PC956L0NIP [SHARP]
Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 2MBps, SURFACE MOUNT, DIP-8;
| 型号： | PC956L0NIP |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 2MBps, SURFACE MOUNT, DIP-8 输出元件 光电 |
| 文件： | 总15页 (文件大小：281K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC956L0NSZ Series
High Speed 2Mb/s, High CMR
DIP 8 pin OPIC Photocoupler
∗
PC956L0NSZ
Series
■ Description
PC956L0NSZ Series contains a LED optically cou-
pled to an OPIC chip.
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC956L)
It is packaged in a 8 pin DIP, available in SMT
gullwing lead form option.
2. Approved by VDE (VDE0884) (as an option) file No.
87446 (as model No. PC956L)
Input-output isolation voltage(rms) is 5.0kV, High
speed response (TYP. 2Mb/s) and CMR is MIN.
15kV/µs.
3. Package resin : UL flammability grade (94V-0)
■ Applications
1. Programmable controller
2. Inverter
■ Features
1. 8 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High noise immunity due to high instantaneous com-
mon mode rejection voltage (CMH : MIN. 15kV/µs,
CML : MIN. −15kV/µs)
4. High speed response
(tPHL : TYP. 210 ns, tPLH : TYP. 400 ns)
5. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A05501EN
1
Date Nov. 28. 2003
© SHARP Corporation
PC956L0NSZ Series
■ Internal Connection Diagram
8
7
6
5
1
2
3
4
5
6
7
NC
GND
VO
VL
Anode
Cathode
NC
Voltage
regulator
8 VCC
Amp.
1
2
3
4
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PC956L0NSZ]
2. Through-Hole (VDE0884 option) [ex. PC956L0YSZ]
0.3
1.2
0.3
1.2
0.2
0.2
0.85
0.85
8
7
6
5
8
7
6
5
P C 9 5 6 L
P C 9 5 6 L
4
VDE0884 Identification mark
1
2
3
0.5
4
1
2
3
0.5
4
9.66
9.66
Primary side
mark
Date code
Primary side
mark
Date code
0.3
0.3
7.62
7.62
Epoxy resin
Epoxy resin
0.1
0.1
0.25
0.25
0.26
0.26
0.1
0.1
2.54
2.54
0.5
0.5
θ
θ
θ
θ
θ:0 to 13˚
θ:0 to 13˚
3. SMT Gullwing Lead-Form [ex. PC956L0NIP]
4. SMT Gullwing Lead-Form (VDE0884 option)
[ex. PC956L0YIP]
0.3
0.3
1.2
1.2
0.2
0.2
0.85
0.85
8
7
6
5
8
7
6
5
P C 9 5 64L
P C 9 5 6 L
Primary side
mark
Primary side
mark
1
2
3
0.5
4
1
2
3
0.5
4
VDE0884 Identification mark
Date code
9.66
9.66
Date code
0.3
0.3
7.62
7.62
Epoxy resin
Epoxy resin
+0.4
+0.4
+0.4
+0.4
0.25
0.25
1.0
1.0
−0
1.0
1.0
−0
2.54
−0
2.54
−0
+0
+0
10.0
10.0
−0.5
−0.5
Product mass : approx. 0.51g
Sheet No.: D2-A05501EN
2
PC956L0NSZ Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Country of origin
Japan
Sheet No.: D2-A05501EN
3
PC956L0NSZ Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
Parameter
Symbol
IF
Rating
*1 Forward current
Reverse voltage
*2 Power dissipation
Supply voltage
Output voltage
Output current
*3 Power dissipation
25
5
mA
Input
VR
V
mW
P
VCC
VO
45
−0.5 to +35
−0.5 to +35
15
V
V
mA
Output
IO
PO
100
mW
˚C
Operating temperature
Storage temperature
*4 Isolation voltage
Topr
Tstg
Viso (rms)
−40 to +85
−55 to +125
5.0
˚C
kV
*5 Soldering temperature
˚C
270
Tsol
*1 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 0.5mA/˚C.(Fig.3)
*2 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 0.8mW/˚C.(Fig.4)
*3 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 1.8mW/˚C.(Fig.4)
*4 40 to 60%RH, AC for 1minute, f=60Hz
*5 For 10s
*6
■ Electro-optical Characteristics
(unless otherwise specified Ta=−40 to +85˚C, VCC=4.5 to 35V)
Parameter
Forward voltage
Conditions
Ta=25˚C, IF=10mA
Ta=25˚C, VR=5V
Ta=25˚C, V=0, f=1MHz
−
MIN.
−
TYP. MAX.
Unit
V
Symbol
VF
1.6
−
1.95
10
−
µA
pF
Reverse current
IR
−
60
−
Ct
250
35
Terminal capacitance
Operating supply voltage
Low level output voltage
Low level output current
High level output current
High level supply current
Low level supply current
VCC
VOL
IOL
4.5
−
V
IF=10mA, Io=2.4mA
0.3
9
0.6
−
V
4.4
−
−
mA
µA
mA
mA
IF=10mA, Vo=0.6V
IF=0, VCC=Vo
IOH
50
5
ICCH
ICCL
0.6
0.8
1.3
1.3
IF=0, Vo=OPEN
IF=10mA, Vo=OPEN
−
Vo=0.8V, RL=20kΩ, VCC=15V
IFHL
−
1.5
5
mA
"High→Low" input threshold current
7
8
Short circuit between pin and pin
5×1010
−
1011
0.6
RISO
Cf
Ω
pF
kΩ
ns
Isolation resistance
Ta=25˚C, DC500V, 40 to 60%RH
Ta=25˚C, V=0, f=1MHz
Ta=25˚C
−
Floating capacitance
1
RL
Internal pull-up resistance
"High→Low" propagation delay time
"Low→High" propagation delay time
Distortion of pulse width
25
14
30
20
tPHL
tPLH
∆tw
210
400
190
400
550
450
IF=10mA (tpHL), IF=0 (tpLH),
VCC=15V, RL=20kΩ, CL=100pF
VTHLH=2.0V, VTHHL=1.5V
270
−
ns
ns
7
Short circuit between pin and
TPSK
−
200
Propagation delay skew
450
ns
8
pin
Ta=25˚C, IF=0, VCC=15V,
Instantaneous common mode rejection
voltage
(High level output)
CL=100pF, VCM=1.5kV(P-P), RL=20kΩ,
VO>3.0V, Short circuit between
CMH
15
30
−
kV/µs
7
8
pin and pin
Ta=25˚C, IF=10mA, VCC=15V,
CL=100pF, VCM=1.5kV(P-P), RL=20kΩ,
VO<1.0V, Short circuit between
Instantaneous common mode rejection
voltage
(Low level output)
CML
−30
−
−15
kV/µs
7
8
pin and pin
*6 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin
8
) and GND (pin
5
)
near the device, when it measures the transfer characteristics and the output side
characteristics
*7 Distortion of pulse width ∆tw= | tPHL−tPLH
|
Sheet No.: D2-A05501EN
4
PC956L0NSZ Series
■ Model Line-up
Lead Form
Through-Hole
SMT Gullwing
Taping
Sleeve
Package
50pcs/sleeve
1 000pcs/reel
VDE0884
Model No.
−−−−−−
Approved
−−−−−−
Approved
PC956L0NSZ PC956L0YSZ PC956L0NIP PC956L0YIP
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A05501EN
5
PC956L0NSZ Series
Fig.1 Test Circuit for Propagation Delay Time
10mA
VCC
RL
0mA
IF
IF
tPHL
tPLH
Voltage
regulator
VO
90%
VO
VTHHL
VTHLH
10%
Amp.
CL
VOL
47Ω
tr
tf
GND
Fig.2 Test Circuit for Common Mode Rejection Voltage
1.5kV
0V
VCC
VCM
RL
IF
CMH,VO
VCC
Voltage
regulator
VO (MIN.)
(IF=0)
SW is A
SW is B
VO (MAX.)
VOL
CML,VO
(IF=10mA)
B
A
VO
Amp.
CL
VCM
+
−
GND
Fig.3 Forward Current vs. Ambient
Temperature
Fig.4 Power Dissipation vs. Ambient
Temperature
PO
100
25
20
15
10
5
80
60
P
45
40
20
70
85
70
85
0
−40 −25
0
0
25
50
75
100
125
−40 −25
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A05501EN
6
PC956L0NSZ Series
Fig.5 Output Current vs. Forward Current
Fig.6 Forward Current vs. Forward Voltage
15
100
VO=0.6V
Ta=−40˚C
10
10
Ta=25˚C
Ta=75˚C
Ta=25˚C
Ta=0˚C
Ta=100˚C
Ta=50˚C
Ta=−20˚C
5
0
1
Ta=75˚C
Ta=−40˚C
0.1
0
5
10
15
20
1.0
1.2
1.4
1.6
1.8
2.0
Forward current IF (mA)
Forward voltage VF (V)
Fig.7 Relative Output Current vs. Ambient
Temperature
Fig.8 Input Threshold Current vs. Ambient
Temperature
120
5.0
IF=10mA
VO=0.6V
VCC=15V
VO=0.8V
IO=100% at Ta=25˚C
RL=20kΩ
110
4.0
100
90
3.0
2.0
80
1.0
0.0
70
60
−40 −20
0
20
40
60
80
100
−40 −20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.9 Low Level Output Voltage vs. Ambient
Temperature
Fig.10 Supply Current vs. Ambient
Temperature
0.6
1.6
VCC=4.5V
IF=10mA
VCC=35V
VO=Open
1.4
IO=2.4mA
ICCH:IF=0
0.5
ICCL:IF=10mA
1.2
1.0
0.8
0.6
0.4
0.4
0.3
0.2
ICCL
ICCH
0.1
0.0
0.2
0.0
−40 −20
0
20
40
60
80
100
−40 −20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A05501EN
7
PC956L0NSZ Series
Fig.11 Propagation Delay Time vs. Ambient
Temperature
Fig.12 Propagation Delay Time vs. Load
Resistance
2.0
2.0
IF=10mA
VCC=15V
IF=10mA
VCC=15V
1.8
1.8
CL=100pF
Ta=25˚C
CL=100pF
RL=20kΩ
1.6
1.6
1.4
1.2
1.0
1.4
1.2
1.0
0.8
0.8
tPLH
0.6
0.6
tPLH
0.4
0.4
tPHL
tPHL
0.2
0
0.2
0
0
5
10 15 20 25 30 35 40 45 50
−40 −20
0
20
40
60
80
100
Load resistance RL (kΩ)
Ambient temperature Ta (˚C)
Fig.13 Propagation Delay Time vs. Load
Capacitance
Fig.14 Propagation Delay Time vs. Supply
Voltage
2.0
2.0
IF=10mA
IF=10mA
CL=100pF
RL=20kΩ
Ta=25˚C
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
1.8
VCC=15V
RL=20kΩ
Ta=25˚C
1.6
1.4
1.2
tPLH
1.0
tPLH
0.8
0.6
0.4
tPHL
0.2
0
0.2
tPHL
0
0
50 100 150 200 250 300 350 400 450 500
Load capacitance CL (pF)
0
5
10
15
20
25
30
35
Supply voltage VCC (V)
Fig.15 Propagation Delay Time vs. Forward
Current
2.0
VCC=15V
CL=100pF
1.8
RL=20kΩ
Ta=25˚C
1.6
1.4
1.2
1.0
0.8
0.6
tPLH
0.4
tPHL
0.2
Remarks : Please be aware that all data in the graph
are just for reference and not for guarantee.
0
0
2
4
6
8
10 12 14 16 18 20
Forward current IF (mA)
Sheet No.: D2-A05501EN
8
PC956L0NSZ Series
■ Design Considerations
● Recommended operating conditions
MAX.
20
Unit
mA
V
Symbol
IF
Parameter
Forward current
Supply voltage
MIN.
10
TYP.
−
−
−
−
VCC
VO
4.5
0
35
Output voltage
35
V
Operating temperature
Topr
−40
70
˚C
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
Sheet No.: D2-A05501EN
9
PC956L0NSZ Series
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5years)
into the design consideration.
Please decide the input current which become 2times of MAX. IFHL
.
● Recommended Foot Print (reference)
8.2
2.2
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A05501EN
10
PC956L0NSZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A05501EN
11
PC956L0NSZ Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A05501EN
12
PC956L0NSZ Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A05501EN
13
PC956L0NSZ Series
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
0.3
0.1
0.1
0.1
0.1
0.1
0.1
0.1
+0.1
16.0
H
7.5
1.75
J
12.0
K
2.0
4.0
φ1.5
−0
I
0.05
0.1
10.4
0.4
4.2
10.2
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
1.5
1.0
0.5
330
e
17.5
f
100
g
13
f
b
1.0
0.5
0.5
a
23
2.0
2.0
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A05501EN
14
PC956L0NSZ Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A05501EN
15
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SHARP
PC957L0YIP0F
Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 1MBps, ROHS COMPLIANT, PLASTIC, SMT, DIP-8
SHARP
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