PC900V0NIZX [SHARP]

Digital Output, Normal OFF Operation DIP 6 pin ∗OPIC Photocoupler; 数字输出,正常关闭操作DIP 6引脚上的???? OPIC光耦合器
PC900V0NIZX
型号: PC900V0NIZX
厂家: SHARP ELECTRIONIC COMPONENTS    SHARP ELECTRIONIC COMPONENTS
描述:

Digital Output, Normal OFF Operation DIP 6 pin ∗OPIC Photocoupler
数字输出,正常关闭操作DIP 6引脚上的???? OPIC光耦合器

光电 输出元件
文件: 总16页 (文件大小:264K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PC900V0NSZX Series  
Digital Output, Normal OFF  
Operation DIP 6 pin OPIC  
Photocoupler  
PC900V0NSZX  
Series  
Description  
PC900V0NSZX Series contains an IRED optically  
coupled to an OPIC chip.  
Agency approvals/Compliance  
1. Recognized by UL1577 (Double protection isolation),  
file No. E64380 (as model No. PC900V)  
It is packaged in a 6 pin DIP, available in SMT gullw-  
ing lead-form and Wide SMT gullwing lead-form op-  
tion.  
2. Approved by TÜV (VDE0884) (as an option) file No.  
R9151577 (as model No. PC900V)  
3. Package resin : UL flammability grade (94V-0)  
Input-output isolation voltage(rms) is 5.0kV.  
Applications  
1. Programmable controllers  
2. PC peripherals  
Features  
1. 6 pin DIP package  
2. Double transfer mold package  
(Ideal for Flow Soldering)  
3. Electronic musical instruments  
3. Normal OFF operation, open collector output  
4. TTL and LSTTL compatible output  
5. Operating supply voltage (VCC : 3 to 15 V)  
6. Isolation voltage (Viso(rms) : 5.0 kV)  
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing  
circuit integrated onto a single chip.  
Notice The content of data sheet is subject to change without prior notice.  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP  
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
Sheet No.: D2-A05301EN  
1
Date Nov. 28. 2003  
© SHARP Corporation  
PC900V0NSZX Series  
Internal Connection Diagram  
6
5
4
1
2
3
4
5
6
Anode  
Cathode  
NC  
VO  
GND  
VCC  
Voltage  
regulator  
Amp  
1
2
3
Outline Dimensions  
(Unit : mm)  
1. Through-Hole [ex. PC900V0NSZX]  
2. Through-Hole (VDE0884 option) [ex. PC900V0YSZX]  
0.3  
0.3  
1.2  
1.2  
0.2  
0.2  
0.6  
0.6  
SHARP  
mark  
"S"  
6
5
4
6
5
4
SHARP  
mark  
"S"  
VDE0884 Identification mark  
P C 9 0 0 V  
P C 9 0 0 V  
Anode  
mark  
4
Anode  
mark  
Date code  
Date code  
1
2
3
1
2
3
0.5  
0.5  
7.12  
7.12  
0.3  
0.3  
7.62  
7.62  
Epoxy resin  
Epoxy resin  
0.1  
0.1  
0.25  
0.5  
0.25  
0.5  
2.54  
2.54  
θ
θ
θ
θ
θ : 0 to 13˚  
θ : 0 to 13˚  
3. SMT Gullwing Lead-Form [ex. PC900V0NIPX]  
4. SMT Gullwing Lead-Form (VDE0884 option)  
[ex. PC900V0YIPX]  
0.3  
0.3  
1.2  
0.2  
6
1.2  
0.2  
6
0.6  
0.6  
5
4
5
4
SHARP  
mark  
"S"  
SHARP  
mark  
"S"  
VDE0884 Identification mark  
P C 9 0 0 V  
P C 9 0 0 V  
Anode  
mark  
4
Anode  
mark  
Date code  
Date code  
1
2
3
1
2
3
0.5  
0.5  
7.12  
7.12  
0.3  
0.3  
7.62  
7.62  
0.25  
0.25  
2.54  
Epoxy resin  
2.54  
Epoxy resin  
+0.4  
+0.4  
+0.4  
+0.4  
1.0  
1.0  
1.0  
0  
1.0  
0  
0  
0  
+0  
+0  
10.0  
10.0  
0.5  
0.5  
Sheet No.: D2-A05301EN  
2
PC900V0NSZX Series  
(Unit : mm)  
5. Wide SMT Gullwing Lead-Form  
6. Wide SMT Gullwing Lead-Form (VDE0884 option)  
[ex. PC900V0NUPX]  
[ex. PC900V0YUPX]  
0.3  
0.3  
1.2  
1.2  
0.2  
0.2  
0.6  
0.6  
SHARP  
mark  
"S"  
SHARP  
mark  
"S"  
P C 9 0 0 V  
P C 9 0 0 V  
Anode  
mark  
4
Anode  
mark  
Date code  
Date code  
VDE0884 Identification mark  
0.5  
0.5  
7.12  
0.3  
0.3  
7.12  
7.62  
7.62  
Epoxy resin  
10.16  
12.0MAX.  
Epoxy resin  
10.16  
12.0MAX.  
0.25  
0.25  
2.54  
2.54  
0.25  
0.5  
0.25  
0.25  
0.5  
0.25  
0.75  
0.75  
0.75  
0.75  
Product mass : approx. 0.36g  
Sheet No.: D2-A05301EN  
3
PC900V0NSZX Series  
Date code (2 digit)  
1st digit  
2nd digit  
Year of production  
Month of production  
A.D.  
1990  
1991  
1992  
1993  
1994  
1995  
1996  
1997  
1998  
1999  
2000  
2001  
A.D  
2002  
2003  
2004  
2005  
2006  
2007  
2008  
2009  
2010  
2011  
2012  
Mark  
P
Month  
Mark  
1
Mark  
A
B
January  
February  
March  
R
2
S
3
C
T
April  
4
D
E
U
May  
5
F
V
June  
6
H
J
W
X
July  
7
August  
September  
October  
November  
December  
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle  
Country of origin  
Japan  
Sheet No.: D2-A05301EN  
4
PC900V0NSZX Series  
Absolute Maximum Ratings  
(Ta=25˚C)  
Unit  
mA  
A
Parameter  
Symbol  
IF  
Rating  
Forward current  
50  
*1  
Peak forward current  
IFM  
1
Input  
Reverse voltage  
Power dissipation  
Supply voltage  
High level output voltage  
Low level output current  
Power dissipation  
VR  
6
V
P
70  
mW  
V
VCC  
VOH  
IOL  
16  
16  
V
Output  
50  
mA  
mW  
mW  
˚C  
PO  
150  
Total power dissipation  
Operating temperature  
Storage temperature  
*2 Isolation voltage  
*3 Soldering temperature  
Ptot  
170  
Topr  
Tstg  
Viso (rms)  
Tsol  
25 to +85  
40 to +125  
5.0  
˚C  
kV  
260  
˚C  
*1 Pulse width100µs, Duty ratio : 0.001  
*2 40 to 60%RH, AC for 1minute, f=60Hz  
*3 For 10s  
Electro-optical Characteristics  
(Unless otherwise specified Ta=0 to +70˚C)  
Parameter  
Symbol  
Conditions  
MIN.  
TYP.  
1.1  
1.0  
MAX.  
1.4  
Unit  
IF=4mA  
IF=0.3mA  
0.7  
Forward voltage  
VF  
V
Reverse current  
IR  
Ta=25˚C, VR=3V  
10  
µA  
pF  
Terminal capacitance  
Operating Supply voltage  
Low level output voltage  
High level output current  
Low level supply current  
High level supply current  
*4 "HighLow" input  
threshold current  
*5 "LowHigh" input  
threshold current  
Ct  
Ta=25˚C, V=0, f=1kHz  
30  
250  
15  
VCC  
VOL  
IOH  
ICCL  
ICCH  
3
V
IOL=16mA, VCC=5V, IF=4mA  
VO=VCC=15V, IF=0  
VCC=5V, IF=4mA  
0.2  
0.4  
100  
5.0  
5.0  
2.0  
4.0  
V
µA  
mA  
mA  
2.5  
1.0  
1.1  
VCC=5V, IF=0  
Ta=25˚C, VCC=5V, RL=280Ω  
VCC=5V, RL=280Ω  
Ta=25˚C, VCC=5V, RL=280Ω  
VCC=5V, RL=280Ω  
VCC=5V, RL=280Ω  
Ta=25˚C, DC500V, 40 to 60%RH  
IFHL  
IFLH  
mA  
mA  
0.4  
0.3  
0.5  
5×1010  
0.8  
*6 Hysteresis  
IFLH/IFHL  
RISO  
tPHL  
tPLH  
tr  
0.7  
1×1011  
1
0.9  
Isolation voltage  
"HighLow" propagation delay time  
"LowHigh" propagation delay time  
Rise time  
3
Ta=25˚C, VCC=5V, IF=4mA  
RL=280Ω  
2
6
µs  
0.1  
0.05  
0.5  
0.5  
Fall time  
tf  
*4 IFHL represents forward current when output goes from high to low.  
*5 IFLH represents forward current when output goes from low to high.  
*6 Hysteresis stands for IFLH/IFHL  
.
Sheet No.: D2-A05301EN  
5
PC900V0NSZX Series  
Model Line-up  
Lead Form  
Through-Hole  
SMT Gullwing  
Wide SMT Gullwing  
Sleeve  
Taping  
1 000pcs/reel  
Approved −−−−−  
Package  
50pcs/sleeve  
VDE0884  
Model No.  
−−−−−−  
Approved  
−−−−−−  
Approved  
−−−−−−  
Approved  
PC900V0NSZX PC900V0YSZX PC900V0NIZX PC900V0YIZX PC900V0NIPX PC900V0YIPX PC900V0NUPX PC900V0YUPX  
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.  
Sheet No.: D2-A05301EN  
6
PC900V0NSZX Series  
Fig.1 Test Circuit for Response Time  
Voltage  
regulator  
50%  
VIN  
5V  
280Ω  
VO  
tPHL  
tPLH  
tr=tf=0.01µs  
Amp  
ZO=50Ω  
VIN  
VOH  
90%  
10%  
VOL  
tr  
0.1µF  
VO  
47Ω  
1.5V  
tf  
Fig.2 Forward Current vs. Ambient  
Fig.3 Power Dissipation vs. Ambient  
Temperature  
Temperature  
200  
60  
Ptot  
170  
50  
40  
30  
20  
PO  
150  
100  
50  
0
10  
0
25  
0
25  
50  
75 85 100  
25  
0
25  
50  
75 85 100  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.4 Forward Current vs. Forward Voltage Fig.5 Relative Input Threshold Current vs.  
Supply Voltage  
1.4  
1.2  
1.0  
0.8  
0.6  
500  
Ta=25˚C  
Ta=75˚C  
IFHL=1 at VCC=5V  
50˚C  
200  
25˚C  
0˚C  
25˚C  
IFHL  
100  
50  
IFLH  
20  
10  
5
0.4  
0.2  
2
1
0
5
10  
15  
20  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
Supply voltage VCC (V)  
Forward voltage VF (V)  
Sheet No.: D2-A05301EN  
7
PC900V0NSZX Series  
Fig.7 Low Level Output Voltage vs. Low  
Fig.6 Relative Input Threshold Current vs.  
Ambient Temperature  
Level Output Current  
1.6  
1.0  
VCC=5V  
1.4  
VCC=5V  
0.5  
Ta=25˚C  
1.2  
0.2  
0.1  
IFHL  
1.0  
0.8  
IFLH  
0.6  
0.05  
0.4  
0.02  
0.01  
IFHL=1 at Ta=25˚C  
0.2  
25  
0
25  
50  
75  
100  
1
2
5
10  
20  
50  
100  
Ambient temperature Ta (˚C)  
Low level output current IOL (mA)  
Fig.9 Supply Current vs. Supply Voltage  
Fig.8 Low Level Output Voltage vs. Ambient  
Temperature  
0.5  
9
Ta= −25˚C  
IOL=30mA  
VCC=5V  
8
25˚C  
0.4  
0.3  
0.2  
7
6
5
4
16mA  
Ta= −25˚C  
85˚C  
3
5mA  
25˚C  
15  
2
0.1  
0
ICCL  
{
85˚C  
1
0
ICCH  
{
1
3
5
7
9
11  
13  
17  
25  
0
25  
50  
75  
100  
Ambient temperature Ta (˚C)  
Supply voltage VCC (V)  
Fig.11 Rise Time, Fall Time vs. Load  
Resistance  
Fig.10 Propagation Delay Time vs. Forward  
Current  
5
0.5  
VCC=5V  
VCC=5V  
RL=280Ω  
IF=4mA  
Ta=25˚C  
Ta=25˚C  
4
0.4  
tPLH  
3
0.3  
2
0.2  
tr  
1
0.1  
tf  
tPHL  
0
0
0
10  
20  
30  
40  
50  
60  
0.1 0.2  
0.5  
1
2
5
10  
20  
Forward current IF (mA)  
Load resistance RL (k)  
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.  
8
Sheet No.: D2-A05301EN  
PC900V0NSZX Series  
Design Considerations  
Notes about static electricity  
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-  
sign.  
When handling these devices, general countermeasure against static electricity should be taken to avoid  
breakdown of devices or degradation of characteristics.  
Design guide  
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of  
0.01µF or more between VCC and GND near the device.  
The detector which is used in this device, has parasitic diode between each pins and GND.  
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin  
becomes below GND level even for instant.  
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become  
below GND level.  
This product is not designed against irradiation and incorporates non-coherent IRED.  
Degradation  
In general, the emission of the IRED used in photocouplers will degrade over time.  
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)  
into the design consideration.  
Please decide the input current which become 2times of MAX. IFHL  
.
Sheet No.: D2-A05301EN  
9
PC900V0NSZX Series  
Recommended Foot Print (reference)  
SMT Gullwing Lead-form  
Wide SMT Gullwing Lead-form  
10.5  
8.5  
2.2  
2.2  
(Unit : mm)  
For additional design assistance, please review our corresponding Optoelectronic Application Notes.  
Sheet No.: D2-A05301EN  
10  
PC900V0NSZX Series  
Manufacturing Guidelines  
Soldering Method  
Reflow Soldering:  
Reflow soldering should follow the temperature profile shown below.  
Soldering should not exceed the curve of temperature profile and time.  
Please don't solder more than twice.  
(˚C)  
300  
Terminal : 260˚C peak  
( package surface : 250˚C peak)  
200  
Reflow  
220˚C or more, 60s or less  
Preheat  
100  
150 to 180˚C, 120s or less  
0
0
1
2
3
4
(min)  
Flow Soldering :  
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below  
listed guidelines.  
Flow soldering should be completed below 270˚C and within 10s.  
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.  
Please don't solder more than twice.  
Hand soldering  
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.  
Please don't solder more than twice.  
Other notices  
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact  
on the junction between the device and PCB varies depending on the tooling and soldering conditions.  
Sheet No.: D2-A05301EN  
11  
PC900V0NSZX Series  
Cleaning instructions  
Solvent cleaning:  
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less  
Ultrasonic cleaning:  
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,  
size of PCB and mounting method of the device.  
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of  
mass production.  
Recommended solvent materials:  
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol  
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-  
tual using conditions since some materials may erode the packaging resin.  
Presence of ODC  
This product shall not contain the following materials.  
And they are not used in the production process for this device.  
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)  
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.  
Sheet No.: D2-A05301EN  
12  
PC900V0NSZX Series  
Package specification  
Sleeve package  
Package materials  
Sleeve : HIPS (with anti-static material)  
Stopper : Styrene-Elastomer  
Package method  
MAX. 50 pcs. of products shall be packaged in a sleeve.  
Both ends shall be closed by tabbed and tabless stoppers.  
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.  
MAX. 20 sleeves in one case.  
Sleeve outline dimensions  
12.0  
6.7  
(Unit : mm)  
Sheet No.: D2-A05301EN  
13  
PC900V0NSZX Series  
Tape and Reel package  
1. SMT Gullwing  
Package materials  
Carrier tape : A-PET (with anti-static material)  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
J
F
D
G
E
I
K
Dimensions List  
(Unit:mm)  
A
B
C
D
E
F
G
0.3  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
+0.1  
16.0  
H
7.5  
1.75  
J
12.0  
K
2.0  
4.0  
φ1.5  
0  
I
0.05  
0.1  
0.1  
10.4  
0.4  
4.2  
7.8  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
1.5  
1.0  
0.5  
330  
e
17.5  
f
100  
g
13  
f
b
1.0  
0.5  
0.5  
a
23  
2.0  
2.0  
Direction of product insertion  
Pull-out direction  
[Packing : 1 000pcs/reel]  
Sheet No.: D2-A05301EN  
14  
PC900V0NSZX Series  
2. Wide SMT Gullwing  
Package materials  
Carrier tape : A-PET (with anti-static material)  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
F
D
J
G
C
I
E
K
Dimensions List  
(Unit : mm)  
A
B
C
D
E
F
G
0.3  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
+0.1  
24.0  
H
11.5  
I
1.75  
J
12.0  
K
2.0  
4.0  
φ1.5  
0  
0.05  
0.1  
0.1  
12.2  
0.4  
4.1  
7.6  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
1.5  
1.0  
0.5  
330  
e
25.5  
f
100  
g
13  
f
b
1.0  
0.5  
0.5  
23  
2.0  
2.0  
a
Direction of product insertion  
Pull-out direction  
[Packing : 1 000pcs/reel]  
Sheet No.: D2-A05301EN  
15  
PC900V0NSZX Series  
Important Notices  
· The circuit application examples in this publication are  
provided to explain representative applications of  
SHARP devices and are not intended to guarantee any  
circuit design or license any intellectual property rights.  
SHARP takes no responsibility for any problems rela-  
ted to any intellectual property right of a third party re-  
sulting from the use of SHARP's devices.  
with equipment that requires higher reliability such as:  
--- Transportation control and safety equipment (i.e.,  
aircraft, trains, automobiles, etc.)  
--- Traffic signals  
--- Gas leakage sensor breakers  
--- Alarm equipment  
--- Various safety devices, etc.  
(iii) SHARP devices shall not be used for or in connec-  
tion with equipment that requires an extremely high lev-  
el of reliability and safety such as:  
--- Space applications  
--- Telecommunication equipment [trunk lines]  
--- Nuclear power control equipment  
--- Medical and other life support equipment (e.g.,  
scuba).  
· Contact SHARP in order to obtain the latest device  
specification sheets before using any SHARP device.  
SHARP reserves the right to make changes in the spec-  
ifications, characteristics, data, materials, structure,  
and other contents described herein at any time without  
notice in order to improve design or reliability. Manufac-  
turing locations are also subject to change without no-  
tice.  
· If the SHARP devices listed in this publication fall with-  
in the scope of strategic products described in the For-  
eign Exchange and Foreign Trade Law of Japan, it is  
necessary to obtain approval to export such SHARP de-  
vices.  
· Observe the following points when using any devices  
in this publication. SHARP takes no responsibility for  
damage caused by improper use of the devices which  
does not meet the conditions and absolute maximum  
ratings to be used specified in the relevant specification  
sheet nor meet the following conditions:  
(i) The devices in this publication are designed for use  
in general electronic equipment designs such as:  
--- Personal computers  
· This publication is the proprietary product of SHARP  
and is copyrighted, with all rights reserved. Under the  
copyright laws, no part of this publication may be repro-  
duced or transmitted in any form or by any means, elec-  
tronic or mechanical, for any purpose, in whole or in  
part, without the express written permission of SHARP.  
Express written permission is also required before any  
use of this publication may be made by a third party.  
--- Office automation equipment  
--- Telecommunication equipment [terminal]  
--- Test and measurement equipment  
--- Industrial control  
--- Audio visual equipment  
--- Consumer electronics  
· Contact and consult with a SHARP representative if  
there are any questions about the contents of this pub-  
lication.  
(ii) Measures such as fail-safe function and redundant  
design should be taken to ensure reliability and safety  
when SHARP devices are used for or in connection  
Sheet No.: D2-A05301EN  
16  

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