SZW05A0B [SEOUL]
Single Color LED,;
| 型号： | SZW05A0B |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Single Color LED, 光电 |
| 文件： | 总22页 (文件大小：722K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCWM_4828539:WP_0000001WP_0000001
Specification
SSC-Z5 series
August 2012
www.seoulsemicon.com
Document No. : SSC- QP- 7- 07- 12
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PCWM_4828539:WP_0000001WP_0000001
Z5 series
Z5
Features
Description
• Super high Flux output
and high Luminance
• Designed for high
current operation
The Z-Power series is designed for
high current operation and high flux
output applications.
• SMT solderable
It incorporates state of the art SMD
• Lead Free product
• RoHS compliant
design and low thermal resistant material.
The Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, large backlights and
high performance torches.
Applications
• General Torch
• Architectural lighting
• Projector light source
• Traffic signals
• Task lighting
• Decorative / Pathway
lighting
• Remote / Solar
powered lighting
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Contents
1. Full code of Z5 series
2. Outline dimensions
3. Characteristics of SZW05A0B (pure)
4. Characteristic diagrams
5. CIE Chromaticity Diagram (pure)
6. Bin Code Description
7. Labeling
8. Packing
9. Recommended solder pad
10. Soldering
11. Precaution for use
12. Handling of Silicone Resin LEDs
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1. Full code of Z5 series
Full code form : X1 X2 X3X4 X5X6 X7X8
1. Part Number
X1
Company
X2
Z-Power LED series number
X3X4
W0
Color Specification
Pure White
WN
Neutral White
Warm White
WW
X5
PKG Series
5
Z5 series
X6
Lens type
PCB Type
X7
2. Internal Number
X8
Revision No.
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2. Outline dimensions
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is 0.1mm
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3. Characteristics of SZW05A0B (pure)
Pure White
1-1 Electro-Optical characteristics at 350mA
(Ta=25 , RH30%)
Value
Typ
Parameter
Symbol
Unit
Min
Max
[2]
ФV
-
-
124
-
-
[1]
Luminous Flux
lm
K
ФV (Tj=100 )
CCT
110
Correlated Color
-
6000
-
[3]
Temperature
[4]
CRI
Ra
VF
-
-
70
-
-
-
[5]
Forward Voltage
3.30
V
Thermal resistance
(J to S)
RθJ-S
6.5
K/W
deg.
View Angle
2Θ ½
120
Parameter
Symbol
Value
Unit
700
Forward Current
IF
mA
1500 (100ms, 1/10duty)
Reverse Voltage
Power Dissipation
Vr
Pd
5
2.6
V
W
Junction Temperature
Operating Temperature
Storage Temperature
Tj
145(@ IF ≤ 700mA)
-40 ~ +85
-40 ~ +100
2
ºC
ºC
ºC
kV
Topr
Tstg
-
[6]
ESD Sensitivity(HBM)
*Notes :
[1] SSC maintains a tolerance of 7% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005, CCT 5% tolerance.
[4] Tolerance is 0.06V on forward voltage measurements
[5] A zener diode is included to protect the product from ESD.
[6] Tolerance is 2.0 on CRI measurements
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4. Characteristic diagrams
Color Spectrum
(IF=350mA, Ta=25 , RH30%)
SZW05A0B
1.0
0.8
0.6
0.4
0.2
0.0
400
500
600
700
Wavelength[nm]
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Forward Current Characteristics
Forward Current vs. Forward Voltage, Ta=25
0.8
SZW05A0B
0.6
0.4
0.2
0.0
2.0
2.5
3.0
3.5
4.0
Forward Voltage[V]
Forward Current vs. Normalized Relative Luminous Flux, Ta=25
200
SZW05A0B
150
100
50
0
0.0
0.2
0.4
0.6
0.8
Forward Current [A]
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Forward Current Characteristics
Forward Current vs. Chromaticity Coordinate, Ta=25
0.015
SZW05A0B
CIE X
0.010
0.005
0.000
-0.005
-0.010
-0.015
CIE Y
Forward Current [A]
Forward Current vs. CCT, Ta=25
500
SZW05A0B
250
0
-250
-500
0.0
0.2
0.4
0.6
0.8
Forward Current [A]
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Junction Temperature Characteristics
Junction Temperature vs. Relative Light Output at IF=350mA
120
SZW05A0B
100
80
60
40
20
0
25
50
75
100
125
150
Junction Temperature[? ]
Junction Temperature vs. Forward Voltage at IF=350mA
0.2
SZW05A0B
0.0
-0.2
-0.4
-0.6
25
50
75
100
125
150
Junction Temperature[oC]
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Junction Temperature Characteristics
Junction Temperature vs. Chromaticity Coordinate at IF=350mA
0.02
SZW05A0B
CIE X
CIE Y
0.01
0.00
-0.01
-0.02
25
50
75
100
125
150
Junction Temperature [oC]
CCT vs. Junction Temperature at IF=350mA
500
SZW05A0B
250
0
-250
-500
25
50
75
100
125
150
Junction Temperature [oC]
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Characteristic diagrams
Ambient Temperature vs. Allowable Forward Current (Tjmax = 145 , @0.7A)
800
600
Rj-a=10oC/W
Rj-a=15oC/W
400
Rj-a=20oC/W
200
0
0
20
40
60
80
100
120
140
Ambient Temperature [oC]
Radiation pattern at 350mA
0
1.0
30
0.8
0.6
0.4
0.2
0.0
60
90
-80
-60
-40
-20
0
Angle [deg]
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5. CIE Chromaticity Diagram (Pure)
[Ta = 25 IF = 350mA]
st 2012
on.com
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6. Bin Code Description
Bin Code
Color Chromaticity
Coordinate
Luminous Flux (lm)
Forward Voltage (V)
@ IF = 350mA
@ IF = 350mA
@ IF = 350mA
V1
B3
H
Color Chromaticity
Coordinate
Forward Voltage (V)
Luminous Flux (lm)
@ IF = 350mA
@ IF = 350mA
@ IF = 350mA
Bin
Code
Bin
Code
Bin
Code
Min.
Max.
Min.
109
Max.
Min.
Max.
U3
118.5
130
H
3.00
3.25
3.50
3.25
3.50
3.75
Ref. 13 pages
V1
V2
118.5
130
I
J
140
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7. Labeling
X10X11X12X13
1000
###############
SZW05A0B
SZW05A0B
Full code form
X1X2X3X4X5X6X7X8
-X1
: Company
-X2
: Z-Power LED series number
: Color Specification
: PKG Series
-X3 X4
-X
-X6
: Lens type
-X7
: PCB Type
-X8
: Revision No.
Rank
X10X11X12X13
-X10
: Luminous Flux : LF [lm]
-X11X12: Color coordinates : x, y
-X13
Lot No
#1#2#3#4#5#6 - #7#8#9#10 - #11#12#13
: Forward Voltage : VF [V]
- #1 #2
- #3 #4
- #5 #6
: Year
: Month
: Day
- #7 #8 #9 #10
- #11 #12 #13
: Mass order
: Tray No.
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8. Packing
CATHODE MARK
22
13
(1) Quantity : 1000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 10-60g when the cover tape
is turned off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp
proof Package
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8. Packing
Reel Packing Structure
X10X11X12X13
1000
###############
SZW05A0B
SZW05A0B
X10X11X12X13
1000
2
SZW05A0B
SZW05A0B
*******
*******
*******
*******
*******
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9. Recommended solder pad
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] This drawing without tolerances are for reference only
[4] Undefined tolerance is 0.1mm
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10. Soldering
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3°C/second max.
3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215
260
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
* Caution
1. Reflow soldering is recommended not to be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be
damaged.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
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11. Precaution for use
(1) Storage
To avoid the moisture penetration, we recommend storing Z5 Series (Z Power) LEDs
in a dry box with a desiccant . The recommended storage temperature range is 5 to 30
and a maximum humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens
may affect the light output efficiency. Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40
Humidity : less than RH30%
b. If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes, components should be dried for 10-12hr at 60 5
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be
used for storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
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11. Precaution for use
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of
fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and
photonic energy. The result can be a significant loss of light output from the fixture.
Knowledge of the properties of the materials selected to be used in the construction of
fixtures can help prevent these issues.
(14) The slug is isolated from anode electrically.
Therefore, we recommend that you don’t isolate the heat sink.
(15) Attaching LEDs, do not use adhesives that outgas organic vapor.
(16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
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12. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much
as possible. Sharp objects of all types should not be used to pierce the sealing
compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure
on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices.
Compared to standard encapsulants, silicone is generally softer,
and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles
cannot be guaranteed, a suitable cleaning solution must be applied to the surface
after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used,
it must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended.
Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and
do not handle this product with acid or sulfur material in sealed space.
(7) Avoid leaving fingerprints on silicone resin parts.
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