SGM6607(EOL) [SGMICRO]
1.1A High Voltage Boost Converter in Small Packages;
| 型号： | SGM6607(EOL) |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 1.1A High Voltage Boost Converter in Small Packages |
| 文件： | 总11页 (文件大小：853K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM6607
1.1A High Voltage Boost
Converter in Small Packages
GENERAL DESCRIPTION
FEATURES
The SGM6607 is a high voltage switching regulator. It
integrates a 40V low-side MOSFET to offer an output
voltage up to 38V. It also accepts a wide input voltage
range of 3V to 20V from multi-cell batteries or regulated
5V/12V power rails. A 1.2MHz switching frequency
makes the use of low-profile inductors and low-value
ceramic input and output capacitors available.
● Input Voltage Range: 3V to 20V
● 38V (MAX) High Output Voltage
● Integrated Switch of 1.1A
● Fixed Switching Frequency of 1.2MHz
● 41V Over-Voltage Protection
● At 5V Input (TYP):
12V at 300mA
24V at 150mA
The device supports boost, SEPIC and some other
standard switching-regulator topologies. The device
regulates the output with PWM (pulse width modulation)
control. This device also includes the built-in functions
of output over-voltage protection, over-current limit,
soft-start and thermal shutdown.
● 93% Peak Efficiency
● 500kΩ Pull-Down Resistor on EN Pin
● Light Load Skip-Switching
● Soft-Start and Thermal Shutdown Built-in
Functions
● -40℃ to +85℃ Operating Temperature Range
● Available in Green TDFN-2×2-6L and TSOT-23-6
Packages
The SGM6607 is available in Green TDFN-2×2-6L and
TSOT-23-6 packages and is rated over the -40℃ to
+85℃ temperature range.
APPLICATIONS
Mobile Phones
Portable Equipment
SG Micro Corp
FEBRUARY 2018 – REV. A. 1
www.sg-micro.com
1.1A High Voltage Boost
SGM6607
Converter in Small Packages
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
6607
XXXX
TDFN-2×2-6L
TSOT-23-6
SGM6607YTDI6G/TR
SGM6607YTN6G/TR
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +85℃
-40℃ to +85℃
SGM6607
SKDXX
MARKING INFORMATION
NOTE: XX = Date Code. XXXX = Date Code.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed may cause permanent damage
to the device. Functional operation of the device at these or
any otherconditions beyond those indicated in the operational
sectionof thespecification is not implied. Exposureto absolute
maximum rating conditions for extended periods may affect
reliability.
Supply Voltage on VIN....................................... -0.3V to 22V
Voltage on EN...................................................... -0.3V to 5V
Voltages on FB and COMP.................................. -0.3V to 3V
Voltage on SW................................................... -0.3V to 40V
Junction Temperature.................................................+150℃
Package Thermal Resistance
TDFN-2×2-6L, θJA.................................................... 120℃/W
TSOT-23-6, θJA ........................................................ 190℃/W
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
HBM.............................................................................4000V
MM.................................................................................300V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuitdesign, specificationor other related things if necessary
without notice at any time.
SG Micro Corp
www.sg-micro.com
FEBRUARY 2018
2
1.1A High Voltage Boost
SGM6607
Converter in Small Packages
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
VIN
EN
1
2
3
6
5
4
FB
FB
COMP
GND
1
2
3
6
5
4
VIN
EN
COMP
GND
GND
SW
SW
TDFN-2×2-6L
TSOT-23-6
PIN DESCRIPTION
PIN
NAME I/O
FUNCTION
TDFN-2×2-6L TSOT-23-6
6
1
2
VIN
EN
I
I
The Input Supply Pin.
Enable Pin of the Boost Regulator. Logic low makes the device disabled. Logic high
makes the device enabled.
5
4
3
SW
I
Switching Node. Connect SW to the switched side of the inductor.
Ground.
3
4
GND
COMP
FB
O
O
I
Output of the Transconductance Error Amplifier. Connect an external RC network to
this pin to compensate the regulator.
2
5
Feedback Pin. Connect to the center tap of a resistor divider to program the output
voltage.
1
6
Solder the thermal pad to the analog ground plane and recommend to connect
thermal vias to the ground plane when available.
Thermal Pad
—
GND
—
SG Micro Corp
www.sg-micro.com
FEBRUARY 2018
3
1.1A High Voltage Boost
SGM6607
Converter in Small Packages
ELECTRICAL CHARACTERISTICS
(VIN = 3.6V, VEN = VIN, Full = -40℃ to +85℃, typical values are at TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
SUPPLY CURRENT
Input Voltage Range
VIN
IQ
3
20
600
1
V
μA
μA
V
+25℃
+25℃
+25℃
+25℃
+25℃
Operating Quiescent Current into VIN
Shutdown Current
Device PWM switching no load
VEN = GND, VIN = 4.2V
VIN falling
400
ISHDN
UVLO
VHYS
Under-Voltage Lockout Threshold
Under-Voltage Lockout Hysteresis
ENABLE AND REFERENCE CONTROL
EN Logic High Voltage
2.2
70
2.5
mV
VIH
VIL
VIN = 3V to 20V
VIN = 3V to 20V
Full
Full
1.5
300
V
V
EN Logic Low Voltage
0.4
EN Pull-Down Resistor
REN
500
700
kΩ
+25℃
VOLTAGE AND CURRENT CONTROL
Voltage Feedback Regulation Voltage
Voltage Feedback Input Bias Current
Oscillator Frequency
VREF
IFB
Full
Full
1.186
1.211
1.236
200
V
nA
VFB = 1.3V
VFB = 1.1V
fOSC
Full
0.96
90
1.2
94
1.44
MHz
%
Maximum Duty Cycle
D
+25℃
+25℃
+25℃
+25℃
Full
Minimum ON Pulse Width
COMP Pin Sink Current
tMIN_ON
ISINK
ISOURCE
GEA
80
ns
55
μA
COMP Pin Source Current
Error Amplifier Transconductance
POWER SWITCH
55
μA
220
300
440
μmho
VIN = 3.6V
0.36
0.55
0.6
1
+25℃
+25℃
+25℃
N-Channel MOSFET On-Resistance
RDS(ON)
ILN_NFET
Ω
VIN = 3.0V
N-Channel Leakage Current
OC AND SS
VSW = 35V, VEN = 0V
μA
N-Channel MOSFET Current Limit
VREF Ramp Up Time
ILIM
tr
0.8
1.1
2
1.3
A
+25℃
+25℃
ms
THERMAL SHUTDOWN
Thermal Shutdown Threshold
Thermal Shutdown Threshold Hysteresis
TSHDN
THYS
150
15
℃
℃
SG Micro Corp
www.sg-micro.com
FEBRUARY 2018
4
1.1A High Voltage Boost
SGM6607
Converter in Small Packages
TYPICAL PERFORMANCE CHARACTERISTICS
TA = +25℃, L = 10μH, D1 = ONsemi MBR0540T1, unless otherwise noted.
Efficiency vs. Output Current
Efficiency vs. Output Current
100
90
80
70
60
50
40
100
90
80
70
60
50
40
VOUT = 12V
VIN = 12V
VIN = 8.5V
VIN = 5V
VOUT = 30V
VOUT = 18V
VOUT = 24V
VIN = 5V
250 300
VOUT = 24V
200 250 300
0
50
100
150
200
0
50
100
150
Output Current (mA)
Output Current (mA)
Error Amplifier Transconductance vs. Temperature
Output Voltage vs. Input Voltage
VIN = 3.6V, ILOAD = 100mA
500
400
300
200
100
0
12.00
11.99
11.98
11.97
11.96
11.95
11.94
TA = -40℃
TA = 25℃
TA = 85℃
VIN = 3.6V
110 140
-40
-10
20
50
80
2.5
4
5.5
7
8.5
10
11.5
Temperature (℃)
Input Voltage (V)
PWM Switching Operation
Skip-Cycle Switching
VSW
VSW
AC Coupled
AC Coupled
VOUT
VOUT
IL
IL
VIN = 5V, VOUT = 12V, ILOAD = 250mA
Time (400ns/div)
VIN = 9V, VOUT = 12V, ILOAD = 100μA
Time (200μs/div)
SG Micro Corp
www.sg-micro.com
FEBRUARY 2018
5
1.1A High Voltage Boost
SGM6607
Converter in Small Packages
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, L = 10μH, D1 = ONsemi MBR0540T1, unless otherwise noted.
Load Transient Response
Start-Up
EN
AC Coupled
VOUT
VOUT
VCOMP
IL
ILOAD
VIN = 5V, VOUT = 12V, ILOAD = 250mA
Time (1ms/div)
VIN = 5V, VOUT = 12V, ILOAD = 50mA to 150mA
Time (1ms/div)
SG Micro Corp
FEBRUARY 2018
www.sg-micro.com
6
1.1A High Voltage Boost
SGM6607
Converter in Small Packages
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
FEBRUARY 2018 ‒ REV.A to REV.A.1
Updated Package Thermal Resistance of TDFN-2×2-6L .....................................................................................................................................2
Changes from Original (FEBRUARY 2014) to REV.A
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
FEBRUARY 2018
7
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6L
D
e
N6
D1
L
E1
E
SEE DETAIL A
k
N3
N1
b
BOTTOM VIEW
TOP VIEW
1.40
0.65
A
A1
0.80
2.60
A2
SIDE VIEW
0.24
0.65
N2
N1
N2
N1
RECOMMENDED LAND PATTERN (Unit: mm)
DETAIL A
Pin #1 ID and Tie Bar Mark Options
NOTE: The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.900
1.100
1.900
0.600
2.100
1.450
2.100
0.850
0.075
0.043
0.075
0.024
0.083
0.057
0.083
0.034
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.250
0.300
0.450
0.007
0.010
0.012
0.018
e
L
SG Micro Corp
www.sg-micro.com
TX00055.001
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSOT-23-6
0.69
0.95
D
e
2.59
E1
E
0.99
b
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
θ
0.25
A1
c
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.043
0.004
0.039
0.020
0.008
0.116
0.065
0.116
A
A1
A2
b
1.000
0.100
0.900
0.500
0.200
2.950
1.650
2.950
0.000
0.700
0.300
0.080
2.850
1.550
2.650
0.000
0.028
0.012
0.003
0.112
0.061
0.104
c
D
E
E1
e
0.950 BSC
0.037 BSC
L
0.300
0°
0.600
8°
0.012
0°
0.024
8°
θ
SG Micro Corp
www.sg-micro.com
TX00038.001
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-2×2-6L
TSOT-23-6
7″
7″
9.5
9.5
2.30
3.20
2.30
3.10
1.10
1.10
4.0
4.0
4.0
4.0
2.0
2.0
8.0
8.0
Q1
Q3
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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