SGM8953-2 [SGMICRO]
High Precision, Low Power, Rail-to-Rail I/O, CMOS Operational Amplifier;型号: | SGM8953-2 |
厂家: | Shengbang Microelectronics Co, Ltd |
描述: | High Precision, Low Power, Rail-to-Rail I/O, CMOS Operational Amplifier |
文件: | 总19页 (文件大小:1358K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SGM8953-1/SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
GENERAL DESCRIPTION
FEATURES
● Low Input Offset Voltage: 10μV (TYP), 50μV (MAX)
● Low Noise: 1μVP-P at 0.1Hz to 10Hz
● Unity-Gain Stable
The single SGM8953-1 and dual SGM8953-2 are low
power, high precision CMOS operational amplifiers,
which can operate from 1.8V to 5.5V single supply or
from ±0.9V to ±2.75V dual power supplies, while
consuming only 17μA quiescent current per amplifier.
The SGM8953-1/2 support rail-to-rail input and output
operation. The input common mode voltage range is
from (-VS) - 0.1V to (+VS) + 0.1V, and the output range is
from (-VS) + 0.0055V to (+VS) - 0.0055V.
● Gain-Bandwidth Product: 200kHz
● Integrated RFI Filter
● Rail-to-Rail Input and Output
● Support Single or Dual Power Supplies:
1.8V to 5.5V or ±0.9V to ±2.75V
● Quiescent Current: 17μA/Amplifier (TYP)
● -40℃ to +125℃ Operating Temperature Range
● Small Packaging:
The SGM8953-1/2 are designed to provide optimal
performance in low voltage and low power systems.
They have high impedance inputs and zero-drift 50μV
(MAX) offset voltage. These specifications make
SGM8953-1 Available in Green SOT-23-5, SOIC-8
and UTDFN-1.6×1.6-6L Packages
SGM8953-2 Available in Green SOIC-8, MSOP-8
and TDFN-2×2-8L Packages
SGM8953-1/2 appropriate for
a
wide range of
applications requiring high precision, such as high
linearity driver of high precision ADC.
APPLICATIONS
The SGM8953-1 is available in Green SOT-23-5,
SOIC-8 and UTDFN-1.6×1.6-6L packages. The
SGM8953-2 is available in Green SOIC-8, MSOP-8
and TDFN-2×2-8L packages. They are specified over
the extended industrial temperature range (-40℃ to
+125℃).
Industrial Equipment
Battery-Powered Equipment
Sensor Signal Conditioning
SG Micro Corp
JANUARY 2019 – REV. A
www.sg-micro.com
SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SOT-23-5
SOIC-8
SGM8953-1XN5G/TR
MBAXX
Tape and Reel, 3000
Tape and Reel, 4000
Tape and Reel, 3000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 3000
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
SGM
89531XS8
XXXXX
SGM8953-1
SGM8953-1XS8G/TR
SGM8953-1XUDN6G/TR
SGM8953-2XS8G/TR
SGM8953-2XMS8G/TR
SGM8953-2XTDE8G/TR
UTDFN-1.6×1.6-6L
SOIC-8
98X
SGM
89532XS8
XXXXX
SGM89532
XMS8
XXXXX
SGM8953-2
MSOP-8
MH7
XXXX
TDFN-2×2-8L
MARKING INFORMATION
NOTE: X = Date Code. XX = Date Code. XXXX = Date Code and Trace Code. XXXXX = Date Code, Trace Code and Vendor Code.
SOT-23-5
SOIC-8/MSOP-8
YYY X X
X X X X X
Date Code - Week
Date Code - Year
Serial Number
Vendor Code
Trace Code
Date Code - Year
UTDFN-1.6×1.6-6L
TDFN-2×2-8L
Serial Number
Y Y Y
X X X X
YY X
Date Code - Quarter
Serial Number
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
SG Micro Corp
JANUARY 2019
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2
SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
ABSOLUTE MAXIMUM RATINGS
Supply Voltage...................................................................6V
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Input Common Mode Voltage Range
Operating Conditions section is not implied.
.................................................... (-VS) - 0.3V to (+VS) + 0.3V
Junction Temperature .................................................+150℃
Storage Temperature Range.........................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................8000V
MM.................................................................................400V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Specified Voltage Range ....................................1.8V to 5.5V
Operating Temperature Range .....................-40℃ to +125℃
DISCLAIMER
OVERSTRESS CAUTION
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
PIN CONFIGURATIONS
SGM8953-1 (TOP VIEW)
SGM8953-1 (TOP VIEW)
SGM8953-1 (TOP VIEW)
1
2
3
4
8
7
6
5
NC
NC
-IN
OUT
-VS
1
2
3
5
+VS
_
+VS
OUT
-IN
1
2
3
6
5
4
-VS
NC
+IN
+VS
OUT
NC
Exposed
Pad
_
+IN
-VS
+
+
+IN
4
-IN
NC = NO CONNECT
SOIC-8
SOT-23-5
UTDFN-1.6×1.6-6L
SGM8953-2 (TOP VIEW)
SGM8953-2 (TOP VIEW)
OUTA
-INA
+INA
-VS
1
2
3
4
8
7
6
5
+VS
OUTA
-INA
+INA
-VS
1
2
3
4
8
7
6
5
+VS
_
OUTB
-INB
OUTB
-INB
Exposed
Pad
+
_
+INB
+
+INB
SOIC-8/MSOP-8
TDFN-2×2-8L
NOTE: For UTDFN-1.6×1.6-6L and TDFN-2×2-8L packages, exposed pad can be connected to -VS or left floating.
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JANUARY 2019
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3
SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
ELECTRICAL CHARACTERISTICS
(At TA = +25℃, VS = 1.8V to 5.5V, VCM = +VS/2, VOUT = +VS/2 and RL = 10kΩ to +VS/2, Full = -40℃ to +125℃, unless otherwise
noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Input Characteristics
10
50
62
+25℃
Full
Input Offset Voltage
VOS
μV
Input Offset Voltage Drift
Input Bias Current
ΔVOS/ΔT
IB
Full
60
80
nV/℃
pA
500
700
+25℃
+25℃
Input Offset Current
IOS
170
pA
Input Common Mode Voltage Range
VCM
Full (-VS) - 0.1
(+VS) + 0.1
V
90
87
106
118
+25℃
Full
Common Mode Rejection Ratio
CMRR (-VS) - 0.1V < VCM < (+VS) + 0.1V
dB
dB
106
103
+25℃
Full
Open-Loop Voltage Gain
Output Characteristics
AOL
(-VS) + 0.1V < VOUT < (+VS) - 0.1V, RL = 10kΩ
5.5
9
+25℃
Full
Output Voltage Swing from Rail
RL = 10kΩ
mV
11
VS = 1.8V
VS = 5.5V
6
9
+25℃
+25℃
Output Short-Circuit Current
ISC
mA
18
26
Power Supply
Specified Voltage Range
VS
PSRR VS = 1.8V to 5.5V
Full
+25℃
Full
1.8
5.5
12.6
22
V
3.2
17
Power Supply Rejection Ratio
Quiescent Current/Amplifier
μV/V
23.5
29
+25℃
Full
IQ
IOUT = 0
μA
Dynamic Performance
Gain-Bandwidth Product
Phase Margin
GBP
φO
CL = 100pF
CL = 100pF
G = 1
200
70
kHz
°
+25℃
+25℃
+25℃
+25℃
Slew Rate
SR
0.05
16
V/μs
μs
Overload Recovery Time
Noise
G = -10
Input Voltage Noise
Input Voltage Noise Density
Input Current Noise Density
f = 0.1Hz to 10Hz
f = 1kHz
1
μVP-P
+25℃
+25℃
+25℃
en
in
50
nV/
Hz
Hz
f = 1kHz
400
fA/
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SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VS = 5V, RL = 10kΩ and CL = 100pF, unless otherwise noted.
Quiescent Current vs. Temperature
Output Short-Circuit Current vs. Temperature
22
20
18
16
14
12
10
45
40
35
30
25
20
15
ISOURCE
ISINK
-50
-50
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Temperature (℃)
Temperature (℃)
PSRR vs. Temperature
CMRR vs. Temperature
2
1
4.5
4
VS = 5.5V
3.5
3
0
2.5
2
-1
-2
-3
VS = 1.8V
1.5
1
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Temperature (℃)
Temperature (℃)
Input Offset Voltage vs. Temperature
10 Typical Units Shown
Input Offset Voltage vs. Supply Voltage
10 Typical Units Shown
30
20
10
0
30
20
10
0
-10
-20
-30
-10
-20
-30
1.5
2
2.5
3
3.5
4
4.5
5
5.5
-25
0
25
50
75
100 125
Supply Voltage (V)
Temperature (℃)
SG Micro Corp
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JANUARY 2019
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SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VS = 5V, RL = 10kΩ and CL = 100pF, unless otherwise noted.
Input Offset Voltage vs. Input Common Mode Voltage
Input Offset Voltage vs. Input Common Mode Voltage
30
20
10
0
30
20
10
0
10 Typical Units Shown
10 Typical Units Shown
VS = 5.5V
VS = 1.8V
-10
-20
-30
-10
-20
-0.4
0
0.4
0.8
1.2
1.6
2
-1
0
1
2
3
4
5
6
Input Common Mode Voltage (V)
Input Common Mode Voltage (V)
Output Voltage Swing vs. Output Current (Maximum Supply)
Quiescent Current vs. Supply Voltage
6
40
32
24
16
8
VS = 5.5V
5
4
3
-40℃
+25℃
+85℃
+125℃
2
1
0
0
0
8
16
24
32
40
48
0
1
2
3
4
5
6
Supply Voltage (V)
Output Current (mA)
Input Bias Current vs. Input Common Mode Voltage
Input Bias Current vs. Input Common Mode Voltage
500
300
500
300
VS = 1.8V
VS = 5.5V
+IB
+IB
100
100
-100
-300
-500
-100
-300
-500
-IB
-IB
-0.4
0
0.4
0.8
1.2
1.6
2
-1
0
1
2
3
4
5
6
Input Common Mode Voltage (V)
Input Common Mode Voltage (V)
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SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VS = 5V, RL = 10kΩ and CL = 100pF, unless otherwise noted.
Large-Signal Step Response
G = 1, VOUT = 2VP-P
Small-Signal Step Response
G = 1, VOUT = 40mVP-P
Time (100μs/div)
Time (100μs/div)
Positive Overload Recovery
Negative Overload Recovery
G = -10
G = -10
0V
VIN
VIN
0V
0V
VOUT
VOUT
0V
Time (50μs/div)
Time (50μs/div)
Large-Signal Settling Time (Positive)
G = -1
Large-Signal Settling Time (Negative)
G = -1
VIN
VOUT
VOUT
VIN
Time (1ms/div)
Time (1ms/div)
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SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VS = 5V, RL = 10kΩ and CL = 100pF, unless otherwise noted.
No Phase Reversal
Maximum Output Voltage vs. Frequency
G = 1
3
2
6
5
4
3
2
1
0
G = 1
RL = No load
CL = No load
VIN
VS = 5.5V
1
0
-1
-2
-3
VOUT
VS = 1.8V
10
100
1000
Frequency (Hz)
10000
100000
Time (1ms/div)
+IN EMIRR vs. Frequency
PRF = -16dBm
PSRR vs. Frequency (Referred-to-Input)
0
-20
120
100
80
60
40
20
0
PSRR-
-40
-60
-80
PSRR+
-100
-120
10
100
1000
10000
100000
10
100
1000
10000
Frequency (Hz)
Frequency (MHz)
Closed-Loop Gain vs. Frequency
Open-Loop Gain and Phase vs. Frequency
60
40
20
0
100
80
60
40
20
0
0
G = 100
-30
-60
-90
-120
-150
-180
Open-Loop Gain
G = 1
G = 10
Phase
-20
-40
G = -1
-20
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
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SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VS = 5V, RL = 10kΩ and CL = 100pF, unless otherwise noted.
Channel Separation vs. Frequency
Small-Signal Overshoot vs. Capacitive Load
G = 1
-60
-80
60
50
40
30
20
10
0
VIN = 1VP-P
-100
-120
-140
-160
VIN = 4.99VP-P
10
100
1000
10
100
1000
10000
100000
Load Capacitance (pF)
Frequency (Hz)
Input Voltage Noise Density vs. Frequency
0.1Hz to 10Hz Input Voltage Noise
1000
100
10
10
100
1000
10000
Time (1s/div)
Frequency (Hz)
Input Offset Voltage Production Distribution
Input Offset Voltage Drift Distribution
-40℃ ≤ TA ≤ +125℃
18
15
12
9
20
15
10
5
3140 Samples
1 Production Lot
6
3
0
0
Input Offset Voltage (μV)
Input Offset Voltage Drift (nV/℃)
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SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
APPLICATION INFORMATION
Rail-to-Rail Input
Driving Capacitive Loads
When SGM8953-1/2 work at the power supply between
1.8V and 5.5V, the input common mode voltage range
is from (-VS) - 0.1V to (+VS) + 0.1V. In Figure 1, the ESD
diodes between the inputs and the power supply rails
will clamp the input voltage not to exceed the rails.
The SGM8953-1/2 are unity-gain stable with heavy
capacitive load. If greater capacitive load must be
driven in application, the circuit in Figure 3 can be used.
In this circuit, the IR drop voltage generated by RISO is
compensated by feedback loop.
+VS
RF
CF
VP
+
_
_
RISO
VN
VOUT
CL
VIN
+
-VS
Figure 1. Input Equivalent Circuit
Figure 3. Circuit to Drive Heavy Capacitive Load
Input Current-Limit Protection
Power Supply Decoupling and Layout
For ESD diode clamping protection, when the current
flowing through ESD diode exceeds the maximum
rating value, the ESD diode and amplifier will be
damaged, so current-limit protection will be added in
some applications. One resistor is selected to limit the
current not to exceed the maximum rating value. In
Figure 2, a series input resistor is used to limit the input
current to less than 10mA, but the drawback of this
current-limit resistor is that it contributes thermal noise
at the amplifier input. If this resistor must be added, its
value must be selected as small as possible.
A clean and low noise power supply is very important in
amplifier circuit design, besides of input signal noise,
the power supply is one of important source of noise to
the amplifiers through +VS and -VS pins. Power supply
bypassing is an effective method to clear up the noise
at power supply, and the low impedance path to ground
of decoupling capacitor will bypass the noise to GND.
In application, 10μF ceramic capacitor paralleled with
0.1μF or 0.01μF ceramic capacitor is used in Figure 4.
The ceramic capacitors should be placed as close as
possible to +VS and -VS power supply pins.
+VS
+VS
+VS
10μF
10μF
_
IOVERLOAD
10mA MAX
VOUT
0.1μF
0.1μF
VIN
+
_
_
VN
VP
VN
VP
VOUT
VOUT
+
+
Figure 2. Input Current-Limit Protection
10μF
-VS (GND)
Rail-to-Rail Output
The SGM8953-1/2 support rail-to-rail output operation.
In single power supply application, for example, when
+VS = 5.5V, -VS = GND, 10kΩ load resistor is tied from
OUT pin to +VS/2, the typical output swing range is from
0.0055V to 5.4945V.
0.1μF
-VS
Figure 4. Amplifier Power Supply Bypassing
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SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
APPLICATION INFORMATION (continued)
the input are used to increase the input impedance and
eliminate drawback of low input impedance in Figure 5.
Grounding
In low speed application, one node grounding technique
is the simplest and most effective method to eliminate
the noise generated by grounding. In high speed
application, the general method to eliminate noise is to
use a complete ground plane technique, and the whole
ground plane will help distribute heat and reduce EMI
noise pickup.
_
R1
R2
VN
+
_
VOUT
+
VP
+
Reduce Input-to-Output Coupling
R3
To reduce the input-to-output coupling, the input traces
must be placed as far away from the power supply or
output traces as possible. The sensitive trace must not
be placed in parallel with the noisy trace in same layer.
They must be placed perpendicularly in different layers
to reduce the crosstalk. These PCB layout techniques
will help to reduce unwanted positive feedback and
noise.
_
R4
VREF
Figure 6. High Input Impedance Difference Amplifier
Active Low-Pass Filter
The circuit in Figure 7 is a design example of active
low-pass filter, the DC gain is equal to -R2/R1 and the
-3dB corner frequency is equal to 1/2πR2C. In this design,
the filter bandwidth must be less than the bandwidth of
the amplifier, the resistor values must be selected as
low as possible to reduce ringing or oscillation generated
by the parasitic parameters in PCB layout.
Typical Application Circuits
Difference Amplifier
The circuit in Figure 5 is a design example of classical
difference amplifier. If R4/R3 = R2/R1, then VOUT = (VP -
VN) × R2/R1 + VREF
.
C
R2
R2
R1
_
VN
R1
_
VOUT
VIN
R3
VP
VOUT
+
+
R4
R3 = R1 // R2
VREF
Figure 5. Difference Amplifier
Figure 7. Active Low-Pass Filter
High Input Impedance Difference Amplifier
The circuit in Figure 6 is a design example of high input
impedance difference amplifier, the added amplifiers at
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SGM8953-1
SGM8953-2
High Precision, Low Power, Rail-to-Rail I/O,
CMOS Operational Amplifiers
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (JANUARY 2019) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
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12
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-5
1.90
D
e1
2.59
E1
E
0.99
b
e
0.95
0.69
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
0.2
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
1.250
0.100
1.150
0.500
0.200
3.020
1.700
2.950
MIN
MAX
0.049
0.004
0.045
0.020
0.008
0.119
0.067
0.116
A
A1
A2
b
1.050
0.000
1.050
0.300
0.100
2.820
1.500
2.650
0.041
0.000
0.041
0.012
0.004
0.111
0.059
0.104
c
D
E
E1
e
0.950 BSC
1.900 BSC
0.037 BSC
0.075 BSC
e1
L
0.300
0°
0.600
8°
0.012
0°
0.024
8°
θ
SG Micro Corp
www.sg-micro.com
TX00033.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
UTDFN-1.6×1.6-6L
NOTE: All linear dimensions are in millimeters.
SG Micro Corp
TX00070.000
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-8L
D
e
N8
E1
D1
L
E
k
N4
N1
b
BOTTOM VIEW
TOP VIEW
1.20
0.65
0.60 1.95
A
A1
A2
SIDE VIEW
0.24
0.50
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.900
1.100
1.900
0.500
2.100
1.300
2.100
0.700
0.075
0.043
0.075
0.020
0.083
0.051
0.083
0.028
D1
E
E1
k
0.200 MIN
0.500 TYP
0.008 MIN
0.020 TYP
b
0.180
0.250
0.300
0.450
0.007
0.010
0.012
0.018
e
L
SG Micro Corp
www.sg-micro.com
TX00056.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8
b
E1
E
4.8
1.02
e
0.41
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
c
A1
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
1.100
0.150
0.950
0.380
0.230
3.100
3.100
5.050
MIN
MAX
0.043
0.006
0.037
0.015
0.009
0.122
0.122
0.199
A
A1
A2
b
0.820
0.020
0.750
0.250
0.090
2.900
2.900
4.750
0.032
0.001
0.030
0.010
0.004
0.114
0.114
0.187
c
D
E
E1
e
0.650 BSC
0.026 BSC
L
0.400
0°
0.800
6°
0.016
0°
0.031
6°
θ
SG Micro Corp
www.sg-micro.com
TX00014.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8
0.6
D
e
2.2
E1
E
5.2
b
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
1.750
0.250
1.550
0.510
0.250
5.100
4.000
6.200
MIN
MAX
0.069
0.010
0.061
0.020
0.010
0.200
0.157
0.244
A
A1
A2
b
1.350
0.100
1.350
0.330
0.170
4.700
3.800
5.800
0.053
0.004
0.053
0.013
0.006
0.185
0.150
0.228
c
D
E
E1
e
1.27 BSC
0.050 BSC
L
0.400
0°
1.270
8°
0.016
0°
0.050
8°
θ
SG Micro Corp
www.sg-micro.com
TX00010.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
SOT-23-5
UTDFN-1.6×1.6-6L
TDFN-2×2-8L
MSOP-8
7″
7″
9.5
9.0
3.20
1.78
2.30
5.20
6.40
3.20
1.78
2.30
3.30
5.40
1.40
0.69
1.10
1.50
2.10
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
2.0
2.0
2.0
2.0
2.0
8.0
8.0
Q3
Q1
Q1
Q1
Q1
7″
9.5
8.0
13″
13″
12.4
12.4
12.0
12.0
SOIC-8
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
368
442
386
227
410
280
224
224
370
8
18
5
7″
13″
SG Micro Corp
www.sg-micro.com
TX20000.000
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