SGM4064 [SGMICRO]
Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode;
| 型号： | SGM4064 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode |
| 文件： | 总11页 (文件大小：674K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM4064
Over-Voltage Protection IC and Li+ Charger
Front-End Protection IC with LDO Mode
GENERAL DESCRIPTION
FEATURES
The SGM4064 is designed for front-end protection of
Li-Ion battery charger.
● Input Over-Voltage Protection
● Battery Over-Voltage Protection
● Up to 18V Input Voltage
The SGM4064 works like a linear regulator, and
constantly monitors the input voltage and battery
voltage to maintain an output voltage of 5.1V, and the
input voltages reach the input over-voltage threshold
(VOVP = 6.8V).
● Up to 1.5A Load Current Capability
● Soft-Start and Soft-Stop Function
Prevent Inrush Currents and Voltage Spikes
● Thermal Shutdown Protection
● Enable Function
The SGM4064 has temperature monitoring function.
When the temperature exceeds 145℃, the device will
switch off. The SGM4064 provides a fault status
indication when it is controlled by the processor.
● Fault Status Indication
● Available in a Green TDFN-2×2-8L Package
The SGM4064 is available in a Green TDFN-2×2-8L
package and is rated over the -40 ℃ to +85 ℃
temperature range.
APPLICATIONS
Portable Internet Devices and Accessory
Mobile Phones and PDAs
Handheld Equipment
MP3 Players
TYPICAL APPLICATION
Charging
Circuit
OUT
VDC
COUT
AC
Adapter
IN
2.2μF
CIN
2.2μF
VBAT
GND
RBAT
10kΩ
SGM4064
System
RPU
47kΩ
RFAULT
47kΩ
RILIM
FAULT
ILIM
RCE
47kΩ
CE
VSS
Figure 1. Typical Application Circuit
SG Micro Corp
OCTOBER 2017 – REV. A. 2
www.sg-micro.com
Over-Voltage Protection IC and Li+ Charger
Front-End Protection IC with LDO Mode
SGM4064
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
4064
XXXX
SGM4064
TDFN-2×2-8L
SGM4064YDE8G/TR
Tape and Reel, 3000
-40℃ to +85℃
NOTE: XXXX = Date Code.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Voltage Range (with Respect to VSS)
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
IN ..................................................................... -0.3V to 28V
OUT ....................................... -0.3V to MIN (VIN + 0.3V, 6V)
ILIM,
,
, VBAT................................... -0.3V to 6V
FAULT CE
Output Source Current (OUT Pin)......................................2A
Output Sink Current ( Pin).................................15mA
FAULT
Package Thermal Resistance
TDFN-2×2-8L, θJA .................................................... 75℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range........................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................4000V
MM.................................................................................200V
RECOMMENDED OPERATING CONDITIONS
IN Voltage Range, VI ...........................................3.3V to 18V
Current, OUT Pin, IO ............................................1.5A (MAX)
OCP Programming Resistor, RILIM ................. 92kΩ to 640kΩ
Operating Temperature Range.......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
2
Over-Voltage Protection IC and Li+ Charger
Front-End Protection IC with LDO Mode
SGM4064
PIN CONFIGURATION
(TOP VIEW)
IN
VSS
OUT
1
2
3
4
8
7
6
5
ILIM
NC
VBAT
FAULT
CE
TDFN-2×2-8L
PIN DESCRIPTION
PIN
1
NAME
IN
FUNCTION
Power Input Pin. Connect a ceramic capacitor (1μF MIN) between IN and VSS.
Ground Terminal. Connect to the thermal pad and to the ground.
No Connection.
2
VSS
NC
3
4
Open-Drain Device Status Output Pin.
FAULT
5
Active-Low Chip Enable Input Pin.
CE
6
VBAT
Battery Voltage Sense Input Pin. Connect a 10kΩ resistor to pack positive terminal.
Overload Current Protection Programming Pin. Connect a resistor to VSS to set the overload
current protection threshold:
7
8
ILIM
OUT
IOCP = 200/(25 + RILIM
)
(current in A, resistance in kΩ)
Output Terminal to the Charging System. Connect a ceramic capacitor (2.2μF MIN) between
OUT and VSS.
Exposed Pad. The exposed pad is electrically connected to VSS internally. The exposed pad
must be connected to the same potential as the VSS pin on the printed circuit board. Do not
use the exposed pad as the primary ground input for the device. VSS pin must be connected
to ground at all times.
Exposed
Pad
GND
SG Micro Corp
OCTOBER 2017
www.sg-micro.com
3
Over-Voltage Protection IC and Li+ Charger
Front-End Protection IC with LDO Mode
SGM4064
ELECTRICAL CHARACTERISTICS
(TA = +25℃, RILIM = 100kΩ,
PARAMETER
= LOW, unless otherwise noted.)
CE
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input
Under-Voltage Lockout, Input Power
Detected Threshold
UVLO
Vhys(UVLO)
tDGL(PGOOD)
V
IN = 0V to 3V
2.5
2.65
225
9
2.8
V
Hysteresis on UVLO
VIN = 3V to 0V
mV
ms
Time measured from VIN = 0V to 5V,
1μs rise-time
Deglitch Time, Input Power Detected Status
Operating Current
IDD
VIN = 5V, no load on OUT pin
185
0.5
260
2
μA
μA
Standby Current
ISTDBY
= HIGH, VIN = 5.5V
CE
Input-to-Output Characteristics
Q1 Off-State Leakage Current
Dropout Voltage IN to OUT
Input Over-Voltage Protection
IOFF
VDO
5
μA
= HIGH, VIN = 5.5V
CE
VIN = 5V, IOUT = 0.5A
120
5.1
170
mV
VIN = 5.5 to VOVP - Vhys(OVP), no load on OUT
pin
Output Voltage
VO(REG)
4.9
5.3
V
Input Over-Voltage Protection Threshold
Hysteresis on OVP
VOVP
6.35
50
6.8
7.05
280
V
Vhys(OVP)
120
mV
Input Over-Voltage Protection
Propagation Delay (1)
tPD(OVP)
VIN = 6V to 9V
200
9
ns
Recovery Time from Input Over-Voltage
Condition
Time measured from VIN = 9V to 6V,
1μs fall-time
tREC(OVP)
ms
Battery Over-Voltage Protection
Battery Over-Voltage Protection Threshold
Hysteresis on BVOVP
BVOVP
Vhys(BVovp)
IVBAT
VOVP - Vhys(OVP) > VIN > 4.5V
VOVP - Vhys(OVP) > VIN > 4.5V
4.275
190
4.35
255
20
4.41
320
180
V
mV
nA
Input Bias Current on VBAT Pin
VIN > 4.5V, time measured from VVBAT rising
Deglitch Time, Battery Over-Voltage
Detected
tDGL(BVovp)
180
μs
from 4.1V to 4.5V to
going low
FAULT
Thermal Protection
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
TJ(OFF)
145
15
℃
℃
TJ(OFF-HYS)
Logic Levels on
CE
Logic LOW Input Voltage
Logic HIGH Input Voltage
Input LOW Current
VIL
VIH
IIL
0.4
V
V
1.4
0.3
9
1.5
15
μA
μA
VCE = 1.8V
Input HIGH Current
IIH
Logic Levels on
FAULT
Output LOW Voltage
VOL
IIkg
ISINK = 5mA
VFAULT = 5V
0.14
0.01
0.3
25
V
Off-State Leakage Current, HI-Z
μA
NOTE:
1. Not tested. Specified by design.
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
4
Over-Voltage Protection IC and Li+ Charger
Front-End Protection IC with LDO Mode
SGM4064
TYPICAL PERFORMANCE CHARACTERISTICS
TA = +25℃, CIN = COUT = 2.2μF, RILIM = 100kΩ, unless otherwise noted.
Normal Power-On Showing Soft-Start
OVP at Power-On
ROUT = 5Ω
VIN
VIN
VOUT
VOUT
VFAULT
IOUT
Time (2ms/div)
Time (2ms/div)
OVP Response for Input Step
Recovery from OVP
VIN = 10V to 6V Step
VFAULT
VIN = 6V to 9V Step
VIN
VOUT
VIN
VOUT
VFAULT
Time (200μs/div)
Time (2ms/div)
Slow Input Ramp into OVP Event
VFAULT
VIN
VOUT
VIN
VOUT
Time (200μs/div)
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
5
Over-Voltage Protection IC and Li+ Charger
Front-End Protection IC with LDO Mode
SGM4064
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, CIN = COUT = 2.2μF, RILIM = 100kΩ, unless otherwise noted.
Soft-Stop during OCP Event
Battery OVP Event
VIN = 3.8V to 4.5V Step
VBAT
VIN
VOUT
VOUT
IOUT
VFAULT
Time (40μs/div)
Time (40μs/div)
Under-Voltage Lockout vs. Temperature
Leakage Current (VBAT Pin) vs. Temperature
2.8
2.7
2.6
2.5
2.4
2.3
50
40
30
20
10
0
VIN Rising
VIN Falling
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
Battery Over-Voltage Protection Threshold
vs. Temperature
Output Voltage Regulation vs. Temperature
5.4
5.3
5.2
5.1
5.0
4.9
4.5
4.4
4.3
4.2
4.1
4.0
VVBAT Rising
VIN = 5.5V
75
VVBAT Falling
-50
-25
0
25
50
100
-50
-25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
6
Over-Voltage Protection IC and Li+ Charger
Front-End Protection IC with LDO Mode
SGM4064
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, CIN = COUT = 2.2μF, RILIM = 100kΩ, unless otherwise noted.
OVPThreshold vs. Temperature
Supply Current vs. Input Voltage
7.2
7.0
6.8
6.6
6.4
6.2
250
200
150
100
50
V
OVP Rising
IC Enabled
IC Disabled
VOVP Falling
0
-50
-25
0
25
50
75
100
0
3
6
9
12
15
18
Input Voltage (V)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
7
Over-Voltage Protection IC and Li+ Charger
Front-End Protection IC with LDO Mode
SGM4064
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
OCTOBER 2017 ‒ REV.A.1 to REV.A.2
Added Recommended Operating Conditions section...........................................................................................................................................2
JANUARY 2016 ‒ REV.A to REV.A.1
Added Functional Block Diagram section.............................................................................................................................................................8
Changes from Original (OCTOBER 2012) to REV.A
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
OCTOBER 2017
8
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-8L
D
e
N8
E1
D1
L
E
k
N4
N1
b
BOTTOM VIEW
TOP VIEW
1.20
0.65
0.60 1.95
A
A1
A2
SIDE VIEW
0.24
0.50
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.900
1.100
1.900
0.500
2.100
1.300
2.100
0.700
0.075
0.043
0.075
0.020
0.083
0.051
0.083
0.028
D1
E
E1
k
0.200 MIN
0.500 TYP
0.008 MIN
0.020 TYP
b
0.180
0.250
0.300
0.450
0.007
0.010
0.012
0.018
e
L
SG Micro Corp
www.sg-micro.com
TX00056.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-2×2-8L
7″
9.5
2.30
2.30
1.10
4.0
4.0
2.0
8.0
Q1
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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