LZ24BP [SHARP]

1/4-type Progressive-scan Color CCD Area Sensor with 350 k Pixels; 四分之一型逐行扫描彩色CCD区域传感器与350的k个像素


型号：	LZ24BP
厂家：	SHARP ELECTRIONIC COMPONENTS
描述：	1/4-type Progressive-scan Color CCD Area Sensor with 350 k Pixels 四分之一型逐行扫描彩色CCD区域传感器与350的k个像素传感器换能器图像传感器 CD
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LZ24BP

1/4-type Progressive-scan Color CCD

Area Sensor with 350 k Pixels

LZ24BP

DESCRIPTION

PIN CONNECTIONS

The LZ24BP is a 1/4-type (4.5 mm) solid-state

image sensor that consists of PN photo-diodes and

CCDs (charge-coupled devices). With approxi-

mately 350 000 pixels (692 horizontal x 504

vertical), the sensor provides a stable high-

resolution color image. All pixel signals can be read

independently via the vertical shift register and

horizontal shift register.

14-PIN HALF-PITCH WDIP

TOP VIEW

ØV2

ØV1

14 Ø^H2

13 ØH1

12 ØRS

11 NC

10 OFD

ØV3A

ØV3B

FEATURES

• Progressive scan

• Square pixel

GND

• Compatible with VGA format

• Number of effective pixels : 659 (H) x 494 (V)

• Number of optical black pixels

– Horizontal : 2 front and 31 rear

– Vertical : 8 front and 2 rear

• Number of dummy bits

(WDIP014-P-0400A)

PRECAUTIONS

– Horizontal : 16

– Vertical : 5

• The exit pupil position of lens should be more

than 25 mm from the top surface of the CCD.

• Refer to "PRECAUTIONS FOR CCD AREA

SENSORS" for details.

• Pixel pitch : 5.6 µm (H) x 5.6 µm (V)

• R, G, and B primary color mosaic filters

• Low fixed-pattern noise and lag

• No burn-in and no image distortion

• Blooming suppression structure

• Built-in output amplifier

• Built-in overflow drain voltage circuit and reset

gate voltage circuit

• Horizontal shift register clock and reset gate clock

voltage : 3.3 V (TYP.)

• Variable electronic shutter (1/30 to 1/10 000 s)

• Package :

14-pin half-pitch WDIP [Plastic]

(WDIP014-P-0400A)

Row space : 10.16 mm

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in

catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

LZ24BP

PIN DESCRIPTION

SYMBOL

PIN NAME

Output transistor drain

Output signals

ØRS

Reset transistor clock

Vertical shift register clock

Horizontal shift register clock

Overflow drain

ØV1, ØV2, ØV3A, ØV3B

ØH1, ØH2

OFD

P-well

GND

Ground

No connection

ABSOLUTE MAXIMUM RATINGS

PARAMETER

Output transistor drain voltage

Overflow drain voltage

(TA = +25 ˚C)

UNIT NOTE

SYMBOL

VOD

VOFD

VØRS

VØV

RATING

0 to +18

Internal output

–11.5 to +17.5

–0.3 to +12

–29 to 0

0 to +15

–40 to +85

–20 to +70

Reset gate clock voltage

Vertical shift register clock voltage

Horizontal shift register clock voltage

Voltage difference between P-well and vertical clock

Voltage difference between vertical clocks

Storage temperature

VØH

VPW-VØV

VØV-VØV

TSTG

˚C

Ambient operating temperature

TOPR

NOTES :

1. Do not connect to DC voltage directly. When OFD is connected to GND, connect VOD to GND. Overflow drain clock is

applied below 27 Vp-p.

2. Do not connect to DC voltage directly. When ØRS is connected to GND, connect VOD to GND. Reset gate clock is

applied below 8 Vp-p.

3. When clock width is below 10 µs, and clock duty factor is below 0.1%, voltage difference between vertical clocks will be

below 28 V.

LZ24BP

RECOMMENDED OPERATING CONDITIONS

PARAMETER

Ambient operating temperature

Output transistor drain voltage

Overflow drain clock p-p level

Ground

SYMBOL

MIN.

TYP. MAX. UNIT NOTE

TOPR

VOD

VØOFD

25.0

˚C

14.55 15.0 15.45

22.5

0.0

GND

P-well voltage

VPW

–10.0

VØVL

–8.5

VØV1L, VØV2L

VØV3AL, VØV3BL

VØV1I, VØV2I

VØV3AI, VØV3BI

VØV3AH, VØV3BH

VØH1L, VØH2L

VØH1H, VØH2H

VØRS

LOW level

–9.5

–9.0

0.0

Vertical shift

INTERMEDIATE level

HIGH level

LOW level

HIGH level

14.55 15.0 15.45

–0.05

3.0

Horizontal shift

0.0

3.3

0.05

5.5

Reset gate clock p-p level

3.0

fØV1, fØV2

fØV3A, fØV3B

fØH1, fØH2

fØRS

Vertical shift register clock frequency

15.73

kHz

Horizontal shift register clock frequency

Reset gate clock frequency

12.27

MHz

NOTES :

1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly.

2. VPW is set below VØVL that is low level of vertical shift register clock, or is used with the same power supply that is connected

to VL of V driver IC.

* To apply power, first connect GND and then turn on VOD. After turning on VOD, turn on PW first and then turn on other powers

and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied.

LZ24BP

CHARACTERISTICS (1/30 s progressive scan readout mode)

(TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS".

Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)

PARAMETER

Standard output voltage

Photo response non-uniformity

Saturation output voltage

Dark output voltage

Dark signal non-uniformity

Sensitivity (green channel)

Smear ratio

SYMBOL

MIN.

450

165

300

TYP. MAX. UNIT NOTE

150

PRNU

VSAT

VDARK

DSNU

SMR

ABL

0.5

230

–94

3.0

2.0

1, 5

1, 6

–86

1.0

Image lag

Blooming suppression ratio

Output transistor drain current

IOD

4.0

8.0

NOTES :

• Within the recommended operating conditions of VOD,

VOFD of the internal output satisfies with ABL larger than

300 times exposure of the standard exposure conditions,

and VSAT larger than 450 mV.

7. The average output voltage of G signal when a 1 000

lux light source with a 90% reflector is imaged by a lens

of F4, f50 mm.

8. The sensor is exposed only in the central area of V/10

square with a lens at F4, where V is the vertical image

size. SMR is defined by the ratio of the output voltage

detected during the vertical blanking period to the

maximum output voltage in the V/10 square.

1. TA = +60 ˚C

2. The average output voltage of G signal under uniform

illumination. The standard exposure conditions are

defined as when Vo is 150 mV.

3. The image area is divided into 10 x 10 segments under

the standard exposure conditions. Each segment's

voltage is the average output voltage of all pixels within

the segment. PRNU is defined by (Vmax – Vmin)/Vo,

where Vmax and Vmin are the maximum and minimum

values of each segment's voltage respectively.

4. The image area is divided into 10 x 10 segments. Each

segment's voltage is the average output voltage of all

pixels within the segment. VSAT is the minimum

segment's voltage under 10 times exposure of the

standard exposure conditions.

9. The sensor is exposed at the exposure level

corresponding to the standard conditions. AI is defined

by the ratio of the output voltage measured at the 1st

field during the non-exposure period to the standard

output voltage.

10. The sensor is exposed only in the central area of V/10

square, where V is the vertical image size. ABL is

defined by the ratio of the exposure at the standard

conditions to the exposure at a point where blooming is

observed.

5. The average output voltage under non-exposure

conditions.

6. The image area is divided into 10 x 10 segments under

non-exposure conditions. DSNU is defined by (Vdmax –

Vdmin), where Vdmax and Vdmin are the maximum and

minimum values of each segment's voltage respectively.

LZ24BP

PIXEL STRUCTURE

OPTICAL BLACK

(2 PIXELS)

1 pin

OPTICAL BLACK

(2 PIXELS)

OPTICAL BLACK

(31 PIXELS)

659 (H) x 494 (V)

OPTICAL BLACK

(8 PIXELS)

COLOR FILTER ARRAY

(1, 494)

(659, 494)

(1, 1)

(659, 1)

LZ24BP

TIMING CHART

VERTICAL TRANSFER TIMING

525 1

ØV1

ØV2

ØV3A

ØV3B

Ø^OFD

492

494

OB2

OB1

OB2

OB4

OB6

OB8

493

OB1 OB3

OB5

OB7

HORIZONTAL TRANSFER TIMING

780, 1

ØH1

ØH2

Ø^RS

107

PRE SCAN (16)

OB (2)

πππππ659

OB (31)

OUTPUT (659) 1πππππππππππ

ØV1

ØV2

ØV3A

ØV3B

ØOFD

READOUT TIMING

ØV1

ØV2

ØV3A

ØV3B

5.05 µs

39.8 µs (489 bits)

46.9 µs (576 bits)

63.5 µs (780 bits)

(62 bits)

LZ24BP

SYSTEM CONFIGURATION EXAMPLE

GND

OFD

GND

Ø^V3B

ØV3A

ØV1

ØRS

ØH1

Ø^V2

ØH2

POFD

VMb

VOFDH

VH3BX

OFDX

V^2X

V1X

V3B

V3A

V1B

V1A

VMa

VH1AX

V3X

VDD

GND

VH3AX

V^4X

VH1BX

PACKAGES FOR CCD AND CMOS DEVICES

PACKAGE

(Unit : mm)

14 WDIP (WDIP014-P-0400A)

0.03

±0.10

10.00

Center of effective imaging area

±0.10

9.00

(◊)

Glass Lid

and center of package

(◊ : Lid's size)

CCD

Package

0.03

CCD

Cross section A-A'

0.50

MAX.

Rotation error of die : ¬= 1.0˚

±0.50

±0.075

5.00

±0.10

0.25

TYP.

0.30

0.46

+0.5

–0

TYP.

10.16

P-1.27

0.25

PRECAUTIONS FOR CCD AREA SENSORS

(In the case of plastic packages)

1. Package Breakage

– The leads of the package are fixed with

package body (plastic), so stress added to a

lead could cause a crack in the package

body (plastic) in the jointed part of the lead.

In order to prevent the package from being broken,

observe the following instructions :

1) The CCD is a precise optical component and

the package material is ceramic or plastic.

Therefore,

Glass cap

Package

ø Take care not to drop the device when

mounting, handling, or transporting.

Lead

Fixed

ø Avoid giving a shock to the package.

Especially when leads are fixed to the socket

or the circuit board, small shock could break

the package more easily than when the

package isn’t fixed.

Stand-off

2) When applying force for mounting the device or

any other purposes, fix the leads between a

joint and a stand-off, so that no stress will be

given to the jointed part of the lead. In addition,

when applying force, do it at a point below the

stand-off part.

3) When mounting the package on the housing,

be sure that the package is not bent.

– If a bent package is forced into place

between a hard plate or the like, the pack-

age may be broken.

4) If any damage or breakage occurs on the sur-

face of the glass cap, its characteristics could

deteriorate.

(In the case of ceramic packages)

– The leads of the package are fixed with low

melting point glass, so stress added to a

lead could cause a crack in the low melting

point glass in the jointed part of the lead.

Therefore,

ø Do not hit the glass cap.

ø Do not give a shock large enough to cause

distortion.

ø Do not scrub or scratch the glass surface.

– Even a soft cloth or applicator, if dry, could

cause dust to scratch the glass.

Low melting point glass

Lead

2. Electrostatic Damage

As compared with general MOS-LSI, CCD has

lower ESD. Therefore, take the following anti-static

measures when handling the CCD :

Fixed

1) Always discharge static electricity by grounding

the human body and the instrument to be used.

To ground the human body, provide resistance

of about 1 M$ between the human body and

the ground to be on the safe side.

Stand-off

2) When directly handling the device with the

fingers, hold the part without leads and do not

touch any lead.

PRECAUTIONS FOR CCD AREA SENSORS

3) To avoid generating static electricity,

a. do not scrub the glass surface with cloth or

plastic.

ø The contamination on the glass surface

should be wiped off with a clean applicator

soaked in Isopropyl alcohol. Wipe slowly and

gently in one direction only.

b. do not attach any tape or labels.

c. do not clean the glass surface with dust-

cleaning tape.

– Frequently replace the applicator and do not

use the same applicator to clean more than

one device.

4) When storing or transporting the device, put it in

a container of conductive material.

◊ Note : In most cases, dust and contamination

are unavoidable, even before the device

is first used. It is, therefore, recommended

that the above procedures should be

taken to wipe out dust and contamination

before using the device.

3. Dust and Contamination

Dust or contamination on the glass surface could

deteriorate the output characteristics or cause a

scar. In order to minimize dust or contamination on

the glass surface, take the following precautions :

1) Handle the CCD in a clean environment such

as a cleaned booth. (The cleanliness level

should be, if possible, class 1 000 at least.)

2) Do not touch the glass surface with the fingers.

If dust or contamination gets on the glass

surface, the following cleaning method is

recommended :

4. Other

1) Soldering should be manually performed within

5 seconds at 350 °C maximum at soldering iron.

2) Avoid using or storing the CCD at high tem-

perature or high humidity as it is a precise

optical component. Do not give a mechanical

shock to the CCD.

ø Dust from static electricity should be blown

off with an ionized air blower. For anti-

electrostatic measures, however, ground all

the leads on the device before blowing off

the dust.

3) Do not expose the device to strong light. For

the color device, long exposure to strong light

will fade the color of the color filters.

LZ24BP [SHARP]

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