THB105-69 [SEOUL]
Surface-mounted chip LED device; 表面贴装芯片LED器件
| 型号： | THB105-69 |
| 厂家： | 
Seoul Semiconductor |
| 描述： | Surface-mounted chip LED device |
| 文件： | 总12页 (文件大小：637K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Specification
THB105-69
SSC
CUSTOMER
Drawn
Approval
Approval
Rev. 00
September 2008
www.ZLED.com
CONTENTS
1. Absolute Maximum Ratings
2. Electro Characteristics
3. Outline Dimension
4. Electro-Optical characteristic Diagram
5.
6.
7.
8.
Rank Division
Packing
Soldering
Precaution for use
Rev. 00
September 2008
www.ZLED.com
THB105-69
THB105-69
Description
Features
• 1.6 (W) X 0.8 (D) X 0.4 (T) mm
-
Small size suitable for compact
• Dominant Wavelength : 470nm
appliances.
-
-
-
Zener Diode for ESD
Surface-mounted chip LED device.
Pb-free and RoHS complaint
component.
-
-
Tape and Reel packing.
Increases the life time of battery.
Applications
•
Cellular phone’s keypad
lightning
•
•
•
Other decoration lighting
Information Boards
Lighting for Small Size
Device.
Rev. 00
September 2008
www.ZLED.com
1. Absolute maximum ratings
(Ta=25℃)
Parameter
Symbol
Value
Unit
Power Dissipation
Forward Current
Pd
IF
64
20
㎽
㎃
㎃
V
*1
Peak Forward Current
Reverse Voltage
IFM
50
VR
Topr
Tstg
5
Operating Temperature
Storage Temperature
-35 ~ 85
-40 ~ 100
℃
℃
*1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10.
2. Electro-Optical Characteristics
(Ta=25℃)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
VF
VFm
VF(Z)
IV
IF=5㎃
IF=1㎂
2.7
1.8
0.6
23
465
-
3.05
-
3.2
2.7
1.5
55
475
-
Forward Voltage
V
Forward Zener Voltage
Luminous Intensity*2
Wavelength
IF(Z)=10㎃
IF=5㎃
0.8
30
V
mcd
㎚
λD
IF=5㎃
470
25
Spectral Bandwidth
Viewing angle*3
∆λ
IF=5㎃
㎚
2θ1/2
IF=5㎃
-
120
-
˚
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the
LED package.
*3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity.
♦ Eelctrical Characteristics of the Zener Diode
Parameter
Condition
IF=10㎃
VR=5V
Min
Typ
Max
1.6
Unit
V
VF
IR
-
-
-
-
1.0
㎂
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at
20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.
Rev. 00
(Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V)
September 2008
www.ZLED.com
3.Outline Dimension
( Tolerance: ±0.1, Unit: mm )
0.12
Polarity Mark
Cathode
Resin
PCB
0.8
0.4±0.05
Anode
* Recommanded solder Pattern
0.8
* MATERIALS
PARTS
Package
MATERIALS
BT_Resin
Epoxy
Encapsulating Resin
Electrodes
Au Plating Copper Alloy
Rev. 00
September 2008
www.ZLED.com
4. Electro-Optical characteristic Diagram
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
10
1
2.9
3.0
3.1
3.2
3.3
3.4
3.5
Forward Voltage VF(V)
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
400
350
300
250
200
150
100
50
0
5
10
15
20
25
30
ForwardCurrent I [mA]
F
Rev. 00
September 2008
www.ZLED.com
Ambient Temperature vs. Allowable Forward Current
25
20
15
10
5
0
-25
25
50
100
0 Ambient temperature Ta(? )75
Radiation Diagram
(Ta=25 OC )
Rev. 00
September 2008
www.ZLED.com
5. Rank Division
IV[mcd]
VF[V]
λD[nm]
BIN
at IF=5[mA]
at IF=5[mA]
at IF=5[mA]
23~38(C)
23~38(C)
23~38(C)
38~55(D)
38~55(D)
38~55(D)
23~38(C)
23~38(C)
23~38(C)
38~55(D)
38~55(D)
38~55(D)
2.6~2.8(B)
2.8~3.0(C)
3.0~3.2(D)
2.6~2.8(B)
2.8~3.0(C)
3.0~3.2(D)
2.6~2.8(B)
2.8~3.0(C)
3.0~3.2(D)
2.6~2.8(B)
2.8~3.0(C)
3.0~3.2(D)
465 ~470(B)
465 ~470(B)
465 ~470(B)
465 ~470(B)
465 ~470(B)
465 ~470(B)
470 ~475 (C)
470 ~475 (C)
470 ~475 (C)
470 ~475 (C)
470 ~475 (C)
470 ~475 (C)
CBB
CCB
CDB
DBB
DCB
DDB
CBC
CCC
CDC
DBC
DCC
DDC
Rev. 00
September 2008
www.ZLED.com
6. Packing
4.0 ±0.1
2.0 ±0.05
±0.05
+0.1
-0
0.2
1.5
0.5±0.08
±0.05
±0.05
4.0 ±0.1
0.95
0.5
11.4
9 ±0.3
+0
-3
180
2 ±0.2
22
13 ±0.2
Label
Tolerance: ±0.2, Unit: ㎜
(1) Quantity:4,000pcs./Reel
(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is
turned off from the carrier tape at10˚angle to be the carrier tape.
(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package.
Rev. 00
September 2008
www.ZLED.com
● Reel Packing Structure
Reel
P/ N: ##########
###
###
제품명 : SSC-THB105-69
Lot No ##########
수량 : 4000
Aluminum Vinyl Bag
P/ N: ##########
제품명 : SSC-THB105-69
Lot No #########
수량 : 4000
Outer Box
*Material: Paper(SW3B(B))
SIZE(mm)
TYPE
a
c
b
7inch
245 220 142
c
CHIP LED
TUV
MADE IN KOREA
PART : SSC-THB105-69
CODE
:
Acriche
Q'YT : 40,000EA
LOT NO :
Semiconductor EcoLight
RoHS
DATE
:
b
SEOUL SEMICONDUCTOR CO.,LTD
a
Rev. 00
September 2008
www.ZLED.com
7. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
Pre-heating
120 sec.
Max.
o
60sec. Max.
120~150 C
2.5~5 C / sec.
o
Pre-heat time
Above 200 C
Peak-Temperature
240℃ Max.
120sec. Max.
Soldering time
Condition
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
150~200℃
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
Pre-heating
o
120 sec.
Max.
60sec. Max.
o
150~200
C
1~5 C / sec.
o
Pre-heat time
Above 220 C
Peak-Temperature
260℃ Max.
120sec. Max.
Soldering time
Condition
10 sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
September 2008
www.ZLED.com
8. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or
a desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
(3) In the case of more than 1 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
(11) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
Rev. 00
September 2008
www.ZLED.com
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