LO500Z [SEOUL]

GREEN OVAL LAMP LED; 绿色椭圆LED灯
LO500Z
型号: LO500Z
厂家: Seoul Semiconductor    Seoul Semiconductor
描述:

GREEN OVAL LAMP LED
绿色椭圆LED灯

文件: 总12页 (文件大小:397K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Specification  
LT770D  
SSC  
Customer  
Drawn  
Approval  
Approval  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Contents  
1. Features  
2. Absolute Maximum Ratings  
3. Electric-Optical Characteristics  
4. Reliability Tests  
5. Characteristic Diagrams  
6. Color & Binning  
7. Outline Dimensions  
8. Packing  
9. Soldering  
10. Precaution for use  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
LT770D  
LT770D  
Description  
Features  
• Non-standoff leads  
• 5mm type package  
• Color Diffused  
epoxy lens  
• Viewing angle  
: 70/40 º  
Lamp LEDs are effective in hot thermal  
and humid condition. This high brightness  
and weather-resistant packaging design  
makes these Lamp LEDs ideal for  
Outdoor applications such as traffic  
signals, variable message signs and  
backlighting for transparent sign panels.  
• Dominant Wavelength  
:525nm  
Applications  
• Electronic signs  
and signals  
• Specialty lighting  
• Small area illumination  
• Backlighting  
• Other outdoor displays  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
2. Absolute Maximum Ratings ( Ta = 25ºC )  
Item  
Symbol  
Value  
Unit  
DC Forward Current  
Forward Peak Pulse Current  
Reverse Voltage  
IF  
30  
mA  
mA  
V
[1]  
IFP  
100  
VR  
PD  
5
125  
Power Dissipation  
mW  
ºC  
Operating Temperature  
Storage Temperature  
Solder Temperature  
Topr  
Tstg  
Ts  
-30 ~ 85  
-40 ~ 100  
260ºC for 10seconds [2]  
ºC  
ºC  
Notes :  
[1] t 0.1ms, D = 1/10  
[2] No lower than 3mm from the base of the epoxy bulb.  
3. Electro-Optical Characteristics ( Ta = 25ºC, IF=20mA )  
Value  
Item  
Symbol  
Unit  
Min.  
Typ.  
Max.  
[4]  
Luminous Intensity [3]  
Dominant Wavelength[5]  
Forward Voltage [6]  
IV  
700  
519  
-
1300  
525  
3.6  
2000  
536  
4.0  
mcd  
nm  
V
λd  
VF  
View Angle  
2θ  
70 / 40  
-
deg.  
µA  
½
Reverse Current (at VR = 5V)  
IR  
-
5
Notes :  
[3] SSC maintains a tolerance of ±10% on intensity and power measurements.  
[4] IV is the luminous intensity output as measured with a cylinder.  
[5] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.  
A tolerance of ±0.5nm for dominant wavelength.  
[6] A tolerance of ±0.05V on forward voltage measurements  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
4. Reliability Tests  
Item  
Condition  
Note  
Failures  
0/22  
Life Test  
Ta = RT, IF = 30mA  
Ta = 85ºC, IF = 8mA  
Ta = -30ºC, IF = 20mA  
1000hrs  
1000hrs  
1000hrs  
High Temperature Operating  
Low Temperature Operating  
Thermal Shock  
0/22  
0/22  
Ta = -40ºC (30min) ~ 100º (30min)  
100  
0/40  
(Transfer time : 10sec, 1Cycle = 1hr)  
cycles  
Resistance to soldering Heat  
Ts = 255 ± 5ºC, t = 10sec  
1kV, 1.5kΩ ; 100pF  
1 time  
1 time  
0/22  
ESD  
0/22  
(Human Body Model)  
High Temperature Storage  
Low Temperature Storage  
Ta = 100ºC  
Ta = -40ºC  
1000hrs  
1000hrs  
1000hrs  
0/22  
0/22  
0/22  
Temperature Humidity  
Storage  
Ta = 85ºC, RH = 85%  
Temperature Humidity  
Operating  
Ta = 85ºC, RH = 85%, IF = 8mA  
100hrs  
0/22  
< Judging Criteria For Reliability Tests >  
VF  
IR  
USL[1] X 1.2  
USL X 2.0  
LSL [2] X 0.5  
ФV  
Notes :  
[1] USL : Upper Standard Level  
[2] LSL : Lower Standard Level.  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
5. Characteristic Diagrams  
Ta= 25ºC  
Ta= 25ºC  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
50  
40  
30  
20  
10  
0
0
10  
20  
30  
40  
50  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
Forward Current [mA]  
Forward Voltage [V]  
Forward Voltage vs. Forward Current  
Forward Current vs. Relative Intensity  
Ta= 25ºC, IF= 20mA  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
40  
X
Y
30  
20  
10  
0
-40  
-20  
0
20  
40  
60  
80  
100  
-90  
-60  
-30  
0
30  
60  
90  
Ambient Temperature Ta[oC]  
Off Axis Angle [deg.]  
Ambient Temperature  
vs. Maximum Forward Current  
Directivity  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
6. Color & Binning  
Bin Code  
Luminous  
Dominant  
Forward Voltage  
2
Intensity  
S
Wavelength  
1
Luminous Intensity (mcd)  
Dominant Wavelength (nm)  
Forward Voltage (V)  
@ IF = 20mA  
@ IF = 20mA  
@ IF = 20mA  
Bin  
Code  
Bin  
Code  
Bin  
Code  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
S
T
700  
1300  
2000  
1
2
1
2
3.0  
3.5  
3.5  
4.0  
519  
527  
527  
536  
1300  
Available ranks  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
7. Outline Dimensions  
Unit : mm  
1.0  
DETAIL  
0.5 ± 0.05  
2.0 ± 0.2  
1.0 MAX  
y
ANODE  
x
1.0MIN  
5.8±0.10  
7.00±0.10  
28.0 MIN  
Notes : Protruded epoxy is 1.0mm maximum.  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
8. Packing  
Unit : mm  
* Antistatic poly bag  
(500pcs max/bag)  
Inner box  
(1bag max/box)  
170  
* Cardboard box  
(35000pcs max/box)  
(70boxes max/box)  
480  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
9. Soldering Profile  
1) Wave Soldering Conditions / Profile  
• Preliminary heating to be at 85ºC(120 ºC max) for 20 seconds(60 seconds max).  
• Soldering heat to be at 255 ºC (260ºC max) for 10 seconds  
• Soak time above 200 ºC is 5 seconds  
3 0 0  
PEAK  
10s  
2 5 0  
2 0 0  
1 5 0  
1 0 0  
5 0  
255 ºC (260 ºC max)  
PREHEAT  
20s (60s Max)  
85 ºC(120 ºC max)  
0
0
2
4
6
8
1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 2 6 2 8 3 0 3 2 3 4 3 6  
T im e [s ]  
2) Hand Soldering conditions  
• Not more than 3 seconds at max. 350ºC, under Soldering iron.  
3) Caution  
• Lead frames are silver plated copper alloy. This substance has a low thermal coefficient  
(easily conducts heat)  
• The LEDs must not be repositioned after soldering.  
• Do not apply any stress to the lead particularly when heat.  
Note : In case the soldered products are reused in soldering process, we don’t guarantee the products.  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
10. Precaution for Use  
1) Storage  
• Before opening the package  
Avoid the absorption of moisture, we recommended to store Lamp LEDs in a dry  
box(or desiccators) with a desiccant . Otherwise, store them in the following environment:  
Temperature : 5~30Humidity : 50% max.  
• After opening the package  
a. Soldering should be done right after opening the package(within 24Hrs).  
b. Keeping of a fraction  
- Sealing  
- Temperature : 5 ~ 40, Humidity : less than 30%  
c. If the package has been opened more than 1week or the color of desiccant changes,  
Components should be dried for 10-12hr at 60±5℃  
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling  
process to normal temp. after soldering.  
• Avoid quick cooling  
• Leadframes are silver plated SPCC. The silver plate surface may be affected by  
environments which contains corrosive substances. Please avoid conditions which may cause  
the LEDs to corrode, tarnish or discolor.  
2) Lead Forming  
• When the lead forming is required before soldering , care must be taken to avoid any bending  
and mechanical stress. The stress to the base may damage the LEDs.  
• When mounting the LEDs onto a PCB, the holes on the circuit board should be exactly  
aligned with the leads of the LEDs.  
• It is recommended that tooling made to precisely form and cut the leads to length rather than  
rely on hand operating.  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  
3) Static Electricity  
• Static Electricity and surge voltage damage the LEDs. So it is recommended that a wrist  
band or an anti-electrostatic glove be used when handling the LEDs.  
• All devices, equipment and machinery must be properly grounded.  
It is recommended precautions be taken against surge voltage to the equipment that mounts  
the LEDs.  
4) Heat Generation  
• Thermal is one of the important parameter to design the end product. Please consider the heat  
generation of the LEDs.  
• The operating current should be decided after considering the ambient maximum temperature  
of LEDs.  
5) Others  
• The color of the LEDs is changed a little by an operating current and thermal.  
• Anti radioactive ray design is not considered for the products listed here in.  
• Gallium arsenide is used in some of the products listed in this publication. These products  
are dangerous if they are burned or smashed in the process of disposal. It is also dangerous  
to drink the liquid or inhale the gas generated by such products when chemically disposed.  
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When washing is required, IPA(Isopropyl Alcohol) should be used.  
• When the LEDs are illuminating, operating current should be decided after considering the  
junction temperature.  
Cf.) Please refer Ambient temperature vs. Forward Current graph on page 5  
• The appearance and specifications of the product may be modified for improvement without  
notice.  
SEOUL SEMICONDUCTOR CO., LTD.  
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea  
TEL : +82-2-3281-6269  
FAX :+82-2-857-5430  
www.seoulsemicon.com www.zled.com  
Rev. 00  
December 2007  
www.ZLED.com  
<080924> Rev. 0.2  
Document No. : SSC-QP-7-07-24 (Rev.00)  

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