SZ5-M0-W0-C8 [SEOUL]
Single Color LED,;
| 型号： | SZ5-M0-W0-C8 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Single Color LED, 光电 |
| 文件： | 总25页 (文件大小：684K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product Data Sheet
Z5-M0 – High-Power LED
Superior high Flux for High Current System
Z Power LED – Z5-M0
SZ5-M0-WX-XX (Cool, Neutral, Warm)
LM-80
RoHS
Product Brief
Description
Features and Benefits
•
•
•
The Z-Power series is designed for high
flux output applications with high current
operation capability.
•
Super high Flux output and high
Luminance
•
•
•
Designed for high current operation
SMT solderable
It incorporates state of the art SMD
design and low thermal resistant
material.
RoHS compliant
The Z Power LED is ideal light sources
for directional lighting applications such
as Spot Lights, various outdoor
applications, automotive lightings and
high performance torches .
Key Applications
•
•
•
•
•
•
•
Indoor lighting
Outdoor lighting
Automotive
Architectural lighting
Industrial lighting (High/Low bay)
Portable Torch
Home appliance
Table 1. Product Selection Table
CCT
CRI
Min
70
Part Number
Color
Min.
Typ.
Max.
SZ5-M0-W0-00
SZ5-M0-W0-C8
SZ5-M0-WN-00
SZ5-M0-WN-C8
SZ5-M0-WN-C9
SZ5-M0-WW-C8
SZ5-M0-WW-C9
Cool White
Neutral White
Neutral White
Neutral White
Neutral White
Warm White
Warm White
4700K
4700K
3700K
3700K
3700K
2600K
2600K
5300K
5300K
4000K
4000K
4000K
3000K
2700K
7000K
7000K
4700K
4700K
4700K
3700K
3700K
80
70
80
90
80
90
www.seoulsemicon.com
Rev2.0, November 15, 2013
1
Product Data Sheet
Z5-M0 – High-Power LED
Table of Contents
Index
•
•
•
Product Brief
Table of Contents
Performance Characteristics
•
•
•
Color Bin Structure
Mechanical Dimensions
Packaging Information
•
•
•
Product Nomenclature (Labeling Information)
Recommended Solder Pad
Reflow Soldering Characteristics
•
•
•
Handling of Silicone Resin for LEDs
Precaution For Use
Company Information
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Rev2.0, November 15, 2013
2
Product Data Sheet
Z5-M0 – High-Power LED
Performance Characteristics
Table 2. Electro Optical Characteristics, Tj = 25ºC, RH30%
Viewi
ng
Typical
Typical Forward
Voltage (VF) [4]
CRI [5]
Ra
,
Angle
CCT
Luminous Flux [2]
(K)[1]
(degre
es)
ФV [3] (lm)
Part Number
2Θ ½
Typ.
120
120
120
120
120
120
120
Typ.
350mA
700mA*
258
1.2A*
350mA
2.95
2.95
2.95
2.95
2.95
2.95
2.95
700m*
3.14
3.14
3.14
3.14
3.14
3.14
3.14
1.2*
Min.
70
80
70
80
90
80
90
SZ5-M0-W0-00
SZ5-M0-W0-C8
SZ5-M0-WN-00
SZ5-M0-WN-C8
SZ5-M0-WN-C9
SZ5-M0-WW-C8
SZ5-M0-WW-C9
5300
5300
4000
4000
4000
3000
2700
142
135
140
122
95
401
382
396
345
268
328
263
3.33
3.33
3.33
3.33
3.33
3.33
3.33
245
254
222
173
116
93
211
169
Table 3. Electro Optical Characteristics, Tj = 85ºC
Typical
CCT (K)
Typical Forward
Voltage (VF) [4]
Luminous Flux [2]
[1]
ФV [3] (lm)
Part Number
Typ.
350mA
129
122
127
111
86
700mA*
234
1.2A*
350mA
2.78
2.78
2.78
2.78
2.78
2.78
2.78
700mA*
2.96
2.96
2.96
2.96
2.96
2.96
2.96
1.2A*
3.14
3.14
3.14
3.14
3.14
3.14
3.14
SZ5-M0-W0-00
SZ5-M0-W0-C8
SZ5-M0-WN-00
SZ5-M0-WN-C8
SZ5-M0-WN-C9
SZ5-M0-WW-C8
SZ5-M0-WW-C9
5300
5300
4000
4000
4000
3000
2700
364
347
360
313
243
298
239
223
231
202
157
105
84
192
153
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color
coordinate : 0.005, CCT 5% tolerance.
(2) SSC maintains a tolerance of 7% on flux and power measurements.
(3) ФV is the total luminous flux output as measured with an integrating sphere.
(4) Tolerance is 0.06V on forward voltage measurements.
(5) Tolerance is 2.0 on CRI measurements.
* No values are provided by real measurement. Only for reference purpose.
www.seoulsemicon.com
Rev2.0, November 15, 2013
3
Product Data Sheet
Z5-M0 – High-Power LED
Performance Characteristics
Table 4. Absolute Maximum Ratings Tj = 25ºC, RH30%
Value
Typ.
-
Parameter
Symbol
Unit
Min.
Max.
Forward Current [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
IF
IF
-
1.5
2.0
5
A
A
VR
-
-
V
Power Dissipation
Pd
-
-
-
5.22
150
125
125
-
W
Junction Temperature
Operating Temperature
Storage Temperature
Thermal resistance (J to S) [3]
ESD Sensitivity(HBM) [4]
Tj
-
-
ºC
ºC
ºC
K/W
Topr
Tstg
RθJ-S
- 40
- 40
-
-
4.5
Class 3A JESD22-A114-E
Notes :
(1) At Junction Temperature 25℃ condition.
(2) Pulse width ≤10ms, duty cycle ≤ 10% condition.
(3) RθJ-S is tested at 350mA.
(4) The zener diode is included to protect the product from ESD.
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Rev2.0, November 15, 2013
4
Prodduuct Dattaa Shheeeet
Z5-M0 – High-Power LED
Relative Spectral Distribution
Fig 1. Color Spectrum, (Tj = 25ºC)
1.25
Cool white
Neutral white
Warm white
1.00
0.75
0.50
0.25
0.00
350
400
450
500
550
600
650
700
750
800
Wavelength [nm]
Fig.2 Typical Spatial Distribution
100
90
80
70
60
50
40
30
20
10
0
-80
-60
-40
-20
0
20
40
60
80
Angular Displacement [degrees]
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Rev2.0, November 15, 2013
5
Prodduuct Dattaa Shheeeet
Z5-M0 – High-Power LED
Forward Current Characteristics
Fig 3. Forward Voltage vs. Forward Current , (Tj = 25ºC)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, (Tj = 25ºC)
400
350
300
250
200
150
100
50
0
0
200
400
600
800
1000
1200
1400
1600
Forward Current [mA]
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Rev2.0, November 15, 2013
6
Prodduuct Dattaa Shheeeet
Z5-M0 – High-Power LED
Forward Current Characteristics
Fig 5. Forward Current vs. CIE X, Y Shift , Tj = 25ºC
0.02
CIE(X)
CIE(Y)
0.01
0.00
-0.01
-0.02
200
400
600
800
1000
1200
1400
Forward Current [mA]
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Rev2.0, November 15, 2013
7
Prodduuct Dattaa Shheeeet
Z5-M0 – High-Power LED
Junction Temperature Characteristics
Fig 6. Relative Light Output vs. Junction Temperature, IF = 350mA
120
100
80
60
40
20
0
25
50
75
100
125
150
Junction Temperature [oC]
Fig 7. Junction Temp. vs. CIE X, Y Shift, IF = 350mA
0.02
CIE(X)
CIE(Y)
0.01
0.00
-0.01
-0.02
25
50
75
100
125
150
o
Junction Temperature [ C]
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Rev2.0, November 15, 2013
8
Prodduuct Dattaa Shheeeet
Z5-M0 – High-Power LED
Junction Temperature Characteristics
Fig 8. Relative Forward vs. Junction Temperature, IF = 350mA
0.05
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
40
60
80
100
120
140
160
o
Junction Temperature [ C]
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Rev2.0, November 15, 2013
9
Prodduuct Dattaa Shheeeet
Z5-M0 – High-Power LED
Ambient Temperature Characteristics
Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.) = 150℃, IF =1.5A
1.6
Rth(j-a)=15℃/W
1.4
Rth(j-a)=20℃/W
Rth(j-a)=25℃/W
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
100
120
140
Ambient Temperature [oC]
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Rev2.0, November 15, 2013
10
Product Data Sheet
Z5-M0 – High-Power LED
Color Bin Structure
Table 5. Bin Code description (@IF=350mA, Tj=25℃)
Luminous Flux (lm)
@ IF = 350mA
Color
Chromaticity
Coordinate
Typical Forward
Voltage (VF)
Part Number
Bin Code
Min.
Max.
Bin Code
Min.
Max.
@ IF = 350mA
V1
V2
V3
W1
V1
V2
V3
W1
V1
V2
V3
W1
U3
V1
V2
V3
T2
U1
U2
U3
U2
U3
V1
V2
T1
T2
U1
U2
118.5
130
140
150
118.5
130
140
150
118.5
130
140
150
109
118.5
130
140
80
130
140
150
160
130
140
150
160
130
140
150
160
118.5
130
140
150
91
G
2.75
3.00
SZ5-M0-W0-00
Refer to page.13
H
I
3.00
3.25
2.75
3.00
3.25
2.75
3.00
3.25
2.75
3.00
3.25
2.75
3.25
3.50
3.00
3.25
3.50
3.00
3.25
3.50
3.00
3.25
3.50
3.00
G
H
I
SZ5-M0-W0-C8
SZ5-M0-WN-00
SZ5-M0-WN-C8
SZ5-M0-WN-C9
SZ5-M0-WW-C8
SZ5-M0-WW-C9
Refer to page.13
Refer to page.14
Refer to page.14
Refer to page.14
Refer to page.15
Refer to page.15
G
H
I
G
H
I
G
91
100
109
118.5
109
118.5
130
140
80
H
3.00
3.25
100
109
100
109
118.5
130
70
I
3.25
2.75
3.50
3.00
G
H
I
3.00
3.25
2.75
3.00
3.25
3.25
3.50
3.00
3.25
3.50
G
H
I
80
91
91
100
109
100
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Rev2.0, November 15, 2013
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Product Data Sheet
Z5-M0 – High-Power LED
Color Bin Structure
Table 6. Flux Bin Code description (@Tj=85℃)
Luminous Flux (lm)
350mA*
700mA*
Max.
134
Bin Code
Min.
65
Max.
74
Min.
117
134
152
167
182
198
217
234
251
268
T1
T2
74
84
152
U1
U2
U3
V1
V2
V3
W1
W2
84
92
167
92
100
109
119
129
138
147
156
182
100
109
119
129
138
147
198
217
234
251
268
284
Table 7. VF Bin Code description (@Tj=85℃)
Forward Voltage (VF)
350mA*
Max.
2.82
700mA*
Max.
3.02
Bin Code
Min.
2.60
2.82
3.06
Min.
2.77
3.02
3.27
G
H
I
3.06
3.27
3.30
3.52
* No values are provided by real measurement. Only for reference purpose.
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Rev2.0, November 15, 2013
12
Product Data Sheet
Z5-M0 – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Cool white), Tj =25℃, IF = 350mA
A0
A5
B0
B5
C0
C5
A1
A6
B1
B6
C1
C6
A2
A7
B2
B7
C2
C7
A3
A8
B3
B8
C3
C8
A4
CIE x
0.3028
0.3041
0.3426
0.3115
CIE y
0.3304
0.3240
0.3324
0.3393
CIE x
0.3115
0.3126
0.3210
0.3205
CIE y
0.3393
0.3324
0.3408
0.3481
CIE x
0.3041
0.3055
0.3136
0.3126
CIE y
0.3240
0.3177
0.3256
0.3324
CIE x
0.3126
0.3136
0.3216
0.3210
CIE y
0.3324
0.3256
0.3334
0.3408
CIE x
0.3055
0.3068
0.3146
0.3136
CIE y
0.3177
0.3113
0.3187
0.3256
A9
B4
B9
C4
C9
CIE x
0.3136
0.3146
0.3221
0.3216
CIE y
0.3256
0.3187
0.3261
0.3334
CIE x
0.3068
0.3082
0.3155
0.3146
CIE y
0.3113
0.3046
0.3120
0.3187
CIE x
0.3146
0.3155
0.3225
0.3221
CIE y
0.3187
0.3120
0.3190
0.3261
CIE x
0.3082
0.3096
0.3164
0.3155
CIE y
0.3046
0.2980
0.3046
0.3120
CIE x
0.3155
0.3164
0.3230
0.3225
CIE y
0.3120
0.3046
0.3110
0.3190
CIE x
0.3207
0.3212
0.3293
0.3292
CIE y
0.3462
0.3389
0.3461
0.3539
CIE x
0.3292
0.3293
0.3373
0.3376
CIE y
0.3539
0.3461
0.3534
0.3616
CIE x
0.3212
0.3217
0.3293
0.3293
CIE y
0.3389
0.3316
0.3384
0.3461
CIE x
0.3293
0.3293
0.3369
0.3373
CIE y
0.3461
0.3384
0.3451
0.3534
CIE x
0.3217
0.3222
0.3294
0.3293
CIE y
0.3316
0.3243
0.3306
0.3384
CIE x
0.3293
0.3294
0.3366
0.3369
CIE y
0.3384
0.3306
0.3369
0.3451
CIE x
0.3222
0.3226
0.3295
0.3294
CIE y
0.3243
0.3178
0.3234
0.3306
CIE x
0.3294
0.3295
0.3364
0.3366
CIE y
0.3306
0.3234
0.3288
0.3369
CIE x
0.3200
0.3207
0.3292
0.3290
CIE y
0.3572
0.3462
0.3539
0.3656
CIE x
0.3290
0.3292
0.3376
0.3381
CIE y
0.3656
0.3539
0.3616
0.3740
CIE x
0.3376
0.3373
0.3456
0.3463
CIE y
0.3616
0.3534
0.3601
0.3687
CIE x
0.3463
0.3456
0.3539
0.3552
CIE y
0.3687
0.3601
0.3669
0.3760
CIE x
0.3373
0.3369
0.3448
0.3456
CIE y
0.3534
0.3451
0.3514
0.3601
CIE x
0.3456
0.3448
0.3526
0.3539
CIE y
0.3601
0.3514
0.3578
0.3669
CIE x
0.3369
0.3366
0.3440
0.3448
CIE y
0.3451
0.3369
0.3428
0.3514
CIE x
0.3448
0.3440
0.3514
0.3526
CIE y
0.3514
0.3428
0.3487
0.3578
CIE x
0.3366
0.3364
0.3433
0.3440
CIE y
0.3369
0.3288
0.3345
0.3428
CIE x
0.3440
0.3433
0.3500
0.3514
CIE y
0.3428
0.3345
0.3400
0.3487
CIE x
0.3381
0.3376
0.3463
0.3470
CIE y
0.3740
0.3616
0.3687
0.3810
CIE x
0.3470
0.3463
0.3552
0.3572
CIE y
0.3810
0.3687
0.3760
0.3891
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Rev2.0, November 15, 2013
13
Product Data Sheet
Z5-M0 – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Neutral white), Tj =25℃, IF = 350mA
D0
D5
E0
E5
D1
D6
E1
E6
D2
D7
E2
E7
D3
D8
E3
E8
D4
CIE x
0.3548
0.3536
0.3625
0.3641
CIE y
0.3736
0.3646
0.3711
0.3804
CIE x
0.3641
0.3625
0.3714
0.3736
CIE y
0.3804
0.3711
0.3775
0.3874
CIE x
0.3536
0.3524
0.3608
0.3625
CIE y
0.3646
0.3555
0.3616
0.3711
CIE x
0.3625
0.3608
0.3692
0.3714
CIE y
0.3711
0.3616
0.3677
0.3775
CIE x
0.3524
0.3512
0.3590
0.3608
CIE y
0.3555
0.3465
0.3521
0.3616
D9
E4
E9
CIE x
0.3608
0.3590
0.3670
0.3692
CIE y
0.3616
0.3521
0.3578
0.3677
CIE x
0.3512
0.3497
0.3575
0.3590
CIE y
0.3465
0.3385
0.3441
0.3521
CIE x
0.3590
0.3575
0.3650
0.3670
CIE y
0.3521
0.3441
0.3489
0.3578
CIE x
0.3562
0.3548
0.3641
0.3661
CIE y
0.3826
0.3736
0.3804
0.3900
CIE x
0.3661
0.3641
0.3736
0.3760
CIE y
0.3900
0.3804
0.3874
0.3974
CIE x
0.3736
0.3714
0.3842
0.3869
CIE y
0.3874
0.3775
0.3855
0.3958
CIE x
0.3869
0.3842
0.3970
0.4006
CIE y
0.3958
0.3855
0.3935
0.4044
CIE x
0.3714
0.3692
0.3813
0.3842
CIE y
0.3775
0.3677
0.3751
0.3855
CIE x
0.3842
0.3813
0.3934
0.3970
CIE y
0.3855
0.3751
0.3825
0.3935
CIE x
0.3692
0.3670
0.3783
0.3813
CIE y
0.3677
0.3578
0.3646
0.3751
CIE x
0.3813
0.3783
0.3898
0.3934
CIE y
0.3751
0.3646
0.3716
0.3825
CIE x
0.3670
0.3650
0.3758
0.3783
CIE y
0.3578
0.3489
0.3550
0.3646
CIE x
0.3783
0.3758
0.3863
0.3898
CIE y
0.3646
0.3550
0.3610
0.3716
CIE x
0.3760
0.3736
0.3869
0.3902
CIE y
0.3974
0.3874
0.3958
0.4067
CIE x
0.3902
0.3869
0.4006
0.4044
CIE y
0.4067
0.3958
0.4044
0.4160
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Rev2.0, November 15, 2013
14
Product Data Sheet
Z5-M0 – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tj =25℃, IF = 350mA
F0
F5
G0
G5
H0
H5
F1
F6
G1
G6
H1
H6
F2
F7
G2
G7
H2
H7
F3
F8
G3
G8
H3
H8
F4
CIE x
0.3996
0.3960
0.4104
0.4146
CIE y
0.4015
0.3907
0.3978
0.4089
CIE x
0.4146
0.4104
0.4248
0.4299
CIE y
0.4089
0.3978
0.4048
0.4165
CIE x
0.3960
0.3925
0.4062
0.4104
CIE y
0.3907
0.3798
0.3865
0.3978
CIE x
0.4104
0.4062
0.4198
0.4248
CIE y
0.3978
0.3865
0.3931
0.4048
CIE x
0.3925
0.3889
0.4017
0.4062
CIE y
0.3798
0.3690
0.3751
0.3865
F9
G4
G9
H4
H9
CIE x
0.4062
0.4017
0.4147
0.4198
CIE y
0.3865
0.3751
0.3814
0.3931
CIE x
0.3889
0.3860
0.3983
0.4017
CIE y
0.3690
0.3600
0.3660
0.3751
CIE x
0.4017
0.3983
0.4104
0.4147
CIE y
0.3751
0.3660
0.3715
0.3814
CIE x
0.4037
0.3996
0.4146
0.4197
CIE y
0.4140
0.4015
0.4089
0.4217
CIE x
0.4197
0.4146
0.4299
0.4354
CIE y
0.4217
0.4089
0.4165
0.4288
CIE x
0.4299
0.4248
0.4374
0.4430
CIE y
0.4165
0.4048
0.4093
0.4212
CIE x
0.4430
0.4374
0.4499
0.4562
CIE y
0.4212
0.4093
0.4138
0.4260
CIE x
0.4248
0.4198
0.4317
0.4374
CIE y
0.4048
0.3931
0.3973
0.4093
CIE x
0.4374
0.4317
0.4436
0.4499
CIE y
0.4093
0.3973
0.4015
0.4138
CIE x
0.4198
0.4147
0.4259
0.4317
CIE y
0.3931
0.3814
0.3853
0.3973
CIE x
0.4317
0.4259
0.4373
0.4436
CIE y
0.3973
0.3853
0.3893
0.4015
CIE x
0.4147
0.4102
0.4207
0.4259
CIE y
0.3814
0.3710
0.3744
0.3853
CIE x
0.4259
0.4207
0.4312
0.4373
CIE y
0.3853
0.3744
0.3778
0.3893
CIE x
0.4354
0.4299
0.4430
0.4487
CIE y
0.4288
0.4165
0.4212
0.4333
CIE x
0.4487
0.4430
0.4562
0.4619
CIE y
0.4333
0.4212
0.4260
0.4378
CIE x
0.4562
0.4499
0.4620
0.4687
CIE y
0.4260
0.4138
0.4166
0.4289
CIE x
0.4687
0.4620
0.4740
0.4810
CIE y
0.4289
0.4166
0.4194
0.4319
CIE x
0.4499
0.4436
0.4551
0.4620
CIE y
0.4138
0.4015
0.4042
0.4166
CIE x
0.4620
0.4551
0.4666
0.4740
CIE y
0.4166
0.4042
0.4069
0.4194
CIE x
0.4436
0.4373
0.4483
0.4551
CIE y
0.4015
0.3893
0.3919
0.4042
CIE x
0.4551
0.4483
0.4593
0.4666
CIE y
0.4042
0.3919
0.3944
0.4069
CIE x
0.4373
0.4312
0.4422
0.4483
CIE y
0.3893
0.3778
0.3805
0.3919
CIE x
0.4483
0.4422
0.4527
0.4593
CIE y
0.3919
0.3805
0.3830
0.3944
CIE x
0.4619
0.4562
0.4687
0.4747
CIE y
0.4378
0.4260
0.4289
0.4410
CIE x
0.4747
0.4687
0.4810
0.4875
CIE y
0.4410
0.4289
0.4319
0.4435
www.seoulsemicon.com
Rev2.0, November 15, 2013
15
Product Data Sheet
Z5-M0 – High-Power LED
Mechanical Dimensions
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.1mm
www.seoulsemicon.com
Rev2.0, November 15, 2013
16
Product Data Sheet
Z5-M0 – High-Power LED
Emitter Tape & Reel Packaging
www.seoulsemicon.com
Rev2.0, November 15, 2013
17
Product Data Sheet
Z5-M0 – High-Power LED
Product Nomenclature
RANK : Z1Z1Z2Z2Z3
QUANTITY : 1000
LOT NUMBER : Y1Y1Y2Y3Y3Y4Y5Y5Y5Y5 - Y6Y6Y6 - Y7Y7Y7 - Y8Y8Y8Y8Y8Y8Y8
SSC PART NUMBER : X1X2X3-X4X5-X6X7-X8X9
Table 8. Part Numbering System : X1X2X3 - X4X5 - X6X7 - X8X9
Part Number Code
Description
Company
Part Number
Value
X1
X2
S
Z
Z-Power LED series number
PKG series
X3
5
X4
PKG series
M
M series
X5
Revision number
Color Specification
1
New version
Pure white
X6 X7
W0
WN
WW
C8
C9
00
Neutral white
Warm white
CRI (min.) 80
CRI (min.) 90
The others
X8 X9
Color Specification
Table 9. Lot Numbering System : Y1Y1Y2Y3Y3Y4Y5Y5Y5Y5 - Y6Y6Y6 - Y7Y7Y7 - Y8Y8Y8Y8Y8Y8Y8
Lot Number Code
Description
Year
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Month
Day
Production area
Mass order
Taping number
Reel number
Internal management number
[1] Z1: Flux rank Z2: Chromaticity Z3: VF rank
Rev2.0, November 15, 2013
www.seoulsemicon.com
18
Product Data Sheet
Z5-M0 – High-Power LED
Recommended Solder Pad
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only
(4) Undefined tolerance is ±0.1mm
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Rev2.0, November 15, 2013
19
Product Data Sheet
Z5-M0 – High-Power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Table 10.
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
150 °C
200 °C
60-120 seconds
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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Rev2.0, November 15, 2013
20
Product Data Sheet
Z5-M0 – High-Power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to
LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing. In
cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not
recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(7) Avoid leaving fingerprints on silicone resin parts.
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Rev2.0, November 15, 2013
21
Product Data Sheet
Z5-M0 – High-Power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing Z5 Series LEDs in a dry box with a
desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from Seoul Semiconductor. A sealed container with a nitrogen atmosphere
should be used for storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
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Rev2.0, November 15, 2013
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Product Data Sheet
Z5-M0 – High-Power LED
Precaution for Use
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. T
he result can be a significant loss of light output from the fixture. Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues.
(14) The slug is electrically isolated.
(15) Attaching LEDs, do not use adhesives that outgas organic vapor.
(16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the rev
erse voltage is applied to LED, migration can be generated resulting in LED damage.
(17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Rev2.0, November 15, 2013
23
Product Data Sheet
Z5-M0 – High-Power LED
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
www.seoulsemicon.com
Rev2.0, November 15, 2013
24
Product Data Sheet
Z5-M0 – High-Power LED
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT -
Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
www.seoulsemicon.com
Rev2.0, November 15, 2013
25
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