PC713V1NIPX [SHARP]
Transistor Output Optocoupler, 1-Element, 5000V Isolation, SMT, PLASTIC, DIP-6;
| 型号： | PC713V1NIPX |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Transistor Output Optocoupler, 1-Element, 5000V Isolation, SMT, PLASTIC, DIP-6 输出元件 光电 |
| 文件： | 总14页 (文件大小：259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC713VxNSZX Series
DIP 6 pin Includes Base Terminal
Connection Photocoupler
PC713VxNSZX
Series
■ Description
PC713VxNSZX Series contains an IRED optically
coupled to a phototransistor.
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC713V)
It is packaged in a 6 pin DIP, available in SMT gullw-
ing lead-form option.
2. Approved by TÜV (VDE0884) (as an option) file No.
R-9151576 (as model No. PC713V)
Input-output isolation voltage(rms) is 5.0kV.
3. Package resin : UL flammability grade (94V-0)
(*)
Collector-emitter voltage is 80V and CTR is 50%
to 600% at input current of 5mA.
■ Applications
1. Home appliances
■ Features
1. 6 pin DIP package
2. Programmable controllers
3. Personal computer peripherals
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. With base terminal
(*)
4. High collector-emitter voltage (VCEO:80V )
5. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
(*) Up to Date code "P7" (July 2002) VCEO : 35V.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A04301EN
1
Date Nov. 28. 2003
© SHARP Corporation
PC713VxNSZX Series
■ Internal Connection Diagram
1
2
3
4
5
6
Anode
Cathode
NC
1
6
5
4
2
3
Emitter
Collector
Base
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PC713VxNSZX]
2. Through-Hole (VDE0884 option) [ex. PC713VxYSZX]
0.3
0.3
1.2
1.2
0.2
0.2
0.6
0.6
VDE0884
Identification mark
6
5
4
SHARP
mark
"S"
6
5
4
SHARP
mark
"S"
P C 7 1 3 V
P C 7 1 3 V
Anode
mark
Anode
mark
4
Date code
Date code
Rank mark
1
2
3
1
2
3
0.3
0.5
7.12
7.12
0.3
0.3
7.62
7.62
Rank mark
Epoxy resin
Epoxy resin
0.1
0.1
0.25
0.5
0.25
0.5
2.54
2.54
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
3. SMT Gullwing Lead-Form [ex. PC713VxNIPX]
4. SMT Gullwing Lead-Form (VDE0884 option)
[ex. PC713VxYIPX]
0.3
0.3
1.2
1.2
0.2
6
0.2
6
0.6
0.6
VDE0884
5
4
5
4
Identification mark
SHARP
mark
"S"
SHARP
mark
"S"
P C 7 1 3 V
P C 7 1 3 V
Anode
mark
4
Date code
Rank mark
Date code
Rank mark
1
2
3
1
2
3
Anode
mark
0.5
0.5
7.12
7.12
0.3
0.3
7.62
7.62
0.25
0.25
2.54
Epoxy resin
+0.4
+0.4
2.54
Epoxy resin
+0.4
+0.4
1.0
1.0
−0
−0
1.0
1.0
−0
−0
+0
+0
10.0
−0.5
10.0
−0.5
Product mass : approx. 0.36g
Sheet No.: D2-A04301EN
2
PC713VxNSZX Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
Refer to the Model Line-up
Sheet No.: D2-A04301EN
3
PC713VxNSZX Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
50
1
Forward current
*1 Peak forward current
Reverse voltage
IFM
VR
6
V
Power dissipation
P
70
80
6
mW
V
*4
*4
Collector-emitter voltage
Emitter-collector voltage
Collector-base voltage
Emitter-base voltage
Collector current
VCEO
VECO
VCBO
VEBO
IC
V
80
6
V
V
50
150
170
mA
mW
mW
˚C
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
*2 Isolation voltage
*3 Soldering temperature
PC
Ptot
Topr
Tstg
−25 to +100
−40 to +125
˚C
Viso (rms)
Tsol
5
kV
˚C
260
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
*4 Up to Date code "P7" (July 2002) VCEO : 35V, VCBO : 35V.
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
MAX.
1.4
3.0
10
250
100
−
Unit
V
Forward voltage
IF=20mA
IFM=0.5A
−
1.2
Peak forward voltage
Reverse current
VFM
IR
−
−
−
V
Input
VR=4V
−
µA
pF
nA
V
Terminal capacitance
Collector dark current
Ct
V=0, f=1kHz
−
30
−
ICEO
VCE=50V, IF=0
−
*5
*5
Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
IE=10µA, IF=0
80
−
Output
Emitter-base breakdown voltage
Collector-base breakdown voltage
Current transfer ratio
BVEBO
BVCBO
IC
6
−
−
V
IC=0.1mA, IF=0
IF=5mA, VCE=5V
IF=20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
80
−
−
V
2.5
−
30
0.2
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
0.1
1×1011
0.6
80
4
Isolation resistance
Floating capacitance
Cut-off frequency
RISO
Cf
fC
5×1010
Ω
Transfer
charac-
teristics
−
−
−
−
1.0
−
pF
kHz
µs
µs
VCE=5V, IC=2mA, RL=100Ω −3dB
Rise time
tr
18
18
Response time
VCE=2V, IC=2mA, RL=100Ω
Fall time
tf
3
*5 Up to Date code "P7" (July 2002) BVCEO≥35V and BVCBO≥35V.
Sheet No.: D2-A04301EN
4
PC713VxNSZX Series
■ Model Line-up
Lead Form
Through-Hole
SMT Gullwing
IC [mA]
Sleeve
Taping
1 000pcs / reel
−−−−−− Approved
(IF=5mA,
VCE=5V,
Ta=25˚C)
Package
Rank mark
50pcs / sleeve
VDE0884
−−−−−−
Approved
−−−−−−
Approved
2.5 to 30.0
4.0 to 8.0
PC713V0NSZX PC713V0YSZX PC713V0NIZX PC713V0YIZX PC713V0NIPX PC713V0YIPX with or with out
PC713V1NSZX PC713V1YSZX PC713V1NIZX PC713V1YIZX PC713V1NIPX PC713V1YIPX
PC713V2NSZX PC713V2YSZX PC713V2NIZX PC713V2YIZX PC713V2NIPX PC713V2YIPX
PC713V3NSZX PC713V3YSZX PC713V3NIZX PC713V3YIZX PC713V3NIPX PC713V3YIPX
PC713V5NSZX PC713V5YSZX PC713V5NIZX PC713V5YIZX PC713V5NIPX PC713V5YIPX
PC713V6NSZX PC713V6YSZX PC713V6NIZX PC713V6YIZX PC713V6NIPX PC713V6YIPX
PC713V8NSZX PC713V8YSZX PC713V8NIZX PC713V8YIZX PC713V8NIPX PC713V8YIPX
A
B
6.5 to 13.0
10.0 to 20.0
4.0 to 13.0
6.5 to 20.0
4.0 to 20.0
Model No.
C
A or B
B or C
A, B or C
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A04301EN
5
PC713VxNSZX Series
Fig.1 Forward Current vs. Ambient
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Temperature
60
100
50
40
30
20
80
70
60
40
20
0
10
0
0
75
Ambient temperature Ta (˚C)
100
-25
25
50
125
−25
0
25
55
75
100
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
200
Temperature
250
200
150
170
150
100
50
0
100
50
0
−25
0
25
50
75
100
125
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
10
Pulse width≤100µs
Ta=75˚C
Ta=25˚C
50˚C
25˚C
100
0˚C
1
−25˚C
10
0.1
1
0.01
10−3
10−2
Duty ratio
10−1
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward voltage VF (V)
Sheet No.: D2-A04301EN
6
PC713VxNSZX Series
Fig.8 Collector Current vs. Collector-
Fig.7 Current Transfer Ratio vs. Forward
Current
emitter Voltage
30
200
RBE=∞
Ta=25˚C
IF=30mA
VCE=5V
Ta=25˚C
180
25
160
140
PC (MAX.)
20mA
20
120
RBE=∞
15
100
80
60
40
500kΩ
10mA
10
100kΩ
5mA
5
20
0
0
0
1
2
3
4
5
6
7
8
9
1
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Fig.10 Collector - emitter Saturation Voltage
Ambient Temperature
150
vs. Ambient Temperature
0.14
IF=20mA
IF=5mA
VCE=5V
RBE=∞
IC=1mA
RBE=∞
0.12
0.10
0.08
0.06
100
50
0
0.04
0.02
−25
0
20
40
60
80
100
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta(˚C)
Fig.11 Collector Dark Current vs. Ambient
Fig.12 Collector-base Dark Current vs.
Ambient Temperature
Temperature
10−5
10−8
VCE=50V
VCB=50V
RBE=∞
RBE=∞
10−6
10−7
10−8
10−9
10−10
10−11
10−9
10−10
10−11
−25
0
25
50
75
100
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A04301EN
7
PC713VxNSZX Series
Fig.13 Response Time vs. Load Resistance
Fig.14 Test Circuit for Response Time
VCE=2V
IC=2mA
Input
VCC
RBE=∞
100
10
Output
Ta=25˚C
Input
RD
RL
10%
90%
Output
VCE
tr
tf
td
ts
tr
tf
td
ts
1
Please refer to the conditions in Fig.13
0.1
0.1
1
10
Load resistance RL (kΩ)
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
VCC
VCE=5V
IC=2mA
RBE=∞
0
RL
RD
Ta=25˚C
Output
VCE
100Ω
RL=10kΩ
1kΩ
−10
Please refer to the conditions in Fig.15
−20
1
10
100
Frequency f (kHz)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A04301EN
8
PC713VxNSZX Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
● Recommended Foot Print (reference)
8.2
2.2
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A04301EN
9
PC713VxNSZX Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A04301EN
10
PC713VxNSZX Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A04301EN
11
PC713VxNSZX Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A04301EN
12
PC713VxNSZX Series
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
J
F
D
G
I
E
K
Dimensions List
(Unit:mm)
A
B
C
D
E
F
G
0.3
0.1
0.1
0.1
0.1
0.1
0.1
+0.1
16.0
H
7.5
1.75
J
12.0
K
2.0
4.0
φ1.5
−0
I
0.05
0.1
0.1
10.4
0.4
4.2
7.8
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
1.5
1.0
0.5
330
e
17.5
f
100
g
13
f
b
1.0
0.5
0.5
a
23
2.0
2.0
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A04301EN
13
PC713VxNSZX Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A04301EN
14
相关型号：
PC713V1YIZXF
Transistor Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, SMT, DIP-6
SHARP
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