SGM6612A [SGMICRO]
20V, 10A Fully-Integrated Synchronous Boost Converter with Load Disconnect Control;
| 型号： | SGM6612A |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 20V, 10A Fully-Integrated Synchronous Boost Converter with Load Disconnect Control |
| 文件： | 总21页 (文件大小：1012K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM6612A
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
DESCRIPTION
FEATURES
The SGM6612A is a 20V high-efficient synchronous
Boost converter integrated with two 15mΩ power
switches. This device offers small size power solution
for portable equipment. The device has high switching
frequency up to 2.2MHz with resistor programmable.
● 2.7V to 16V Input Voltage Range
● 4.5V to 20V Output Voltage Range
● Up to 10A Resistor-Programmable Current Limit
● Up to 2.2MHz Resistor-Programmable Switching
Frequency
● 15mΩ Low RDSON Internal MOSFETs
● Up to 95% Efficiency
The SGM6612A has two operation modes, the pulse
width modulation (PWM) mode and pulse frequency
modulation (PFM) mode. The PWM mode is applied at
moderate to heavy load. The PFM mode is applied at
light load to improve the efficiency.
(at VIN = 7.2V, VOUT = 16V, IOUT = 2A)
● Gate Driver for Load Disconnection
● Hiccup Short Protection
● Over-Voltage Protection
The SGM6612A features a built-in gate driver for
external MOSFET, which can isolate the output from
the input when the device shuts down or in output short
condition. When the output is shorted and the short
protection is triggered, the device goes to the hiccup
mode for safety. In addition, the device also provides
output over-voltage protection, inductor current limit
protection and thermal shutdown.
● Auto PFM Mode at Light Load
● Available in a Green TQFN-3×3.5-13L Package
APPLICATIONS
Portable Loudspeaker Boxes
LCD Display Source Driver
Supply for Power Amplifier and Motor Driver
Supply for USB Type-C
The SGM6612A is available in a Green TQFN-3×3.5-13L
package.
SG Micro Corp
JUNE 2022– REV. A. 3
www.sg-micro.com
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
6612A
YTQX13
XXXXX
SGM6612A
TQFN-3×3.5-13L
SGM6612AYTQX13G/TR
Tape and Reel, 4000
-40℃ to +85℃
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
OVERSTRESS CAUTION
BOOT Voltage ........................................... -0.3V to VSW + 6V
VIN, SW, VOUT, DISDRV, EN Voltages............. -0.3V to 23V
VCC, FB, COMP, FREQ, ILIM Voltages............... -0.3V to 6V
Package Thermal Resistance
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
TQFN-3×3.5-13L, θJA................................................. 66℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range........................-65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
HBM.............................................................................2000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS can cause damage. ESD damage can range from subtle
Input Voltage Range ............................................2.7V to 16V
Output Voltage Range .........................................4.5V to 20V
Operating Ambient Temperature Range.........-40℃ to +85℃
Operating Junction Temperature Range......-40℃ to +125℃
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
JUNE 2022
2
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
PIN CONFIGURATION
(TOP VIEW)
8
7
6
9
5
4
3
2
1
FB
DISDRV
VCC 10
EN 11
COMP
ILIM
VIN 12
AGND
FREQ
BOOT 13
TQFN-3×3.5-13L
PIN DESCRIPTION
PIN
1
NAME
FREQ
AGND
ILIM
I/O
FUNCTION
Adjustable Switching Frequency Pin. A resistor is placed between FREQ and the
AGND to program the switching frequency. Do not leave this pin floating in application.
I
2
-
Analog Signal Ground.
Adjustable Peak Switch Current Limit. A resistor is placed between ILIM and AGND to
program the peak switch current limit.
3
I
Output of the Internal Error Amplifier. Put the loop compensation network between this
pin and the AGND.
4
COMP
FB
O
5
I
Voltage Feedback. Connect to the resistor divider to program the output voltage.
Power Ground. Connect to the source of the low-side MOSFET.
Switch Node of the Converter. Connect to the internal power MOSFETs.
Boost Converter Output.
6
PGND
SW
PWR
7
PWR
8
VOUT
DISDRV
VCC
PWR
Gate Drive Output for the External Disconnect MOSFET. Connect this pin to the gate of
the external MOSFET. When the load disconnect function is not used, leave it floating.
9
O
O
I
Output of the Internal Regulator. Connect this pin to ground with a capacitor more than
1.0µF.
10
11
12
13
EN
Enable Input Pin. Logic high enables the device. Logic low shuts down the device.
Power Supply.
VIN
I
Gate Driver Supply of High-side MOSFET. Connect this pin to SW pin with a ceramic
capacitor.
BOOT
O
NOTE: I: input, O: output, PWR: power for the circuit.
SG Micro Corp
www.sg-micro.com
JUNE 2022
3
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
ELECTRICAL CHARACTERISTICS
(VIN = 2.7V to 14V and VOUT = 16V, TJ = -40℃ to +125℃, typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS
Power Supply
Input Voltage Range
VIN
2.7
16
3.3
2.7
2.6
V
V
Minimum Input Voltage Range for Start-up
VIN_SS
3.0
2.6
2.5
100
5
TJ = +25℃
IN rising, TJ = -40℃ to +85℃
V
Input Voltage Under-Voltage Lockout Threshold VIN_UVLO
V
VIN falling, TJ = -40℃ to +85℃
VIN UVLO Hysteresis
VIN_HYS
VCC
mV
V
VCC Regulation Voltage
VCC UVLO Threshold
ICC = 5mA, VIN = 6V
VCC_UVLO VCC falling
2.2
0.35
125
1.2
3.7
V
Quiescent Current into VIN Pin
Quiescent Current into VOUT Pin
0.5
200
3
IC enabled, no load, no ext. MOSFET, VIN = 6V,
IQ
µA
VOUT = 20V, VFB = 1.23V, TJ = -40℃ to +85℃
IC disabled, VIN = 6V, TJ = -40℃ to +85℃
Shutdown Current into VIN Pin
ISD
µA
µA
6
IC disabled, VIN = 16V, TJ = -40℃ to +85℃
IC disabled, VIN = 16V, VOUT = VSW = 20V,
TJ = -40℃ to +85℃
Leakage Current of Low-side MOSFET
ILS_LKG
0.1
5
Output Voltage
Output Voltage Range
VOUT
VOVP
fSW = 530kHz
4.5
20
V
V
Output Over-Voltage Protection Threshold
Power Switches
VIN = 8V, VOUT rising
20.4
21
21.7
High-side MOSFET On-Resistance
Low-side MOSFET On-Resistance
VCC = 5V
VCC = 5V
15
15
27
27
mΩ
mΩ
RDSON
Gm
Power Stage Trans-Conductance
(peak current ratio with comp voltage)
VCC = 5V
12
A/V
Current Limit
Resistor-Programmable Current Limit
Short Current Limit
ILIM
7.6
9
10.8
A
A
RLIM = 80.6kΩ, TJ = +25℃
ILIM_SHORT
20
Voltage Reference
PWM operation
1.180 1.198 1.215
100.2%
V
Reference Voltage at FB Pin
VREF
Auto PFM operation
VREF
nA
Leakage Current into FB Pin
IFB_LKG
10
50
SG Micro Corp
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JUNE 2022
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20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 2.7V to 14V and VOUT = 16V, TJ = -40℃ to +125℃, typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS
EN Logic
EN Pin Logic High Threshold
EN Pin Logic Low Threshold
EN Pin Pull-Down Resistor
Error Amplifier
VEN_H
VEN_L
REN
1.3
V
0.4
V
700
kΩ
COMP Pin Output High Voltage
COMP Pin Output Low Voltage
Error Amplifier Trans-Conductance
COMP Pin Sink Current
COMP Pin Source Current
Current Limit
VCOMP_H High threshold, VFB = VREF - 100mV, RLIM = 80.6kΩ
VCOMP_L Low threshold, VFB = VREF + 100mV, RLIM = 80.6kΩ
2.0
0.4
270
160
25
V
V
GmEA
ISINK
VCOMP = 1.2V
µS
µA
µA
VFB = VREF + 100mV, VCOMP = 1.2V
VFB = VREF - 100mV, VCOMP = 1.2V
ISOURCE
Waiting Time for Restart in Hiccup Mode
Soft-Start
tHIC_OFF
90
ms
Start-Up Time
tSTART-UP
3.2
2.5
ms
ms
Pre-Charge Time
tPRE_CHARGE
1.8
3.2
TJ = +25℃
Protection
Thermal Shutdown Rising Threshold
Thermal Shutdown Falling Threshold
Switching Frequency
TSD_R
TSD_F
TJ rising
TJ falling
155
130
℃
℃
R
FREQ = 348kΩ
460
205
530
245
600
285
Switching Frequency
fSW
RFREQ = 842kΩ
RFREQ = 75kΩ
kHz
ns
1750
2050
120
2350
Minimum On-Time
tON_MIN
Gate Driver for Load Disconnect
Driver Current for the External MOSFET
IGD_SINK
55
µA
SG Micro Corp
www.sg-micro.com
JUNE 2022
5
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
TYPICAL PERFORMANCE CHARACTERISTICS
At TJ = +25℃, VIN = 7.2V and VOUT = 16V, unless otherwise noted.
Efficiency vs. Output Current
Efficiency vs. Output Current
VOUT = 16V
L = 3.3μH
Auto PFM
100
90
80
70
60
50
40
30
20
100
90
80
70
60
50
40
30
20
VOUT = 16V
L = 3.3μH
Auto PFM
VIN = 6V
V
V
VIN = 10.8V
V
V
IN = 7.2V
IN = 8.4V
IN = 12V
IN = 13.2V
0.0001
0.001
0.01
Output Current (A)
0.1
1
3
3
3
0.0001
0.001
0.01
Output Current (A)
0.1
1
3
Efficiency vs. Output Current
VOUT = 14V
L = 1.8μH
Auto PFM
Output Voltage vs. Output Current
VOUT = 16V
L = 3.3μH
Auto PFM
100
90
80
70
60
50
40
30
20
16.5
16.4
16.3
16.2
16.1
16.0
15.9
15.8
15.7
15.6
15.5
VIN = 3V
IN = 3.6V
IN = 4.2V
VIN = 6V
IN = 7.2V
IN = 8.4V
V
V
V
V
0.001
0.01
0.1
1
0.0001
0.001
0.01
0.1
1
3
Output Current (A)
Output Current (A)
Output Voltage vs. Output Current
VOUT = 16V
L = 3.3μH
Auto PFM
Quiescent Current vs. VIN
16.5
16.4
16.3
16.2
16.1
16.0
15.9
15.8
15.7
15.6
15.5
160
140
120
100
80
TJ = +85℃
TJ = +25℃
TJ = -40℃
VIN = 10.8V
IN = 12V
IN = 13.2V
60
V
V
40
0.0001
0.001
0.01
0.1
1
8
9
10
11
12
13
14
15
16
Output Current (A)
Input Voltage (V)
SG Micro Corp
www.sg-micro.com
JUNE 2022
6
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TJ = +25℃, VIN = 7.2V and VOUT = 16V, unless otherwise noted.
Shutdown Current vs. VIN
Switch Current Limit vs. Setting Resistor
5
4.5
4
16
14
12
10
8
VOUT = 16V
IN = 7.2V
Auto PFM
V
3.5
3
2.5
2
6
1.5
1
TJ = +85℃
TJ = +25℃
TJ = -40℃
4
2
0.5
0
0
2
4
6
8
10
12
14
16
40 60 80 100 120 140 160 180 200 220 240
Input Voltage (V)
Resistor (kΩ)
LS RDSON vs. Temperature
HS RDSON vs. Temperature
22
20
18
16
14
12
10
22
20
18
16
14
12
10
VCC = 5V
VCC = 5V
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Temperature (℃)
Temperature (℃)
Frequency vs. Setting Resistor
Reference Voltage vs. Temperature
3300
3000
2700
2400
2100
1800
1500
1200
900
1.202
1.200
1.198
1.196
1.194
1.192
VOUT = 16V
IN = 7.2V
V
600
300
0
0
100 200 300 400 500 600 700 800 900 1000
-50 -25
0
25
50
75 100 125 150
Resistor (kΩ)
Temperature (℃)
SG Micro Corp
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JUNE 2022
7
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TJ = +25℃, VIN = 7.2V and VOUT = 16V, unless otherwise noted.
VIN UVLO Rising/Falling Threshold vs. Temperature
EN Rising/Falling Threshold vs. Temperature
2.8
2.7
2.6
2.5
2.4
2.3
1.0
0.9
0.8
0.7
0.6
0.5
Rising
Falling
Rising
Falling
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Temperature (℃)
Temperature (℃)
Steady State 1000mA
Steady State 10mA
VIN = 7.2V, VOUT = 16V, L = 3.3μH, COUT = 86μF,
LOAD = 1000mA
VIN = 7.2V, VOUT = 16V, L = 3.3μH, COUT = 86μF, Auto PFM,
ILOAD = 10mA
I
VOUT2
VOUT2
SW
AC Coupled
AC Coupled
SW
IL
IL
Time (1μs/div)
Time (10μs/div)
Start-Up by EN
Shutdown by EN
VIN = 7.2V, VOUT = 16V, L = 3.3μH, COUT = 86μF, Auto PFM,
RLOAD = 32Ω
VIN = 7.2V, VOUT = 16V, L = 3.3μH, COUT = 86μF, Auto PFM,
RLOAD = 32Ω
EN
EN
VOUT2
VOUT2
IL
IL
Time (1ms/div)
Time (2ms/div)
SG Micro Corp
JUNE 2022
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8
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TJ = +25℃, VIN = 7.2V and VOUT = 16V, unless otherwise noted.
Load Transient
Output Short Release (with Load Disconnect MOSFET)
VOUT2
AC Coupled
VOUT2
VGS
IL
ILOAD
VIN = 7.2V, VOUT = 16V, L = 3.3μH, COUT = 86μF,
VIN = 7.2V, VOUT = 16V, L = 3.3μH, COUT = 86μF
ILOAD = 500mA to 2A, 0.1A/μs slew rate
Time (200μs/div)
Time (10μs/div)
Output Short Release (with Load Disconnect MOSFET)
VOUT2
VGS
IL
VIN = 7.2V, VOUT = 16V, L = 3.3μH, COUT = 86μF
Time (2ms/div)
SG Micro Corp
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20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
FUNCTIONAL BLOCK DIAGRAM
L
VIN
CBOOT
CIN
CVCC
VCC
VIN
BOOT
SW
VIN VOUT
REG
VCC
VOUT
P-MOS
VOUT2
EN
COUT1 RGATE
CGATE COUT2
LS
HS
DRV
PWM Control
&
Protection
Logic
ISENSE
DISDRV
+
-
ILIM
1.2V
+
-
REF
CR LIM Cmp
+
-
RUP
Slope Comp
FREQ
ILIM
1.2V
VCC
RFREQ
PWM
Cmp
+
-
FB
-
Gm
+
ILIM REF
OVP
OT
VREF
Protection Protection
RLIM
RDOWN
COMP
CC
CP
RC
AGND
PGND
Figure 1. Block Diagram
SG Micro Corp
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JUNE 2022
10
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
DETAILED DESCRIPTION
The SGM6612A, a synchronous Boost converter,
integrates two 15mΩ power switches. It is capable of
delivering up to 10A peak switch current and up to 20V
output voltage. In moderate to heavy load condition, the
SGM6612A works in PWM mode with fixed frequency.
In light load condition, the SGM6612A operates in the
auto PFM mode to improve the efficiency. Excellent line
and load transient response can be achieved with
minimal output capacitance by applying a peak current
control topology. The external loop compensation
makes a wider range of inductor and output capacitor
combinations available.
Start-up
The SGM6612A implements the soft-start function to
reduce the inrush current during start-up. The device
first charges the output voltage to 1.1 × VIN with the
fixed 500kHz switching frequency during pre-charge
phase. After the precharge phase (2.5ms, TYP), the
output voltage will rise gradually and linearly to the
target value. The soft-start time is 3.2ms (TYP). Then,
the switching frequency is set by the resistor connected
through the FREQ pin.
Load Disconnect Gate Driver
The external MOSFET is driven by the DISDRV pin at
the output to isolate the output from the input in
shutdown or output short-circuit condition. During the
start-up phase, the load disconnect MOSFET is softly
turned on by an internal sink current (55µA, TYP). The
load disconnect MOSFET connection is shown in
Figure 2.
The SGM6612A supports the resistor-programmable
switching frequency of up to 2.2MHz. In Boost
operation, the device can avoid overload with the
help of peak current control topology. In addition, if the
output current is higher than the short current
threshold or the output voltage is less than the short
voltage threshold, hiccup current protection will be
started in which the regulator remains off for 90ms
before restarting the converter. The device has a gate
driver for external MOSFETs to disconnect the output
from the input side in off-state or output short-circuit
conditions.
P-MOS
VOUT
VOUT2
COUT1
VGS
COUT2
CGATE
RGATE
SGM6612A
DISDRV
Under-Voltage Lockout (UVLO)
An under-voltage lockout circuit prevents operation at
input voltages below 2.5V (TYP) with a hysteresis of
100mV. Therefore, if the input voltage rises and
exceeds 2.6V (TYP), the device restarts.
Figure 2. The Load Disconnect MOSFET Configuration
Enable and Disable
When the input voltage exceeds minimum input voltage
during start-up and the EN voltage is higher than its
logic high threshold, the SGM6612A is enabled. When
the EN voltage is lower than its logic low threshold, the
SGM6612A enters shutdown mode.
The driver voltage and turn-on/off timing can be set by
the resistor and capacitor which are connected
between DISDRV pin and VOUT pin.
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20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
DETAILED DESCRIPTION (continued)
Adjustable Peak Current Limit
To avoid accidental large peak current, an internal
cycle-by-cycle current limit is adopted.
Adjustable Switching Frequency
The SGM6612A has an adjustable switching frequency
up to 2.2MHz. The switching frequency is set by an
external resistor connected between the FREQ pin and
the AGND. Do not leave the FREQ pin floating. The
resistor value is calculated by Equations as follows.
By connecting a resistor to the ILIM pin, the peak
switch current limit can be set. Calculate the correct
resistor value according to Equation 1 as below:
1
T =
= k ×CFREQ ×RFREQ + tDELAY
(2)
730
Freq
(1)
RLIM
=
ILIM
1
- tDELAY
Freq
where:
LIM is the resistor used to set the current limit (kΩ).
LIM is the peak switch current limit (A).
(3)
RFREQ
=
k ×CFREQ
R
I
where:
DELAY = 50ns, k = 3, CFREQ = 1.8pF.
For example, a 50kΩ resistor gives a 14.6A peak
t
current limit.
For example, when RFREQ is 348kΩ, the frequency is
Switch current limit and resistor setting of SGM6612A
530kHz.
(Auto PFM) with 7.2V input and 16V output is in Figure
3.
Switching frequency versus setting resistor please see
Figure 4 (VOUT = 16V and VIN = 7.2V).
16
VOUT = 16V
3300
VOUT = 16V
IN = 7.2V
V
IN = 7.2V
14
12
10
8
3000
V
Auto PFM
2700
2400
2100
1800
1500
1200
900
6
4
600
2
300
0
0
40 60 80 100 120 140 160 180 200 220 240
0
100 200 300 400 500 600 700 800 900 1000
Resistor (kΩ)
Resistor (kΩ)
Figure 3. Switch Current Limit vs. Setting Resistor
Figure 4. Switching Frequency vs. Setting Resistor
SG Micro Corp
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JUNE 2022
12
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
DETAILED DESCRIPTION (continued)
enough to reach the pre-set low threshold and the
device stops switching. In light load condition, the
frequency is reduced depending on the load to
minimize the switching and gate driving losses and
keep the efficiency high.
Start-up with Pre-biased Output
The low-side switch is prohibited from turning on and
discharging the output if a pre-biased voltage is sensed
on the output before start-up. As long as the internal
soft-start voltage is higher than VFB, the low-side switch
is allowed to sink current to have a monotonic start-up
with pre-biased output.
When VOUT is close to VIN, the Boost converter cannot
support the duty cycle anymore. It enables its built-in
Diode Mode which enables the converter to regulate
the output voltage. When operating in Diode Mode, the
converter's rectifier switch stops switching to regulate
the output voltage. The efficiency during Diode Mode
operation is reduced so that it is recommended that VIN
Bootstrap Voltage (BOOT)
A small ceramic capacitor between the BOOT pin and
the SW pin provides gate current to charge the gate of
the high-side MOSFET device during the on-time of
each cycle and to charge the bootstrap capacitor. The
value of this capacitor is recommended to be above
0.1µF.
be at least 1V lower than VOUT
.
Hiccup Mode Short Protection (with Load
Disconnect MOSFET)
Device Functional Modes
SGM6612A equips a hiccup protection mode. When the
inductor current reaches the short-circuit protection
limit threshold of 20A (TYP) or the output voltage is less
than 70% of the normal output voltage (TYP), hiccup
protection mode starts. In this mode, the device turns
off for a 90ms (TYP) wait time. After the short-circuit
The synchronous Boost converter SGM6612A operates
at a constant frequency PWM mode in moderate to
heavy load condition. The low-side N-MOSFET switch
is turned on at the start of a cycle, and the inductor
current increases to a peak current determined by the
EA. After the peak current is reached, the current
comparator trips, and it disables the low-side
N-MOSFET switch and the inductor current goes
through the body diode of the high-side N-MOSFET in
a dead-time duration. After the dead-time duration, the
high-side N-MOSFET switch is turned on. Because the
output voltage is larger than the input voltage, the
inductor current decreases. After a short dead-time
duration, the low-side switch is turned on again and the
switching cycle is repeated. To avoid sub-harmonic
oscillation, the SGM6612A has internal slope
compensation.
condition is
automatically.
removed,
the device recovers
Over-Voltage Protection (OVP)
The SGM6612A provides 21V (TYP) OVP threshold.
The device stops switching immediately until the
voltage at the VOUT pin drops 500mV below the
output over-voltage protection threshold. The OVP
circuitry monitors the output voltage (VOUT) and protects
VOUT and SW from exceeding safe operating voltages.
Thermal Shutdown
To prevent thermal damage, the device has an internal
temperature monitor. If the die temperature exceeds
+155℃ (TYP), the device stops switching. Once the
temperature drops below +130℃ (TYP), the device
resumes operation.
The device features a power-save PFM mode in light
load condition. When the output load is reduced, the
peak current is also decreasing but has a minimum
value. When the load is further reduced and the peak
current is clamped and cannot be reduced further, then
the error amplifier output (COMP pin) will be low
SG Micro Corp
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JUNE 2022
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20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
APPLICATION INFORMATION
Typical Application
The typical application is for 6V to 14V input, 16V output converter.
CBOOT
0.1μF
L
BOOT
3.3μH
VIN
M1
VOUT2
SW
VIN
VOUT
COUT2_1
22μF
COUT2_2
22μF
COUT2_3
22μF
RUP
1MΩ
CIN1
22μF
COUT1_1
10μF
COUT1_2
10μF
RGATE
150kΩ
CGATE
22nF
VCC
DISDRV
FB
CVCC
RDOWN
2.2μF
80.6kΩ
SGM6612A
EN
COMP
FREQ
RFREQ
CC
6.8nF
348kΩ
CP
10pF
RC
ILIM
15kΩ
RLIM
51.1kΩ
AGND
PGND
Figure 5. SGM6612A Typical Application Circuit with 16V Output
Design Requirements
Table 1 shows the design parameters in this design.
Table 1. Design Parameters
Parameter
Input Voltage Range
Output Voltage
Value
6V to 14V
16V
Output Ripple Voltage
Output Current Rating
Operating Frequency
±3%
3A
530kHz
Table 2. Recommended Inductors for SGM6612A
Saturation
Current/Heat Rating Current (A)
Size
Part Number
L (μH)
DCR TYP (mΩ)
Manufacturer
(L × W × H mm3)
5 × 10 × 4
744325180
74437368033
1.8
3.3
3.3
4.7
6.8
10
3.5
11.8
12
18
23/8
10/10
15/8.5
14
Würth
Würth
10 × 10 × 3.8
10.9 × 10 × 4
10.9 × 10 × 3.8
11 × 10 × 3.8
11 × 10 × 3.8
DFEH10040D-3R3M#
PIMB104T-4R7MS
74437368068
Murata/TOKO
Cyntec
20.0
17.5
27
Würth
74437368100
12.5
Würth
Table 3. Recommended Capacitors for SGM6612A
Designator
Qty
Value
Description
Package
Part Number
Manufacturer
CIN1, COUT2_1
COUT2_2, COUT2_3
,
4
22µF
CAP, CERM, 22µF, 25V, ±10%, X5R, 1210
CAP, CERM, 10µF, 25V, ±20%, X5R, 0603
1210
GRM32ER61E226KE15L
Murata
COUT1_1
,
2
10µF
0603
GRM188R61E106MA73D
Murata
COUT1_2
CBOOT
CC
1
1
1
0.1µF
6.8nF
2.2µF
CAP, CERM, 0.1µF, 16V, ±10%, X5R, 0402
CAP, CERM, 6.8nF, 25V, ±10%, X7R, 0402
CAP, CERM, 2.2µF, 10V, ±20%, X5R, 0402
0402
0402
0402
GRM155R61C104KA88D
GRM155R71E682KA01D
GRM155R61A475MEAAD
Murata
Murata
Murata
CVCC
SG Micro Corp
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14
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
APPLICATION INFORMATION (continued)
Setting the Peak Current Limit
Loop Stability and Compensation
The peak current limit of the SGM6612A is set by an
Table 4. Recommended L, RC and CC for Different Output
Voltages and Frequencies
external resistor. For setting a current limit of 13A, the
resistor value is 56kΩ after calculation. Due to the
distribution of the current limit, it is recommended to
select a resistor about 10% less than the calculated
value for safety. Here, 51.1kΩ resistor is a preferable
choice.
fSW (kHz)
530
VOUT (V)
L (μH)
1.8/3.3
1.8/3.3
1.2
CC (nF)
6.8
6.8
6.8
2.2
2.2
2.2
10
RC (kΩ)
20
16
5
15
15
5
530
530
2050
2050
2050
240
20
16
5
1.8
50
50
20
5
1.8
0.68
6.8
Setting the Output Voltage
The output voltage is set by a resistor divider network.
Calculate the output voltage by Equation 4:
20
16
5
240
6.8
10
5
240
3.3
10
2
RUP
(4)
VOUT = VFB × 1+
RDOWN
Selecting the Disconnect MOSFET
The SGM6612A has a gate driver to control an external
MOSFET. When the device shuts down or output shorts,
it disconnects the output from the input, shown in
Figure 7.
where:
VOUT is the output voltage.
RUP is the top divider resistor.
RDOWN is the bottom divider resistor.
P-MOS
VOUT
For setting an output voltage of 16V, choose RDOWN to
be about 80.6kΩ, calculated by Equation 4, and RUP is
1MΩ.
VOUT2
COUT1
CGATE VGS
COUT2
RGATE
SGM6612A
Selecting the Output Capacitors
It is recommended to use 3 × 22μF X5R or X7R MLCC
capacitors connected in parallel for most applications.
Refer to Table 3.
DISDRV
With the connection of the load disconnect MOSFET,
the output capacitor should be divided into two parts,
shown in Figure 6. COUT2 should be no greater than 10
× COUT1 to avoid the inrush current when the disconnect
MOSFET is turned on.
Figure 7. Load Disconnect MOSFET Connection
VDS and IDS ratings and safe operating area (SOA)
should be considered when MOSFET is selected.
P-MOS
The drain-to-source voltage rating should be larger
VOUT
VOUT2
than the maximum output VDS_DIS_MAX = VOUT
The drain-to-source RMS current rating is the
maximum output current IDS_DIS_RMS = IOUT
.
SGM6612A
VGS
CGATE
COUT1
COUT2
RGATE
.
Considering the SOA when the output is
short-circuited, the short protection response time
DISDRV
and surge current can result in heat, SOA > QSHORT
.
1
(5)
QSHORT
=
× VOUT ×ISHORT × tSHORT
2
Figure 6. Output Capacitor Configuration with Load
Disconnect MOSFET
Selecting the Input Capacitors
A 22μF input capacitor is enough for most applications.
To reduce the input current ripple, larger values may
also be allowed. See Table 3.
SG Micro Corp
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JUNE 2022
15
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
APPLICATION INFORMATION (continued)
where:
(7)
(8)
VGATE = RGATE ×IDIS _P−MOS
VDS_DIS_MAX is the drain-source maximum voltage.
IDS_DIS_RMS is the drain-source RMS current.
ISHORT is the short current.
VGATE
RGATE
=
IDIS _P−MOS
tSHORT is the response time before the short
Given the 5V VGATE, the RGATE = 100kΩ.
protection is triggered.
QSHORT is the heat generated by the output short.
Selecting the Bootstrap Capacitor
A range of 0.047μF ~ 0.1μF capacitor is recommended for
bootstrap capacitor. And 0.1μF is used in this design.
Refer to Table 3.
For instance: VOUT = 16V, ISHORT = 20A, tSHORT = 30μs.
SOA ≥ 4.8mJ, VDS_DIS_MAX ≥ 16V.
The CSD25404Q3-20V P-Channel Power MOSFET is
recommended for this design example.
VCC Capacitor
The value of VCC capacitor should be at least 10 times
larger than the value of CBOOT. A 1μF ~ 2.2μF capacitor
value range is recommended for VCC capacitor. A value
of 2.2μF is recommended in this example, please see
Table 3.
To reduce the turn-on speed, an additional capacitor is
recommended to put between the gate and source of
the external MOSFET.
VTH_P−MOS ×CGS _P−MOS
(6)
tON_P−MOS
=
IDIS _P−MOS
Layout Guidelines
where:
As for all switching power supplies, especially those
high frequency and high current ones, layout is an
important design step. Poor layout could result in
system instability, EMI failure, and device damage.
Therefore, use wide and short traces for high current
paths. Thus, place input capacitor as close to the VIN
pin and GND pin as possible. If possible, choose higher
capacitance value for CIN. The SW pin carries high
current with fast rising and falling edges, therefore, all
connections to the SW pin should be kept as short and
wide as possible. The output capacitor COUT should be
put close to VOUT. It is also beneficial to have the
ground of COUT close to the GND pin since there is large
ground return current flowing between them. Sensitive
signals like FB, COMP traces must be placed away
from SW trace. The ground of these signals should be
connected to GND pin and separated with power
ground.
tON_P-MOS is the on-time of external MOSFET.
VTH_P-MOS is the gate threshold of external MOSFET.
CGS_P-MOS is the total gate capacitance between gate
and source of external MOSFET (including the
self-gate-source capacitance of the MOSFET).
IDIS_P-MOS is a typical 55μA discharge current inside
the device.
Given VTH = 1.5V and CGS_P-MOS = 10nF, tON_P-MOS is
about 300μs. It should be noted that the maximum
turn-on time should be no more than 3ms, and the
maximum capacitance CGS_P-MOS should be less than
100nF. That is to say, if the disconnected MOSFET
could not be turned on within the 3ms, the device would
not start up normally.
When selects the gate resistor, the gate-source voltage
of the external MOSFET should be referenced.
SG Micro Corp
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JUNE 2022
16
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
APPLICATION INFORMATION (continued)
System Examples
SGM6612A (14V Output, 2.7V to 4.4V Input)
The schematic of a typical application circuit that is used for 14V output voltage from 2.7V to 4.4V input voltage of
SGM6612A is given in Figure 8. The inductor has a minimum of 1.8μH for the 14V output.
CBOOT
0.1μF
L
BOOT
1.8μH
VIN
M1
VOUT2
SW
VIN
VOUT
COUT2_1
22μF
COUT2_2
22μF
COUT2_3
22μF
RUP
860kΩ
CIN1
22μF
COUT1_1
10μF
COUT1_2
10μF
RGATE
150kΩ
CGATE
22nF
VCC
DISDRV
FB
CVCC
RDOWN
2.2μF
80.6kΩ
SGM6612A
EN
COMP
FREQ
RFREQ
CC
6.8nF
348kΩ
CP
10pF
RC
ILIM
15kΩ
RLIM
51.1kΩ
AGND
PGND
Figure 8. SGM6612A 14V Output Voltage from 2.7V to 4.4V Input Voltage
SGM6612A without Load Disconnect Function
The schematic of a typical application circuit that is used for 16V output voltage without load disconnect function of
SGM6612A is given in Figure 9. Without the load disconnect MOSFET, the device has a simplified design and
minimized external components.
CBOOT
0.1μF
L
BOOT
3.3μH
VIN
VOUT
SW
VIN
VOUT
COUT2_1
22μF
COUT2_2
22μF
COUT2_3
22μF
RUP
1MΩ
CIN1
COUT1_1
10μF
22μF
VCC
CVCC
2.2μF
DISDRV
FB
RDOWN
80.6kΩ
SGM6612A
EN
COMP
FREQ
RFREQ
CC
6.8nF
348kΩ
CP
10pF
RC
ILIM
15kΩ
RLIM
51.1kΩ
AGND
PGND
Figure 9. SGM6612A 16V Output Voltage without Load Disconnect Function
SG Micro Corp
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JUNE 2022
17
20V, 10A Fully-Integrated Synchronous Boost
Converter with Load Disconnect Control
SGM6612A
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
JUNE 2022 ‒ REV.A.2 to REV.A.3
Page
Updated Detailed Description and Application Information sections....................................................................................................... 10, 11, 13
MAY 2021 ‒ REV.A.1 to REV.A.2
Page
Updated Electrical Characteristics section...........................................................................................................................................................4
DECEMBER 2020 ‒ REV.A to REV.A.1
Page
Updated Package/Ordering Information section...................................................................................................................................................2
Changes from Original (OCTOBER 2020) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
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JUNE 2022
18
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TQFN-3×3.5-13L
PIN 1#
b
N13
N1
e
E
N9
N5
N8
N6
e1
L
b
D
BOTTOM VIEW
TOP VIEW
0.7
0.25
A1
N1
N13
0.25
3.4
0.5
N9
N5
N6
N8
A2
0.55
3.2
A
RECOMMENDED LAND PATTERN (Unit: mm)
SIDE VIEW
Dimensions In Millimeters
Symbol
MIN
0.700
0.000
MOD
0.750
MAX
0.800
0.050
A
A1
A2
b
0.020
0.203 REF
0.250
0.200
3.450
2.950
0.450
0.300
3.550
3.050
0.550
D
3.500
E
3.000
L
0.500
e
0.500 BSC
0.550 BSC
e1
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00166.001
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PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TQFN-3×3.5-13L
13″
12.4
3.30
3.80
1.05
4.0
8.0
2.0
12.0
Q2
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
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TX20000.000
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