D32182 [SEOUL]
Single Color LED, Royal Blue, 5.6mm, ROHS COMPLIANT, SMD, 2 PIN;型号: | D32182 |
厂家: | Seoul Semiconductor |
描述: | Single Color LED, Royal Blue, 5.6mm, ROHS COMPLIANT, SMD, 2 PIN 光电 |
文件: | 总31页 (文件大小:779K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SEOUL SEMICONDUCTOR
Z-POWER LED Series
Technical Datasheet for X3218X
Features
• Super high Flux output
and high Luminance
Z-Power series is designed for high current operation and
high flux output applications.
• Designed for high
current operation
Z-Power LED's thermal management perform exceeds
other power LED solutions.
• Low thermal resistance
• SMT solderbility
It incorporates state of the art SMD design and Thermal
emission material.
• Lead Free product
• RoHS compliant
Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, automotive large
LCD backlights
Application
• Mobile phone flash
• Automotive interior / exterior lighting
• Automotive signal lighting
• Automotive forward lighting
• General Torch
• Architectural lighting
• LCD TV / Monitor Backlight
• Projector light source
• Traffic signals
• Task lighting
• Decorative / Pathway lighting
• Remote / Solar powered lighting
• Household appliances
1
Rev 06 – 2007 / 08
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Full Code of Z-Power LED Series
Full code form : X1 X2 X3 X4 X5 X6 – X7 X8 – X9 X10 X11 X12 X13
1. Part Number
- X1 : Color
- X2 : Z-Power LED series number
- X3 : LENS type
- X4 : Chip quantity (or Power Dissipation)
- X5 : Package outline size
- X6 : Type of PCB
2. Internal Number
- X7
- X8
3. Code Labeling
- X9 : Luminous flux (or Radiant flux for royal blue)
- X10 X11 X12 : Dominant wavelength (or x,y coordinates rank code)
- X13 : Forward voltage
4. Sticker Diagram on Reel & Aluminum Vinyl Bag
X X X X X X – X X
8
PART NO. :
QUANTITY : ###
LOT NUMBER : ##########
1
2
3
4
5
6
7
X X10 X11 X12 X13
BIN CODE :
9
For more information about binning and labeling, refer to the Application Note -1
2
Rev 06 – 2007 / 08
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Outline Dimensions
1. Dome Type
TOP VIEW
BOTTOM VIEW
Slug
Cathode Mark
Cathode Mark
Lens
Lead
Body
Slug
Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
3. Slug of package is connected to anode.
*The appearance and specifications of the product may be changed for improvement without
notice.
3
Rev 06 – 2007 / 08
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PCB Type Outline Dimensions
Rectangular Type
Star Typ
Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
*The appearance and specifications of the product may be changed for improvement without
notice.
4
Rev 06 – 2007 / 08
www.zled.com
Characteristics for Dome type Z-Power LED
1. Pure White (W32181, W32182)
1-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
52
Parameter
Symbol
Unit
Min
32
-
Max
[2]
[1]
ФV
Luminous Flux
-
-
lm
K
[3]
Correlated Color Temperature
CRI
CCT
Ra
6300
70
65
3.0
-
-
[4]
Forward Voltage
VF
3.5
120
9
4.0
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
deg.
ºC /W
ºC /W
[5]
Thermal resistance
[6]
Thermal resistance
7.5
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
Power Dissipation
IF
PD
Tj
0.4
1.6
125
A
W
ºC
ºC
ºC
-
Junction Temperature
Operating Temperature
Storage Temperature
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[7]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
5
Rev 06 – 2007 / 08
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2. Natural white (S32181, S32182)
1-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
38
Parameter
Symbol
Unit
Min
Max
[2]
[1]
ФV
Luminous Flux
-
-
-
-
lm
K
[3]
Correlated Color Temperature
CRI
CCT
Ra
4000
73
-
-
-
[4]
Forward Voltage
VF
3.0
3.5
135
9
4.0
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
deg.
ºC /W
ºC /W
[5]
Thermal resistance
[6]
Thermal resistance
7.5
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
PD
Tj
0.4
1.6
125
A
W
ºC
ºC
ºC
-
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[7]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
6
Rev 06 – 2007 / 08
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3. Warm White (N32181, N32182)
2-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
35
Parameter
Symbol
Unit
Min
24.5
-
Max
[2]
[1]
ФV
Luminous Flux
-
-
lm
K
[3]
Correlated Color Temperature
CRI
CCT
Ra
3000
80
75
-
-
[4]
Forward Voltage
VF
3.0
3.5
120
9
4.0
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
deg.
ºC /W
ºC /W
[5]
Thermal resistance
[6]
Thermal resistance
7.5
2-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
PD
Tj
0.4
1.6
125
A
W
ºC
ºC
ºC
-
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[7]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
7
Rev 06 – 2007 / 08
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4. Royal Blue (D32181, D32182)
3-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
255
460
3.5
Parameter
Symbol
Unit
Min
80
Max
-
[2]
[1]
ФV
Radiant Flux
mW
nm
[3]
Dominant Wavelength
λD
VF
455
3.0
465
4.0
[4]
Forward Voltage
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
130
9
deg.
ºC /W
ºC /W
[5]
Thermal Resistance
Thermal Resistance
[6]
7.5
3-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
PD
Tj
0.4
1.6
A
W
ºC
ºC
ºC
-
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
125
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[7]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
2. Blue power light sources represented here are IEC825 Class 2 for eye safety
8
Rev 06 – 2007 / 08
www.zled.com
5. Blue (B32181,B32182)
4-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
11
Parameter
Symbol
Unit
Min
6
Max
-
[2]
[1]
ФV
Luminous Flux
lm
nm
[3]
Dominant Wavelength
λD
VF
455
3.0
460
3.5
130
9
475
4.0
[4]
Forward Voltage
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
deg.
ºC /W
ºC /W
[5]
Thermal Resistance
Thermal Resistance
[6]
7.5
4-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
PD
Tj
0.4
1.6
125
A
W
ºC
ºC
ºC
-
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[7]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
2. Blue power light sources represented here are IEC825 Class 2 for eye safety
9
Rev 06 – 2007 / 08
www.zled.com
6. Cyan (C32181, C32182)
5-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
40
Parameter
Symbol
Unit
Min
24.5
500
3.0
Max
-
[2]
[1]
ФV
Luminous Flux
lm
nm
[3]
Dominant Wavelength
λD
VF
505
3.5
130
9
510
4.0
[4]
Forward Voltage
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
deg.
ºC /W
ºC /W
[5]
Thermal Resistance
Thermal Resistance
[6]
7.5
5-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
PD
Tj
0.4
1.6
125
A
W
ºC
ºC
ºC
-
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[7]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
10
Rev 06 – 2007 / 08
www.zled.com
7. Green (G32181, G32182)
6-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
48
Parameter
Symbol
Unit
Min
24.5
520
3.0
Max
-
[2]
[1]
ФV
Luminous Flux
lm
nm
[3]
Dominant Wavelength
λD
VF
527
3.5
130
9
535
4.0
[4]
Forward Voltage
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
deg.
ºC /W
ºC /W
[5]
Thermal Resistance
Thermal Resistance
[5]
7.5
6-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
PD
Tj
0.4
1.6
125
A
W
ºC
ºC
ºC
-
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[6]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
11
Rev 06 – 2007 / 08
www.zled.com
8. Amber (A32181, A32182)
7-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
36
Parameter
Symbol
Unit
Min
24.5
585
2.0
Max
-
[2]
[1]
ФV
Luminous Flux
lm
nm
[3]
Dominant Wavelength
λD
VF
590
2.5
595
3.0
[4]
Forward Voltage
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
125
10.5
9
deg.
ºC /W
ºC /W
[5]
Thermal Resistance
Thermal Resistance
[6]
7-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
PD
Tj
0.4
1.2
100
A
W
ºC
ºC
ºC
-
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[7]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
12
Rev 06 – 2007 / 08
www.zled.com
9. Red (R32181, R32182)
8-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Value
Typ
33
Parameter
Symbol
Unit
Min
24.5
618
2.0
Max
-
[2]
[1]
ФV
Luminous Flux
lm
nm
[3]
Dominant Wavelength
λD
VF
625
2.5
632
3.0
[4]
Forward Voltage
V
View Angle
2Θ 1/2
RθJ-B
RθJ-C
125
15
deg.
ºC /W
ºC /W
[5]
Thermal Resistance
Thermal Resistance
[6]
13.5
8-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
PD
Tj
0.4
1.2
100
A
W
ºC
ºC
ºC
-
Power Dissipation
Junction Temperature
Operating Temperature
Storage Temperature
Topr
Tstg
-
-40 ~ +85
-40 ~ +120
[7]
ESD Sensitivity
±20,000V HBM
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
13
Rev 06 – 2007 / 08
www.zled.com
White color Spectrum, TA=25ºC
1. Pure White
1 .0
S ta n d a rd e ye re s p o n s e c u rv e
0 .8
0 .6
0 .4
0 .2
0 .0
3 0 0
4 0 0
5 0 0
6 0 0
7 0 0
8 0 0
9 0 0
W a v e le n g th ( n m )
2. Warm White
1 .0
0 .8
0 .6
0 .4
0 .2
0 .0
3 0 0
4 0 0
5 0 0
6 0 0
7 0 0
8 0 0
9 0 0
W a v e le n g t h ( n m )
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3. Natural White
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
900
W avelength[nm ]
4. Blue, Cyan, Green, Amber, Red
1 .0
0 .8
0 .6
0 .4
0 .2
0 .0
4 0 0
5 0 0
6 0 0
7 0 0
W a v e le n g th (n m )
15
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Light Output Characteristics
1. Relative Light Output vs. Junction Temperature at IF=350mA, TA=25℃
160
140
120
100
80
60
Blue, Royal Blue
40
20
0
Cyan
G reen
Pure white, W arm white, Natural white
0
20
40
60
80
100
120
Junction Tem perature, TJ [oC]
160
140
120
100
80
60
40
20
Am ber Photom etric
R ed Photom etric
0
0
20
40
60
80
100
Junction Tem perature, TJ [oC]
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Forward Current Characteristics
1. Forward Voltage vs. Forward Current, TA=25℃
400
Pure W hite, W arm W hite, Blue
G reen, Cyan, N atural W hite
350
300
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Forw ard Voltage [V]
400
350
300
250
200
150
100
50
Red, Am ber
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Forw ard Voltage [V]
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2. Forward Current vs. Normalized Relative Luminous Flux, TA=25℃
1.2
Blue, Green, Cyan
W hite, W arm white, Natural white
1.0
0.8
0.6
0.4
0.2
0.0
0
100
200
300
400
Forw ard Current [m A]
1.2
Red, AMBER
1.0
0.8
0.6
0.4
0.2
0.0
0
100
200
300
400
Forw ard Current [m A]
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3. Forward Current Vs Wavelength shift, TA=25℃
10
8
BLUE, Cyan
GREEN
RED
Am ber
6
4
2
0
0
50
100
150
200
250
300
350
400
Forw ard Current [m A]
4. Forward Current vs. Chromaticity Coordinate (Ta=25℃)
Pure white
0.315
350mA
150mA
0.310
0.305
20mA
0.305
0.310
CIE(X)
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Warm white
0.41
0.40
0.39
350mA
100mA
20mA
0.431
0.432
0.433
0.434
Natural white
0.392
0.390
0.388
0.386
0.384
350mA
150mA
20mA
0.388
0.390
0.392
0.394
CIE(X)
20
Rev 06 – 2007 / 08
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Junction Temperature Characteristics
6
blue
Green
4
2
0
20
40
60
80
100
120
140
Junction Temperature
8
6
4
2
0
Amber
Red
20
40
60
80
100
Junction Temperature
21
Rev 06 – 2007 / 08
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Ambient Temperature vs Allowable Forward Current
1. Pure White, Warm White, Royal Blue, Blue, Cyan, Green, Natural White
(TJMAX = 125 ºC)
400
350
300
250
200
RjaT = 60oC/W
150
RjaT = 50oC/W
RjaT = 40oC/W
100
RjaT = 30oC/W
50
0
0
25
50
75
100
125
Ambient Temperature(oC)
2. Amber, Red (TJMAX = 100 ºC)
400
350
300
250
200
150
100
50
RjaT = 60oC/W
RjaT = 50oC/W
RjaT = 40oC/W
RjaT = 30oC/W
0
0
20
40
60
80
100
Ambient Temperature(oC)
22
Rev 06 – 2007 / 08
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Typical Dome Type Radiation pattern
1. Pure White, Warm White
0
1.0
0.8
0.6
0.4
0.2
0.0
30
60
90
-80
-60
-40
-20
0
Directional angle[deg.]
2. Natural White
0
1.0
0.8
0.6
0.4
0.2
30
60
0.0
-80
90
-60
-40
-20
0
Directional Angle[deg.]
23
Rev 06 – 2007 / 08
www.zled.com
3. Royal Blue, Blue, Cyan, Green
0
1.0
0.8
0.6
0.4
0.2
0.0
30
60
90
-80
-60
-40
-20
0
Directional angle[deg.]
4. Amber, Red
0
1.0
0.8
0.6
0.4
0.2
30
60
0.0
-80
90
-60
-40
-20
0
Directional angle[deg.]
24
Rev 06 – 2007 / 08
www.zled.com
Recommended Soldering
1. Solder pad
2. Solder paste pattern
1. Paste thickness : 0.2mm
Note :
1. All dimensions are in millimeters (tolerance : ±0.2 )
2. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
25
Rev 06 – 2007 / 08
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Soldering profile, TA=25ºC
1. Reflow Soldering Conditions / Profile
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Cooling
-5 °C/sec
Rising
5 °C/sec
Pre-heating
180
150
0
Time
[Hr]
2. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280℃
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered. When
repairing is unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
26
Rev 06 – 2007 / 08
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Rectangular Type Reel Packaging - Rectangular type
10 pitch cumlative
tolerance on tape ±0.2
MIN 1.5
CENTER
DETALE"A"
5°TYPICAL
DETAIL 'A'
Note :
1. The number of loaded products in the reel is 100ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
27
Rev 06 – 2007 / 08
www.zled.com
Rectangular Type Reel Packaging - Star type
10 pitch cumlative
tolerance on tape ±0.2
MIN 1.5
DETALE"A"
5°TYPICAL
CENTER
DETAIL 'A'
Note :
1. The number of loaded products in the reel is 100ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
28
Rev 06 – 2007 / 08
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Packaging Structure
Aluminum Vinyl Bag
PART NO. : ######-##
QUANTITY : 100
LOT NO. : ##########
BIN CODE NO. : #####
SEOUL SEMICONDUCTOR CO., LTD
Outer Box
SIZE(mm)
TYPE
a
c
b
350 350 370
c
Z POWER LED
PART NO. : ######-##
ORDER CODE : ######
Q'YT : ######
Z POWER LED
DATE : ######
SEOUL SEMICONDUCTOR CO.,LTD
b
a
Printed label on back of aluminum PCB
######-##-###
######-#####
Part No. - Internal No. - Bin Code
Lot No.
Note :
1. 6 reels are loaded in box
2. Scale none
3. For more information about binning and labeling, refer to the Application Note - 1
29
Rev 06 – 2007 / 08
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Precaution for use
• Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
(or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30
degrees Centigrade. Humidity 50% maximum.
• Precaution after opening packaging
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed.
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
components should be dried for 10-12hr at 60±5℃
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp. after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Anti radioactive ray design is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA(Isopropyl Alcohol) should be used.
• When the LEDs are illuminating, operating current should be decided after considering the
package maximum temperature.
• LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is connected to the anode. Therefore, we recommend to isolate the heat sink.
• Attaching LEDs, don’t use adhesives to generate organic vapor.
30
Rev 06 – 2007 / 08
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Handling of Silicone resin LEDs
Z-Power LED is encapsulated by silicone resin for the highest flux efficiency.
Notes for handling of Silicone resin Z-Power LEDs
• Avoid touching silicone resin parts especially by sharp tools such as Tweezers
• Avoid leaving fingerprints on silicone resin parts.
• Please store the LEDs away from dusty areas or seal the product against dust.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on
the surface of the resin must be prevented.
• Please do not use a force of over 3000 gf impact or pressure diagonally on the silicon
lens. This may cause a catastrophic failure.
• Please do not mold over the silicone lens with another resin.
(epoxy, urethane, etc)
31
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