PC81100NSZC [SHARP]

Transistor Output Optocoupler,;


型号：	PC81100NSZC
厂家：	SHARP ELECTRIONIC COMPONENTS
描述：	Transistor Output Optocoupler,
文件：	总6页 (文件大小：74K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PC8110XNSZ Series

Photocoupler with Built-in

Schottky Barrier Diode

PC8110XNSZ Series

■ Features

■ Outline Dimensions

(Unit : mm)

1. High speed response at turn-off time due to built-in

schottky barrier diode

Anode mark

Internal connection

diagram

2. 4-pin DIP package

3. Isolation voltage (Viso : 5kVrms)

8 1 1 0

■ Applications

6.5^±0.5

1. Refrigerators

Anode

Cathode

Emitter

2. Air conditioners

3. Various home appliances

Collector

■ Rank Table

7.62^±0.3

4.58^±0.5

Model No.

Rank mark

Ic (mA)

2.5 to 20

3.0 to 6.0

5.0 to 10

7.5 to 15

3.0 to 10

5.0 to 15

3.0 to 15

Conditions

PC81100NSZ A, B, C or no mark

PC81101NSZ

PC81102NSZ

PC81103NSZ

PC81105NSZ

PC81106NSZ

PC81108NSZ

I^F=5mA

VCE=5V

T^a=25°C

Epoxy resin

A or B

B or C

A, B or C

0.26^±0.1

0.5^±0.1

θ : 0 to 13°

■ Absolute Maximum Ratings

(Ta=25°C)

Parameter

Symbol

Rating

Unit

Forward current

^*1Peak forward current

Reverse voltage

Power dissipation

Collector-emitter voltage

Emitter-collector voltage

Collector current

Collector power dissipation

Total power dissipation

Operating temperature

IFM

1.0

Input

VCEO

VECO

0.1

Output

150

200

Ptot

Topr

T^stg

Viso

Tsol

−30 to +100

−55 to +125

°C

Storage temperature

^*2Isolation voltage

kVrms

°C

260

Soldering temperature

*1 Pulse width<=100µs, Duty ratio=0.001

*2 40 to 60%RH, AC for 1 minute, f=60Hz

*3 For 10 seconds

Notice

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/

PC8110XNSZ Series

■ Electro-optical Characteristics

(Ta=25°C)

Parameter

Symbol

Conditions

I^F=20mA

I^FM=0.5A

MIN.

−

TYP.

1.2

−

MAX.

1.4

Unit

Forward voltage

V^F

Peak forward voltage

Reverse current

Terminal capacitance

Collector dark current

Collector-emitter breakdown voltage

Collector current

3.0

V^FM

−

V^R=4V

−

µA

250

100

−

V=0, f=1kHz

−

ICEO

BVCEO

V^CE=50V, IF=0

I^C=0.1mA, IF=0

IF=5mA, VCE=5V

I^F=20mA, IC=1mA

DC500V, 40 to 60%RH

V=0, f=1MHz

−

2.5

−

5×10¹⁰

−

Collector-emitter saturation voltage

VCE (sat)

0.15

1×10¹¹

0.6

0.35

−

Ω

Isolation resistance

Floating capacitance

RISO

1.0

100

Rise time

Not saturated

−

V^CE=2V, IC=2mA, RL=100Ω

Fall time

t^on

Turn-on time

Saturated 1

Saturated 2

Storage time

Turn-off time

Turn-on time

Storage time

Turn-off time

V^CC=5V, IF=20mA, RL=10kΩ

µs

toff

ton

V^CC=5V, IF=20mA, RL=100kΩ

toff

*4 It has negative resistance characteristics due to built-in base-emitter resistance.

Please be careful not to apply voltage that exceed absolute maximum rating.

Fig.1 Forward Current vs. Ambient

Temperature

Fig.2 Diode Power Dissipation vs. Ambient

Temperature

100

−30

50 55 75

100

125

−30

50 55 75

100

125

Ambient temperature T_a(°C)

PC8110XNSZ Series

Fig.3 Collector Power Dissipation vs.

Fig.4 Total Power Dissipation vs. Ambient

Ambient Temperature

Temperature

250

200

150

100

200

150

100

−30

100

125

−30

100

125

Ambient temperature T_a(°C)

Fig.5 Peak Forward Current vs. Duty Ratio

Fig.6 Forward Current vs. Forward Voltage

100

2000

1000

500

Pulse width <=100µs

T_a=25°C

T_a=100°C

T_a=75°C

T_a=50°C

T_a=25°C

T_a=0°C

T_a=−25°C

200

100

10⁻³

10⁻²

Duty ratio

10⁻¹

1.0

2.0

3.0

Forward voltage V_F(V)

Fig.8 Collector Current vs. Collector-emitter

Fig.7 Current Transfer Ratio vs. Forward

Current

Voltage

200

P_C(MAX.)

V_CE=5V

T_a=25°C

180

I_F=30mA

160

140

120

100

I_F=20mA

I_F=10mA

I_F=5mA

I_F=3mA

100

Collector-emitter voltage V_CE(V)

Forward current I_F(mA)

PC8110XNSZ Series

Fig.10 Collector - emitter Saturation Voltage

Fig.9 Relative Current Transfer Ratio vs.

Ambient Temperature

vs. Ambient Temperature

0.20

140

V_CE=5V

I_F=20mA

0.18

I_F=5mA

120

I_C=1mA

0.16

0.14

0.12

0.10

0.08

0.06

0.04

100

0.02

−30 −20 −10

10 20 30 40 50 60 70 80 90 100

−30 −20 −10

10 20 30 40 50 60 70 80 90 100

Ambient temperature T_a(°C)

Fig.11 Collector Dark Current vs. Ambient

Temperature

Fig.12 Response Time vs. Load Resistance

(saturated mode)

100

10⁻⁵

V_CE=50V

10⁻⁶

10⁻⁷

10⁻⁸

10⁻⁹

t_off

t_s

t_on

10⁻¹⁰

10⁻¹¹

V_CC=5V

I_F=20mA

T_a=25°C

0.1

−30 −20 −10

10 20 30 40 50 60 70 80 90 100

100

Ambient temperature T_a(°C)

Load resistance R_L(kΩ)

Fig.14 Voltage gain vs Frequency

Fig.13 Response Time vs. Load Resistance

(not saturated made)

100

V_CE=2V

R_L=100Ω

I_C=2mA

t_r

t_f

R_L=10kΩ

−5

1kΩ

−10

t_d

100Ω

t_s

−15

V_CE=2V

I_C=2mA

T_a=25°C

−20

−25

0.1

100

1000

Frequency response f (kHz)

Load resistance R_L(kΩ)

PC8110XNSZ Series

Fig.16 Reflow Soldering

Fig.15 Collector-emitter Saturation Voltage

vs. Forward Current

Only one time soldering is recommended within the temperature

profile shown below.

I_C=7mA

T_a=25°C

230°C

I_C=5mA

I_C=3mA

200°C

180°C

I_C=1mA

I_C=0.5mA

25°C

10 seconds

30 seconds

2 minutes

1 minute

Forward current I_F(mA)

Application Circuits

NOTICE

●The circuit application examples in this publication are provided to explain representative applications of

SHARP devices and are not intended to guarantee any circuit design or license any intellectual property

rights. SHARP takes no responsibility for any problems related to any intellectual property right of a

third party resulting from the use of SHARP's devices.

●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the specifications, characteristics, data, materials,

structure, and other contents described herein at any time without notice in order to improve design or

reliability. Manufacturing locations are also subject to change without notice.

●Observe the following points when using any devices in this publication. SHARP takes no responsibility

for damage caused by improper use of the devices which does not meet the conditions and absolute

maximum ratings to be used specified in the relevant specification sheet nor meet the following

conditions:

(i) The devices in this publication are designed for use in general electronic equipment designs such as:

--- Personal computers

--- Office automation equipment

--- Telecommunication equipment [terminal]

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and

safety when SHARP devices are used for or in connection with equipment that requires higher

reliability such as:

--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely

high level of reliability and safety such as:

--- Space applications

--- Telecommunication equipment [trunk lines]

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g., scuba).

●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"

applications other than those recommended by SHARP or when it is unclear which category mentioned

above controls the intended use.

●If the SHARP devices listed in this publication fall within the scope of strategic products described in the

Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export

such SHARP devices.

the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any

means, electronic or mechanical, for any purpose, in whole or in part, without the express written

permission of SHARP. Express written permission is also required before any use of this publication

may be made by a third party.

●Contact and consult with a SHARP representative if there are any questions about the contents of this

publication.

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