PR39MF51NSZ [SHARP]
Cost effective Non-Zero Cross type DIP 8pin Triac output SSR; 成本效益的非过零型DIP 8pin的三端双向可控硅输出固态继电器型号: | PR39MF51NSZ |
厂家: | SHARP ELECTRIONIC COMPONENTS |
描述: | Cost effective Non-Zero Cross type DIP 8pin Triac output SSR |
文件: | 总14页 (文件大小:265K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PR39MF51NSZ Series
IT(rms)≤0.9A, Cost effective
Non-Zero Cross type
DIP 8pin
PR39MF51NSZ
Series
Triac output SSR
■ Description
■ Agency approvals/Compliance
1. Under application to UL, CSA and VDE
2. Package resin : UL flammability grade (94V-0)
PPR39MF51NSZ Series Solid State Relays (SSR)
are an integration of an infrared emitting diode (IRED),
a Phototriac Detector and a main output Triac. These
devices are ideally suited for controlling high voltage
AC loads with solid state reliability while providing
4.0kV isolation (Viso(rms)) from input to output.
■ Applications
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching motors, fans, heaters, solenoids, and
valves.
■ Features
1. Output current, IT(rms)≤0.9A
2. Non-zero crossing functionary
3. Phase or power control in applications such as
lighting and temperature control equipment.
3. 8 pin DIP package (SMT gullwing also available)
4. High repetitive peak off-state voltage (VDRM : 600V)
5. Superior noise immunity (dV/dt : MIN. 100V/µs)
6. Response time, ton : MAX. 100µs
7. Lead-free terminal components are also available
(see Model Line-up section in this datasheet)
8. High isolation voltage between input and output
(Viso(rms) : 4.0kV)
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D4-A00801EN
1
Date Mar. 31. 2004
© SHARP Corporation
PR39MF51NSZ Series
■ Internal Connection Diagram
5
8
6
1
2
3
4
5
6
8
Cathode
Anode
Cathode
Cathode
Gate
Output (T1)
Output (T2)
1
2
3
4
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PR39MF51NSZF]
2. SMT Gullwing Lead-Form [ex. PR39MF51NIPF]
1.2–0.3
1.2±0.3
1.05±0.2
1.05–0.2
8
6
5
SHARP
mark
"S"
Model No.
SHARP
mark
"S"
8
6
5
Model No.
R 3 9 M F 5
R 3 9 M F 5
Rank mark
Rank mark
1
2
3
4
Date code (2 digit)
Anode
mark
1
2
3
4
Factory identification mark
Anode
mark
Date code (2 digit)
Factory identification mark
9.66–0.5
7.62–0.3
9.66±0.5
7.62±0.3
Epoxy resin
0.26–0.1
Epoxy resin
+0.4
+0.4
2.54±0.25
−0
2.54–0.25
1.0
1.0
−0
0.5–0.1
+0
10.0
−0.5
θ
θ
θ:0 to 13˚
Product mass : approx. 0.56g
Product mass : approx. 0.54g
Sheet No.: D4-A00801EN
2
PR39MF51NSZ Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Please refer to the Model Line-up table.
Sheet No.: D4-A00801EN
3
PR39MF51NSZ Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol
IF
Rating
Unit
mA
V
*3
50
6
Forward current
Reverse voltage
RMS ON-state current
Peak one cycle surge current
Repetitive peak OFF-state voltage
Input
VR
*3
*4
IT(rms)
Isurge
0.9
9
A
Output
A
VDRM
Viso(rms)
Topr
600
4.0
V
*1Isolation voltage
kV
˚C
˚C
˚C
−30 to +85
−40 to +125
270 *5
Operating temperature
Storage temperature
*2Soldering temperature
Tstg
Soldering area
Tsol
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f=50Hz sine wave
*5 Lead solder plating models : 260˚C
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
Conditions
IF=20mA
VR=3V
MIN. TYP. MAX. Unit
−
−
1.2
−
1.4
10
100
2.5
25
−
V
µA
µA
V
VF
IR
Forward voltage
Input
Reverse current
IDRM
VT
VD=VDRM
IT=0.9A
VD=6V
−
−
Repetitive peak OFF-state current
−
−
ON-state voltage
Output
IH
−
−
mA
V/µs
mA
Ω
Holding current
−
dV/dt
IFT
VD=1/√2 ·VDRM
Critical rate of rise of OFF-state voltage
100
−
5×
1010 1011
−
VD=6V, RL=100Ω
Minimum trigger current
Isolation resistance
Turn-on time
−
10
−
Transfer
charac-
teristics
RISO
ton
DC500V,40 to 60%RH
VD=6V, RL=100Ω, IF=20mA
−
−
100
µs
Sheet No.: D4-A00801EN
4
PR39MF51NSZ Series
■ Model Line-up (1) (Lead-free terminal components)
Lead Form
Shipping Package
Model No.
Through-Hole
Sleeve
SMT Gullwing
Taping
IFT[mA]
(VD=6V,
RL=100Ω)
VDRM
[V]
Rank mark
1
50pcs/sleeve
1 000pcs/reel
MAX.10
PR39MF51NSZF
PR39MF51NIPF
600
■ Model Line-up (2) (Lead solder plating components)
Lead Form
Shipping Package
Model No.
Through-Hole
Sleeve
SMT Gullwing
Taping
IFT[mA]
(VD=6V,
RL=100Ω)
VDRM
[V]
Rank mark
1
50pcs/sleeve
1 000pcs/reel
MAX.10
PR39MF51NSZ
600
Please contact a local SHARP sales representative to see the actual status of the production.
Sheet No.: D4-A00801EN
5
PR39MF51NSZ Series
Fig.2 RMS ON-state Current vs.
Fig.1 Forward Current vs. Ambient
Temperature
Ambient Temperature
1.0
70
60
50
40
30
20
0.8
0.6
0.4
0.2
0
10
0
−30
0
50
100
100
100
−30
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Minimum Trigger Current vs.
Ambient Temperature
12
25˚C 0˚C
VD=6V
RL=100Ω
100
10
8
Ta=75˚C
50
−25˚C
50˚C
6
10
5
4
2
0
1
−40 −20
0
20
40
60
80
0
0.5
1
1.5
2
2.5
3
Ambient temperature Ta (˚C)
Forward voltage VF (V)
Fig.5 ON-state Voltage vs.
Ambient Temperature
1.4
Fig.6 Relative Holding Current vs.
Ambient Temperature
1 000
VD=6V
IT=0.9A
1.3
1.2
1.1
1.0
100
0.9
0.8
10
−40 −20
−40 −20
0
20
40
60
80
100
0
20
40
60
80
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D4-A00801EN
6
PR39MF51NSZ Series
Fig.7 ON-state Current vs. ON-state Voltage
Fig.8 Turn-on Time vs. Forward Current
100
1.2
VD=6V
RL=100Ω
Ta=25˚C
IF=20mA
Ta=25˚C
1.0
0.8
0.6
0.4
10
0.2
0
1
10
20
30
40 50
100
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Forward current IF (mA)
ON-state voltage VT (V)
Remarks : Please be aware that all data in the graph are just for reference.
Sheet No.: D4-A00801EN
7
PR39MF51NSZ Series
■ Design Considerations
● Recommended Operating Conditions
Parameter
Symbol
IF(ON)
IF(OFF)
Conditions
MIN.
20
0
MAX.
25
Unit
mA
mA
V
Input signal current at ON state
Input signal current at OFF state
Load supply voltage
−
Input
0.1
−
V
OUT(rms)
−
240
−
Locate snubber circuit between output terminals
IT(rms)×80%(∗) mA
Output Load supply current
IOUT(rms)
−
(Cs=0.022µF, Rs=47Ω)
Frequency
f
−
−
50
60
80
Hz
˚C
Operating temperature
(∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature).
Topr
−20
● Design guide
In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less.
In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width
is a minimum of 1ms.
When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the
voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation,
please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can
merely recommend some circuit values to start with : Cs=0.022µF and Rs=47Ω. The operation of the SSR
and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit
component values accordingly.
When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops
in current are not accompanied by large instantaneous changes in voltage across the Triac.
This fast change in voltage is brought about by the phase difference between current and voltage.
Primarily, this is experienced in driving loads which are inductive such as motors and solenods.
Following the procedure outlined above should provide sufficient results.
Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main
output triac as possible.
All pins shall be used by soldering on the board. (Socket and others shall not be used.)
● Degradation
In general, the emission of the IRED used in SSR will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least
twice the minimum required triggering current from initial operation.
Sheet No.: D4-A00801EN
8
PR39MF51NSZ Series
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
8.2
2.2
(Unit : mm)
● Standard Circuit
R1
2
3
8
6
+VCC
Load
SSR
ZS
D1
AC Line
V1
Tr1
ZS : Surge absorption circuit (Snubber circuit)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D4-A00801EN
9
PR39MF51NSZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A00801EN
10
PR39MF51NSZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D4-A00801EN
11
PR39MF51NSZ Series
■ Package specification
● Sleeve package
Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D4-A00801EN
12
PR39MF51NSZ Series
● Tape and Reel package
SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.1
12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
10.4±0.1
0.4±0.05
4.2±0.1
10.2±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
23±1.0
17.5±1.5
100±1.0
13±0.5
f
f
g
b
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D4-A00801EN
13
PR39MF51NSZ Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
Sheet No.: D4-A00801EN
14
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