LZ2523 [SHARP]

1/5-type Color CCD Area Sensor with 320 k Pixels; 1月5日型彩色CCD传感器面积为320的k个像素


型号：	LZ2523
厂家：	SHARP ELECTRIONIC COMPONENTS
描述：	1/5-type Color CCD Area Sensor with 320 k Pixels 1月5日型彩色CCD传感器面积为320的k个像素传感器 CD
文件：	总11页 (文件大小：89K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LZ2523

1/5-type Color CCD Area Sensor

with 320 k Pixels

LZ2523

DESCRIPTION

PIN CONNECTIONS

The LZ2523 is a 1/5-type (3.6 mm) solid-state

image sensor that consists of PN photo-diodes

and CCDs (charge-coupled devices). With

approximately 320 000 pixels (542 horizontal x 582

vertical), the sensor provides a stable high-resolution

color image.

14-PIN HALF-PITCH WDIP

TOP VIEW

Ø^RS

NC1

14 GND

13 Ø^V4

12 ØV3

11 ØV2

10 ØV1

FEATURES

• Number of effective pixels : 512 (H) x 582 (V)

• Number of optical black pixels

– Horizontal : 2 front and 28 rear

• Pixel pitch : 5.8 µm (H) x 3.8 µm (V)

• Mg, G, Cy, and Ye complementary color filters

• Low fixed-pattern noise and lag

• No burn-in and no image distortion

• Blooming suppression structure

• Built-in output amplifier

NC²

ØH2

ØH1

OFD

(WDIP014-P-0400A)

• Built-in overflow drain voltage circuit and reset

gate voltage circuit

• Horizontal shift register clock voltage : 3.6 V (TYP.)

• Variable electronic shutter (1/50 to 1/10 000 s)

• Compatible with PAL standard

• Package :

PRECAUTIONS

• The exit pupil position of lens should be more

than 25 mm from the top surface of the CCD.

• Refer to "PRECAUTIONS FOR CCD AREA

SENSORS" for details.

14-pin half-pitch WDIP [Plastic]

(WDIP014-P-0400A)

Row space : 10.16 mm

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in

catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

LZ2523

PIN DESCRIPTION

SYMBOL

PIN NAME

Output transistor drain

Output signals

ØRS

Reset transistor clock

Vertical shift register clock

Horizontal shift register clock

Overflow drain

ØV1, ØV2, ØV3, ØV4

ØH1, ØH2

OFD

P-well

GND

Ground

NC1, NC2

No connection

ABSOLUTE MAXIMUM RATINGS

PARAMETER

Output transistor drain voltage

Overflow drain voltage

(TA = +25 ˚C)

UNIT NOTE

SYMBOL

VOD

VOFD

VØRS

VØV

RATING

0 to +18

Internal output

–11.5 to +17.5

–0.3 to +12

–29 to 0

0 to +15

–40 to +85

–20 to +70

Reset gate clock voltage

Vertical shift register clock voltage

Horizontal shift register clock voltage

Voltage difference between P-well and vertical clock

Voltage difference between vertical clocks

Storage temperature

VØH

VPW-VØV

VØV-VØV

TSTG

˚C

Ambient operating temperature

TOPR

NOTES :

1. Do not connect to DC voltage directly. When OFD is connected to GND, connect VOD to GND. Overflow drain clock is

applied below 27 Vp-p.

2. Do not connect to DC voltage directly. When ØRS is connected to GND, connect VOD to GND. Reset gate clock is

applied below 8 Vp-p.

3. When clock width is below 10 µs, and clock duty factor is below 0.1%, voltage difference between vertical clocks will be

below 28 V.

LZ2523

RECOMMENDED OPERATING CONDITIONS

PARAMETER

Ambient operating temperature

Output transistor drain voltage

Overflow drain clock p-p level

Ground

SYMBOL

MIN.

TYP. MAX. UNIT NOTE

TOPR

VOD

VØOFD

25.0

14.55 15.0 15.45

22.5

˚C

24.5

GND

0.0

P-well voltage

VPW

–10.0

–9.5

VØVL

–8.5

VØV1L, VØV2L

VØV3L, VØV4L

VØV1I, VØV2I

VØV3I, VØV4I

VØV1H, VØV3H

VØH1L, VØH2L

VØH1H, VØH2H

VØRS

LOW level

–9.0

0.0

Vertical shift

INTERMEDIATE level

HIGH level

LOW level

HIGH level

14.55 15.0 15.45

–0.05

3.3

Horizontal shift

0.0

3.6

5.0

0.05

5.5

Reset gate clock p-p level

4.5

fØV1, fØV2

fØV3, fØV4

fØH1, fØH2

fØRS

Vertical shift register clock frequency

15.63

kHz

Horizontal shift register clock frequency

Reset gate clock frequency

9.66

MHz

NOTES :

• Connect NC1 and NC2 to GND directly or through a capacitor larger than 0.047 µF.

1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly.

2. VPW is set below VØVL that is low level of vertical shift register clock, or is used with the same power supply that is connected

to VL of V driver IC.

* To apply power, first connect GND and then turn on VOD. After turning on VOD, turn on PW first and then turn on other powers

and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied.

LZ2523

CHARACTERISTICS (Drive method : Field accumulation)

(TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS".

Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)

PARAMETER

Standard output voltage

SYMBOL

MIN.

TYP. MAX. UNIT NOTE

150

Photo response non-uniformity

Saturation output voltage

Dark output voltage

Dark signal non-uniformity

Sensitivity

PRNU

VSAT

VDARK

DSNU

500

650

0.5

200

–80

3.0

2.0

1, 5

1, 6

145

Smear ratio

Image lag

SMR

–70

1.0

Blooming suppression ratio

Output transistor drain current

Output impedance

Vector breakup

Line crawling

Luminance flicker

ABL

IOD

1 000

4.0

350

8.0

˚, %

7.0

3.0

2.0

NOTES :

• Within the recommended operating conditions of VOD,

VOFD of the internal output satisfies with ABL larger than

1 000 times exposure of the standard exposure conditions,

and VSAT larger than 500 mV.

8. The sensor is exposed only in the central area of V/10

square with a lens at F4, where V is the vertical image

size. SMR is defined by the ratio of the output voltage

detected during the vertical blanking period to the

maximum output voltage in the V/10 square.

1. TA = +60 ˚C

2. The average output voltage under uniform illumination.

The standard exposure conditions are defined as when

Vo is 150 mV.

9. The sensor is exposed at the exposure level

corresponding to the standard conditions. AI is defined

by the ratio of the output voltage measured at the 1st

field during the non-exposure period to the standard

output voltage.

10. The sensor is exposed only in the central area of V/10

square, where V is the vertical image size. ABL is

defined by the ratio of the exposure at the standard

conditions to the exposure at a point where blooming is

observed.

11. Observed with a vector scope when the color bar chart

is imaged under the standard exposure conditions.

12. The difference between the average output voltage of the

(Mg + Ye), (G + Cy) line and that of the (Mg + Cy), (G +

Ye) line under the standard exposure conditions.

13. The difference between the average output voltage of

the odd field and that of the even field under the

standard exposure conditions.

3. The image area is divided into 10 x 10 segments under

the standard exposure conditions. Each segment's

voltage is the average output voltage of all pixels within

the segment. PRNU is defined by (Vmax – Vmin)/Vo,

where Vmax and Vmin are the maximum and minimum

values of each segment's voltage respectively.

4. The image area is divided into 10 x 10 segments. Each

segment's voltage is the average output voltage of all

pixels within the segment. VSAT is the minimum

segment's voltage under 10 times exposure of the

standard exposure conditions.

5. The average output voltage under non-exposure

conditions.

6. The image area is divided into 10 x 10 segments under

non-exposure conditions. DSNU is defined by (Vdmax –

Vdmin), where Vdmax and Vdmin are the maximum and

minimum values of each segment's voltage respectively.

7. The average output voltage when a 1 000 lux light

source with a 90% reflector is imaged by a lens of F4,

f50 mm.

LZ2523

PIXEL STRUCTURE

OPTICAL BLACK

(2 PIXELS)

OPTICAL BLACK

(28 PIXELS)

512 (H) x 582 (V)

1 pin

COLOR FILTER ARRAY

(1, 582)

(512, 582)

Cy Ye Cy Ye Cy

Mg Mg Mg

Ye Cy Ye Cy Ye

Mg Mg

Cy Ye Cy Ye Cy

Mg Mg

Ye Cy Ye Cy Ye

Mg Mg Mg

Cy Ye Cy Ye Cy

Ye Cy Ye Cy Ye

Cy Ye Cy Ye Cy

Mg Mg Mg

Ye Cy Ye Cy Ye

Mg Mg

Cy Ye Cy Ye Cy

Mg Mg

Cy Ye Cy Ye Cy

Ye Cy Ye Cy Ye

Mg Mg Mg

Ye Cy Ye Cy Ye

2nd, 4th

field

1st, 3rd

field

(1, 1)

(512, 1)

LZ2523

TIMING CHART

(1st, 3rd FIELD)

VERTICAL TRANSFER TIMING

Shutter speed

₂₂1/2 000 s

623

625

ØV1

ØV2

ØV3

ØV4

Ø^OFD

580 582

581

(2nd, 4th FIELD)

311

318

332

ØV1

ØV2

ØV3

ØV4

Ø^OFD

579 581

580 582

HORIZONTAL TRANSFER TIMING

618, 1

ØH1

ØH2

Ø^RS

OB (2)

OUTPUT (512) 1ππ

...

512

OB (28)

ØV1

ØV2

ØV3

ØV4

ØOFD

LZ2523

READOUT TIMING

(1st, 3rd FIELD)

618, 1

242

290

29 49

39 59

29 49

39 59

ØV1

161

449

ØV2

ØV3

290

338

24 54

180

34 64

ØV4

(2nd, 4th FIELD)

618, 1

242

290

29 49

39 59

ØV1

161

ØV2

ØV3

338

24 54

180

450

Ø^V4

LZ2523

SYSTEM CONFIGURATION EXAMPLE

Ø^RS

NC¹

GND

Ø^V4

ØV3

ØV2

NC2

ØH2

ØH1

ØV1

OFD

POFD

VMb

VOFDH

VH3BX

OFDX

V^2X

V1X

V3B

V3A

V1B

V1A

VMa

VH1AX

V3X

VDD

GND

VH3AX

V^4X

VH1BX

PACKAGES FOR CCD AND CMOS DEVICES

PACKAGE

(Unit : mm)

14 WDIP (WDIP014-P-0400A)

0.03

±0.10

10.00

Center of effective imaging area

±0.10

9.00

(◊)

Glass Lid

and center of package

(◊ : Lid's size)

CCD

Package

0.03

CCD

Cross section A-A'

0.50

MAX.

Rotation error of die : ¬= 1.0˚

±0.50

±0.075

5.00

±0.10

0.25

TYP.

0.30

0.46

+0.5

–0

TYP.

10.16

P-1.27

0.25

PRECAUTIONS FOR CCD AREA SENSORS

(In the case of plastic packages)

1. Package Breakage

– The leads of the package are fixed with

package body (plastic), so stress added to a

lead could cause a crack in the package

body (plastic) in the jointed part of the lead.

In order to prevent the package from being broken,

observe the following instructions :

1) The CCD is a precise optical component and

the package material is ceramic or plastic.

Therefore,

Glass cap

Package

ø Take care not to drop the device when

mounting, handling, or transporting.

Lead

Fixed

ø Avoid giving a shock to the package.

Especially when leads are fixed to the socket

or the circuit board, small shock could break

the package more easily than when the

package isn’t fixed.

Stand-off

2) When applying force for mounting the device or

any other purposes, fix the leads between a

joint and a stand-off, so that no stress will be

given to the jointed part of the lead. In addition,

when applying force, do it at a point below the

stand-off part.

3) When mounting the package on the housing,

be sure that the package is not bent.

– If a bent package is forced into place

between a hard plate or the like, the pack-

age may be broken.

4) If any damage or breakage occurs on the sur-

face of the glass cap, its characteristics could

deteriorate.

(In the case of ceramic packages)

– The leads of the package are fixed with low

melting point glass, so stress added to a

lead could cause a crack in the low melting

point glass in the jointed part of the lead.

Therefore,

ø Do not hit the glass cap.

ø Do not give a shock large enough to cause

distortion.

ø Do not scrub or scratch the glass surface.

– Even a soft cloth or applicator, if dry, could

cause dust to scratch the glass.

Low melting point glass

Lead

2. Electrostatic Damage

As compared with general MOS-LSI, CCD has

lower ESD. Therefore, take the following anti-static

measures when handling the CCD :

Fixed

1) Always discharge static electricity by grounding

the human body and the instrument to be used.

To ground the human body, provide resistance

of about 1 M$ between the human body and

the ground to be on the safe side.

Stand-off

2) When directly handling the device with the

fingers, hold the part without leads and do not

touch any lead.

PRECAUTIONS FOR CCD AREA SENSORS

3) To avoid generating static electricity,

a. do not scrub the glass surface with cloth or

plastic.

ø The contamination on the glass surface

should be wiped off with a clean applicator

soaked in Isopropyl alcohol. Wipe slowly and

gently in one direction only.

b. do not attach any tape or labels.

c. do not clean the glass surface with dust-

cleaning tape.

– Frequently replace the applicator and do not

use the same applicator to clean more than

one device.

4) When storing or transporting the device, put it in

a container of conductive material.

◊ Note : In most cases, dust and contamination

are unavoidable, even before the device

is first used. It is, therefore, recommended

that the above procedures should be

taken to wipe out dust and contamination

before using the device.

3. Dust and Contamination

Dust or contamination on the glass surface could

deteriorate the output characteristics or cause a

scar. In order to minimize dust or contamination on

the glass surface, take the following precautions :

1) Handle the CCD in a clean environment such

as a cleaned booth. (The cleanliness level

should be, if possible, class 1 000 at least.)

2) Do not touch the glass surface with the fingers.

If dust or contamination gets on the glass

surface, the following cleaning method is

recommended :

4. Other

1) Soldering should be manually performed within

5 seconds at 350 °C maximum at soldering iron.

2) Avoid using or storing the CCD at high tem-

perature or high humidity as it is a precise

optical component. Do not give a mechanical

shock to the CCD.

ø Dust from static electricity should be blown

off with an ionized air blower. For anti-

electrostatic measures, however, ground all

the leads on the device before blowing off

the dust.

3) Do not expose the device to strong light. For

the color device, long exposure to strong light

will fade the color of the color filters.

LZ2523 [SHARP]

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