LO651 [SEOUL]
CYAN LAMP LED; 青色LAMP LED型号: | LO651 |
厂家: | Seoul Semiconductor |
描述: | CYAN LAMP LED |
文件: | 总13页 (文件大小:361K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SPECIFICATIONS
MODEL
CYAN LAMP LED
LC531
PART NO.
[Contents]
1.
2.
Devices --------------------------------------------------
Outline Dimensions -----------------------------------
Absolute Maximum Ratings -------------------------
Electro-Optical Characteristics ----------------------
Reliability Tests ----------------------------------------
Characteristic Diagrams ------------------------------
Packing --------------------------------------------------
Soldering Profile ---------------------------------------
Reference ------------------------------------------------
Precaution For Use -------------------------------------
2
2
3.
3
4.
5.
6.
7.
4
5
6
8
8.
11
12
13
9.
10.
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-1-
1. DEVICES
Lens
Source
Dice Source
Part Number
Color
Diffusion
Color
LC531
Water Clear
Non-Diffused
InGaN/SiC
Cyan
2. OUTLINE DEMENSIONS
1.0
2.6±0.2
MAX1.0
5.05±0.2
5.9±0.2
2.5±0.2
1.0±0.2
28.0MIN
8.62±0.2
Notes : 1. All dimensions are in millimeters.
2. Protruded epoxy is 1.0mm maximum.
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-2-
3. ABSOUTE MAXIMUM RATINGS (at Ta = 25ºC)
Item
Symbol
Value
Unit
DC Forward Current
IF
30
mA
1
Forward Peak Pulse Current
Reverse Voltage
IFP
100
mA
V
VR
PD
5
100
Power Dissipation
mW
ºC
Operating Temperature
Storage Temperature
Solder Temperature
Topr
Tstg
TS
-30 ~ 85
-40 ~ 105
ºC
260 ºC for 10 second 2
ºC
Notes : 1. t ≤ 0.1ms, D = 1/10
2. 3mm bellow seating plane
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-3-
4. ELECTRO-OPTICAL CHARACTERISTICS (at IF = 20mA, Ta = 25ºC)
Value
Item
Symbol
Unit
Min.
2000
499
-
Typ.
3500
505
3.5
Max.
-
Luminous Intensity 1
Dominant Wavelength
Forward Voltage
View Angle
IV
λd
VF
mcd
nm
V
515
4.1
28
deg.
2θ
½
Reverse Current (at VR = 5V)
IR
-
-
10
µA
Note : 1. Luminous Intensity Tolerance ± 10%
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-4-
5. RELIABLITY TESTS
Item
Condition
Note
Failures
0/22
Life Test
Ta = RT, IF = 30mA
Ta = 100ºC, IF = 10mA
1000hrs
1000hrs
High Temperature
Operating
0/22
Low Temperature
Operating
Ta = -40ºC, IF = 20mA
1000hrs
100cycles
100cycles
10cycles
1 time
0/22
0/50
0/50
0/50
0/50
0/22
0/50
0/50
0/50
0/22
Ta = -40ºC (30min) ~ 105º (30min)
(Transfer time : 5sec, 1Cycle = 1hr)
Thermal Shock
Ta = -40ºC (25min) ~ 25ºC (5min) ~
Temperature Cycle
105ºC (25min) ~ 25ºC (5min)
Moisture Resistance
Cycle
Ta = 25ºC ~ 65ºC ~ -10ºC, RH = 90%
(1Cycle = 24hrs)
Resistance to soldering
Heat
Ts = 260 ± 5ºC, t = 10 ± 1sec
1kV, 1.5kΩ ; 100pF
Ta = 105ºC
ESD
1 time
(Human Body Model)
High Temperature
Storage
1000hrs
1000hrs
1000hrs
100hrs
Low Temperature
Storage
Ta = -40ºC
Temperature Humidity
Storage
Ta = 85ºC, RH = 85%
Ta = 85ºC, RH = 85%
IF = 15mA
Temperature Humidity
Operating
< Judging Criteria For Reliability Tests >
VF
USL 1 X 1.2
IR
USL X 2.0
LSL 2 X 0.7
IV
Notes : 1. USL : Upper Standard Level
2. LSL : Lower Standard Level.
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-5-
6. CHARACTERISTIC DIAGRAMS
I
rel = f (θ ), Ta= 25ºC
IF = f (VF), Ta= 25ºC
1.0
0.8
0.6
0.4
0.2
0.0
100
10
1
-90
-60
-30
0
30
60
90
2.4
2.6
2.8
3.0
3.2
3.4
3.6
Forward Voltage VF [V]
OFF Axis Angle [deg]
Off Axis Angle vs. Relative Intensity
Forward Voltage vs. Forward Current
IV = f (IF), Ta= 25ºC
IF = f (Ta), Ta= 25ºC
0.5
0.4
0.3
0.2
0.1
0.0
50
40
30
20
10
0
0
5
10
15
20
25
30
-40
-20
0
20
40
60
80
100
Ambient Temperature Ta [oC]
Forward Current IF [mA]
Forward Current vs. Relative Intensity
Ambient Temperature vs. Forward Current
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-6-
IV /IV(25C)= f (TA ), IF= 20mA
Irel = f ( λd ), TA= 25ºC, IF= 20mA
1.0
0.5
0.0
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
400
450
500
550
600
-40
-20
0
20
40
60
80
100
Ambient Temperature Ta[oC]
Wavelength [nm]
Wavelength vs. Relative Intensity
Ambient Temperature vs. Relative Intensity
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-7-
7. PACKING
1) Bulk Packing
(1) Antistatic poly vinyl bag apply
Poly bag:
5φ Lamp Series : 500pcs
3φ Lamp Series : 500pcs
(2) Inner box structure
Box : 2 poly bags
P/O No.
Lot No
SEOUL SEMICONDUCTOR CO.,LTD
TEL : (02) 3281-6269
170mm
260mm
(3) Outer box structure
Box : 27 boxes
485.0mm
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-8-
2) Tapping Outline Dimensions
P
0±2.0
0±1.3
F
Do
Po
Package Dimensions (unit : mm)
Ho*
W
P
Po
F
12.7±0.5
+1.0
-0.5
18.0
12.7±0.3
2.54±0.5
φ4.0±0.5
Wo
W1
W2
13.0±0.3
1.0±0.5
9.0±0.5
Do
1 Box contain quantity.
∗ 3φ Lamp Series : 3000pcs
* 5φ Lamp Series : 2000pcs
* Remark : Ho - users define.
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-9-
3) Forming Outline Dimensions
P
F
Po
Do
Package Dimensions (unit : mm)
H *
W2
P
9.0±0.5
Ho *
H1 *
W
12.7±0.5
12.7±0.3
5.0±0.5
Po
F
18.0 +1.0
-0.5
Wo
W1
13.0±0.3
1.0±0.5
Do
φ4.0±0.5
1 Box contain quantity.
∗ 3φ Lamp Series : 2000pcs
* 5φ Lamp Series : 1500pcs
* Remark : H / Ho / H1- users define.
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-10-
8. SOLDERING PROFILE
1) Wave Soldering Conditions / Profile
• Preliminary heating to be at 85ºC(120 ºC max) for 20 seconds(60 seconds max).
• Soldering heat to be at 235 ºC (260ºC max) for 5 seconds (10 seconds max.)
• Soak time above 200 ºC is 5 seconds
2 5 0
PEAK
5s (10s Max)
2 0 0
235 ºC(260 ºC Max)
1 5 0
PREHEAT
1 0 0
20s (60s Max)
85 ºC(120 ºC max)
5 0
0
0
2
4
6
8
1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 2 6 2 8 3 0 3 2 3 4 3 6
T im e [s ]
2) Hand Soldering conditions
• Not more than 5 seconds at max. 300ºC, under Soldering iron.
Note : In case the soldered products are reused in soldering process, we don’t guarantee the products.
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
-11-
Preliminary
9. PART NUMBERING SYSTEM
1
2
3
4
5
6
7
8
A
B
C
L * * * * * * * - * * *
1) Lamp LED initial
2) Color
U : Ultra Violet,
B : Blue (460~490),
C : Cyan (490~510),
T : True Green (510~540), G : Yellow-Green (540~580)
Y : Yellow (580~600)
W : White
O : Orange (600~620)
M : Warm
R : Red (620~700)
I : Infrared
3) If the products have 2 or 3chips
GR : Green + Red ( according to wavelength), FL : Full color
4) Outline type
1 : 3x2(square),
6 : 3Phi Oval,
5) Half angle
2 : 5x2(square),
7 : 5Phi Oval
3 : Phi3,
5 : Phi 5 ,
O
O
O
O
O
O
1: ~14 , 2: 15~24 , 3: 25~34 , 4: 35~44 , 5 : 45~54 … 0 : more than 100
6) 1st Development according to a chip
7) 2nd Development (other material)
D : diffused C : colored Z : zener chip attached
8) Stand off type
A, B, C : Bin cord description A: IV, B: WD C: VF
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
-12-
Preliminary
10. PRECAUTION FOR USE
1)
2)
3)
4)
In order to avoid the absorption of moisture, it is recommended to store in the dry box (or
desiccators) with a desiccant .
In case of more than 1 week passed after opening or change color of indicator on
desiccant components shall be dried 10-12Hr, at 60±5℃.
In case of supposed the components is humid, shall be dried dip-solder just before, 12Hr
at 80±5℃ or 10Hr at 100±5℃.
Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temp. after soldering.
5)
6)
7)
8)
Quick cooling shall not be avoid.
Components shall not be mounted on warped direction of PCB.
Anti radioactive ray design is not considered for the products listed here in.
This device should not be used in any type of fluid such as water, oil, organic solvent and
etc. When washing is required, IPA should be used.
9)
When the LEDs are illuminating, operating current should be decided after considering
the ambient maximum temperature.
10)
LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months
or more after being shipped from SSC, a sealed container with a nitrogen atmosphere
should be used for storage.
11)
12)
The LEDs must be soldered within seven days after opening the moisture-proof packing.
Repack unused products with anti-moisture packing, fold to close any opening and then
store in a dry place.
13)
The appearance and specifications of the product may be modified for improvement
without notice.
<050201> Rev. 0.0
LC531
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
Preliminary
-13-
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