PC852XNNSZ1H [SHARP]
Darlington Output Optocoupler,;
| 型号： | PC852XNNSZ1H |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Darlington Output Optocoupler, 输出元件 光电 |
| 文件： | 总14页 (文件大小：1593K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC852XNNSZ1H Series
DIP 4pin Darlington Phototransistor
Output, High Collector-emitter Voltage
Photocoupler
PC852XNNSZ1H
Series
Description
Agencyapprovals/Compliance
1. Recognized by UL1577, file No. E64380
(as model No. PC852)
PC852XNNSZ1H Seriescontains an IRED optically
coupled to a phototransistor.
2. Package resin : UL flammability grade (94V-0)
It is packaged in a 4-pin DIP, available in SMT gull-
wing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 350V and CTR is MIN.
1,000% at input current of 1mA.
Features
Applications
1. 4pin DIP package
1. Telephone lineinterface/isolation
2. Interface to power supply circuit
3. Controller for SSRs, DC motors
2. Double transfer mold package
(Ideal for FlowSoldering)
3. High collector-emitter voltage (VCEO : 350V)
4. Darlington phototransistor output
(CTR : MIN. 1,000% at IF=1mA,VCE=2V)
5. High isolation voltage between input and output
(Viso(rms) : 5kV)
6. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without priornotice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARPdevice.
Sheet No .: OP18006EN
1
Date Jan. 15. 2018
© SHARPCorporation
PC852XNNSZ1H Series
Internal ConnectionDiagram
1
2
3
4
Anode
3
Cathode
Emitter
Collector
2
Outline
(Unit : mm)
１． Through-Hole
２．SMT GullwingLead-Form
[ex. PC852XNNSZ1H]
[ex . PC852XNNIP1H]
DATE
DATE
DATE
Product mass : approx.0.23g
Product mass : approx.0.22g
Sheet No .: OP18006EN
2
PC852XNNSZ1H Series
Date code indication (Ex.)
3-digit number shall be marked the age indication of 1-digit number, and week code of 2-digit number.
Week code “01” indicate the week including the first Thursday of January. And later, Monday is the starting
point.
Year Week
Date code
652
701
702
703
・
MON
12/26
1/2
1/9
1/16
・
TUE
12/27
1/3
1/10
1/17
・
WED
12/28
1/4
1/11
1/18
・
THU
12/29
1/5
1/12
1/19
・
FRI
12/30
1/6
1/13
1/20
・
SAT
12/31
1/7
1/14
1/21
・
SUN
1/1
1/8
1/15
1/22
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
752
751
752
801
12/11
12/18
12/25
1/1
12/12
12/19
12/26
1/2
12/13
12/20
12/27
1/3
12/14
12/21
12/28
1/4
12/15
12/22
12/29
1/5
12/16
12/23
12/30
1/6
12/17
12/24
12/31
1/7
Factory identification mark and Plating material
Factory identification Mark
Country of origin
Plating material
SnBi (Bi : 1 4%)
K
Japan
～
Rankmark
Refer to the Model Line-uptable.
Sheet No .: OP18006EN
3
PC852XNNSZ1H Series
Absolute MaximumRatings
(Ta25˚C)
Parameter
Symbol
Rating
Unit
mA
A
Forward current
IF
50
*1 Peak forward current
Reverse voltage
1
IFM
VR
6
70
V
Power dissipation
P
mW
V
Collector-emittervoltage
Emitter-collectorvoltage
Collector current
350
VCEO
VECO
IC
0.1
V
150
mA
mW
mW
kV
˚C
Collectorpowerdissipation
Total power dissipation
*2 Isolation voltage
Operating temperature
Storage temperature
*3 Soldering temperature
PC
150
200
Ptot
5.0
Viso (rms)
Topr
Tstg
30 to 100
to 125
270
˚C
˚C
Tsol
*1 Pulse width100s, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute
*3 For 10s
■Electro-opticalCharacteristics
(Ta25˚C)
Parameter
Symbol
VF
MIN.
TYP.
1.2
MAX. Unit
Conditions
IF10mA
Forward voltage
1.4
10
V
A
pF
nA
V
Reverse Current
IR
VR4V
V0, f1kHz
VCE200V, IF0
IC0.1mA, IF0
IF1mA, VCEV
Input
Terminal capacitance
Dark current
Ct
30
250
200
ICEO
BVCEO
IC
40
Collector-emitter breakdown voltage
Collector current
350
Output
10
mA
V
1.2
Collector-emitter saturation voltage
Isolation resistance
IF20mA, IC100mA
DC500V, 40 to 60%RH
V0, f1MHz
VCE(sat)
RISO
Cf
51010
11011
0.6
7
Transfer
charac-
teristics
Floating capacitance
Cut-off frequency
1.0
pF
kHz
s
fC
VCE2V, IC20mA, RL100, 3dB
300
100
Risetime
Response
tr
100
20
VCE2V, IC20mA, RL100
Falltime
time
tf
s
Sheet No .: OP18006EN
4
PC852XNNSZ1H Series
ModelLine-up
Lead Form
Through-Hole
Sleeve
IC[mA]
Rank mark
(IF=1mA,
VCE=2V,
Ta=25˚C)
10～150
100pcs/sleeve
Package
ModelNo.
Lead Form
with or “_”
J
PC852XNNSZ1H
PC852X1NSZ1H
40～150
SMT Gullwing
Taping
IC[mA]
Rank mark
“_”
(IF=1mA,
VCE=2V,
Ta=25˚C)
10～150
2,000pcs/reel
Package
ModelNo.
PC852XNNIP1H
Please contact a local SHARP sales representative to inquire about productionstatus.
Sheet No .: OP18006EN
5
PC852XNNSZ1H Series
Fig.2 Diode Power Dissipation vs.
Fig.1 Forward Current vs. Ambient
Temperature
Ambient Temperature
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
Sheet No .: OP18006EN
6
PC852XNNSZ1H Series
Fig.8 Collector Current vs. Collector-
Fig.7 Current Transfer Ratio vs. Forward
Current
emitter Voltage
Fig.9 Relative Current Transfer Ratiovs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
Fig.11 Collector Dark Current vs. Ambient
Temperature
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
Sheet No .: OP18006EN
7
PC852XNNSZ1H Series
Fig.13 Response Time vs. Load Resistance
Fig.14 Test Circuit for ResponseTime
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No .: OP18006EN
9
PC852XNNSZ1H Series
Design Considerations
● Designguide
While operating at IF<1mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the designconsideration.
● Recommended foot print (reference)
SMT Gullwinglead-form
8.2
2.2
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No .: OP18006EN
9
PC852XNNSZ1H Series
ManufacturingGuidelines
SolderingMethod
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No .: OP18006EN
10
PC852XNNSZ1H Series
● Cleaninginstructions
Solvent cleaning:
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of thedevice.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
massproduction.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packagingresin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane(Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
(1) The RoHS directive(2011/65/EU)
This product complies with the RoHS directive(2011/65/EU)
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls
（PBB）and polybrominated diphenyl ethers（PBDE）
(2) Content of six substances specified in Management Methods for Control of Pollution Caused
by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Hazardous Substances
Polybrominated
biphenyls
Polybrominated
diphenyl ethers
Hexavalent
chromium
(Cr6+)
Category
Lead
Mercury
Cadmium
(Cd)
(Pb)
(Hg)
(PBB)
○
(PBDE)
○
Photocoupler
○
○
○
○
This table is prepared in accordance with the provisions of SJ/T 11364.
○：Indicates that said hazardous substance contained in all of the homogeneous materials
for this part is below the limit requirement of GB/T 26572.
Sheet No .: OP18006EN
11
PC852XNNSZ1H Series
Packagespecification
● Sleevepackage
Through-Hole
Packagematerials
Sleeve : HIPS/PS or PC (with anti-staticmaterial)
Stopper : EPM
Packagemethod
MAX. 100pcs. of products shall be packaged in a sleeve and both of sleeve edges shall be fixed by stoppers.
MAX. 25 sleeves (Product : 2,500pcs.) above shall be packaged in inner case and sealed by tape .
Max 2 bags(product : 5,000pcs) above shall be packaged in packing case , and put a cushioning material inside.
8.8 ± 0.2
Sleeve outlinedimensions
6.5 ± 0.2
14.2 ± 0.2
500 ± 2
(Unit : mm)
Sheet No .: OP18006EN
12
PC852XNNSZ1H Series
● Tapeand Reelpackage
SMTGullwing
Packagematerials
Carrier tape : PS
Cover tape : PET (three layersystem)
Reel : PS
Carrier tape structure andDimensions
Dimensions List
(Unit : mm)
A
16.00.3
B
7.50.1
I
C
1.750.10
J
D
8.00.1
E
2.00.1
F
G
0.1
4.00.1
1.5
0.0
H
K
10.30.1
0.400.05
4.00.1
5.30.1
Reel structure and Dimensions
Dimensions List
(Unit : mm)
a
330
e
b
17.51.5
f
c
d
1001 13.00.5
g
2.00.5
2.00.5
21.01
Direction of productinsertion
[Packing : 2,000pcs/reel]
Sheet No .: OP18006EN
13
PC852XNNSZ1H Series
ImportantNotices
·The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles,etc.)
--- Trafficsignals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices,etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
·Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
--- Space applications
--- Telecommunication equipment [trunklines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
·If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
·Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the followingconditions:
·This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
thirdparty.
(i)The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personalcomputers
--- Office automationequipment
--- Telecommunication equipment[terminal]
--- Test and measurement equipment
--- Industrialcontrol
--- Audio visual equipment
--- Consumerelectronics
·Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
(ii)Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No .: OP18006EN
[E203]
14
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