PC844X1J000FA [SHARP]
Transistor Output Optocoupler, 1-Element, 5000V Isolation,;
| 型号： | PC844X1J000FA |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Transistor Output Optocoupler, 1-Element, 5000V Isolation, |
| 文件： | 总12页 (文件大小：237K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC844XJ0000F Series
DIP 16pin (4-channel)
AC Input Photocoupler
PC844XJ0000F
Series
∗1-channel package type is also available.
(model No. PC814XJ0000F Series)
■ Description
PC844XJ0000F Series contains an IRED optically
coupled to a phototransistor.
■ Agency approvals/Compliance
1. Recognized by UL1577, file No. E64380 (as model
No. PC844)
It is packaged in a 4-channel 16pin DIP.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 20% to
300% at input current of ±1mA.
2. Package resin : UL flammability grade
(94V-0)
■ Applications
1. Programmable controllers
2. Telephone sets, telephone exchangers
3. System appliances
4. Signal tranmission between circuits of different poten-
tials and impedances
■ Features
1. 16pin DIP 4-channel package
2. Double transfer mold package (ldeal for Flow Solder-
ing)
3. AC input type
4. High collector-emitter voltage (VCEO : 80V)
5. Current transfer ratio
(CTR : MIN. 20% at IF=±1mA, VCE=5V)
6. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
7. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A03603EN
1
Date Sep. 1. 2006
© SHARP Corporation
PC844XJ0000F Series
■ Internal Connection Diagram
16
15
14
13
12
11
10
9
8
1
2
3
4
5
6
7
8
Anode/Cathode
Cathode/Anode
Emitter
9 11 13 15
10 12 14 16
Collector
1
2
3
4
5
6
7
■ Outline Dimensions
(Unit : mm)
1.2±0.3
0.6±0.2
Factory identification mark
16
15
14
13
12
11
10
9
PC844
1
2
3
4
5
6
7
8
2.54±0.25
Date code
Rank mark
19.82±0.50
7.62±0.30
Epoxy resin
0.26±0.10
0.5±0.1
θ
θ
θ : 0 to 13˚
Product mass : approx. 1.0g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A03603EN
2
PC844XJ0000F Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actual status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A03603EN
3
PC844XJ0000F Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
±50
*1 Peak forward current
IFM
±1
Power dissipation
P
70
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
80
6
50
V
mA
mW
mW
kV
Collector power dissipation
Total power dissipation
*2 Isolation voltage
Operating temperature
Storage temperature
*3 Soldering temperature
PC
150
Ptot
200
Viso (rms)
Topr
Tstg
5.0
−30 to +100
−55 to +125
260
˚C
˚C
Tsol
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
MAX.
1.4
3.0
250
100
−
Unit
V
Forward voltage
IF=±20mA
IFM=±0.5V
−
1.2
Peak forward voltage
Terminal capacitance
Collector dark current
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Collector current
VFM
Ct
−
−
50
−
V
V=0, f=1kHz
−
pF
nA
V
ICEO
BVCEO
BVECO
IC
VCE=50V, IF=0
−
80
6
IC=0.1mA, IF=0
−
IE=10µA, IF=0
−
−
V
IF=±1mA, VCE=5V
IF=±20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
0.2
−
5×1010
−
3.0
0.2
−
mA
V
Collector-emitter saturation voltage
Isolation resistance
VCE (sat)
RISO
Cf
0.1
1×1011
0.6
80
4
Ω
Floating capacitance
Cut-off frequency
−
1.0
−
pF
kHz
µs
µs
fc
VCE=5V, IC=2mA, RL=100Ω, −3dB
15
−
Rise time
Response time
tr
18
VCE=2V, IC=2mA, RL=100Ω
Fall time
tf
−
3
18
Sheet No.: D2-A03603EN
4
PC844XJ0000F Series
■ Model Line-up
Sleeve
25 pcs/sleeve
PC844XJ0000F with or without
PC844X1J000F
IC [mA]
(IF=±1.0mA, VCE=5V, Ta=25˚C)
Package
Rank mark
0.2 to 3.0
0.5 to 1.5
Model No.
A
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A03603EN
5
PC844XJ0000F Series
Fig.2 Diode Power Dissipation vs.
Fig.1 Forward Current vs. Ambient
Temperature
Ambient Temperature
100
50
40
30
20
80
70
60
40
20
0
10
0
−30
0
25
50 55 75
100
125
−30
0
25
50 55 75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
250
Temperature
250
200
150
100
200
150
100
50
0
50
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
10 000
Pulse width≤100µs
Ta=25˚C
−25˚C
0˚C
Ta=75˚C
50˚C
100
25˚C
1 000
100
10
1
10
10−3
10−2
Duty ratio
10−1
1
0
0.5
1.0
1.5
2.0
2.5
3.0
Forward voltage VF (V)
Sheet No.: D2-A03603EN
6
PC844XJ0000F Series
Fig.7 Current Transfer Ratio vs. Forward
Current
Fig.8 Collector Current vs. Collector-emitter
Voltage
140
Ta=25˚C
VCE=5V
30mA
=
IF
30
Ta=25˚C
120
PC (MAX.)
100
80
20mA
20
60
10mA
5mA
10
0
40
20
0
1mA
4
0.1 0.2
0.5
1
2
5
10 20
50
0
2
6
8
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
0.1
150
IF=1mA
VCE=5V
IF=20mA
0.09
IC=1mA
0.08
0.07
0.06
0.05
0.04
0.03
0.02
100
50
0
0.01
0
−30
0
25
50
75
100
−30
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs. Ambient
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
Temperature
10−5
Ta=25˚C
VCE=50V
6
10−6
10−7
10−8
10−9
IC=0.5mA
5
4
3
2
1mA
3mA
5mA
7mA
10−10
10−11
1
0
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
−30
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Forward current IF (mA)
Sheet No.: D2-A03603EN
7
PC844XJ0000F Series
Fig.13 Response Time vs. Load Resistance
Fig.14 Test Circuit for Response Time
VCE=2V
IC=2mA
Ta=25˚C
Input
VCC
100
Output
tr
RL
Input
Output
VCE
10%
90%
tf
RD
tf
10
td
ts
tr
td
ts
Please refer to the conditions in Fig.13.
1
0.1
0.01
0.1
1
10
50
Load resistance RL (kΩ)
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
5
VCC
VCE=5V
IC=2mA
Ta=25˚C
RL
RD
0
Output
VCE
−5
Please refer to the conditions in Fig.15.
RL=10kΩ
1kΩ
100Ω
−10
−15
−20
0.1
1
10
Frequency f (kHz)
100
1 000
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A03603EN
8
PC844XJ0000F Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A03603EN
9
PC844XJ0000F Series
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive.
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
Sheet No.: D2-A03603EN
10
PC844XJ0000F Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
Through-Hole
12.0
6.7
(Unit : mm)
Sheet No.: D2-A03603EN
11
PC844XJ0000F Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A03603EN
[E179]
12
相关型号：
PC844XJ0000F
AC Input-Transistor Output Optocoupler, 4-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, DIP-16
SHARP
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