SGM6623 [SGMICRO]
4.4A, Miniature Boost Converter;型号: | SGM6623 |
厂家: | Shengbang Microelectronics Co, Ltd |
描述: | 4.4A, Miniature Boost Converter |
文件: | 总14页 (文件大小:859K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SGM6623
4.4A, Miniature Boost Converter
GENERAL DESCRIPTION
FEATURES
The SGM6623 is a general-purpose miniature Boost
DC/DC switching regulator with high efficiency for
battery backup and standby power systems. The
acceptable input voltage range of 0.8V to 12V can be
converted to a regulated 3.3V to 13V output voltage with
efficiency as high as 90%. SGM6623 can be used as
backup charger for systems with 1- to 4-cell batteries. It
operates at a 600kHz (TYP) switching frequency, allowing
the use of small and low-profile inductor for compact
design. It also has several built-in protection features,
such as cycle-by-cycle over-current limit, soft-start,
thermal shutdown and open loop over-voltage protection.
● 0.8V to 12V Input Voltage Range
● 3.3V to 13V Wide Output Voltage Range
● 4.4A Current Limited Integrated Switch
● 47μA (TYP) Quiescent Current (to VS Pin)
● 0.4μA (TYP) Supply Current in Shutdown
● Up to 90% Efficiency
● 600kHz (TYP) Fixed Switching Frequency with
Pulse Skipping at Light Loads
● Enable Input Pin
● Built-in Soft-Start Function
● Open Loop Over-Voltage Protection
● Available in a Green SOT-23-6 Package
The SGM6623 is available in a Green SOT-23-6 package.
APPLICATIONS
Mobile Phones
Portable Equipment
Hand-Held Instruments
1-, 2-, 3- or 4-Cell Battery Systems
TYPICAL APPLICATION
VIN
0.8V to 12V
L
VOUT
12V/200mA
VIN
0.8V to 12V
L
VOUT
12V/200mA
D1
D1
3.3μH
3.3μH
CIN
COUT
CIN
COUT
4.7μF
100μF
4.7μF
100μF
SW
VS
SW
FB
ON
EN
VS
OFF
ON
R1
88.7kΩ
R1
88.7kΩ
EN SGM6623
SGM6623
OFF
VVS
3V to 12V
FB
CVS
1μF
R2
10kΩ
R2
10kΩ
GND
GND
Figure 1. Typical Application Circuits
SG Micro Corp
OCTOBER 2022 – REV. A. 4
www.sg-micro.com
SGM6623
4.4A, Miniature Boost Converter
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM6623
SOT-23-6
SGM6623YN6G/TR
CB4XX
Tape and Reel, 3000
-40℃ to +85℃
MARKING INFORMATION
NOTE: XX = Date Code.
YYY X X
Date Code - Week
Date Code - Year
Serial Number
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Voltages on EN and FB ....................................... -0.3V to 6V
Voltages on SW and VS ................................. -0.3V to 14.5V
Package Thermal Resistance
SOT-23-6, θJA .......................................................... 190℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range........................-65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
HBM.............................................................................3000V
CDM ............................................................................1000V
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
RECOMMENDED OPERATING CONDITIONS
Operating Ambient Temperature Range........-40℃ to +85℃
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
OCTOBER 2022
2
SGM6623
4.4A, Miniature Boost Converter
PIN CONFIGURATION
(TOP VIEW)
SW
GND
FB
1
2
3
6
5
4
NC
VS
EN
SOT-23-6
PIN DESCRIPTION
PIN
1
NAME
SW
I/O
FUNCTION
I
G
I
Switching Node of the Device. Connect to the input source through the Boost inductor.
Ground.
2
GND
FB
3
Feedback input to the error amplifier for regulated output.
Enable Pin of the Boost Regulator. Logic low disables the chip and logic high enables it. It needs to
be pulled up to enable the device, otherwise the weak internal pull-down will disable it. Two levels
logic or analog bias with edge slope rate > 10V/ms is desired for stable on/off transition.
4
EN
I
I
5
6
VS
NC
Supply Power Input for Internal Circuit. Connect to the output of converter.
—
Not connected. Recommend to solder it onto ground plane for better thermal dissipation.
NOTE: I = Input, O = Output, G = Ground.
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OCTOBER 2022
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SGM6623
4.4A, Miniature Boost Converter
ELECTRICAL CHARACTERISTICS
(VVS = 3.6V, VEN = 3.6V. Full = -40℃ to +85℃, typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
0.8
3
TYP
MAX
UNITS
Supply Current
Sustainable Input Voltage Range
Minimum VS Voltage for Start-up
VS Input Voltage Range
VIN
The VS pin connects to output
12
V
V
+25℃
+25℃
+25℃
Full
VVS_START_MIN The VS pin connects to output
1.5
47
VVS
IQ
VIN is in 0.8V to 12.5V range
No switching, no load
13
65
1
V
Operating Quiescent Current into VS
μA
+25℃
Full
Shutdown Current
ISHDN
VEN = GND
μA
1.5
Enable and Reference Control
EN Logic High Voltage
VIH
VIL
Full
Full
Full
1.1
400
V
V
EN Logic Low Voltage
0.3
EN Internal Pull-Down Resistor
Voltage and Current Control
Voltage Feedback Regulation Voltage
Voltage Feedback Input Bias Current
Switching Frequency
REN
570
740
kΩ
VREF
IFB
Full
Full
1.177
480
1.205
1.231
170
V
nA
kHz
%
VFB = 1.3V
fSW
Full
600
96
720
Maximum Duty Cycle
DMAX
VOVP
+25℃
+25℃
Over-Voltage Protection Threshold
13.3
13.8
14.3
V
Over-Voltage Protection Threshold
Hysteresis
VOVP_HYS
0.43
V
+25℃
Power Switch
70
90
110
1
+25℃
Full
N-Channel MOSFET On-Resistance
RDSON
VVS = 3.6V
mΩ
+25℃
Full
N-Channel Leakage Current
ILN_NFET
ILIM
VSW = 13.2V, VEN = 0V
μA
1.5
5.25
N-Channel MOSFET Current Limit
Thermal Shutdown
3.65
4.4
A
+25℃
Thermal Shutdown Threshold
Thermal Shutdown Threshold Hysteresis
TSHDN
THYS
165
15
℃
℃
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SGM6623
4.4A, Miniature Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS
TJ = +25℃, CIN = 4.7μF, COUT = 100μF, L = 3.3μH and VVS = VOUT, unless otherwise noted.
PWM Switching Operation
Skip-Cycle Switching Operation
VSW
VSW
AC Coupled
AC Coupled
VOUT
VOUT
IL
IL
VIN = 1.8V, VOUT = 12V, ILOAD = 250mA
VIN = 1.8V, VOUT = 12V, ILOAD = 100μA
Time (800ns/div)
Time (1ms/div)
DCM Switching Operation
Load Transient Response
AC Coupled
VSW
VOUT
AC Coupled
VOUT
IL
ILOAD
VIN = 1.8V, VOUT = 12V, ILOAD = 50mA-100mA (0.1A/μs)
VIN = 1.8V, VOUT = 12V, ILOAD = 25mA
Time (800ns/div)
Time (1ms/div)
Start-up
VIN Ramp Response
VIN = 6V-0V, VOUT = 12V, ILOAD = 200mA,
tF = 200ms, CIN = 44μF
VEN
VIN
VOUT
VOUT
IL
IL
VIN = 1.8V, VOUT = 12V, ILOAD = 100mA
Time (500μs/div)
Time (50ms/div)
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SGM6623
4.4A, Miniature Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TJ = +25℃, CIN = 4.7μF, COUT = 100μF, L = 3.3μH and VVS = VOUT, unless otherwise noted.
Output Voltage vs. Input Voltage
Output Voltage vs. Output Current
12.10
12.05
12.00
11.95
11.90
11.85
11.80
11.970
11.965
11.960
11.955
11.950
11.945
11.940
11.935
11.930
11.925
11.920
TA = -40℃
TA = +25℃
TA = +85℃
ILOAD = 100mA
VIN = 1.8V
0 20 40 60 80 100 120 140 160 180 200
1
2
3
4
5
6
7
8
9
10 11
Input Voltage (V)
Output Current (mA)
Efficiency vs. Output Current
Efficiency vs. Output Current
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 1.8V
VIN = 1.8V
V
V
IN = 3.3V
IN = 5V
V
V
IN = 3.3V
IN = 5V
VOUT = 9V
VOUT = 12V
0.001
0.001
0.01
0.1
1
0.01
0.1
1
Output Current (A)
Output Current (A)
Efficiency vs. Output Current
Supply Power Input Current vs. Output Current
VVS = 3.3V
100
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
90
80
70
60
50
40
30
20
10
0
V
OUT = 12V
VIN = 1.8V
V
V
V
IN = 3.3V
IN = 3.8V
IN = 4.2V
VIN = 1.8V
V
V
IN = 3.3V
IN = 4.2V
VOUT = 5V
0.1
1
10
100
1000
0.001
0.01
0.1
1
Output Current (mA)
Output Current (A)
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SGM6623
4.4A, Miniature Boost Converter
FUNCTIONAL BLOCK DIAGRAM
COUT
R1
D1
R2
L
SW
FB
VS
Band Gap
Error
Amplifer
INPUT
EAOUT
CIN
PWM Control
EN
Soft-Start
570kΩ
Pull-Down
Resistor
+
Ramp
Generator
Current
Sensor
-
+
Oscillator
GND
Figure 2. Block Diagram
DETAILED DESCRIPTION
cycle which ultimately regulates the output voltage to
the desired voltage. At the beginning of each clock
cycle, the PWM comparator turns on the low-side
MOSFET to ramp up the inductor current. As the
inductor current reaches the level set by the error
amplifier’s output, the low-side MOSFET turns off,
which causes the external Schottky diode to be forward
biased to ramp down the inductor current that delivers
the energy to the load as well as replenishes the output
capacitor.
Operation
The SGM6623 is a miniature Boost converter with
integrated low-side MOSFET switch, which is capable
of delivering up to 13V output voltages that are typically
used in battery operated portable devices. Current
mode PWM control is used to regulate the output
voltage as shown in Figure 2. The device has a fixed
switching frequency of 600kHz (TYP). A slope ramp is
added to the sensed peak current ramp to avoid
sub-harmonic oscillation at operation duty cycle higher
than 40%. The error amplifier compares the FB pin
voltage with an internal reference signal to provide an
error signal for the PWM comparator to adjust the duty
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SGM6623
4.4A, Miniature Boost Converter
DETAILED DESCRIPTION (continued)
The SGM6623 monitors the voltage at the SW pin
during each switching cycle. The circuitry turns off the
switch FET when the SW voltage exceeds the OVP
threshold. The switch FET remains in shutdown mode
until SW pin voltage is lower than 13.37V for 100ms.
The OVP threshold of SGM6623 is 13.8V.
Soft-Start
The SGM6623 implements the internal soft-start
feature to reduce the inrush current drawn during
start-up. When logic high is applied on the EN pin, the
device starts operation and ramps up the reference
voltage to 1.205V in 2.5ms. The 2.5ms soft-start time
ensures the output voltage to ramp slowly, which
effectively reduces the inrush current during start-up.
Pulse-Skipping Mode
The SGM6623 integrates a pulse-skipping mode at the
light load. When a light load condition occurs, the
EAOUT voltage naturally decreases and reduces the
peak current. When the EAOUT voltage further goes
down with the load lowered and reaches the pre-set low
threshold, the output of the error amplifier is clamped at
this threshold and does not go down any more. If the
load is further lowered, the output voltage of SGM6623
exceeds the nominal voltage and the device skips the
switching cycles. The pulse-skipping mode reduces the
switching losses and improves efficiency at the light
load condition by reducing the average switching
frequency.
As shown in Figure 1, the VS pin is the power input for
the device itself and is powered from the converter
output or a voltage source in proper range. When the
VS pin is powered from the converter output, before
enabling the chip, the bias to VS comes from the input
through the inductor and Schottky diode. The
SGM6623 can start up from input voltage as low as
1.5V. During start-up, the controller switches the
N-channel MOSFET continuously until the VOUT
reaches 2.7V. When 2.7V is reached, the normal Boost
regulator feedback takes over the control. Once the
device is in the regulated state, it can work when the
input voltage drops to 0.8V.
When the VS is not self-biased with its own output but
from an independent power source, enable the device
after the VS is biased > 3V stably to avoid continuous
switching without output voltage regulation, in which the
output voltage may trigger the over-voltage protection
and hiccups to output the maximum possible voltage
decided by the OVP threshold.
Enable and Shutdown
The SGM6623 implements the EN function to turn
on/off the device. A logic signal lower than 0.3V turns
off the device. The EN pin integrates an internal 570kΩ
(TYP) pull-down resistor to prevent the device from
false turn-on when the EN pin is left floating. Apply two
levels logic or analog bias with edge slope rate >
10V/ms to enable/shutdown the device stably. Quick
toggles during the enabling may cause false
over-voltage hiccup if the bias voltage ramps slowly.
Over-Current Protection
The SGM6623 provides inherent over-current
protection. The low-side MOSFET is turned off when
the peak current reaches the current limit threshold of
4.4A (TYP), and the low-side MOSFET is not turned on
again until the next clock cycle.
Thermal Shutdown
The internal thermal shutdown protection turns off the
device when the junction temperature exceeds 165℃.
The chip will resume operation when the junction
temperature drops by at least 15℃ (TYP).
Over-Voltage Protection (OVP)
Over-voltage protection circuitry prevents IC damage
as the result of output resistor divider disconnection.
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OCTOBER 2022
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SGM6623
4.4A, Miniature Boost Converter
APPLICATION INFORMATION
DC current can be calculated by subtracting half of the
inductor ripple current from the current limit value. The
inductor ripple current is a function of the switching
frequency, inductor value and duty cycle. In summary,
the following two equations show the impact of all the
above factors on the maximum output current.
Supply to Internal Circuit
The internal circuit is biased from the VS pin. The bias
voltage could be from 3V to 12V, but not higher than the
output voltage + 1V, which could be connected to the
VOUT or to any supply rail whose voltage is in the
range as mentioned above. But when the supply rail is
less than 3V, the voltage of EN must be less than 0.3V.
When the VS pin is connected to the VOUT, a 50Ω
resistor inserted between VS and VOUT is
recommended to isolate the VS from potential voltage
1
ΔIL =
(2)
1
1
L× f
×
+
SW
VOUT + VF − V
V
IN
IN
where:
surge at the VOUT
.
∆IL = Inductor peak-to-peak ripple current.
L = Inductor value.
VF = Schottky diode forward voltage.
Program Output Voltage
The output voltage of SGM6623 is configured via a
resistive divider connected to the FB pin. Use Equation
1 to program the output voltage. R1 is the top feedback
resistor and R2 is the bottom feedback resistor.
f
V
SW = Switching frequency.
OUT = Output voltage.
VIN = Input voltage.
ΔIL
R1
R2
V × I
−
×η
or
IN
LIM
VOUT
VOUT =1.205×
+1
2
(3)
IOUT_MAX
=
VOUT
(1)
R1 = R2 ×
−1
1.205
where:
OUT_MAX = Maximum output current of the Boost converter.
LIM = Over-current limit (typically 4.4A for SGM6623).
I
I
Due to the leakage current of the resistor divider, the
resistance of R2 should be no less than 10kΩ.
Thermally stable resistors with 1% or better accuracy
and of same type are recommended for R1 and R2.
Mount them close to each other for the same thermal
η = Efficiency.
Switch Duty Cycle
The maximum duty cycle (D) of the internal power
switch in the SGM6623 is 96% (TYP). The duty cycle
and input/output voltage relationship under continuous
conduction mode (CCM) is shown in Equation 4:
variations.
VOUT
R1
VOUT − V
SGM6623
IN
(4)
D =
FB
VOUT
R2
For example, in a 5V to 12V application, the duty cycle
is almost 58.3%. Care should be taken to ensure that
the maximum duty cycle limit (96%, TYP) is not
reached.
Figure 3. Output Voltage Programming
Maximum Output Current
The SGM6623 also implements minimum on-time
switching pulse width, which is related to the minimum
duty cycle. In light load condition, the device enters
pulse-skipping mode, and the device operates with
minimum duty cycle in this mode.
For the Boost converter, the maximum input current is
generally limited by the over-current limit. And the
maximum input power (for a given input voltage) is also
limited by the over-current limit. Therefore, the
maximum output power is limited to the maximum input
power minus losses. So, the actual maximum output
current depends on the input current limit, input voltage,
output voltage and efficiency. The input current limit
clamps the peak inductor current. The maximum input
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SGM6623
4.4A, Miniature Boost Converter
APPLICATION INFORMATION (continued)
input voltage ripple and reduced efficiency. Large
Inductor Selection
inductors with low DCR values can offer better output
current and higher conversion efficiency. However,
smaller inductance usually provides better load
transient response. For these reasons, an inductance
with 30%~40% current ripple (of the peak load current) is
recommended.
Inductor is the most critical component in the design of
a Boost converter with SGM6623 because it affects
steady state operation, transient behavior and loop
stability (sub-harmonic oscillations). Four parameters of
the inductor must be considered in the design: nominal
inductance value, DC resistance (DCR), saturation
current (or 20%~30% inductance-drop currents) and
maximum RMS current (DC plus AC) for a certain
temperature rise.
SGM6623 implements built-in slope compensation to
prevent sub-harmonic oscillation. Too small inductance
might result in insufficient slope compensation, which
ultimately results in unstable operation. Therefore, the
designer must verify the selected inductor for the
application with the maximum and minimum margins of
the input and output voltages if it is not chosen based
on the recommended values.
Inductance and saturation current of an inductor are the
two most important criterions for the inductor selection.
It is recommended to choose a peak-to-peak ripple
current (given by Equation 2) that is in the 30%~40%
range of the maximum DC current of the inductor in the
application. Such ripple factor usually gives a good
compromise between inductor core and converter
conduction losses (due to the ac ripple) and the
inductor size. Inductor DC current can be calculated
based on input-output power balance as given in
Equation 5:
Schottky Diode Selection
The external rectification diode selection is critical to
ensure device performance. A high speed and low
forward voltage drop diode is recommended to improve
efficiency. The average current rating of the diode
should be higher than the peak load. The breakdown
voltage of the selected diode should be higher than the
maximum output voltage (13V) with margin. To achieve
smaller size and less cost, Schottky diodes with lower
rated voltages can be used. For example, a 12V output
application requires a minimal of 20V breakdown
voltage.
VOUT ×IOUT
(5)
I
=
IN_DC
V ×η
IN
Typically, the inductor value can have a ±20% initial
tolerance. On top of that the inductance may drop
another 20%~30% when the inductor current
approaches to the maximum (saturation or 20%~30%
drops) at maximum current. This drop is usually given
by manufacturer. Note that the powder iron core
inductors do not have a sharp saturation like ferrite
inductors and show a gradual inductance drop even if
the current peaks are much higher than their maximum
rated currents, which is an important advantage. The
manufacturer specifies the 20%~30% drop current level
for them instead of saturation. However, they are
usually slightly bigger than the similar ferrite inductor.
Finally, the total RMS current of the inductor must be
limited to keep the total inductor losses low and prevent
excessive temperature rise in the inductor. The DCR of
an inductor may increase around 50% if the
temperature is increased from +25℃ to +125℃. Such
temperature rises need to be considered in the
evaluation of the I2R losses of the inductor.
Input and Output Capacitor Selection
The output capacitors of Boost converter dictate the
output voltage ripple and load transient response.
Equation 6 is used to estimate the necessary
capacitance to achieve desired output voltage ripple,
where VRIPPLE is the peak-to-peak output ripple.
V
− V ×I
(
=
)
OUT
IN
OUT
(6)
COUT
VOUT × fSW × VRIPPLE
The additional output ripple component caused by ESR
can be given by Equation 7.
(7)
VRIPPLE_ESR = ΔIL ×ESR
For ceramic capacitors, the ESR is usually small and
VRIPPLE_ESR can be neglected, but for tantalum or
electrolytic capacitors, the capacitive and ESR
components of the ripple must be added to estimate the
total output voltage ripple.
Using an inductor with a smaller inductance in a Boost
converter results in having discontinuous conduction
mode (DCM) range extended to the higher load
currents due to larger ripple. Small inductance can also
result in reduced maximum output current, increased
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SGM6623
4.4A, Miniature Boost Converter
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
OCTOBER 2022 ‒ REV.A.3 to REV.A.4
Page
Updated Detailed Description and Application Information sections....................................................................................................... 7, 8, 9, 10
SEPTEMBER 2021 ‒ REV.A.2 to REV.A.3
Page
Updated Pin Description section..........................................................................................................................................................................3
JULY 2020 ‒ REV.A.1 to REV.A.2
Page
Updated switching frequency.......................................................................................................................................................................1, 4, 7
FEBRUARY 2020 ‒ REV.A to REV.A.1
Page
Updated Pin Description section..........................................................................................................................................................................3
Updated Detailed Description section..................................................................................................................................................................8
Changes from Original (SEPTEMBER 2019) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
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PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-6
D
e1
e
E1
E
2.59
0.99
b
0.95
0.69
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
0.2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.049
0.004
0.045
0.020
0.008
0.119
0.067
0.116
A
A1
A2
b
1.050
0.000
1.050
0.300
0.100
2.820
1.500
2.650
1.250
0.100
1.150
0.500
0.200
3.020
1.700
2.950
0.041
0.000
0.041
0.012
0.004
0.111
0.059
0.104
c
D
E
E1
e
0.950 BSC
1.900 BSC
0.037 BSC
0.075 BSC
e1
L
0.300
0°
0.600
8°
0.012
0°
0.024
8°
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00034.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
SOT-23-6
7″
9.5
3.23
3.17
1.37
4.0
4.0
2.0
8.0
Q3
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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