SGM2564 [SGMICRO]
5.5V, 4A, 16mΩ RON Load Switch with Reverse Current Protection;
| 型号： | SGM2564 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 5.5V, 4A, 16mΩ RON Load Switch with Reverse Current Protection |
| 文件： | 总14页 (文件大小：813K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM2564
5.5V, 4A, 16mΩ RON Load Switch with
Reverse Current Protection
GENERAL DESCRIPTION
FEATURES
The SGM2564 is a single load switch with reverse
current protection function. The device can operate
from 1V to 5.5V single supply and has the ability to
drive up to 4A continuous current.
● Input Voltage Range: 1V to 5.5V
● Maximum Continuous Current: 4A
● Low On-Resistance
RON = 16mΩ at VIN = 3.3V
RON = 16mΩ at VIN = 1.8V
The device contains a 16mΩ low RON N-MOSFET
controlled by the ON pin. The small package and low
RON make the device very suitable for space limited,
battery powered applications.
● Low Shutdown Current: 180nA (TYP)
● Reverse Current Protection When Disabled
● Low Threshold 1.2V GPIO Control Input
● Bidirectional Power Supply for Power Zone
Application
The device supports a wide input voltage range, which
is suitable for many different voltage rails. The rise time
is used to avoid inrush current. The SGM2564 offers
the quick output discharge function in disable status.
● Controlled Slew Rate to Avoid Inrush Current
● Quick Output Discharge
● Available in a Green WLCSP-1.45×0.95-6B Package
The SGM2564 is available in a Green WLCSP-1.45×0.95-6B
package.
APPLICATIONS
Smartphone
Notebook and Tablet Computers
Solid State Drive (SSD)
Set-Top Boxes and Residential Gateways
Portable and Handheld Devices
TYPICAL APPLICATION
VIN
VIN
ON
VOUT
CIN
SGM2564
COUT
ROUT
On
GND
Off
Figure 1. Typical Application Circuit
SG Micro Corp
www.sg-micro.com
MAY 2022–REV. A.1
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
XXX
MZF
SGM2564
WLCSP-1.45×0.95-6B
SGM2564YG/TR
Tape and Reel, 3000
-40℃ to +85℃
MARKING INFORMATION
NOTE: XXX = Date Code and Trace Code.
Date Code - Year
Trace Code
X X X
Y Y Y
Serial Number
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Input Voltage Range, VIN ..................................... -0.3V to 6V
Output Voltage Range, VOUT................................-0.3V to 6V
ON Pin Voltage Range, VON.................................-0.3V to 6V
Maximum Continuous Switch Current, IMAX....................... 4A
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................4000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range, VIN .......................................1V to 5.5V
Output Voltage Range, VOUT..................................0V to 5.5V
ON Pin Input High Voltage, VIH ...........................1.1V to 5.5V
ON Pin Input Low Voltage, VIL ...............................0V to 0.4V
Operating Ambient Temperature Range.........-40℃ to +85℃
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
MAY 2022
2
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
PIN CONFIGURATION
(TOP VIEW)
A
B
C
VOUT
VOUT
VIN
VIN
GND
1
ON
2
WLCSP-1.45×0.95-6B
PIN DESCRIPTION
PIN
A1, B1
A2, B2
C1
NAME
VOUT
VIN
FUNCTION
Switch Output.
Switch Input. Use a bypass capacitor (ceramic) to ground.
Ground.
GND
ON
C2
Switch Control Input. High level is active. Do not float this pin.
FUNCTIONAL BLOCK DIAGRAM
VIN
Reverse
Current
Protection
Charge
Pump
Control
Logic
ON
Driver
VOUT
QOD
SGM2564
GND
SG Micro Corp
MAY 2022
www.sg-micro.com
3
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
ELECTRICAL CHARACTERISTICS
(Full = -40℃ to +85℃, VIN = 1V to 5.5V, CIN = 1μF, COUT = 0.1μF, typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Voltage Range
VIN
1
5.5
V
V
IN = 5.5V, VON = 1.2V, IOUT = 0mA
600
440
250
180
960
700
460
550
Quiescent Current
Shutdown Current
IQ
VIN = 3.3V, VON = 1.2V, IOUT = 0mA
VIN = 1V, VON = 1.2V, IOUT = 0mA
VIN = 5.5V, VON = 0V
nA
ISD
nA
nA
Supply Leakage Current in Shutdown
Mode
ILEAKAGE
VIN = 5.5V, VON = 0V, VOUT = 0V
560
VIN = 3.3V, VON = 1.2V, IOUT = -200mA
VIN = 1.8V, VON = 1.2V, IOUT = -200mA
VIN = 5V
16
16
56
47
37
35
35
35
mΩ
mΩ
On-Resistance
RON
VIN = 3.3V
ON Pin Hysteresis
VHYS
mV
VIN = 1.8V
VIN = 1V
ON Pin Leakage Current
ION
IRC
VON = 5.5V
720
1
nA
Reverse Current When Disabled
VIN = VON = 0V, VOUT = 5V
VIN = 2.5V, VON = 0V, IOUT = 2mA
VIN = 5V, VON = 0V, IOUT = 2mA
μA
280
270
400
390
0.4
Output Pull-Down Resistance
RPD
Ω
ON Pin Input Low Voltage
ON Pin Input High Voltage
VIL
VIH
V
1.1
●
SG Micro Corp
www.sg-micro.com
MAY 2022
4
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
SWITCHING CHARACTERISTICS
(CIN = 1μF, ROUT = 10Ω, COUT = 0.1μF, typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VIN = 5.0V, TJ = +25℃, unless otherwise noted.
Turn-On Time
Turn-Off Time
VOUT Rise Time
VOUT Fall Time
Delay Time
tON
tOFF
tR
1200
30
Figure 2 and Figure 3
1000
25
µs
tF
tD
920
VIN = 3.3V, TJ = +25℃, unless otherwise noted.
Turn-On Time
Turn-Off Time
VOUT Rise Time
VOUT Fall Time
Delay Time
tON
tOFF
tR
1050
30
Figure 2 and Figure 3
850
25
µs
tF
tD
850
PARAMETER MEASUREMENT INFORMATION
VIN
VIN
VOUT
CIN
1μF
COUT
ROUT
SGM2564
On
*
ON
GND
GND
Off
*: Rise and fall times of the control signal are 100ns.
Figure 2. Test Circuit
50%
50%
VON
tOFF
tON
90%
50%
90%
50%
VOUT
10%
10%
tD
tR
tF
Figure 3. Timing Waveforms
SG Micro Corp
www.sg-micro.com
MAY 2022
5
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
TYPICAL PERFORMANCE CHARACTERISTICS
TJ = +25℃, CIN = 1μF, COUT = 0.1μF, ROUT = 10Ω, VIH = 1.2V, VIL = 0V, unless otherwise noted.
Quiescent Current vs. Input Voltage
Quiescent Current vs. Junction Temperature
VIN = 2.5V
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
VIN = 5.5V
V
V
V
IN = 1.8V
IN = 1.2V
IN = 1V
V
V
V
IN = 5V
IN = 4.5V
IN = 3.3V
+85℃
+25℃
-40℃
1
1
1
1.5
2
2.5
3
3.5
4
4.5
5
5
5
5.5
5.5
5.5
-50
-25
0
25
50
75
100
Input Voltage (V)
Junction Temperature (℃)
On-Resistance vs. Junction Temperature
VIN = 1V
On-Resistance vs. Input Voltage
IOUT = -200mA
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
V
IN = 1.2V
IN = 1.8V
IN = 2.5V
IN = 3.3V
IN = 4.5V
IN = 5V
V
V
V
V
V
V
IN = 5.5V
+85℃
+25℃
-40℃
IOUT = -200mA
50 75 100
1.5
2
2.5
3
3.5
4
4.5
-50
-25
0
25
Input Voltage (V)
Junction Temperature (℃)
Shutdown Current vs. Input Current
Shutdown Current vs. Junction Temperature
VIN = 1V
V
V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
IN = 1.2V
IN = 1.8V
VIN = 2.5V
V
V
V
V
IN = 3.3V
IN = 4.5V
IN = 5V
+85℃
IN = 5.5V
+25℃
-40℃
1.5
2
2.5
3
3.5
4
4.5
-50
-25
0
25
50
75
100
Input Voltage (V)
Junction Temperature (℃)
SG Micro Corp
www.sg-micro.com
MAY 2022
6
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TJ = +25℃, CIN = 1μF, COUT = 0.1μF, ROUT = 10Ω, VIH = 1.2V, VIL = 0V, unless otherwise noted.
Output Voltage vs. VON Falling
Output Voltage vs. VON Rising
VIN = 5.5V
6
5
4
3
2
1
0
6
5
4
3
2
1
0
VIN = 5.5V
V
V
V
V
V
V
V
IN = 5V
V
V
V
V
V
V
V
IN = 5V
IN = 4.5V
IN = 3.3V
IN = 2.5V
IN = 1.8V
IN = 1.2V
IN = 1V
IN = 4.5V
IN = 3.3V
IN = 2.5V
IN = 1.8V
IN = 1.2V
IN = 1V
2
1
1
1.6
1.2
0.8
0.4
0
0
1
1
0.4
0.8
1.2
1.6
2
VON Falling (V)
VON Rising (V)
ON Pin Hysteresis vs. Input Voltage
Delay Time vs. Input Voltage
70
60
50
40
30
20
10
0
1400
1200
1000
800
600
400
200
0
-40℃
+25℃
+25℃
+85℃
VIH = 1.8V
4.5
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
2
2.5
3
3.5
4
5
5.5
Input Voltage (V)
Input Voltage (V)
Rise Time vs. Input Voltage
Fall Time vs. Input Voltage
1400
1200
1000
800
600
400
200
0
4.5
4
3.5
3
-40℃
-40℃
+25℃
+85℃
2.5
2
+85℃
1.5
1
+25℃
VIH = 1.8V
4.5 5.5
VIH = 1.8V
4.5 5.5
1.5
2
2.5
3
3.5
4
5
1.5
2
2.5
3
3.5
4
5
Input Voltage (V)
Input Voltage (V)
SG Micro Corp
www.sg-micro.com
MAY 2022
7
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TJ = +25℃, CIN = 1μF, COUT = 0.1μF, ROUT = 10Ω, VIH = 1.2V, VIL = 0V, unless otherwise noted.
Turn-Off Time vs. Input Voltage
VIH = 1.8V
Turn-On Time vs. Input Voltage
VIH = 1.8V
60
50
40
30
20
10
0
1800
1600
1400
1200
1000
800
-40℃
-40℃
+25℃
+85℃
+25℃
+85℃
1 1.5
600
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Input Voltage (V)
Output Pull-Down Resistance vs. Input Voltage
320
310
300
290
280
270
260
+85℃
+25℃
-40℃
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Turn-On Response Time
Turn-Off Response Time
VON
VOUT
VON
VOUT
VIN = 3.3V, CIN = 1μF, COUT = 0.1μF, ROUT = 10Ω
VIN = 3.3V, CIN = 1μF, COUT = 0.1μF, ROUT = 10Ω
Time (500μs/div)
Time (2μs/div)
SG Micro Corp
MAY 2022
www.sg-micro.com
8
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
DETAILED DESCRIPTION
The SGM2564 is a small, 4A load switch. A low
on-resistance N-MOSFET is integrated, which makes a
low voltage drop across the device. To choose suitable
rise time is always used to avoid inrush current.
Quick Output Discharge
The quick output discharge (QOD) feature is available
for SGM2564. If the ON pin is pulled low, a discharge
resistor of 270Ω (TYP) is connected between VOUT
and GND pins to prevent the output from floating when
the switch is disabled.
Control Pin
The ON pin can control the device. Pulling the ON pin
high enables the device. Logic high of VIH on the ON
pin will enable the device and VIL will turn off it. It has
the ability to interface with low-voltage GPIO. It can
support with 1.2V GPIOs.
Table 1. Quick Output Discharge (QOD) Feature
ON
L
VIN to VOUT
Output Discharge
Active
Off
On
H
Disabled
APPLICATION INFORMATION
From the Equation 1, we can also calculate the
soft-start time.
SGM2564 is a single channel, up to 4A current capability
load switch with low on-resistance. The device has a
wide input range, which can be used in different end
equipment to set power sequence, reduce inrush
current and maintain low standby leakage current. The
typical application circuit of SGM2564 is shown in
Figure 4.
dt = COUT × VOUT/IINRUSH
(2)
In this example: COUT = 4.7μF, VOUT = VIN = 3.3V, IINRUSH
= 30mA.
So,
dt = 4.7μF × 3.3V/30mA ≈ 517μs
(3)
Input Voltage
VIN
VOUT
To ensure an inrush current is less than 30mA, the
soft-start time cannot be less than 517μs. The
SGM2564 has a typical rise time of 1000μs at 5V which
meets the above design requirements.
CIN
COUT
SGM2564
ROUT
On
ON
GND
Load
Off
Input Capacitor
Figure 4. Typical Application Circuit
A 1μF input capacitor (CIN) is recommended to use
between VIN and GND close to the device pins. It can
limit the voltage drop on the input supply. Larger CIN
can reduce voltage dip in high current applications.
Design Requirements
Design Parameter
Value
3.3V
Input Voltage (VIN)
Output Capacitor
Load Capacitance (COUT)
4.7µF
30mA
A 0.1μF output capacitor (COUT) should be placed
between VOUT and GND close to the device pins. This
capacitor will prevent parasitic board inductances from
forcing VOUT below GND when the switch is turned off.
To improve the VIN dropping when the device is turned
on, it is recommended that CIN is placed greater than
Maximum Acceptable Inrush Current (IINRUSH
)
Inrush Current
When the switch is enabled, VOUT begins to soft-start
from 0V linearly. Inrush current can be calculated by the
following formula.
dVOUT
C
OUT, due to the CIN is charge for COUT.
(1)
I
= COUT ×
INRUSH
dt
SG Micro Corp
www.sg-micro.com
MAY 2022
9
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
APPLICATION INFORMATION (continued)
Figure 6 shows how the reverse current protection
Saving Standby Power
circuit is activated in SGM2564. Pulling the ON pin
down, the device is shut down and an external voltage
(VFORCE) is forced to VOUT pin, the reverse current is
tested very small given by IRC_VIN. This will prevent any
large extra current reverse from the VFORCE (added on
VOUT) to VIN.
In battery-powered equipment, the strict power budget
must be met under different operating modes. In
standby or sleep mode, leakage current of some
modules such as LCD displays, Wi-Fi, power amplifiers
and GPS may be up to several mA or more. The large
consumption is far from meeting the application
requirements. Using load switches ahead of these
modules can reduce this leakage current to μA/nA level,
which can save the standby power consumption greatly.
The configuration is illustrated in Figure 5.
Power Supply Recommendations
The SGM2564 is designed for a wide operate input
voltage range of 1V to 5.5V. Place a 1μF input bypass
capacitor close to the device terminal is recommended.
Always On
Module
Power Supply Sequencing without a GPIO
Input
VIN
System
Module
VIN
ON
VOUT
GND
In many terminal devices, each module needs to be
powered up in a pre-determined manner. SGM2564 can
set a power sequence by the tDELAY without extra GPIO,
and may reduce inrush current. Figure 7 shows the
sequence that the ON pin of first load switch is tied to
the VIN, and the second load switch ON pin is tied to
the VOUT of first load switch. The second load switch is
powered up when the first load switch is turned on, this
is the fixed sequence and the delay time set by default
CIN
COUT
SGM2564
On
Off
Figure 5. Standby Power Reduction
Reverse Current Protection
If the ON pin is pulled low, the device is disabled, while
VIN > 1V or VOUT > 1V is met, the reverse current
protection function is activated. This function prevents
the current flowing from VOUT to VIN, and is very
useful when SGM2564 is disabled and the output
needs to be driven by another voltage source.
tDELAY
.
Power Supply
VIN
ON
VOUT
Module 1
CIN
COUT1
SGM2564
GND
VSRC
ON
VOUT
GND
Module 2
VIN
COUT2
SGM2564
VIN
VIH
RCP Disabled
RCP Enabled
VON
0V
VSRC - (IOUT × RON
)
VFORCE
Figure 7. Power Supply Sequencing without a GPIO Input
VOUT
Due to QOD
IOUT
IVIN
0V
IRC_VIN
NOTES: VSRC is the input power supply to the equipment.
FORCE is the external power source forced at VOUT pin. IVIN
V
is the current of VIN pin. IOUT is output load current.
Figure 6. Reverse Current Protection
SG Micro Corp
www.sg-micro.com
MAY 2022
10
5.5V, 4A, 16mΩ RON Load Switch with
SGM2564
Reverse Current Protection
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
MAY 2022 ‒ REV.A to REV.A.1
Page
Updated General Description and Features sections ...........................................................................................................................................1
Updated Detailed Description and Application Information sections............................................................................................................... 9, 10
Changes from Original (DECEMBER 2019) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
MAY 2022
11
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
WLCSP-1.45×0.95-6B
A1 CORNER
0.21
0.19
6 × Φ
0.5
0.5
TOP VIEW
RECOMMENDED LAND PATTERN
0.950± 0.015
1
2
6 × Φ0.240± 0.030
A
B
C
0.5
0.450± 0.050
0.170± 0.020
0.255± 0.025
0.025± 0.005
0.5
BOTTOM VIEW
SIDE VIEW
NOTE: All linear dimensions are in millimeters.
SG Micro Corp
TX00159.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
7"
9.0
1.12
1.57
0.62
4.0
4.0
2.0
8.0
Q1
WLCSP-1.45×0.95-6B
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
相关型号：
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