
2500
-
3170
K
X
Y
0.4129
0.3725
0.497
IF =60 mA
Color Coordinate
-
0.4466
*2
IF =60 mA
IF =60 mA
2θ
Viewing Angle
-
-
120
57
-
-
deg
½
Optical Efficiency
lm/W
η
op
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
: SSC-QP-7-07-24 (Rev.00)
4. Optical characteristics
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
3.4
3.2
3.0
2.8
2.6
0
5
10
15
20
25
30
Forward Current IF [mA]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
15
30
45
60
75
90
105
120
Forward Current IF[mA]
: SSC-QP-7-07-24 (Rev.00)
4. Optical characteristics
Ambient Temperature vs. Allowable Forward Current (per die)
(Ta=25 OC )
35
30
25
20
15
10
5
0
-25
0
25
50
75
100
Ambient temperature Ta(OC)
Radiation Diagram
0
30
-30
60
-60
90
-90
: SSC-QP-7-07-24 (Rev.00)
4. Optical characteristics
Spectrum
(TA=25℃, IF=60mA)
1.0
0.8
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800
Wavelength[nm]
: SSC-QP-7-07-24 (Rev.00)
5. Color & Binning
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
520
525
515
510
530
535
540
545
550
555
505
560
565
570
575
580
585
590
595
600
500
495
610
620
490
630
830
485
480
475
470
460
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
C I E (x)
: SSC-QP-7-07-24 (Rev.00)
5. Color & Binning
0.46
0.44
0.42
0.40
0.38
0.36
v2
v1
t2
t1
2500K
w2
w1
3170K
r2
u2
u1
r1
3800K
s2
s1
4600K
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
x
● COLOR RANK
<IF=20mA, Ta=25℃>
r1
X
r2
s1
s2
ꢀ
ꢀ
ꢀ
ꢀ
Y
X
Y
X
Y
X
Y
0.3593
0.3575
0.39
0.3734
0.3612
0.3823
0.395
0.361
0.3593
0.3938
0.3988
0.385
0.3734
0.395
0.356
0.3545
0.382
0.351
0.3408
0.358
0.3575
0.356
0.3862
0.39
u2
0.3612
0.351
0.3709
0.3823
0.3938
0.4116
0.3862
0.3709
t1
t2
u1
ꢀ
ꢀ
ꢀ
ꢀ
X
Y
X
Y
X
Y
X
Y
0.3938
0.39
0.395
0.3823
0.4
0.3988
0.3938
0.432
0.439
0.4116
0.395
0.4146
0.431
0.3862
0.382
0.4129
0.42
0.3709
0.358
0.3725
0.3869
0.39
0.3862
0.42
0.4255
w2
0.3823
0.3709
0.3869
0.4
0.4255
0.432
0.4146
v2
v2
w1
ꢀ
ꢀ
ꢀ
ꢀ
X
Y
X
Y
X
Y
X
Y
0.432
0.4255
0.477
0.4861
0.4146
0.4
0.439
0.432
0.4861
0.497
0.431
0.4146
0.4289
0.4466
0.42
0.3869
0.3725
0.3838
0.3979
0.4255
0.42
0.467
0.477
0.4
0.4129
0.4588
0.467
0.3869
0.3979
0.4137
0.4137
0.4289
* Measurement Uncertainty of the Color Coordinates : ± 0.01
: SSC-QP-7-07-24 (Rev.00)
6. Rank of AWT722
▣ Rank Name Table
X1
X2
IV
X3
VF
CIE
▣ Forward Voltage [V]
Rank
Name
MIN
2.9
3.1
3.3
MAX
3.1
3.3
3.5
Y
Z
A
▣ Luminous Intensity [mcd]
Rank
Name
MIN
3500
5000
MAX
5000
7200
O
P
: SSC-QP-7-07-24 (Rev.00)
7.outline dimension
Package Outlines
6
5
4
Package
Marking
(Cathode)
1
2
3
Front View
Right View
Rear View
( Tolerance: ±0.2, Unit: mm )
Recommended
Solder Pad
Circuit Diagram
Warm White Anode
6
5
4
3
W1
W2
W3
1
2
Warm White Cathode
* MATERIALS
PARTS
MATERIALS
Package
Encapsulating Resin
Electrodes
Heat-Resistant Polymer
Epoxy Resin
Ag Plating Copper Alloy
: SSC-QP-7-07-24 (Rev.00)
8. packing
Package
Marking
( Tolerance: ±0.2, Unit: mm )
1)Quantity : 700pcs/Reel
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10 to the carrier tape
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
: SSC-QP-7-07-24 (Rev.00)
● Reel Packing Structure
Reel
R A N K :
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
R A N K :
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
245 220 142
7inch
1 SIDE
c
R A N K :
XXX
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
b
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
a
: SSC-QP-7-07-24 (Rev.00)
9. soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
Pre-heating
120~150 C
Pre-heat tim e
120 sec. M ax.
240℃ M ax.
10 sec. M ax.
o
60sec. Max.
Above 200 C
2.5~5 C / sec.
o
Peak-Tem perature
Soldering tim e Condition
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
150~200℃
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
Pre-heating
Pre-heat tim e
120 sec. M ax.
260℃ M ax.
o
60sec. Max.
Above 220 C
o
150~200
C
1~5 C / sec.
o
Peak-Tem perature
Soldering tim e Condition
10 sec. M ax.
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
: SSC-QP-7-07-24 (Rev.00)
10. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or
a desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
(3) In the case of more than 1 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
(11) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
: SSC-QP-7-07-24 (Rev.00)
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