SGM7227 [SGMICRO]
High Speed USB 2.0 (480Mbps) DPDT Analog Switch;型号: | SGM7227 |
厂家: | Shengbang Microelectronics Co, Ltd |
描述: | High Speed USB 2.0 (480Mbps) DPDT Analog Switch 光电二极管 |
文件: | 总14页 (文件大小:728K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SGM7227
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
GENERAL DESCRIPTION
FEATURES
The SGM7227 is a DPDT (double-pole/double-throw)
analog switch. It operates from a 1.8V to 4.3V single
power supply. Each switch of the SGM7227 is
bidirectional, which can ensure that the high speed
signals have little or no attenuation at the outputs.
● Supply Voltage Range: 1.8V to 4.3V
● On-Resistance: 5Ω (TYP) at 3.0V
● High Off-Isolation: -51dB (RL = 50Ω, f = 250MHz)
● Low Crosstalk: -26dB (RL = 50Ω, f = 250MHz)
● -3dB Bandwidth: 500MHz
● Fast Switching Times at VCC = 3.3V:
tON = 20ns (TYP)
The SGM7227 features high speed, low power and
wide bandwidth. The high performances make it very
suitable for multiple applications, such as cellular
phones and computer peripherals, etc.
tOFF = 18ns (TYP)
● Break-Before-Make Switching
● Rail-to-Rail Input and Output Operation
● Power-Off and Power-On Protections
● -40℃ to +85℃ Operating Temperature Range
● Available in Green UTQFN-1.8×1.4-10L and
MSOP-10 Packages
The SGM7227 has a power-off protection. It can
prevent accidental signal leakage and ensure system
reliability under power-down and over-voltage
conditions. In addition, the device is capable of
withstanding a VBUS short to D+ or D- when the device
is either powered on or powered off because of the
special circuitry on the D+/D- pins.
APPLICATIONS
Cellular Phones
SGM7227 is available in Green UTQFN-1.8×1.4-10L
and MSOP-10 packages. It operates over an ambient
temperature range of -40℃ to +85℃.
Digital Cameras
Portable Equipment
Computer Peripherals
Battery-Powered Systems
Routes Signals for USB 2.0 Full-Speed
SG Micro Corp
MAY 2022 – REV. B. 1
www.sg-micro.com
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM7227
YMS10
XXXXX
MSOP-10
SGM7227YMS10G/TR
SGM7227YUWQ10G/TR
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +85℃
-40℃ to +85℃
SGM7227
UTQFN-1.8×1.4-10L
7227
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
MSOP-10
X X X X X
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
VCC to GND............................................................0V to 4.6V
Analog, Digital Voltage Range.............. -0.3V to (VCC + 0.3V)
Continuous Current HSDn or Dn ................................±50mA
Peak Current HSDn or Dn ........................................±100mA
Junction Temperature.................................................+150℃
Storage Temperature Range .......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
HBM.............................................................................8000V
MM.................................................................................400V
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
MAY 2022
2
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
HSD2+ HSD2-
1
2
3
4
5
10
9
VCC
OE
7
6
HSD2+
HSD2-
HSD1+
HSD1-
S
OE
VCC
S
8
9
5
4
3
HSD1+
HSD1-
GND
8
D+
10
7
D-
1
2
6
GND
D+
D-
UTQFN-1.8×1.4-10L
MSOP-10
PIN DESCRIPTION
PIN
NAME
FUNCTION
UTQFN-1.8×1.4-10L
MSOP-10
1, 2
5, 4
7, 6
3
3, 4
7, 6
9, 8
5
D+, D-
HSD1+, HSD1-
HSD2+, HSD2-
GND
Data Ports.
Ground.
8
10
1
Output Enable Control Pin.
Positive Power Supply Pin.
Select Input Pin.
OE
VCC
S
9
10
2
SG Micro Corp
MAY 2022
www.sg-micro.com
3
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
BLOCK DIAGRAM
HSD1+
D+
D-
HSD2+
HSD1-
HSD2-
LOGIC
S
OE
FUNCTION TABLE
S
0
1
X
HSD1+, HSD1-
HSD2+, HSD2-
OE
0
ON
OFF
OFF
OFF
ON
0
1
OFF
NOTE: Switches shown for logic "0" input.
SG Micro Corp
www.sg-micro.com
MAY 2022
4
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
ELECTRICAL CHARACTERISTICS
(VCC = +3.3V, Full = -40℃ to +85℃, typical values are at TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Analog Switch
Analog I/O Voltage
(HSD1+, HSD1-, HSD2+, HSD2-)
VIS
Full
0
VCC
V
+25℃
Full
5
0.3
1
8
9
VCC = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, Test Circuit 1
On-Resistance
RON
Ω
+25℃
Full
0.7
0.8
1.8
2
VCC = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, Test Circuit 1
On-Resistance Match Between Channels
On-Resistance Flatness
∆RON
Ω
Ω
+25℃
Full
V
CC = 3.0V, VIS = 0V to 1.0V,
RFLAT(ON)
ID = 8mA, Test Circuit 1
VCC = 0V, VD = 0V to 3.6V,
VS , VOE = 0V or 3.6 V
Power Off Leakage Current (D+, D-)
Increase in ICC per Control Voltage
Source Off Leakage Current
IOFF
Full
Full
Full
1
5
1
μA
μA
μA
ICCT
IHSD2(OFF)
VCC = 3.6V, VS or VOE = 2.6V
,
VCC = 3.6V, VIS = 3.3V/ 0.3V,
IHSD1(OFF) VD = 0.3V/ 3.3V
IHSD2(ON) VCC = 3.6V, VIS = 3.3V/0.3V,
,
Channel On Leakage Current
Full
1
μA
IHSD1(ON) VD = 3.3V/0.3V or floating
Digital Inputs
Input High Voltage
Input Low Voltage
Input Leakage Current
Dynamic Characteristics
Turn-On Time
VIH
VIL
Full
Full
Full
1.6
V
V
0.3
1
IIN
VCC = 3.0V, VS , VOE = 0V or VCC
μA
tON
+25℃
+25℃
20
18
ns
ns
V
IS = 0.8V, RL = 50Ω, CL = 10pF,
Test Circuit 2
Turn-Off Time
tOFF
VIS = 0.8V, RL = 50Ω, CL = 10pF,
Test Circuit 3
Break-Before-Make Time Delay
Propagation Delay
tD
+25℃
+25℃
+25℃
4
ns
ns
dB
tPD
RL = 50Ω, CL = 10pF
0.5
-51
Signal = 0dBm, RL = 50Ω,
f = 250MHz, Test Circuit 4
Signal = 0dBm, RL = 50Ω,
f = 250MHz, Test Circuit 5
Signal = 0dBm, RL = 50Ω,
CL = 5pF, Test Circuit 6
Off Isolation
OISO
Channel-to-Channel Crosstalk
XTALK
+25℃
-26
dB
-3dB Bandwidth
BW
tSKEW
Q
+25℃
+25℃
+25℃
500
130
1.5
MHz
ps
Channel-to-Channel Skew
RL = 50Ω, CL = 10pF
VG = GND, CL = 1.0nF, RG = 0Ω,
Q = CL × VOUT, Test Circuit 7
Charge Injection Select Input to Common I/O
pC
HSD+, HSD-, D+, D- ON Capacitance
CON
f = 1MHz
+25℃
11
pF
Power Requirements
Power Supply Range
Power Supply Current
VCC
ICC
Full
Full
1.8
4.3
1
V
VCC = 3.0V, VS , VOE = 0V or VCC
μA
SG Micro Corp
www.sg-micro.com
MAY 2022
5
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
TYPICAL PERFORMANCE CHARACTERISTICS
Response vs. Frequency
Response vs. Frequency
20
0
20
0
-20
-20
-40
-40
Crosstalk
-60
-60
Off-Isolation
-80
-80
-100
-120
-140
-100
-120
-140
VCC = 3.3V
VCC = 3.3V
TA = +25℃
TA = +25℃
0.1
1
10
Frequency (MHz)
100
1000
0.1
1
10
Frequency (MHz)
100
1000
SG Micro Corp
www.sg-micro.com
MAY 2022
6
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
TEST CIRCUITS
8mA
V1
HSDn
Dn
VIS
VS
GND
RON = V1/8mA
Test Circuit 1. On-Resistance
VCC
VIH
tR < 5ns
tF < 5ns
0.1μF
VCC
50%
50%
VS
VIL
HSDn
Dn
VOUT
90%
90%
RL
CL
VOUT
0V
VS
GND
tOF F
tON
Test Circuit 2. Switching Times (tON, tOFF
)
VCC
VIH
tR < 5ns
tF < 5ns
0.1μF
VCC
VS
50%
HSD1n
HSD2n
VIL
VIS
Dn
VOUT
90%
VOUT
0V
RL
CL
VS
GND
tD
Test Circuit 3. Break-Before-Make Time (tD)
VCC
0.1μF
VCC
VIN
50Ω
HSDn
Dn
VS
RL
S
VOUT
Network
Analyzer
50Ω
GND
Test Circuit 4. Off Isolation
SG Micro Corp
www.sg-micro.com
MAY 2022
7
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
TEST CIRCUITS (continued)
VCC
0.1μF
VCC
Dn
HSDn
VIN
50Ω
RL
HSDn
NC
Dn
Network
Analyzer
VOUT
50Ω
S
VS
GND
Channel-to-Channel Crosstalk = -20 log (VHSDn/VOUT
)
Test Circuit 5. Channel-to-Channel Crosstalk
VCC
0.1μF
VCC
VIN
50Ω
HSDn
Dn
VS
S
VOUT
Network
Analyzer
50Ω
GND
CL
Test Circuit 6. -3dB Bandwidth
VCC
0.1μF
VIH
VS
VCC
tR < 5ns
tF < 5ns
Floating
HSD1n
HSD2n
VIL
RS
Dn
VOUT
VOUT
ΔVOUT
S
CL
GND
VS
Q = ΔVOUT × CL
Test Circuit 7. Charge Injection (Q)
SG Micro Corp
www.sg-micro.com
MAY 2022
8
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
APPLICATION INFORMATION
Power-Off Protection
Power-On Protection
When D+ or D- is shorted to VBUS, there is a special
protection circuit inside the SGM7227, so that the
device will not be damaged within 24 hours. In case of
power-down or over-voltage event, the protection
circuit can prevent the leakage signal on D+/D- pins to
ensure the reliability of the system.
The USB 2.0 specification requires USB device to
ensure that the device will not be damaged even if VBUS
short-circuit occurs during data transmission. Therefore,
under over-voltage conditions, the SGM7227 will limit
the current flowing back to the VCC track, and the
current will not exceed the safe operating range.
USB2.0 Signal Quality Compliance Test Results
The results of USB eye map test are shown in Figure 2 and Figure 3. The SGM7227 passes all the tests.
Required Tests
Overall result:
Pass!
Additional Information
Consecutive jitter range:
-61.770ps to 39.668ps, RMS jitter 21.900ps
Signal eye:
Paired JK jitter range:
Eye passes
-47.800ps to 42.890ps, RMS jitter 21.591ps
EOP width: 7.91 bits
Paired KJ jitter range:
EOP width passes
-50.590ps to 49.704ps, RMS jitter 23.281ps
Measured signaling rate: 480.0551MHz
Signal rate passes
Rising Edge Rate:
901.28V/μs (710.10ps equivalent rise-time)
Passes
Falling Edge Rate:
889.18V/μs (719.77ps equivalent rise-time)
Passes
Figure 1. Waveform Plot
Figure 2. High-Speed Signal Quality Eye Diagram Test
(VCC = 3.3V)
SG Micro Corp
www.sg-micro.com
MAY 2022
9
High Speed USB 2.0 (480Mbps)
DPDT Analog Switch
SGM7227
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
MAY 2022 ‒ REV.B to REV.B.1
Page
Updated ELECTRICAL CHARACTERISTICS section..............................................................................................................................................5
JUNE 2021 ‒ REV.A.4 to REV.B
Page
Updated Package Outline Dimensions section.......................................................................................................................................................10
MAY 2014 ‒ REV.A.3 to REV.A.4
Page
Updated Absolute Maximum Ratings section ...........................................................................................................................................................2
DECEMBER 2012 ‒ REV.A.2 to REV.A.3
Page
Updated Absolute Maximum Ratings section ...........................................................................................................................................................2
SG Micro Corp
www.sg-micro.com
MAY 2022
10
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
UTQFN-1.8×1.4-10L
D
L
e
PIN 1# IDENTIFICATION
CHAMFER 0.100
× 45°
E
e1
L1
N10
N1
b
DETAIL A
PIN 1#
TOP VIEW
BOTTOM VIEW
2.100
0.563
A
C
SEATING
PLANE
A2
A1
eee C
1.700
SIDE VIEW
0.663
L2
0.225
0.40
0.20
ALTERNATE A-1 ALTERNATE A-2
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions In Millimeters
Symbol
MIN
MOD
-
MAX
0.600
0.050
A
A1
A2
b
0.450
0.000
-
0.152 REF
0.200
1.800
1.400
0.400 TYP
0.800 REF
0.400
0.500
-
0.150
1.750
1.350
0.250
1.850
1.450
D
E
e
e1
L
0.350
0.450
0.000
-
0.450
0.550
0.100
-
L1
L2
eee
0.080
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00091.001
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-10
b
E1
E
4.8
1.02
0.3
e
0.5
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
A1
c
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
1.100
0.150
0.950
0.280
0.230
3.100
3.100
5.050
MIN
MAX
0.043
0.006
0.037
0.011
0.009
0.122
0.122
0.199
A
A1
A2
b
0.820
0.020
0.750
0.180
0.090
2.900
2.900
4.750
0.032
0.001
0.030
0.007
0.004
0.114
0.114
0.187
c
D
E
E1
e
0.500 BSC
0.020 BSC
L
0.400
0°
0.800
6°
0.016
0°
0.031
6°
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00015.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
UTQFN-1.8×1.4-10L
MSOP-10
7″
9.0
1.75
5.20
2.10
3.30
0.70
1.20
4.0
4.0
4.0
8.0
2.0
2.0
8.0
Q1
Q1
13″
12.4
12.0
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
368
442
386
227
410
280
224
224
370
8
18
5
7″
13″
SG Micro Corp
www.sg-micro.com
TX20000.000
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