SGM6332 [SGMICRO]

3A, 18V, 1.4MHz Buck Converter;
SGM6332
型号: SGM6332
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

3A, 18V, 1.4MHz Buck Converter

文件: 总10页 (文件大小:626K)
中文:  中文翻译
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SGM6332  
3A, 18V, 1.4MHz Buck Converter  
GENERAL DESCRIPTION  
FEATURES  
The SGM6332 is a current-mode buck converter with  
an internal power MOSFET switch. This device has a  
fixed switching frequency of 1.4MHz. It can efficiently  
provide up to 3A output load current over a wide input  
supply range from 4.5V to 18V with excellent load and  
line regulation responses.  
4.5V to 18V Input Voltage Range  
0.8V to 14V Adjustable Output Voltage Range  
3A Output Current  
High Efficiency: Up to 91%  
Shutdown Supply Current: 18µA (MAX)  
100mΩ Internal Power MOSFET Switch  
1.4MHz Fixed Switching Frequency  
Cycle-by-Cycle Current Limit Protection  
Thermal Shutdown Protection  
Under-Voltage Lockout  
In addition, the SGM6332 is an efficient, 91% peak  
efficiency when the device is in operation. The  
shutdown supply current consumed is less than 18µA.  
Protection features include cycle-by-cycle current limit  
and thermal shutdown. The device also includes an  
internal soft-start and an external adjustable soft-start  
function to limit the inrush current and prevent the  
overshoot of output voltage.  
Support Low ESR Ceramic Capacitors  
-40to +85Operating Temperature Range  
Available in a Green SOIC-8 (Exposed Pad)  
Package  
The SGM6332 is available in a Green SOIC-8 (Exposed  
Pad) package and also minimizes the external  
components of the device to complete a 3A buck  
DC/DC converter solution.  
APPLICATIONS  
Battery Chargers  
Flat Panel TVs  
Set-Top Boxes  
Cigarette Lighter Powered Devices  
Pre-Regulators  
TYPICAL APPLICATION  
R4  
10Ω  
or shorted  
C5  
10nF  
L
BS  
Enable  
4.7μH  
EN  
IN  
Output  
3.3V/3A  
SW  
Input  
4.5V to 18V  
SGM6332  
R1  
33kΩ  
SS  
FB  
COMP  
GND  
R2  
10.5kΩ  
COUT  
47μF  
C3  
5.6nF  
D1  
B340A  
CIN  
22μF  
C4  
0.1μF  
C6  
Optional  
R3  
10kΩ  
Figure 1. Typical Application Circuit  
SG Micro Corp  
JULY 2015 – REV. B  
www.sg-micro.com  
SGM6332  
3A, 18V, 1.4MHz Buck Converter  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM  
6332YPS8  
XXXXX  
SOIC-8  
(Exposed Pad)  
SGM6332  
-40°C to +85°C  
SGM6332YPS8G/TR  
Tape and Reel, 2500  
MARKING INFORMATION  
NOTE: XXXXX = Date Code and Vendor Code.  
X X X X X  
Vendor Code  
Date Code - Week  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
OVERSTRESS CAUTION  
ABSOLUTE MAXIMUM RATINGS  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
Supply Voltage, VIN............................................ -0.3V to 20V  
SW Voltage, VSW.......................................-0.5V to VIN + 0.3V  
Boost Voltage, VBS.............................VSW - 0.3V to VSW + 6V  
All Other Pins....................................................... -0.3V to 6V  
Package Thermal Resistance  
SOIC-8 (Exposed Pad), θJA ....................................... 50/W  
Junction Temperature.................................................+150℃  
Storage Temperature Range.......................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
ESD SENSITIVITY CAUTION  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
HBM.............................................................................4000V  
MM.................................................................................250V  
RECOMMENDED OPERATING CONDITIONS  
Operating Temperature Range...................... -40°C to +85°C  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
JULY 2015  
2
SGM6332  
3A, 18V, 1.4MHz Buck Converter  
PIN CONFIGURATION  
(TOP VIEW)  
1
2
3
8
7
6
BS  
IN  
SS  
EN  
SW  
GND  
COMP  
FB  
4
5
SOIC-8 (Exposed Pad)  
PIN DESCRIPTION  
PIN  
1
NAME  
BS  
FUNCTION  
High-side Gate Drive Boost Input. A 10Ω resistor placed between SW and BS cap is strongly recommended to  
reduce SW spike voltage.  
Power Input. This pin powers the device and step-down converter switches. A large enough capacitor is used to  
bypass this pin to GND to eliminate input’s noise.  
2
IN  
3
SW  
Power Switching Output. Place a capacitor between SW and BS to supply the high-side switch.  
4
5
GND  
FB  
Ground. (Exposed pad is connected to the backside of GND)  
Feedback Input. Connect to the resistor divider between output and ground to set output voltage.  
Compensation Node for regulation control loop compensation. An additional capacitor between COMP and GND may  
be needed.  
6
7
8
COMP  
EN  
Enable Input for regulator’s turn-on or turn-off. Drive EN high to turn on the regulator, and drive EN low to turn it off.  
Output voltage is discharged when the IC is off. EN is disconnected in automatic startup.  
Soft-Start Control Input. A capacitor is placed between SS and GND to set the soft-start period. Disconnect the SS to  
disable the soft-start function.  
SS  
Exposed  
Pad  
GND  
Power Ground Exposed Pad. Must be connected to GND plane.  
SG Micro Corp  
JULY 2015  
www.sg-micro.com  
3
SGM6332  
3A, 18V, 1.4MHz Buck Converter  
ELECTRICAL CHARACTERISTICS  
(VIN = 12V, TA = +25°C, unless otherwise noted.)  
PARAMETER  
Input Voltage Range  
SYMBOL  
VIN  
CONDITIONS  
MIN  
4.5  
TYP  
MAX  
18  
UNITS  
V
Feedback Voltage  
VFB  
0.776  
0.8  
10  
0.824  
18  
V
Shutdown Supply Current  
Quiescent Supply Current  
High-side Switch (M1) On-Resistance  
Low-side Switch (M2) On-Resistance  
Error Amplifier Transconductance  
Error Amplifier Voltage Gain  
SW Leakage Current  
ISHDN  
IQ  
VEN = 0V  
μA  
mA  
mΩ  
Ω
VEN = 2.6V, VFB = 1.0V  
0.8  
1.7  
RONH  
RONL  
GEA  
AEA  
100  
10  
VFB = ±12.5mV  
500  
800  
10000  
1120  
1
μA/V  
V/V  
μA  
A
ILSW  
ILIM  
VEN = 0V, VSW = 0V  
Current Limit  
4.2  
6.2  
80  
0
Current Sense to COMP Transconductance  
Maximum Duty Cycle  
GCS  
DMAX  
DMIN  
VIH  
A/V  
%
VFB = 0.6V  
VFB = 1V  
Minimum Duty Cycle  
%
EN Threshold Voltage  
1.2  
V
EN Threshold Voltage  
VIL  
0.4  
2
V
EN Pull-Up Current  
VEN = 0V  
0.8  
1.4  
1.4  
140  
3.8  
230  
10  
μA  
MHz  
kHz  
V
Oscillator Frequency  
fOSC  
1.15  
1.6  
Short-Circuit Oscillator Frequency  
Under-Voltage Lockout Threshold  
Under-Voltage Lockout Threshold Hysteresis  
Soft-Start Period  
VFB = 0V  
VIN Rising  
3.5  
4.2  
mV  
ms  
CSS = 0.1μF  
Thermal Shutdown Temperature  
TSHDN  
160  
SG Micro Corp  
www.sg-micro.com  
JULY 2015  
4
SGM6332  
3A, 18V, 1.4MHz Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS  
VIN = 12V, CIN = 22µF, COUT = 47µF and TA = +25°C, unless otherwise noted.  
Efficiency vs. Load Current  
VOUT = 5.0V  
Feedback Voltage vs. Temperature  
100  
90  
80  
70  
60  
50  
40  
30  
0.83  
0.82  
0.81  
0.80  
0.79  
0.78  
0.77  
VOUT = 3.3V  
V
IN = 12V  
-50  
-25  
0
25  
50  
75  
100  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
Temperature ()  
Load Current (A)  
Steady State Operation  
Steady State Operation  
AC Coupled  
AC Coupled  
VOUT  
VOUT  
VSW  
VSW  
IL  
VOUT = 1.8V, IOUT = 1.5A  
IL  
VOUT = 1.8V, IOUT = 3A  
Time (400ns/div)  
Time (400ns/div)  
Shutdown Through Enable  
Shutdown Through Enable  
VEN  
VEN  
VOUT  
VOUT  
VSW  
VSW  
IL  
VOUT = 3.3V, IOUT = 3A  
(Resistance Load)  
VOUT = 3.3V, IOUT = 1.5A  
(Resistance Load)  
IL  
Time (200μs/div)  
Time (200μs/div)  
SG Micro Corp  
www.sg-micro.com  
JULY 2015  
5
SGM6332  
3A, 18V, 1.4MHz Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
VIN = 12V, CIN = 22µF, COUT = 47µF and TA = +25°C, unless otherwise noted.  
Startup through Enable  
Startup through Enable  
VEN  
VEN  
C4 = 0.1μF,  
VOUT = 3.3V, IOUT = 3A  
(Resistance Load)  
C4 = 0.1μF,  
VOUT = 3.3V, IOUT = 1.5A  
(Resistance Load)  
VOUT  
VOUT  
VSW  
VSW  
IL  
IL  
Time (4ms/div)  
Time (4ms/div)  
Startup through Enable  
Startup through Enable  
VEN  
VEN  
No Soft-Start Cap,  
VOUT = 3.3V, IOUT = 3A  
(Resistance Load)  
No Soft-Start Cap,  
OUT = 3.3V, IOUT = 1.5A  
(Resistance Load)  
V
VOUT  
VSW  
IL  
VOUT  
Time (400μs/div)  
Time (400μs/div)  
Load Transient Response  
AC Coupled  
VOUT  
IL  
ILOAD  
VOUT = 3.3V, IOUT = 1A to 2A Step  
Time (100μs/div)  
SG Micro Corp  
www.sg-micro.com  
JULY 2015  
6
SGM6332  
3A, 18V, 1.4MHz Buck Converter  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
JULY 2015 ‒ REV.A.4 to REV.B  
Page  
Changed Typical Application and Input Capacitor............................................................................................................................................1, 8  
JULY 2014 ‒ REV.A.3 to REV.A.4  
Page  
Added a 10Ω resistor between SW and BS pin in application circuit .......................................................................................................... 1, 3, 10  
APRIL 2014 ‒ REV.A.2 to REV.A.3  
Page  
Updated typical application, shutdown supply current and electrical characteristics.........................................................................................1, 4  
JANUARY 2013 ‒ REV.A.1 to REV.A.2  
Page  
Updated Soft-Start section...................................................................................................................................................................................7  
NOVEMBER 2012 ‒ REV.A to REV.A.1  
Page  
Updated Electrical Characteristic section.............................................................................................................................................................4  
Changes from Original (OCTOBER 2012) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
JULY 2015  
7
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
SOIC-8 (Exposed Pad)  
3.302  
D
e
E1  
E
2.413 5.56  
E2  
1.91  
b
D1  
1.27  
0.61  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
c
θ
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
MIN  
MAX  
0.067  
0.004  
0.061  
0.020  
0.010  
0.201  
0.134  
0.157  
0.244  
0.099  
A
A1  
A2  
b
1.700  
0.100  
1.550  
0.510  
0.250  
5.100  
3.402  
4.000  
6.200  
2.513  
0.000  
1.350  
0.330  
0.170  
4.700  
3.202  
3.800  
5.800  
2.313  
0.000  
0.053  
0.013  
0.007  
0.185  
0.126  
0.150  
0.228  
0.091  
c
D
D1  
E
E1  
E2  
e
1.27 BSC  
0.050 BSC  
L
0.400  
0°  
1.270  
8°  
0.016  
0°  
0.050  
8°  
θ
SG Micro Corp  
www.sg-micro.com  
TX00013.000  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
SOIC-8  
(Exposed Pad)  
13″  
12.4  
6.40  
5.40  
2.10  
4.0  
8.0  
2.0  
12.0  
Q1  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
13″  
386  
280  
370  
5
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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