SGM4560 [SGMICRO]
CA Card Power Supply and Level Translator;
| 型号： | SGM4560 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | CA Card Power Supply and Level Translator |
| 文件： | 总6页 (文件大小：445K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM4560
CA Card Power Supply and Level Translator
GENERAL DESCRIPTION
FEATURES
The SGM4560 is used for power conversion and level
translation of the signal in the application of CA cards.
Also, it can be used for the applications of 3.3V or 5.0V
CA cards, which is powered by its internal LDOs from
3.3V to 5.5V input signal. The value of the output
voltage can be controlled with the voltage selection
pins of the SGM4560 with the maximum load current of
200mA.
● CA Card Power Supply: 3.3V/5.0V at 200mA
● 3.3V to 5.5V Input Voltage Range
● 1.6V to 5.5V Controller Voltage Range
● Fast Rising Time for the Signals
● Built-In Fault Protection Circuitry
● Level Translators to 3.3V or 5.0V
● Low Supply Voltage and Shutdown Current
● -40℃ to +85℃ Operating Temperature Range
● Available in a Green TSSOP-14 Package
The level translator integrated on the SGM4560 can
boost the input signal which is powered by 1.6V to 3.3V
or 5.0V interface. The lifespan of the battery can be
enhanced as the 100μA (TYP) operating current and
1μA (MAX) shutdown current.
APPLICATIONS
CA Card Interface
The SGM4560 is available in a Green TSSOP-14
package. It operates over an ambient temperature
range of -40℃ to +85℃.
TYPICAL APPLICATION
3.3V to 5.5V
1.6V to 5.5V
1μF
1μF
DVCC
DVCC
VP
VCC
SHDN
VCC
1μF
CA Card
Interface
Controller
SGM4560
VSEL
RIN
RST
CLK
I/O
RST
CLK
I/O
CIN
DATA
GND
GND
Figure 1. Typical Application Circuit
SG Micro Corp
www.sg-micro.com
APRIL2014–REV. A. 1
SGM4560
CA Card Power Supply and Level Translator
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM4560
YTS14
XXXXX
SGM4560
TSSOP-14
SGM4560YTS14G/TR
Tape and Reel, 3000
-40℃ to +85℃
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
X X X X X
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Voltage Range (with Respect to GND)
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
VP, DVCC ............................................................ -0.3V to 6V
VCC .......................................................... -0.3V to VP + 0.3V
SHDN, VSEL, RIN, CIN .......................................... -0.3V to 6V
CLK, RST, I/O........................................-0.3V to VCC + 0.3V
DATA ....................................................-0.3V to DVCC+0.3V
Package Thermal Resistance
TSSOP-14, θJA....................................................... 154℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................4000V
MM.................................................................................400V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
APRIL 2014
2
SGM4560
CA Card Power Supply and Level Translator
PIN CONFIGURATION
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
NC
CIN
RIN
CLK
GND
RST
DATA
SHDN
VSEL
10 I/O
9
8
VCC
VP
DVCC
NC
TSSOP-14
PIN DESCRIPTION
PIN
1
NAME
CIN
FUNCTION
Controller Clock Input Pin.
Controller Reset Input Pin.
2
RIN
Controller Bidirectional Data Input/Output Pin. A weak pull-up current source ensures that the DATA
pin is held HIGH during shutdown, as long as DVCC is powered.
3
4
5
DATA
SHDN
VSEL
Controller Driven Shutdown Pin. This pin goes to high (DVCC) in the normal operation, and the pin
goes to low when in the shutdown mode.
Select Pin for VCC Voltage. Select VCC = 3.3V for the low level and VCC = 5.0V for driving the pin to
DVCC
.
Controller Supply Voltage, for the Input/Output Pins (CIN, RIN, DATA). Bypass with a 1μF ceramic
capacitor to GND.
6
DVCC
NC
7, 14
No Connection.
VCC Supply Input Pin. It can be operated between 3.3V and 5.5V. It is recommended to use a 1μF or
larger ceramic capacitor from VP pin to GND to get good power supply decoupling. This ceramic
capacitor should be placed as close as possible to VP pin.
8
9
VP
CA Card VCC Supply Voltage. It is recommended to use a 1μF ceramic capacitor to ensure stability.
This ceramic capacitor should be placed as close as possible to VCC pin. The pin is discharged to
GND in the shutdown mode.
VCC
10
11
12
I/O
CA Card Bidirectional Data Input/Output Pin. The pin is pulled to GND in the shutdown mode.
CA Card Reset Output Pin. The pin is pulled to GND in the shutdown mode.
Ground.
RST
GND
CA Card Clock Output Pin. The pin is pulled to GND in the shutdown mode. Careful board layout of
CLK pin is necessary for fast rising and falling edges.
13
CLK
SG Micro Corp
APRIL 2014
www.sg-micro.com
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-14
D
E1
E
5.94
1.78
b
e
0.42
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
H
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
1.100
0.150
1.000
0.300
0.200
5.100
4.500
6.550
MIN
MAX
0.043
0.006
0.039
0.012
0.008
0.201
0.177
0.258
A
A1
A2
b
0.050
0.800
0.190
0.090
4.900
4.300
6.250
0.002
0.031
0.007
0.004
0.193
0.169
0.246
c
D
E
E1
e
0.650 BSC
0.026 BSC
L
0.500
1°
0.700
7°
0.02
1°
0.028
7°
H
θ
0.25 TYP
0.01 TYP
SG Micro Corp
TX00019.001
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TSSOP-14
13″
12.4
6.95
5.60
1.20
4.0
8.0
2.0
12.0
Q1
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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