PC123X1YFZ1B [SHARP]
Transistor Output Optocoupler,;
| 型号： | PC123X1YFZ1B |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Transistor Output Optocoupler, 输出元件 光电 |
| 文件： | 总15页 (文件大小：1481K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC123XxYSZ1BSeries
DIP 4pin Reinforced Insulation Type
Photocoupler
PC123XxYSZ1B
Series
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN62368
(as model No. PC123)
3. Approved by SEMKO, EN60065, EN60335-1, EN60950
(as model No. PC123)
Description
PC123XxYSZ1B Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-formoption.
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% (at IF=5mA,VCE=5V,Ta=25℃)
4. Approved by DEMKO, EN60065, EN60335-1,EN60950,
Features
1. 4-pin DIPpackage
2. Double transfer mold package
(Ideal for Flow Soldering)
3.Current transfer ratio
(CTR : MIN. 50% at IF=5 mA, VCE=5V, Ta=25℃)
4.Several CTR ranks available
5.Reinforced insulation type
(Isolation distance : MIN. 0.4mm)
6.Long creepage distance type
(wide lead-form type only : MIN. 8mm)
7.High isolation voltage between input and output
(Viso(rms) : 5kV)
(as model No. PC123)
5. Approved by NEMKO, EN60065,EN60335-1, EN60950
(as model No. PC123)
6. Approved by FIMKO, EN60065,EN60335-1, EN60950,
(as model No. PC123)
7.Recognized by CSA file No. CA95323
(as modelNo. PC123)
*
8. Approved by VDE, DIN EN60747-5-5( ) (as an option)
File No. 40008087 (as model No. PC123)
9.Package resin : UL flammability grade (94V - 0)
() DIN EN60747-5-5 : successor standard of DIN VDE0884.
Applications
8.RoHS directivecompliant
1. I/O isolation for MCUs (Micro ControllerUnits)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials andimpedances
4. Over voltagedetection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specificationsheets, SHARP takes no responsibilityfor any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specificationsheets before using any SHARPdevice.
Sheet No.: OP18001EN
Date Jan.15. 2018
© SHARPCorporation
1
PC123XxYSZ1BSeries
Internal ConnectionDiagram
1 Anode
4
3
1
2
2 Cathode
3 Emitter
4 Collector
Outline Dimensions
(Unit : mm)
１． Through-Hole
２．SMT GullwingLead-Form
[ex. PC123XNYSZ1B]
[ex. PC123XNYIP1B]
Product mass : approx.0.22g
Product mass : approx.0.23g
３． Wide Through-Hole Lead-Form
４． Wide SMT GullwingLead-Form
[ex. PC123XNYFZ1B]
[ex. PC123XNYUP1B]
Product mass : approx.0.23g
Product mass : approx.0.22g
Sheet No.: OP18001EN
2
PC123XxYSZ1BSeries
Date code indication (Ex.)
3-digit number shall be marked the age indication of 1-digit number, and week code of 2-digit number.
Week code “01” indicate the week including the first Thursday of January. And later, Monday is the starting
point.
Year Week
Date code
652
701
702
703
・
MON
12/26
1/2
1/9
1/16
・
TUE
12/27
1/3
1/10
1/17
・
WED
12/28
1/4
1/11
1/18
・
THU
12/29
1/5
1/12
1/19
・
FRI
12/30
1/6
1/13
1/20
・
SAT
12/31
1/7
1/14
1/21
・
SUN
1/1
1/8
1/15
1/22
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
752
751
752
801
12/11
12/18
12/25
1/1
12/12
12/19
12/26
1/2
12/13
12/20
12/27
1/3
12/14
12/21
12/28
1/4
12/15
12/22
12/29
1/5
12/16
12/23
12/30
1/6
12/17
12/24
12/31
1/7
Factory identification mark and Plating material
Factory identification Mark
Country of origin
Plating material
SnBi (Bi : 1 4%)
K
Japan
～
Rankmark
Refer to the Model Line-uptable.
Sheet No.: OP18001EN
3
PC123XxYSZ1BSeries
Absolute Maximum Ratings
(T 25̊C)
a
Parameter
Symbol
IF
Rating
Unit
mA
A
Forward current
*1 Peak forward current
50
1
IFM
Input
Reverse voltage
VR
6
V
Power dissipation
P
70
80
6
mW
V
Collector-emitter voltage
VCEO
VECO
Emitter-collector voltage
Output
V
Collector current
Collector power dissipation
Total power dissipation
*2 Isolation voltage
IC
50
150
200
5
mA
mW
mW
kV
PC
Ptot
Viso(rms)
Topr
Operating temperature
Storage temperature
*2 Soldering temperature
30 to 100
̊C
Tstg
55 to 125
̊C
270
C
Tsol
*1 Pulse width≦100μs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute
*3 For 10s
Electro-opticalCharacteristics
(T 25̊C)
a
Parameter
Symbol
VF
Condition
MIN.
TYP.
1.2
MAX.
1.4
Unit
V
Forward voltage
I 20mA
F
80
Reverse current
Input
IR
VR 4V
10
A
30
Terminal capacitance
Dark current
Ct
V 0, f 1kHz
250
100
pF
nA
V
VCE 50V,I
0
ICEO
BVCEO
BVECO
IC
F
Collector-emitter breakdown voltage
Output
IC 0.1mA, I
0
F
20
Emitter-collector breakdown voltage
Collector current
I
10 A, I 0
6
E
F
5mA, V 5V
V
I
2.5
mA
V
F
F
CE
0.1
Collector-emitter saturation voltage
VCE(sat)
RISO
Cf
I
20mA, I 1mA
C
0.2
Isolation resistance
Transfer
DC500V, 40 to 60%RH
V 0, f 1MHz
5×1010 1×1011
Ω
1.0
charac
Floating capacitance
Cut-off frequency
0.6
pF
kHz
fC
VCE 5V, I 2mA, R 100 , 3dB
C L Ω
80
teristics
Risetime
Fall time
tr
4
18
s
s
Responsetime
VCE 2V, I 2mA, R 100
C L
Ω
tf
3
18
Sheet No.: OP18001EN
4
PC123XxYSZ1BSeries
Model Line-up
IC[mA]
Lead Form
Through-Hole
Sleeve
(IF=5mA,
VCE=5V,
Ta=25˚C)
Rank mark
100pcs/sleeve
Package
PC123XNYSZ1B
PC123X1YSZ1B
PC123X2YSZ1B
PC123X5YSZ1B
PC123X8YSZ1B
2.5～20
2.5～7.5
5.0～12.5
10～20
with or “ _ “
L
M
N
E
Model No.
5.0～10
IC[mA]
Lead Form
Package
Wide Through-Hole
Sleeve
(IF=5mA,
VCE=5V,
Ta=25˚C)
Rank mark
100pcs/sleeve
PC123XNYFZ1B
PC123X1YFZ1B
PC123X2YFZ1B
PC123X5YFZ1B
PC123X8YFZ1B
2.5～20
2.5～7.5
5.0～12.5
10～20
with or “ _ “
L
M
N
E
Model No.
5.0～10
IC[mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
Lead Form
Package
SMT Gullwing
Taping
Rank mark
2,000pcs/reel
PC123XNYIP1B
PC123X1YIP1B
PC123X2YIP1B
PC123X5YIP1B
PC123X8YIP1B
2.5～20
2.5～7.5
5.0～12.5
10～20
with or “ _ “
L
M
N
E
Model No.
5.0～10
IC[mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
Lead Form
Package
Wide SMT Gullwing
Taping
Rank mark
2,000pcs/reel
PC123XNYUP1B
PC123X1YUP1B
PC123X2YUP1B
PC123X5YUP1B
PC123X8YUP1B
2.5～20
2.5～7.5
5.0～12.5
10～20
with or “ _ “
L
M
N
E
Model No.
5.0～10
Please contact a local SHARP sales representative to inquire about productionstatus.
Sheet No.: OP18001EN
5
PC123XxYSZ1BSeries
Fig.2 Diode Power Dissipationvs.
Fig.1 Forward Current vs.Ambient
Temperature
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
Sheet No.: OP18001EN
6
PC123XxYSZ1BSeries
Fig.7 Current Transfer Ratio vs.
Forward Current
Fig.8 Collector Current vs.
Collector-emitterVoltage
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. AmbientTemperature
Fig.11 Collector Dark Current vs.
Ambient Temperature
Fig.12 Collector-emitter Saturation Voltage vs.
Forward Current
Sheet No.: OP18001EN
7
PC123XxYSZ1BSeries
Fig.13 Response Timevs.
Load Resistance
Fig.14 Test Circuit for Response Time
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: OP18001EN
8
PC123XxYSZ1BSeries
Design Considerations
● Designguide
While operating at IF〈1mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the designconsideration.
● Recommended foot print (reference)
Wide SMT Gullwinglead-form
SMT Gullwinglead-form
10.2
8.2
2.2
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic ApplicationNotes.
Sheet No.: OP18001EN
9
PC123XxYSZ1BSeries
Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more thantwice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering:
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the be-
low listedguidelines.
Flow soldering should be completed below 270℃ and within 10s.
Preheating is within the bounds of 100 to 150℃ and 30 to 80s.
Please don't solder more thantwice.
Handsoldering
Hand soldering should be completed within 3s when the point of solder iron is below 400℃.
Please don't solder more thantwice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: OP18001EN
10
PC123XxYSZ1BSeries
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of thedevice.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
massproduction.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packagingresin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane(Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
(1) The RoHS directive(2011/65/EU)
This product complies with the RoHS directive(2011/65/EU)
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls
（PBB）and polybrominated diphenyl ethers（PBDE）
(2) Content of six substances specified in Management Methods for Control of Pollution Caused
by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Marking Styles for the Names and Contents of the Hazardous Substances
Hazardous Substances
Polybrominated
biphenyls
Polybrominated
diphenyl ethers
Hexavalent
chromium
(Cr6+)
Category
Lead
Mercury
Cadmium
(Cd)
(Pb)
(Hg)
(PBB)
○
(PBDE)
○
Photocoupler
○
○
○
○
This table is prepared in accordance with the provisions of SJ/T 11364.
○：Indicates that said hazardous substance contained in all of the homogeneous materials
for this part is below the limit requirement of GB/T 26572.
Sheet No.: OP18001EN
11
PC123XxYSZ1BSeries
Packagespecification
● Sleevepackage
1. Through-Hole, WideThrough-Hole
Packagematerials
Sleeve : HIPS/PS or PC (with anti-staticmaterial)
Stopper : EPM
Packagemethod
MAX. 100pcs. of products shall be packaged in a sleeve and both of sleeve edges shall be fixed by stoppers.
MAX. 25 sleeves (Product : 2,500pcs.) above shall be packaged in inner case and sealed by tape .
Max 2 bags(product : 5,000pcs) above shall be packaged in packing case , and put a cushioning material inside.
Sleeve outlinedimensions
8.8 ± 0.2
6.5 ± 0.2
14.2 ± 0.2
500 ± 2
(Unit : mm)
Sheet No.: OP18001EN
12
PC123XxYSZ1BSeries
● Tapeand Reelpackage
1. SMTGullwing
Packagematerials
Carrier tape : PS
Cover tape : PET (three layersystem)
Reel : PS
Carrier tape structure andDimensions
(Unit : mm)
Dimensions List
A
16.00.3
B
7.50.1
I
C
1.750.10
J
D
8.00.1
E
2.00.1
F
G
0.1
4.00.1
1.5
0.0
H
K
10.30.1
0.400.05
4.00.1
5.30.1
Reel structure and Dimensions
Dimensions List
(Unit : mm)
a
330
e
b
17.51.5
f
c
d
1001 13.00.5
g
2.00.5
2.00.5
21.01
Direction of productinsertion
[Packing : 2,000pcs/reel]
Sheet No.: OP18001EN
13
PC123XxYSZ1BSeries
2. Wide SMT Gullwing
Packagematerials
Carrier tape : PS
Cover tape : PET (three layersystem)
Reel : PS
Carrier tape structure andDimensions
Dimensions List
(Unit : mm)
A
B
11.50.1
I
C
1.750.10
J
D
8.00.1
E
2.00.1
F
G
0.1
24.00.3
4.00.1
1.5
0.0
H
K
12.50.1
0.400.05
4.050.1
5.30.1
Reel structure and Dimensions
Dimensions List
(Unit : mm)
a
b
c
d
25.51.5
330
e
1001 13.00.5
f
g
2.00.5
2.00.5
231
Direction of productinsertion
[Packing : 2,000pcs/reel]
Sheet No.: OP18001EN
14
PC123XxYSZ1BSeries
Important Notices
·The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP'sdevices.
with equipment that requires higher reliability suchas:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles,etc.)
--- Trafficsignals
--- Gas leakage sensor breakers
--- Alarmequipment
--- Various safety devices,etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
·Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
withoutnotice.
--- Spaceapplications
--- Telecommunication equipment [trunk lines]
--- Nuclear power controlequipment
--- Medical and other life support equipment (e.g.,
scuba).
·If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
·Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i)The devices in this publication are designed for use in
general electronic equipment designs such as:
--- Personalcomputers
·This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automationequipment
--- Telecommunication equipment [terminal]
--- Testand measurement equipment
--- Industrialcontrol
--- Audio visualequipment
--- Consumerelectronics
(ii)Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
·Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
Sheet No.: OP18001EN
[E253]
15
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