PR3BMF51NSKF [SHARP]
Transistor Output SSR, 1-Channel, 4000V Isolation, ROHS COMPLIANT, PLASTIC, DIP-8;
| 型号： | PR3BMF51NSKF |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Transistor Output SSR, 1-Channel, 4000V Isolation, ROHS COMPLIANT, PLASTIC, DIP-8 输出元件 光电 |
| 文件： | 总14页 (文件大小：248K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PR3BMF51NSKF Series
IT(rms)≤1.2A, Non-Zero Cross type
DIP 8pin
Triac output SSR
PR3BMF51NSKF
Series
*Zero cross type is also available. (PR3BMF21NSZF Series)
Description
Agency approvals/Compliance
■
■
PR3BMF51NSKF Series Solid State Relays (SSR)
1. Recognized by UL508 file No. E94758 (as model No.
R3BMF5)
are an integration of an infrared emitting diode (IRED),
a Phototriac Detector and a main output Triac. These
devices are ideally suited for controlling high voltage AC
loads with solid state reliability while providing 4kV isola-
tion (Viso(rms)) from input to output.
2. Approved by CSA 22.2 No.14, file No. LR63705 (as
model No. R3BMF5)
3. Optionary available VDE approved (DIN EN 60747-5-
(
)
∗
2) , file No. 40008898 (as model No. R3BMF5)
4. Package resin : UL flammability grade (94V-0)
Features
■
(
) DIN EN60747-5-2 : successor standard of DIN VDE0884.
∗
1. Output current, IT(rms)≤1.2A
2. Non-zero crossing functionary
Applications
■
3. 8 pin DIP package (SMT gullwing also available)
4. High repetitive peak off-state voltage (VDRM : 600V)
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
5. Superior noise immunity (dV/dt : MIN. 100V/ s)
μ
6. Response time, ton : MAX. 100 s
2. Switching motors, fans, heaters, solenoids, and
valves.
μ
7. High isolation voltage between input and output
(Viso(rms) : 4kV)
3. Phase or power control in applications such as light-
ing and temperature control equipment.
8. Lead free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D4-A03801EN
Date Sep. 1. 2006
© SHARP Corporation
1
PR3BMF51NSKF Series
Internal Connection Diagram
■
5
8
6
1
2
3
4
5
6
8
Cathode
Anode
Cathode
Cathode
Gate
Output (T1)
Output (T2)
1
2
3
4
(Unit : mm)
Outline Dimensions
■
1. Through-Hole [ex. PR3BMF51NSKF]
2. SMT Gullwing Lead-Form [ex. PR3BMF51NIPF]
1.2±0.3
1.2±0.3
1.05±0.20
1.05±0.20
8
6
5
SHARP
mark
"S"
Model No.
SHARP
mark
"S"
8
6
5
Model No.
R 3 B M F 5
R 3 B M F 5
Rank mark
Rank mark
CSA mark
CSA mark
1
2
3
4
Date code (2 digit)
Factory identification mark
Anode
mark
1
2
3
4
Date code (2 digit)
Factory identification mark
Anode
mark
9.66±0.50
7.62±0.30
9.66±0.50
7.62±0.30
Epoxy resin
0.26±0.10
Epoxy resin
+0.4
−0
+0.4
1.0
−0
2.54±0.25
2.54±0.25
1.0
0.5±0.1
+0
10.0
−0.5
θ
θ
θ : 0 to 13˚
Product mass : approx. 0.56g
Product mass : approx. 0.54g
3. Through-Hole VDE option
4. SMT Gullwing Lead-Form VDE option
[ex. PR3BMF51YSKF]
[ex. PR3BMF51YIPF]
1.2±0.3
1.2±0.3
1.05±0.20
1.05±0.20
8
6
5
SHARP
mark
"S"
Model No.
SHARP
mark
"S"
8
6
5
Model No.
R 3 B M F 5
R 3 B M F 5
4
4
Rank mark
VDE identification mark
Rank mark
VDE identification mark
CSA mark
CSA mark
1
2
3
4
Date code (2 digit)
1
2
3
4
Anode
mark
Factory identification mark
Date code (2 digit)
Anode
mark
Factory identification mark
9.66±0.50
7.62±0.30
9.66±0.50
7.62±0.30
Epoxy resin
0.26±0.10
Epoxy resin
+0.4
−0
+0.4
1.0
−0
2.54±0.25
2.54±0.25
1.0
0.5±0.1
+0
10.0
−0.5
θ
θ
θ:0 to 13˚
Product mass : approx. 0.56g
Product mass : approx. 0.54g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D4-A03801EN
2
PR3BMF51NSKF Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
A.D.
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
:
Mark
P
Month
Mark
1
January
February
March
R
2
C
S
3
D
E
T
April
4
U
V
W
X
A
B
May
5
F
June
6
H
J
July
7
August
September
October
November
December
8
K
L
9
O
N
D
M
N
C
:
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Please refer to the Model Line-up table.
Sheet No.: D4-A03801EN
3
PR3BMF51NSKF Series
Absolute Maximum Ratings
■
(T 25˚C)
=
a
Parameter
Symbol
IF
Rating
50∗
Unit
mA
V
3
Forward current
Input
Reverse voltage
VR
6
1.2∗
12∗
3
RMS ON-state current
IT(rms)
Isurge
A
4
Output Peak one cycle surge current
Repetitive peak OFF-state voltage
*1 Isolation voltage
A
VDRM
600
4
V
V (rms)
iso
kV
˚C
˚C
˚C
Operating temperature
Topr
Tstg
Tsol
30 to 105
+
−
−
Storage temperature
*2 Soldering temperature
40 to 125
+
Soldering area
270
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f 50Hz sine wave
=
Electro-optical Characteristics
■
(T 25˚C)
=
a
Parameter
Symbol
VF
Condition
MIN.
TYP. MAX.
Unit
V
Forward voltage
I
20mA
1.2
−
1.4
10
100
2.5
25
−
=
F
−
−
Input
Reverse current
IR
VR 3V
A
A
=
μ
Repentitive peak OFF-state current
ON-state voltage
IDRM
VT
VD V
=
DRM
−
−
μ
I
1.2A
V
=
T
−
−
Output
Holding current
IH
VD 6V
mA
=
−
−
−
Critical rate of rise of OFF-state voltage
dV/dt
IFT
VD 1/ 2 ·V
100
−
V/ s
μ
mA
=
−
√
DRM
Transfer Minimum trigger current
VD 6V, R 100
10
−
=
=
L
Ω
−
1011
Isolation resistance
RISO
tON
DC500V, 40 to 60%RH
5 1010
×
Ω
charac-
Turn-on time
VD 6V, R 100 , I 20mA
100
s
μ
=
=
Ω
=
F
−
−
teristics
L
Sheet No.: D4-A03801EN
4
PR3BMF51NSKF Series
Model Line-up
■
Lead Form
Shipping
Package
Through-Hole
Sleeve
SMT Gullwing
Taping
IFT[mA]
VDRM
Rank
mark
50 pcs/sleeve
1 000 pcs/reel
(VD 6V,
=
[V]
R
L
100 )
Ω
DIN
=
Approved
Approved
EN60747-5-2
Model No.
600
1
MAX.10
PR3BMF51NSKF PR3BMF51YSKF PR3BMF51NIPF PR3BMF51YIPF
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D4-A03801EN
5
PR3BMF51NSKF Series
Fig.1 Forward Current vs.
Fig.2 RMS ON-state Current vs.
Ambient Temperature
Ambient Temperature
60
1.4
1.2
1
50
40
30
20
0.8
0.6
CONDITION
∗No heat sink
∗Paper phenol boad:
0.4
100mm×100mm×1.6mm
∗All pins should be installed in
the print board with soldering
∗Solder land:140mm2
10
0
0.2
(the total of all solder land area)
0
−30
0
50
100
−30
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Minimum Trigger Current vs.
Ambient Temperature
12
VD=6V
RL=100
25˚C
0˚C
100
10
Ta=75˚C
50˚C
−25˚C
8
6
10
4
2
0
1
0
0.5
1
1.5
2
2.5
3
−40 −20
0
20
40
60
80 100 120
Forward voltage VF (V)
Ambient temperature Ta (C)
Fig.5 ON-state Voltage vs.
Ambient Temperature
1.4
Fig.6 Relative Holding Current vs.
Ambient Temperature
1 000
VD=6V
IT(rms)=1.2A
1.3
1.2
1.1
1
100
0.9
0.8
10
−30
−30
0
50
100
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D4-A03801EN
6
PR3BMF51NSKF Series
Fig.7 ON-state Current vs. ON-state Voltage
Fig.8 Turn-on Time vs. Forward Current
2.1
100
IF=20mA
VD=6V
RL=100Ω
Ta=25˚C
Ta=25˚C
1.8
1.5
1.2
0.9
0.6
10
0.3
0
1
10
0
0.5
1
1.5
100
ON-state voltage VT (V)
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D4-A03801EN
7
PR3BMF51NSKF Series
Design Considerations
■
●
Recommended Operating Conditions
Parameter
Symbol
IF(ON)
IF(OFF)
Condition
MIN.
20
0
MAX.
25
Unit
mA
mA
V
Input signal current at ON state
Input signal current at OFF state
Load supply voltage
−
Input
0.1
−
VOUT(rms)
240
−
−
Locate snubber circuit between output terminals
IT(rms)×
80%(*)
60
Output Load supply current
IOUT(rms)
A
−
(Cs 0.022 F, Rs 47 )
=
μ
−
−
=
Ω
Frequency
f
50
Hz
Operating temperature
Topr
20
80
˚C
−
(*) See Fig.2 about derating curve (IT(rms) vs. ambient temperature).
●
Degradation
In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less
In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width
is a minimum of 1ms.
When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the
voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situa-
tion, please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can
merely recommend some circuit values to start with : Cs 0.022 F and Rs 47 . The operation of the SSR
=
μ
=
Ω
and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit
component values accordingly
When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops
in current are not accompanied by large instantaneous changes in voltage across the Triac.
This fast change in voltage is brought about by the phase difference between current and voltage.
Primarily, this is experienced in driving loads which are inductive such as motors and solenods.
Following the procedure outlined above should provide sufficient results.
Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main out-
put triac as possible.
All pins shall be used by soldering on the board. (Socket and others shall not be used.)
●
Degradation
In general, the emission of the IRED used in SSR will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least
twice the minimum required triggering current from initial operation.
Sheet No.: D4-A03801EN
8
PR3BMF51NSKF Series
●
Recommended Foot Print (reference)
SMT Gullwing Lead-form
8.2
2.2
(Unit : mm)
●
Standard Circuit
R1
2
3
8
6
+VCC
Load
SSR
ZS
D1
AC Line
V1
Tr1
ZS : Surge absorption circuit (Snubber)
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
✩
Sheet No.: D4-A03801EN
9
PR3BMF51NSKF Series
Manufacturing Guidelines
■
●
Soldering Method
Reflow Soldering :
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering (No Solder bathing)
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A03801EN
10
PR3BMF51NSKF Series
●
Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
●
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
(
)
*
•Lead , Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
(
) High melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead)
*
is exempted from the requirements.
Sheet No.: D4-A03801EN
11
PR3BMF51NSKF Series
Package specification
■
●
Sleeve package
Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12
6.7
(Unit : mm)
Sheet No.: D4-A03801EN
12
PR3BMF51NSKF Series
●
Tape and Reel package
SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.10 12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
10.4±0.1 0.40±0.05
4.2±0.1
10.2±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
φ330
17.5±1.5
φ100±1 φ13.0±0.5
f
e
f
g
b
φ23±1
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D4-A03801EN
13
PR3BMF51NSKF Series
Important Notices
■
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
[N076]
Sheet No.: D4-A03801EN
14
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