GM2BB50GT4E [SHARP]

Single Color LED,;


型号：	GM2BB50GT4E
厂家：	SHARP ELECTRIONIC COMPONENTS
描述：	Single Color LED, 光电
文件：	总23页 (文件大小：2494K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ZENIGATA LED

July 30, 2014

SPECIFICATIONS

Pico ZENIGATA-LED

GM2BB**GT4E

**:50,57,65

Notice

Contents in this technical document be changed without any notice due to the product modiﬁcation.

In the absence of conﬁrmation by device speciﬁcation sheets, SHARP takes no responsibility for any

defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.

Development DepartmentⅡ

Lighting Device Division

Electronic Components And Devices Group

SHARP CORPORATION

http://www.sharp-world.com/products/device/

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Model No. GM2BB**GT4E

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“Contents in this technical document be changed without any notice due to the product modiﬁcation.”

●Handle this document carefully it contains material protected by international

without the express written permission of the company.

●When using the products covered herein,please observe the conditions written herein

and the precautions outlined in the following paragraphs. In no event shall the

company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions.

(1) Please do verify the validity of this part after assembling it in customerʼs products,when

customer wants to make catalogue and instruction manual based on the specification sheet of this part.

(2) The products covered herein are desigd and manufactured for the following application areas.

When using the products covered herein for the equipment listed in paragraph(3),even for the following

application areas, be sure to observe the precautions given in Paragraph(3).

Never use the products for the equipment listed in Paragraph(4).

・Office electronics

・Instrumentation and measuring equipment

・Machine tools

・Audiovisual equipment

・Home appliances

・Communication equipment other than for trunk lines

(3) These contemplating using the products covered herein for the following equipment which demands

high reliability, should first contact a sales representative of the company and then accept responsibility

for incorporating into the design fail-safe operation,redundansy, and other appropriate measures for

ensuring reliability and safety of the equipment and the overall system.

・Control and safety devices for airplanes, trains,automobiles, and other transportation equipment

・Mainframe computers

・Traffic control systems

・Gas leak detectors and automatic cutoff devices

・Rescue and security equipment

・Other safety devices and safety equipment, etc.

(4) Do not use the products covered herein for the followin equipment which demands extremely

high performance in terms of functionality, reliability, or accuracy.

・Aerospace equipment

・Communications equipment for trunk lines

・Control equipment for the nuclear power industry

・Medical equipment related to life support, etc.

(5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to

a sales representative of the company.

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GM2BB**GT4E Technical literature

１．Application

These technical literatures apply to light emitting diode Model No.GM2BB**GT4E.

[ LED module (InGaN Blue LED chip + Phosphor) ]

Main application : Lighting

Refer to Page 2.

2. External dimensions and equivalent circuit

3. Ratings and characteristics

Refer to Page 3-6.

3-1. Absolute maximum ratings

3-2. Electro-optical characteristics

3-3. Derating curve

3-4. Characteristics diagram (TYP.)

4. Reliability

Refer to Page 7-8.

Refer to Page 9.

4-1. Test items and test conditions

4-2. Failure criteria

5. Quality level

5-1. Applied standard

5-2. Sampling inspection

5-3. Inspection items and defect criteria

6. Supplements

Refer to Page 10-16.

6-1. Chromaticity rank table

6-2. Taping

6-3. Label

6-4. Packing

6-5. Indication printed on product

7. Precautions

Refer to Page 17-20.

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2. External dimensions and equivalent circuit

②

（0.6）

（1.9）

①

2.8

Equivalent circuit

②

-Cathode

2.8

（2.4）

+Anode

①

・ Unspecified tolerance to be ±0.2

This tolerance does not include dimensions of resin and substrate burr remained on edge.

・ Values inside parentheses are reference values.

・ Tc: Measurement point of case temperature

Unit

Material

Finish

Substrate : Ceramics

Terminal：Au plating

ｍｍ

Lens : Silicone resin

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3. Ratings and characteristics

3-1. Absolute maximum ratings

Applied temperature

Parameter

Symbol

Rating

Unit

℃

[℃]

Operating temperature

-30 to +100

-40 to +100

(Note 1)

Storage temperature

(Note 2)

Tstg

℃

1280

45.4

100

3.4

-30 ≦ Topr ≦ 85

85 ＜ Topr ≦ 100

-30 ≦ Topr ≦ 85

85 ＜ Topr ≦ 100

-30 ≦ Topr ≦ 85

85 ＜ Topr ≦ 100

mW/℃

Power dissipation (Note 3)

Derating factor

I_F

Forward current (Note 4)

Derating factor

mA/℃

I_FM

Peak pulsed forward current

Derating factor

200

6.8

mA/℃

V_R

Tc=25

Derating factor

Tsol

Soldering temperature

(Note 5)

350

℃

(Note 1) The range of operating temperature is prescribed by case temperature,

Case temperature (Refer to Page 2, External dimensions and equivalent circuit)

(Note 2)Do not exceed specified temperature range under any packing condition.

(Except when baking and soldering)

(Note 3) The operating current value follows the derating curve. (Refer to Page 5)

(Note 4) Duty ratio = 1/10, Pulse width = 100 μs.

(Note 5) Each terminal must be soldered with the soldering iron (under 60W) within 3 seconds

(only once). Solder tip temperature: under 350℃

As for the reﬂow soldering proﬁle, please refer to Page 19.

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3-2. Electro-optical characteristics

（Tc＝25℃）

Parameter

Symbol

V_F

Conditions

MIN.

TYP.

MAX.

Unit

Forward voltage

12.8

(11.8)

Luminous flux

(Note 1)

Φ_v

See diagram below

_F=50mA

ｘ

ｙ

3-2.1

Chromaticity coordinates

(Note 2)

Color rendering index

(Note 3)

(70)

3-2.1 Fundamental characteristics in all models

（Tc＝25℃）

Typical of chromaticity

coordinates Typ.

Colortemperature

Chromaticity

Luminous flux

Model No.

Typ.

diagram

Typ.

GM2BB65GT4E

GM2BB57GT4E

GM2BB50GT4E

(6 500)

(5 700)

(5 000)

(0.3123,0.3282)

(0.3287,0.3417)

(0.3447,0.3553)

(73.0)

(78.0)

6-1

Page 10

（I ＝50mA）

(Note 1)ꢀMonitored by 8 inch integrating sphere of Sharp Standard. (After 20 ms drive) (Tolerance: ±10%)

(Note 2) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±0.01)

(Note 3) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±5)

(Note 4) Values inside parentheses are indicated only for reference, and are not guaranteed.

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3-3. Derating Curve

Peak Pulsed Forward Current Derating Curve

Forward Current Derating Curve

Case Temperature Tc (℃)

Peak Pulsed Forward Current vs. Duty Ratio

Duty Ratio

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ꢀꢀ3-4.Characteristics Diagram (TYP.)

Forward Current vs. Forward Voltage

Relative Luminous ｆlux vs. Forward Current

Forward Voltage V

(V)

Forward Current I (mA)

Relative Luminous flux vs. Case Temperature

Case Temperature Tc (℃)

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4．Reliability

ꢀꢀ4-1. Test items and test conditions

ꢀ

（Confidence level：90％）

Samples Defective

LTPD

No.

Test items

Test conditions

（％）

-40℃（30min）to +100℃（30min）,100cycles

Tstg = +60℃,RH = 90%,Time = 1 000h

Temperature cycle

Temperature humidity storage

High temperature storage

Low temperature storage

Tstg = +100℃,Time = 1 000h

Tstg = -40℃,Time = 1 000h

Steady state operating life

at room temperature

Tc =25℃,I_F= 100 mA,Time = 1 000h

Tc = +100℃,I _F= 50 mA,Time = 1 000h

Steady state operating life

at high temperature

Steady state operating life

at high temperature and

elevated humidity

Tc = +60℃,RH=90%,I _F= 100 mA,Time = 500h

Acceleration: 15 000 m/s2, Pulse width: 0.5 ms,

Shock

Tc = +25 ℃

Direction: X, Y and Z, 3 trials in each direction

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Acceleration: 200 m/s2

Frequency: 100 to 2 000 Hz (round-trip) 4 min

Tc = +25 ℃

Direction: X, Y and Z

4 trials in each direction

Vibration

2 trials, under the reflow condition

mentioned in Page 23.

10 Resistance to soldering heat

M705/ESR-250

Solder/ Flux: M705/ ESR 250

(SENJU METAL INDUSTRY CO., LTD)

Pretreatment

①High temp. storage : 150℃, 1h

②PCT(105℃, 100%RH, 1.22×105Pa, 4h)

Applied only to terminal part

Solderability

(Solder dip)

Soldering Temperature：Tsol=240℃±2℃, 3s,

Dipping depth：0.2～0.25mm

(After pretreatment, leave 2h or more at room

temperature and humidity. Dipping

flux in 3～5s and soldering)

M705-221BM5-42-11

Solder: M705-221BM5-42-11

(SENJU METAL INDUSTRY CO., LTD)

under the reflow condition mentioned

in Page 23

Solder joint strength

Temperature cycle

-40℃～+100℃(30min.), 100cycles

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5．Quality level

ꢀꢀ5-1. Applied standard（ISO 2859-1）

ꢀꢀ5-2. Sampling inspection（A single normal sampling plan, level S-4）

ꢀꢀ5-3. Inspection items and defect criteria

No.

Inspection items

Defect criteria

Classification

AQL

No light emitting

No radiation

Different from the specified color

Radiation color

Major defect

0.1

Not conforming to the inserted direction shown

in the specification

Taping

Not satisfied with specified values for VF, IR,

φ and chromaticity coordinates mentioned in Page 4

Electro-optical

characteristics

Not satisfied with specified dimensions in Page 2

External dimensions

Minor defect

0.4

Foreign substances and scratches of light

emitting face which are obstructed light

emitting condition.

(Except removable foreign substance)

Appearance

Resin or substrate burr which is over 0.3mm

Resin crack and terminal crack, which are over φ0.3 mm

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6．Supplements

ꢀꢀ6-1. Chromaticity diagram of each model

ꢀꢀ

（Tc=25℃）

Point1

Point2

Point3

Point4

Rank

0.3205

0.3376

0.3551

0.3481

0.3616

0.3760

0.3208

0.3207

0.3376

0.3304

0.3462

0.3616

0.3068

0.3222

0.3366

0.3113

0.3243

0.3369

0.3221

0.3366

0.3515

0.3261

0.3369

0.3487

GM2BB65GT4E

GM2BB57GT4E

GM2BB50GT4E

（IF=50mA Tolerance：±0.01）

0.380

0.370

0.360

0.350

0.340

0.330

0.320

0.310

GM2BB50GT4E(5000K)

GM2BB57GT4E(5700K)

GM2BB65GT4E(6500K)

0.300

0.290

0.300

0.310

0.320

0.330

CIE x

0.340

0.350

0.360

0.370

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6-2．Taping

6.2.1 Shape and dimensions of tape (Ref.)

Feeding direction

Cathode Mark

Symbol Dimension [mm]

Remarks

Parameter

3.13

4.0

Length

Width

Pitch

Measured at inside bottom

square corner

Pocket

(embossed)

P₁

D₀

P₀

1.5

Diameter

Pitch

Sprocket hole

4.0

Accumulated error ±0.5 mm/ 10 pitch

Dimension from the edge of the tape

to the center of the sprocket hole

1.75

Sprocket hole position

P₂

2.0

Dimension at the extension of the

center lines of the pocket to the

center line of the sprocket hole

Pocket position

3.5

5.3

0.1

8.0

W₁

t₃

Width

Cover tape

Carrier tape

Thickness

Width

W₀

t₁

0.25

Thickness

Including the thickness of cover and

carrier tape

t₂

2.6

Overall thickness of the taping

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6-2-2．Shape and dimensions of reel (Ref.)

Label

Parameter

Symbol

Dimension [mm]

Remarks

Diameter

Thickness

180

Flange

1.5

Dimension measured close to the core

Clearance between the flanges

External diameter

Spindle hole diameter

Hub

Width

Key slit

2.0

Depth

4.5

Indication of Model No. etc.

Label attached on flange (Model No., quantity, Lot No. etc.)

Materials: Polystyrene

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6-2-3．Taping technical specification

Feeding direction

Empty

LEDs inside

Leader(Empty)

MIN. 160mm

MIN. 400mm

Cover tape separation

Cover Tape

Tape speed：5mm/s

0.1N ～ 1.0N（Θ＝10°以下）

0 ～ 10°

Forward

Carrier Tape

(1)Tape strength against bending: The radius of curvature should be more than 30 mm.

If i bent at less than 30 mm, the cover may peel off.

(2) Joint of the tape: No joint of cover tape or carrier tape in one reel

(3) Quantity: 2 000 pcs. per reel (standard)

(4) Product mass: Approx. 30mg (One piece of LED/ Reference value)

(5) Others:

①There are no continuous empty pockets except leader and trailer part.

ꢀ②The quantity of the products lacking should be less than 0.1% of total product quantity.

ꢀ③Products should not be attached to the cover tape when it peeled off.

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6-3．Label (on reel）

EIAJC-3 compliant bar code (format e) label is attached on each reel.

SHARP CORPORATION

Model No.

←

PART No.

GM2BB**GT4E

2 000

← Product quantity

QUANTITY

←

EIAJ C-3 Bar codes

← LOT number and rank

← Production country

LOT No. XX12J19/ RANK ○△△－□

〈EIAJ C-3〉 MADE IN XXXX

④

①

②

③

① Production plant code (to be indicated alphabetically)

② Year of production (the last two figures of the year)

③ Month of production

(to be indicated alphabetically with January corresponding to A)

④ Date of production (01 to 31)

<Rank>

RANK○△△-□：○ꢀ Luminous flux rank

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ△△ Chromaticity rank

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ□ꢀ Forward voltage rank

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6-4．Packing

6-4-1．Moisture proof packing

In order to avoid the absorption of humidity while transport and storage,

the devices are packed in moisture proof aluminum bags.

SHIPMENTꢀTABLE

PART No. GM2BB**GT4C

Aluminum bag

Label

QUANTITY. 2000

RANK ○△△-□

LOT No.

XXXXXXXXXXX

SHARP CORPORATION

MADE IN XXXX

(※１)

R.C.

Silica gel

SHARP LABEL

Label(EIAJ C-3 compliant)

Reel

(Note 1) This mark indicates that this product is RoHS compliant product designed and

manufactured in accordance with Sharp's Green Device Guidelines.

6-4-2．Recommended storage conditions

Temperature: 5℃to 30 ℃ Relative humidity: 85% or less

6-4-3．Precautions after opening aluminum bags

①Please be sure to give them the soldering within 7 days under the following

conditions. Temperature: 5 ℃to 30 ℃ Relative humidity: 60% or less

②Storage in a dry box is recommended in case that the products are not used for

a long time after opened. Or repack the reels with a desiccative by the sealer

and store them under the same conditions mentioned in 5.3.2.

③Please perform the baking treatment under the recommended conditions in the

following cases;

・ The blue indicator of silica gel changes its color or fades.

・ 7days passed after opened under the specified storage conditions.

・ Products were stored out of storage condition.

(Recommended baking conditions）

・ Products with taping

ꢀTemperature: 60 ℃to 65 ℃, Time: 36 to 48 hours

・ Single piece of the products (on PCB or metallic tray)

ꢀTemperature: 100 ℃to 120 ℃, Time: 2 to 3 hours.

ꢀAvoid piling up the reels or applying stress to them during baking so as to protect from

ꢀdeformation. Please be sure to cool them to room temperature after baking.

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6-5．Information on environmental impact substances

6-5-1．RoHS compliant product

ꢀꢀꢀꢀꢀꢀThis product complies with the RoHS Directive (2011/65/EU) and manufactured

in accordance with Sharp's Green Device Guidelines.

6-5-2. Information relating to China RoHS

ꢀꢀꢀꢀꢀꢀProduct Information Notification based on Chinese law, Management Methods for

Controlling Pollution by Electronic Information Products.

Names and Contents of the Toxic and Hazardous Substances or Elements in the Products.

Toxic and Hazardous Substances or Elements.

Hexavalent

Chromium

Polybrominated

Biphenyls

Polybrominated Diphenyl

Ethers

Lead

Mercury

Cadmium

(Pb)

(Hg)

(Cd)

(Cr(VI))

(PBB)

(PBDE)

○

○：indicates that the content of the toxic and hazardous substance in all the homogeneous

materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006.

×：indicates that the content of the toxic and hazardous substance in at least one

homogeneous material of the part exceeds the concentration limit requirement

as described in SJ/T 11363-2006 standard.

6-5-3．Ozone Depleting Substances

・ This product does not contain the following Ozone Depleting Substances.

・ This product does not have a production line whose process requires the

following Ozone Depleting Substances.

・ Restricted substances: CFCs, Halones, CCl4, and 1, 1, 1-Trichloroethane

(Methyl chloroform)

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7 Precautions

7-1．General handling

① The voltage must be applied to LED only as a forward direction. Moreover, please design

circuit diagram considering no voltage gap between Anode and Cathode during off state.

If the reverse voltage is applied to LED for a long term, the electro-migration is generated

and there is a possibility of the short-circuit of the circuit.

ꢀꢀꢀꢀ

② This product is sensitive for electrostatic voltageand surge voltage.Static electricity or surge

voltage can deteriorate product and its reliability. Please make sure that all devices and

equipments must be grounded.

We recommend to built in zener diode or TVS(Transient Voltage Suppression) as

protectioncircuit against static electricity.

③ This product is composed of blue LED chip and special phosphor.

Color tone is possibleto vary in some degree, depending on the operating conditions such

as ambient temperature or current amount. Also it is subject to variation due to the

afterglow of the phosphor in pulse drive.

So please verify the performancebefore use.

④ Do not look directly at LEDs with unshielded eyes, or damage to your eyes may result.

⑤ Materials with high thermal conductivity are used in this product in order to allow generated

heat to escape effectively out of the product.Avoid locating other heat sources

(ex. resistance, etc.) near the products on circuit board to protect the devices from the

heatdamage. Please make sure that case temperature is always under 100 ℃

during operation, including the self-heating.

⑥ Since dust on the surface of the radiation part is hard to remove and may decrease the

luminous intensity, please handle the products in a clean, non-dusty condition.

⑦ The lensof this product is formed with silicone resin. In the case of handling this device,

please do not push the lens portion by the sharp tools. The crackandpeeloffof the lens,

and the wire deformation are generated and it causes not lighting.

・ Especially do not apply the load from horizontal direction to the side of the lens of this product.

・ Please do not apply the static loadof 2.5N or more (1.4mmφor less)fromthe diagonal 45

degrees of this productslens portion to the direction of an optical axis.

⑧ This product is the small size andthe lens portion is formed by silicone resin, there isa

possibilityto have damage by the external stress.

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・ In the case of the handling withthe tweezers

In the case of the handling with the tweezers, please pick up the products with the sides of the

ꢀ

ceramic substrate and do not touch the lens portion .

・ In the case of the mount of the product

ꢀPlease use this productafter confirming the mounting condition,

because there is a possibility to have damage by the external stress

when the load is applied by the collet of the mounter.

Please see the recommended collet of this product as right picture.

1.66mm

1.2mm

2.6mm

3.2mm

⑨ Please make sure not to apply any external stress to resin after mounted as well.When the

substrate bends after mounted, the product might be applied by an external stress, and

thecrack will be generated in the soldering part.

Please arrange the product in the direction not stressed for thewarp of the substrate after

mounted.

⑩ Please do not pile the substrate after this product is mounted.This product will be damaged

by the substrate, and it causes the crack ofthe lens and not lighting bythe inner-wire

deformation or wiringdisconnection.

⑪ The products are not designed for the use under any of the following conditions. Please verify

their performance and reliability well enough if you use under any of the following conditions;

(1) In a place with a lot of moisture, dew condensation, briny air, and corrosive gas

(Cl, H2S, NH3, SO2, NOX, etc.)

(2) Under the direct sunlight, outdoor exposure, and in a dusty place

(3) In water, oil, medical fluid, and organic solvents

⑫ Guarantee covers the compliance to the quality standards mentioned in the Specifications;

however it does not cover the compatibility with application in the end-use, including assembly

and usage environment.

In case any quality problems occurred in the application of end-use, details will be separately

discussed and determined between the parties hereto.

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7-2 Soldering

This product is reflow ready model (within 2 times), but it is not ready for solder dipping.

ꢀ

Reflow

① Package temperature at reflow soldering is defined in the Fig. below. However, even

when it is under the profile condition, external stress can damage the internal packages.

Please test your reflow method and verify the solderability before use.

② Giving the soldering process promptly after opened aluminum package is recommended.

Soldering process must be completed including 2ndreflow as repairing within 7 days

(Temperature: 5 ℃ to 30 ℃ Relative humidity: 60% or less) after opened.

(Storage in a dry box after the first reflow is recommended.)

③ Recommended solder paste

Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD)

④ Recommended Temperature Profile

260( MAX)

1 to 2.5℃/s

1 to 4℃/s

220

200

150

60s (MAX)

60 to 120s

5s (MAX)

1 to 4℃/s

Time [second]

In order to secure the product reliability, it is recommended to control the peak temperature

and temperature gradient. Moreover, since the thermal conduction to the products depends

on the specification of the reflow machine, and the size and layout of the PCBs please test

your solder conditions carefully.

Moreover, after the reflow process, if the activator remains in the flux between anode and

cathode, the remaining activator might react during high temperature operation, and the

electro-migration is generated and there will be a possibility of a short-circuit. Please use

it after confirming the electro-migration is not generated while mounted actual.

sharp LD-E7-7-14-A

Model No. GM2BB**GT4E

“Contents in this technical document be changed without any notice due to the product modiﬁcation.”

http://www.sharp-world.com/products/device/

⑤ Recommended solder pad design

ꢀ

We recommend the metal mask of thickness 0.15mm for screen-printing. Solderability

depends on the reflow conditions, solder paste, and materials of the PCBs etc. Please test

and verify the solderability under the actual solder method.

Moreover, it might have a risk of short-circuit (leakage) with the electro-migration by the

remaining activator in the flux. Please make a suitable selection and test of the metal mask

in terms of pitch size and thickness before mass production.

2.8

1.15

0.25

（Unit：mm）

0.5

⑥ Precautions for PCB backside dip process

ꢀ

Please verify your conditions carefully in giving the dip process on the backside of the

PCBs, since the warped boards caused by heat and heat itself affect the inside of the

package. It is recommended to give the reflow process after dip process.

Though it is also available to give the reflow process before the dip process, the interval

of the two processes should be as short as possible.

7-3 Cleaning

・ Avoid cleaning the PCBs, since packages and resin are eroded by cleaning.

Please use the soldering paste without need of cleaning.

・ Avoid ultrasonic cleaning.

sharp LD-E7-7-14-A

http://www.sharp-world.com/products/device/

GM2BB50GT4E [SHARP]

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