SGM6623 [SGMICRO]

4.4A, Miniature Boost Converter;
SGM6623
型号: SGM6623
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

4.4A, Miniature Boost Converter

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SGM6623  
4.4A, Miniature Boost Converter  
GENERAL DESCRIPTION  
FEATURES  
The SGM6623 is a general-purpose miniature Boost  
DC/DC switching regulator with high efficiency for  
battery backup and standby power systems. The  
acceptable input voltage range of 0.8V to 12V can be  
converted to a regulated 3.3V to 13V output voltage with  
efficiency as high as 90%. SGM6623 can be used as  
backup charger for systems with 1- to 4-cell batteries. It  
operates at a 600kHz (TYP) switching frequency, allowing  
the use of small and low-profile inductor for compact  
design. It also has several built-in protection features,  
such as cycle-by-cycle over-current limit, soft-start,  
thermal shutdown and open loop over-voltage protection.  
0.8V to 12V Input Voltage Range  
3.3V to 13V Wide Output Voltage Range  
4.4A Current Limited Integrated Switch  
47μA (TYP) Quiescent Current (to VS Pin)  
0.4μA (TYP) Supply Current in Shutdown  
Up to 90% Efficiency  
600kHz (TYP) Fixed Switching Frequency with  
Pulse Skipping at Light Loads  
Enable Input Pin  
Built-in Soft-Start Function  
Open Loop Over-Voltage Protection  
Available in a Green SOT-23-6 Package  
The SGM6623 is available in a Green SOT-23-6 package.  
APPLICATIONS  
Mobile Phones  
Portable Equipment  
Hand-Held Instruments  
1-, 2-, 3- or 4-Cell Battery Systems  
TYPICAL APPLICATION  
VIN  
0.8V to 12V  
L
VOUT  
12V/200mA  
VIN  
0.8V to 12V  
L
VOUT  
12V/200mA  
D1  
D1  
3.3μH  
3.3μH  
CIN  
COUT  
CIN  
COUT  
4.7μF  
100μF  
4.7μF  
100μF  
SW  
VS  
SW  
FB  
ON  
EN  
VS  
OFF  
ON  
R1  
88.7kΩ  
R1  
88.7kΩ  
EN SGM6623  
SGM6623  
OFF  
VVS  
3V to 12V  
FB  
CVS  
1μF  
R2  
10kΩ  
R2  
10kΩ  
GND  
GND  
Figure 1. Typical Application Circuits  
SG Micro Corp  
OCTOBER 2022 – REV. A. 4  
www.sg-micro.com  
 
SGM6623  
4.4A, Miniature Boost Converter  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM6623  
SOT-23-6  
SGM6623YN6G/TR  
CB4XX  
Tape and Reel, 3000  
-40to +85℃  
MARKING INFORMATION  
NOTE: XX = Date Code.  
YYY X X  
Date Code - Week  
Date Code - Year  
Serial Number  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
OVERSTRESS CAUTION  
ABSOLUTE MAXIMUM RATINGS  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
Voltages on EN and FB ....................................... -0.3V to 6V  
Voltages on SW and VS ................................. -0.3V to 14.5V  
Package Thermal Resistance  
SOT-23-6, θJA .......................................................... 190/W  
Junction Temperature .................................................+150℃  
Storage Temperature Range........................-65to +150℃  
Lead Temperature (Soldering, 10s) ............................+260℃  
ESD Susceptibility  
ESD SENSITIVITY CAUTION  
HBM.............................................................................3000V  
CDM ............................................................................1000V  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
RECOMMENDED OPERATING CONDITIONS  
Operating Ambient Temperature Range........-40to +85℃  
Operating Junction Temperature Range......-40to +125℃  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
2
SGM6623  
4.4A, Miniature Boost Converter  
PIN CONFIGURATION  
(TOP VIEW)  
SW  
GND  
FB  
1
2
3
6
5
4
NC  
VS  
EN  
SOT-23-6  
PIN DESCRIPTION  
PIN  
1
NAME  
SW  
I/O  
FUNCTION  
I
G
I
Switching Node of the Device. Connect to the input source through the Boost inductor.  
Ground.  
2
GND  
FB  
3
Feedback input to the error amplifier for regulated output.  
Enable Pin of the Boost Regulator. Logic low disables the chip and logic high enables it. It needs to  
be pulled up to enable the device, otherwise the weak internal pull-down will disable it. Two levels  
logic or analog bias with edge slope rate > 10V/ms is desired for stable on/off transition.  
4
EN  
I
I
5
6
VS  
NC  
Supply Power Input for Internal Circuit. Connect to the output of converter.  
Not connected. Recommend to solder it onto ground plane for better thermal dissipation.  
NOTE: I = Input, O = Output, G = Ground.  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
3
 
SGM6623  
4.4A, Miniature Boost Converter  
ELECTRICAL CHARACTERISTICS  
(VVS = 3.6V, VEN = 3.6V. Full = -40to +85, typical values are at TJ = +25, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
0.8  
3
TYP  
MAX  
UNITS  
Supply Current  
Sustainable Input Voltage Range  
Minimum VS Voltage for Start-up  
VS Input Voltage Range  
VIN  
The VS pin connects to output  
12  
V
V
+25  
+25℃  
+25℃  
Full  
VVS_START_MIN The VS pin connects to output  
1.5  
47  
VVS  
IQ  
VIN is in 0.8V to 12.5V range  
No switching, no load  
13  
65  
1
V
Operating Quiescent Current into VS  
μA  
+25℃  
Full  
Shutdown Current  
ISHDN  
VEN = GND  
μA  
1.5  
Enable and Reference Control  
EN Logic High Voltage  
VIH  
VIL  
Full  
Full  
Full  
1.1  
400  
V
V
EN Logic Low Voltage  
0.3  
EN Internal Pull-Down Resistor  
Voltage and Current Control  
Voltage Feedback Regulation Voltage  
Voltage Feedback Input Bias Current  
Switching Frequency  
REN  
570  
740  
kΩ  
VREF  
IFB  
Full  
Full  
1.177  
480  
1.205  
1.231  
170  
V
nA  
kHz  
%
VFB = 1.3V  
fSW  
Full  
600  
96  
720  
Maximum Duty Cycle  
DMAX  
VOVP  
+25℃  
+25℃  
Over-Voltage Protection Threshold  
13.3  
13.8  
14.3  
V
Over-Voltage Protection Threshold  
Hysteresis  
VOVP_HYS  
0.43  
V
+25℃  
Power Switch  
70  
90  
110  
1
+25℃  
Full  
N-Channel MOSFET On-Resistance  
RDSON  
VVS = 3.6V  
mΩ  
+25℃  
Full  
N-Channel Leakage Current  
ILN_NFET  
ILIM  
VSW = 13.2V, VEN = 0V  
μA  
1.5  
5.25  
N-Channel MOSFET Current Limit  
Thermal Shutdown  
3.65  
4.4  
A
+25℃  
Thermal Shutdown Threshold  
Thermal Shutdown Threshold Hysteresis  
TSHDN  
THYS  
165  
15  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
4
SGM6623  
4.4A, Miniature Boost Converter  
TYPICAL PERFORMANCE CHARACTERISTICS  
TJ = +25, CIN = 4.7μF, COUT = 100μF, L = 3.3μH and VVS = VOUT, unless otherwise noted.  
PWM Switching Operation  
Skip-Cycle Switching Operation  
VSW  
VSW  
AC Coupled  
AC Coupled  
VOUT  
VOUT  
IL  
IL  
VIN = 1.8V, VOUT = 12V, ILOAD = 250mA  
VIN = 1.8V, VOUT = 12V, ILOAD = 100μA  
Time (800ns/div)  
Time (1ms/div)  
DCM Switching Operation  
Load Transient Response  
AC Coupled  
VSW  
VOUT  
AC Coupled  
VOUT  
IL  
ILOAD  
VIN = 1.8V, VOUT = 12V, ILOAD = 50mA-100mA (0.1A/μs)  
VIN = 1.8V, VOUT = 12V, ILOAD = 25mA  
Time (800ns/div)  
Time (1ms/div)  
Start-up  
VIN Ramp Response  
VIN = 6V-0V, VOUT = 12V, ILOAD = 200mA,  
tF = 200ms, CIN = 44μF  
VEN  
VIN  
VOUT  
VOUT  
IL  
IL  
VIN = 1.8V, VOUT = 12V, ILOAD = 100mA  
Time (500μs/div)  
Time (50ms/div)  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
5
SGM6623  
4.4A, Miniature Boost Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
TJ = +25, CIN = 4.7μF, COUT = 100μF, L = 3.3μH and VVS = VOUT, unless otherwise noted.  
Output Voltage vs. Input Voltage  
Output Voltage vs. Output Current  
12.10  
12.05  
12.00  
11.95  
11.90  
11.85  
11.80  
11.970  
11.965  
11.960  
11.955  
11.950  
11.945  
11.940  
11.935  
11.930  
11.925  
11.920  
TA = -40℃  
TA = +25℃  
TA = +85℃  
ILOAD = 100mA  
VIN = 1.8V  
0 20 40 60 80 100 120 140 160 180 200  
1
2
3
4
5
6
7
8
9
10 11  
Input Voltage (V)  
Output Current (mA)  
Efficiency vs. Output Current  
Efficiency vs. Output Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VIN = 1.8V  
VIN = 1.8V  
V
V
IN = 3.3V  
IN = 5V  
V
V
IN = 3.3V  
IN = 5V  
VOUT = 9V  
VOUT = 12V  
0.001  
0.001  
0.01  
0.1  
1
0.01  
0.1  
1
Output Current (A)  
Output Current (A)  
Efficiency vs. Output Current  
Supply Power Input Current vs. Output Current  
VVS = 3.3V  
100  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
OUT = 12V  
VIN = 1.8V  
V
V
V
IN = 3.3V  
IN = 3.8V  
IN = 4.2V  
VIN = 1.8V  
V
V
IN = 3.3V  
IN = 4.2V  
VOUT = 5V  
0.1  
1
10  
100  
1000  
0.001  
0.01  
0.1  
1
Output Current (mA)  
Output Current (A)  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
6
SGM6623  
4.4A, Miniature Boost Converter  
FUNCTIONAL BLOCK DIAGRAM  
COUT  
R1  
D1  
R2  
L
SW  
FB  
VS  
Band Gap  
Error  
Amplifer  
INPUT  
EAOUT  
CIN  
PWM Control  
EN  
Soft-Start  
570kΩ  
Pull-Down  
Resistor  
+
Ramp  
Generator  
Current  
Sensor  
-
+
Oscillator  
GND  
Figure 2. Block Diagram  
DETAILED DESCRIPTION  
cycle which ultimately regulates the output voltage to  
the desired voltage. At the beginning of each clock  
cycle, the PWM comparator turns on the low-side  
MOSFET to ramp up the inductor current. As the  
inductor current reaches the level set by the error  
amplifier’s output, the low-side MOSFET turns off,  
which causes the external Schottky diode to be forward  
biased to ramp down the inductor current that delivers  
the energy to the load as well as replenishes the output  
capacitor.  
Operation  
The SGM6623 is a miniature Boost converter with  
integrated low-side MOSFET switch, which is capable  
of delivering up to 13V output voltages that are typically  
used in battery operated portable devices. Current  
mode PWM control is used to regulate the output  
voltage as shown in Figure 2. The device has a fixed  
switching frequency of 600kHz (TYP). A slope ramp is  
added to the sensed peak current ramp to avoid  
sub-harmonic oscillation at operation duty cycle higher  
than 40%. The error amplifier compares the FB pin  
voltage with an internal reference signal to provide an  
error signal for the PWM comparator to adjust the duty  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
7
 
SGM6623  
4.4A, Miniature Boost Converter  
DETAILED DESCRIPTION (continued)  
The SGM6623 monitors the voltage at the SW pin  
during each switching cycle. The circuitry turns off the  
switch FET when the SW voltage exceeds the OVP  
threshold. The switch FET remains in shutdown mode  
until SW pin voltage is lower than 13.37V for 100ms.  
The OVP threshold of SGM6623 is 13.8V.  
Soft-Start  
The SGM6623 implements the internal soft-start  
feature to reduce the inrush current drawn during  
start-up. When logic high is applied on the EN pin, the  
device starts operation and ramps up the reference  
voltage to 1.205V in 2.5ms. The 2.5ms soft-start time  
ensures the output voltage to ramp slowly, which  
effectively reduces the inrush current during start-up.  
Pulse-Skipping Mode  
The SGM6623 integrates a pulse-skipping mode at the  
light load. When a light load condition occurs, the  
EAOUT voltage naturally decreases and reduces the  
peak current. When the EAOUT voltage further goes  
down with the load lowered and reaches the pre-set low  
threshold, the output of the error amplifier is clamped at  
this threshold and does not go down any more. If the  
load is further lowered, the output voltage of SGM6623  
exceeds the nominal voltage and the device skips the  
switching cycles. The pulse-skipping mode reduces the  
switching losses and improves efficiency at the light  
load condition by reducing the average switching  
frequency.  
As shown in Figure 1, the VS pin is the power input for  
the device itself and is powered from the converter  
output or a voltage source in proper range. When the  
VS pin is powered from the converter output, before  
enabling the chip, the bias to VS comes from the input  
through the inductor and Schottky diode. The  
SGM6623 can start up from input voltage as low as  
1.5V. During start-up, the controller switches the  
N-channel MOSFET continuously until the VOUT  
reaches 2.7V. When 2.7V is reached, the normal Boost  
regulator feedback takes over the control. Once the  
device is in the regulated state, it can work when the  
input voltage drops to 0.8V.  
When the VS is not self-biased with its own output but  
from an independent power source, enable the device  
after the VS is biased > 3V stably to avoid continuous  
switching without output voltage regulation, in which the  
output voltage may trigger the over-voltage protection  
and hiccups to output the maximum possible voltage  
decided by the OVP threshold.  
Enable and Shutdown  
The SGM6623 implements the EN function to turn  
on/off the device. A logic signal lower than 0.3V turns  
off the device. The EN pin integrates an internal 570kΩ  
(TYP) pull-down resistor to prevent the device from  
false turn-on when the EN pin is left floating. Apply two  
levels logic or analog bias with edge slope rate >  
10V/ms to enable/shutdown the device stably. Quick  
toggles during the enabling may cause false  
over-voltage hiccup if the bias voltage ramps slowly.  
Over-Current Protection  
The SGM6623 provides inherent over-current  
protection. The low-side MOSFET is turned off when  
the peak current reaches the current limit threshold of  
4.4A (TYP), and the low-side MOSFET is not turned on  
again until the next clock cycle.  
Thermal Shutdown  
The internal thermal shutdown protection turns off the  
device when the junction temperature exceeds 165.  
The chip will resume operation when the junction  
temperature drops by at least 15(TYP).  
Over-Voltage Protection (OVP)  
Over-voltage protection circuitry prevents IC damage  
as the result of output resistor divider disconnection.  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
8
SGM6623  
4.4A, Miniature Boost Converter  
APPLICATION INFORMATION  
DC current can be calculated by subtracting half of the  
inductor ripple current from the current limit value. The  
inductor ripple current is a function of the switching  
frequency, inductor value and duty cycle. In summary,  
the following two equations show the impact of all the  
above factors on the maximum output current.  
Supply to Internal Circuit  
The internal circuit is biased from the VS pin. The bias  
voltage could be from 3V to 12V, but not higher than the  
output voltage + 1V, which could be connected to the  
VOUT or to any supply rail whose voltage is in the  
range as mentioned above. But when the supply rail is  
less than 3V, the voltage of EN must be less than 0.3V.  
When the VS pin is connected to the VOUT, a 50Ω  
resistor inserted between VS and VOUT is  
recommended to isolate the VS from potential voltage  
1
ΔIL =  
(2)  
1
1
L× f  
×
+
SW  
VOUT + VF V  
V
IN  
IN  
where:  
surge at the VOUT  
.
IL = Inductor peak-to-peak ripple current.  
L = Inductor value.  
VF = Schottky diode forward voltage.  
Program Output Voltage  
The output voltage of SGM6623 is configured via a  
resistive divider connected to the FB pin. Use Equation  
1 to program the output voltage. R1 is the top feedback  
resistor and R2 is the bottom feedback resistor.  
f
V
SW = Switching frequency.  
OUT = Output voltage.  
VIN = Input voltage.  
ΔIL  
R1  
R2  
V × I  
×η  
or  
IN  
LIM  
VOUT  
VOUT =1.205×  
+1  
2
(3)  
IOUT_MAX  
=
VOUT  
(1)  
R1 = R2 ×  
1  
1.205  
where:  
OUT_MAX = Maximum output current of the Boost converter.  
LIM = Over-current limit (typically 4.4A for SGM6623).  
I
I
Due to the leakage current of the resistor divider, the  
resistance of R2 should be no less than 10kΩ.  
Thermally stable resistors with 1% or better accuracy  
and of same type are recommended for R1 and R2.  
Mount them close to each other for the same thermal  
η = Efficiency.  
Switch Duty Cycle  
The maximum duty cycle (D) of the internal power  
switch in the SGM6623 is 96% (TYP). The duty cycle  
and input/output voltage relationship under continuous  
conduction mode (CCM) is shown in Equation 4:  
variations.  
VOUT  
R1  
VOUT V  
SGM6623  
IN  
(4)  
D =  
FB  
VOUT  
R2  
For example, in a 5V to 12V application, the duty cycle  
is almost 58.3%. Care should be taken to ensure that  
the maximum duty cycle limit (96%, TYP) is not  
reached.  
Figure 3. Output Voltage Programming  
Maximum Output Current  
The SGM6623 also implements minimum on-time  
switching pulse width, which is related to the minimum  
duty cycle. In light load condition, the device enters  
pulse-skipping mode, and the device operates with  
minimum duty cycle in this mode.  
For the Boost converter, the maximum input current is  
generally limited by the over-current limit. And the  
maximum input power (for a given input voltage) is also  
limited by the over-current limit. Therefore, the  
maximum output power is limited to the maximum input  
power minus losses. So, the actual maximum output  
current depends on the input current limit, input voltage,  
output voltage and efficiency. The input current limit  
clamps the peak inductor current. The maximum input  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
9
SGM6623  
4.4A, Miniature Boost Converter  
APPLICATION INFORMATION (continued)  
input voltage ripple and reduced efficiency. Large  
Inductor Selection  
inductors with low DCR values can offer better output  
current and higher conversion efficiency. However,  
smaller inductance usually provides better load  
transient response. For these reasons, an inductance  
with 30%~40% current ripple (of the peak load current) is  
recommended.  
Inductor is the most critical component in the design of  
a Boost converter with SGM6623 because it affects  
steady state operation, transient behavior and loop  
stability (sub-harmonic oscillations). Four parameters of  
the inductor must be considered in the design: nominal  
inductance value, DC resistance (DCR), saturation  
current (or 20%~30% inductance-drop currents) and  
maximum RMS current (DC plus AC) for a certain  
temperature rise.  
SGM6623 implements built-in slope compensation to  
prevent sub-harmonic oscillation. Too small inductance  
might result in insufficient slope compensation, which  
ultimately results in unstable operation. Therefore, the  
designer must verify the selected inductor for the  
application with the maximum and minimum margins of  
the input and output voltages if it is not chosen based  
on the recommended values.  
Inductance and saturation current of an inductor are the  
two most important criterions for the inductor selection.  
It is recommended to choose a peak-to-peak ripple  
current (given by Equation 2) that is in the 30%~40%  
range of the maximum DC current of the inductor in the  
application. Such ripple factor usually gives a good  
compromise between inductor core and converter  
conduction losses (due to the ac ripple) and the  
inductor size. Inductor DC current can be calculated  
based on input-output power balance as given in  
Equation 5:  
Schottky Diode Selection  
The external rectification diode selection is critical to  
ensure device performance. A high speed and low  
forward voltage drop diode is recommended to improve  
efficiency. The average current rating of the diode  
should be higher than the peak load. The breakdown  
voltage of the selected diode should be higher than the  
maximum output voltage (13V) with margin. To achieve  
smaller size and less cost, Schottky diodes with lower  
rated voltages can be used. For example, a 12V output  
application requires a minimal of 20V breakdown  
voltage.  
VOUT ×IOUT  
(5)  
I
=
IN_DC  
V ×η  
IN  
Typically, the inductor value can have a ±20% initial  
tolerance. On top of that the inductance may drop  
another 20%~30% when the inductor current  
approaches to the maximum (saturation or 20%~30%  
drops) at maximum current. This drop is usually given  
by manufacturer. Note that the powder iron core  
inductors do not have a sharp saturation like ferrite  
inductors and show a gradual inductance drop even if  
the current peaks are much higher than their maximum  
rated currents, which is an important advantage. The  
manufacturer specifies the 20%~30% drop current level  
for them instead of saturation. However, they are  
usually slightly bigger than the similar ferrite inductor.  
Finally, the total RMS current of the inductor must be  
limited to keep the total inductor losses low and prevent  
excessive temperature rise in the inductor. The DCR of  
an inductor may increase around 50% if the  
temperature is increased from +25to +125. Such  
temperature rises need to be considered in the  
evaluation of the I2R losses of the inductor.  
Input and Output Capacitor Selection  
The output capacitors of Boost converter dictate the  
output voltage ripple and load transient response.  
Equation 6 is used to estimate the necessary  
capacitance to achieve desired output voltage ripple,  
where VRIPPLE is the peak-to-peak output ripple.  
V
V ×I  
(
=
)
OUT  
IN  
OUT  
(6)  
COUT  
VOUT × fSW × VRIPPLE  
The additional output ripple component caused by ESR  
can be given by Equation 7.  
(7)  
VRIPPLE_ESR = ΔIL ×ESR  
For ceramic capacitors, the ESR is usually small and  
VRIPPLE_ESR can be neglected, but for tantalum or  
electrolytic capacitors, the capacitive and ESR  
components of the ripple must be added to estimate the  
total output voltage ripple.  
Using an inductor with a smaller inductance in a Boost  
converter results in having discontinuous conduction  
mode (DCM) range extended to the higher load  
currents due to larger ripple. Small inductance can also  
result in reduced maximum output current, increased  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
10  
SGM6623  
4.4A, Miniature Boost Converter  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
OCTOBER 2022 ‒ REV.A.3 to REV.A.4  
Page  
Updated Detailed Description and Application Information sections....................................................................................................... 7, 8, 9, 10  
SEPTEMBER 2021 ‒ REV.A.2 to REV.A.3  
Page  
Updated Pin Description section..........................................................................................................................................................................3  
JULY 2020 ‒ REV.A.1 to REV.A.2  
Page  
Updated switching frequency.......................................................................................................................................................................1, 4, 7  
FEBRUARY 2020 ‒ REV.A to REV.A.1  
Page  
Updated Pin Description section..........................................................................................................................................................................3  
Updated Detailed Description section..................................................................................................................................................................8  
Changes from Original (SEPTEMBER 2019) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
OCTOBER 2022  
11  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
SOT-23-6  
D
e1  
e
E1  
E
2.59  
0.99  
b
0.95  
0.69  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
c
θ
A2  
0.2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
MIN  
MAX  
0.049  
0.004  
0.045  
0.020  
0.008  
0.119  
0.067  
0.116  
A
A1  
A2  
b
1.050  
0.000  
1.050  
0.300  
0.100  
2.820  
1.500  
2.650  
1.250  
0.100  
1.150  
0.500  
0.200  
3.020  
1.700  
2.950  
0.041  
0.000  
0.041  
0.012  
0.004  
0.111  
0.059  
0.104  
c
D
E
E1  
e
0.950 BSC  
1.900 BSC  
0.037 BSC  
0.075 BSC  
e1  
L
0.300  
0°  
0.600  
8°  
0.012  
0°  
0.024  
8°  
θ
NOTES:  
1. Body dimensions do not include mode flash or protrusion.  
2. This drawing is subject to change without notice.  
SG Micro Corp  
TX00034.000  
www.sg-micro.com  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
SOT-23-6  
7″  
9.5  
3.23  
3.17  
1.37  
4.0  
4.0  
2.0  
8.0  
Q3  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
7″ (Option)  
7″  
368  
442  
227  
410  
224  
224  
8
18  
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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