S216S02 [SHARP]
IT(rms)÷16A, Zero Cross type SIP 4pin Triac output SSR; IT （RMS ） ÷ 16A ，零交叉型SIP 4PIN可控硅输出固态继电器
| 型号： | S216S02 |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | IT(rms)÷16A, Zero Cross type SIP 4pin Triac output SSR |
| 文件： | 总13页 (文件大小：239K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S116S02 Series
S216S02 Series
IT(rms)≤16A, Zero Cross type
SIP 4pin
Triac output SSR
S116S02 Series
S216S02 Series
∗Non-zero cross type is also available. (S116S01 Series/
S216S01 Series)
■ Description
■ Agency approvals/Compliance
1. Recognized by UL508 (only for S116S02 Series), file
No. E94758 (as models No. S116S02)
2. Approved by CSA 22.2 No.14 (only for S116S02
Series), file No. LR63705 (as models No. S116S02
3. Package resin : UL flammability grade (94V-0)
S116S02 Series and S216S02 Series Solid State
Relays (SSR) are an integration of an infrared emitting
diode (IRED), a Phototriac Detector and a main output
Triac. These devices are ideally suited for controlling
high voltage AC loads with solid state reliability while
providing 4.0kV isolation (Viso(rms)) from input to
output.
)
■ Applications
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching motors, fans, heaters, solenoids, and
valves.
3. Power control in applications such as lighting and
temperature control equipment.
■ Features
1. Output current, IT(rms)≤16.0A
2. Zero crossing functionary (VOX : MAX. 35V)
3. 4 pin SIP package
4. High repetitive peak off-state voltage
(VDRM : 600V, S216S02 Series)
(VDRM : 400V, S116S02 Series)
5. High isolation voltage between input and output
(Viso(rms) : 4.0kV)
6. Lead-free terminal components are also available
(see Model Line-up section in this datasheet)
7. Screw hole for heat sink
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.:D4-A02701EN
Date Apr. 28. 2004
© SHARP Corporation
1
S116S02 Series
S216S02 Series
■ Internal Connection Diagram
1
2
3
4
Output (Triac T2)
Output (Triac T1)
Input (+)
Input (−)
1
2
3 4
Zero Crossing Circuit
(Unit : mm)
■ Outline Dimensions
S116S02
S216S02
18.5±0.2
16.4±0.3
18.5±0.2
16.4±0.3
φ3.2±0.2
5.5±0.2
φ3.2±0.2
5.5±0.2
Common to pin No.1
Common to pin No.1
Common to pin No.1
Common to pin No.1
CSA mark
UL mark
Epoxy resin
Epoxy resin
S216S02
S116S02
Model No.
Model No.
16A250VAC
16A125VAC
∗
Date code (2 digit)
∗
Date code (2 digit)
+−
+−
4-1.1±0.2
4-1.25±0.3
4-0.8±0.2
4-1.1±0.2
4-1.25±0.3
4-0.8±0.2
1
2
3 4
1
2
3 4
0.6±0.1
(1.4)
(5.08)
(7.62)
(2.54)
0.6±0.1
(1.4)
(5.08)
(7.62)
(2.54)
Product mass : approx. 6.3g
Product mass : approx. 6.3g
∗ : Do not allow external connection.
( ) : Typical dimensions
Sheet No.: D4-A02701EN
2
S116S02 Series
S216S02 Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
There is no rank mark indicator and currently there are no rank offered for this device.
Sheet No.: D4-A02701EN
3
S116S02 Series
S216S02 Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Forward current
Symbol Rating
Unit
mA
V
*3
IF
VR
50
6
Input
Reverse voltage
*3
RMS ON-state current
IT(rms)
Isurge
16
A
160 *4
400
A
Peak one cycle surge current
Repetitive
S116S02
S216S02
S116S02
VDRM
V
V
peak OFF-state voltage
Non-Repetitive
600
Output
400
VDSM
peak OFF-state voltage S216S02
Critical rate of rise of ON-state current
Operating frequency
600
dIT/dt
f
50
A/µs
Hz
kV
˚C
45 to 65
4.0
*1Isolation voltage
Viso(rms)
Topr
Soldering area
Operating temperature
Storage temperature
*2Soldering temperature
−25 to +100
−30 to +125
260
Tstg
˚C
Tsol
˚C
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f=60Hz sine wave, Tj=25˚C start
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
Conditions
MIN. TYP. MAX. Unit
VF
IR
Forward voltage
Input
IF=20mA
VR=3V
−
−
1.2
−
1.4
100
100
1.5
50
−
V
µA
µA
V
Reverse current
IDRM
VT(rms)
IH
Repetitive peak OFF-state current
ON-state voltage
VD=VDRM
−
−
IT(rms)=16A, Resistance load, IF=20mA
−
−
−
Output Holding current
−
−
mA
V/µs
V/µs
mA
Ω
dV/dt
(dV/dt)c
IFT
Critical rate of rise of OFF-state voltage
Critical rate of rise of OFF-state voltage at commutaion
Minimum trigger current
VD=2/3•VDRM
30
5
−
Tj=125˚C, VD=2/3•VDRM, dIT/dt=−8A/ms
VD=6V, RL=30Ω
−
−
−
1010
−
8
RISO
Isolation resistance
DC500V, 40 to 60%RH
IF=8mA
−
−
VOX
Zero cross voltage
−
−
35
V
VD(rms)=100V, AC50Hz
IT(rms)=2A, Resistance load, IF=20mA
VD(rms)=200V, AC50Hz
IT(rms)=2A, Resistance load, IF=20mA
VD(rms)=100V, AC50Hz
IT(rms)=2A, Resistance load, IF=20mA
VD(rms)=200V, AC50Hz
IT(rms)=2A, Resistance load, IF=20mA
Between junction and case
Between junction and ambient
S116S02
−
−
−
−
−
−
−
−
10
10
10
10
Transfer
charac-
teristics
ton
Turn-on time
ms
S216S02
S116S02
Turn-off time
toff
ms
S216S02
Rth(j-c)
Rth(j-a)
−
−
3.3
40
−
−
˚C/W
Thermal resistance
Sheet No.: D4-A02701EN
4
S116S02 Series
S216S02 Series
■ Model Line-up (1) (Lead-free terminal components)
IFT[mA]
(VD=6V,
RL=30Ω)
Case
VDRM
[V]
Shipping Package
Model No.
200pcs/case
MAX.8
MAX.8
S116S02F
S216S02F
400
600
■ Model Line-up (2) (Lead solder plating components)
IFT[mA]
(VD=6V,
RL=30Ω)
Case
VDRM
[V]
Shipping Package
Model No.
200pcs/case
MAX.8
MAX.8
S116S02
S216S02
400
600
Please contact a local SHARP sales representative to see the actual status of the production.
Sheet No.: D4-A02701EN
5
S116S02 Series
S216S02 Series
Fig.1 Forward Current vs. Ambient
Temperature
60
50
40
30
20
10
0
−25
0
25
50
75
100
100
100
125
Ambient temperature Ta (˚C)
Fig.2 RMS ON-state Current vs.
Ambient Temperature
20
(1) With infinite heat sink
(2) With heat sink (280×280×2mm Al plate)
(3) With heat sink (200×200×2mm Al plate)
(4) With heat sink (100×100×2mm Al plate)
(5) Without heat sink
(Note) In natural cooling condition, please locate Al
plate vertically, spread the thermal conductive
silicone grease on the touch surface of the
device and tighten up the device in the center
of Al plate at the torque of 0.4N • m.
18
16
(2)
(1)
(3)
14
(4)
12
10
8
6
4
(5)
2
0
−25
0
50
75
125
25
Ambient temperature Ta (˚C)
Fig.3 RMS ON-state Current vs.
Fig.4 Forward Current vs. Forward Voltage
Case Temperature
16
100
Ta=100˚C
14
12
10
8
75˚C
25˚C
50˚C
0˚C
10
−25˚C
6
4
2
0
1
−25
0
25
50
75
125
0
1.0
2.0
Case temperature Tc (˚C)
Forward voltage VF (V)
Sheet No.: D4-A02701EN
6
S116S02 Series
S216S02 Series
Fig.5 Surge Current vs. Power-on Cycle
Fig.6 Maximum ON-state Power Dissipation
vs. RMS ON-state Current
200
20
Ta=25˚C
f=60Hz
Tj=25˚C Start
180
18
160
140
120
100
80
16
14
12
10
8
60
6
40
4
20
0
2
0
1
10
100
0
2
4
6
8
10
12
14
16
Power-on cycle (Times)
RMS ON-state current IT (rms)(A)
Fig.7 Minimum Trigger Current vs.
Fig.8-a Repetitive Peak OFF-state Current
vs. Ambient Temperature (S116S02)
Ambient Temperature
10
10−4
VD=400V
VD=6V
RL=30Ω
10−5
10−6
10−7
8
6
4
10−8
10−9
2
0
−25
0
25
50
75
100
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.8-b Repetitive Peak OFF-state Current vs.
Ambient Temperature (S216S02)
10−4
VD=600V
10−5
10−6
10−7
10−8
10−9
Remarks : Please be aware that all data in the graph
are just for reference.
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Sheet No.: D4-A02701EN
7
S116S02 Series
S216S02 Series
■ Design Considerations
● Recommended Operating Conditions
Parameter
Input signal current at ON state
Input signal current at OFF state
Symbol
IF(ON)
IF(OFF)
Conditions
MIN.
16
MAX.
24
Unit
mA
mA
−
−
Input
0
0.1
S116S02
Load supply voltage
S216S02
80
120
V
OUT(rms)
V
−
80
240
Output
Locate snubber circuit between output terminals
IT(rms)
×80%(∗)
63
Load supply current
I
OUT(rms)
0.1
mA
(Cs=0.1µF, Rs=47Ω)
Frequency
f
−
−
47
Hz
˚C
Operating temperature
(∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature).
Topr
−20
80
● Design guide
In order for the SSR to turn off, the triggering current (lF) must be 0.1mA or less.
When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the
voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation,
please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can
merely recommend some circuit vales to start with : Cs=0.1µF and Rs=47Ω. The operation of the SSR and
snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit com-
ponent values accordingly.
When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops
in current are not accompanied by large instantaneous changes in voltage across the Triac.
This fast change in voltage is brought about by the phase difference between current and voltage.
Primarily, this is experienced in driving loads which are inductive such as motors and solenoids.
Following the procedure outlined above should provide sufficient results.
For over voltage protection, a Varistor may be used.
Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main out-
put triac as possible.
Particular attention needs to be paid when utilizing SSRs that incorporate zero crossing circuitry.
If the phase difference between the voltage and the current at the output pins is large enough, zero crossing
type SSRs cannot be used. The result, if zero crossing SSRs are used under this condition, is that the SSR
may not turn on and off irregardless of the input current. In this case, only a non zero cross type SSR should
be used in combination with the above mentioned snubber circuit selection process.
The load current should be within the bounds of derating curve. (Refer to Fig.2)
Also, please use the optional heat sink when necessary.
In case the optional heat sink is used and the isolation voltage between the device and the optional heat sink
is needed, please locate the insulation sheet between the device and the heat sink.
When the optional heat sink is equipped, please set up the M3 screw-fastening torque at 0.3 to 0.5N•m.
In order to dissipate the heat generated from the inside of device effectively, please follow the below sugges-
tions.
Sheet No.: D4-A02701EN
8
S116S02 Series
S216S02 Series
(a) Make sure there are no warps or bumps on the heat sink, insulation sheet and device surface.
(b) Make sure there are no metal dusts or burrs attached onto the heat sink, insulation sheet and device sur-
face.
(c) Make sure silicone grease is evenly spread out on the heat sink, insulation sheet and device surface.
Silicone grease to be used is as follows;
1) There is no aged deterioration within the operating temperature ranges.
2) Base oil of grease is hardly separated and is hardly permeated in the device.
3) Even if base oil is separated and permeated in the device, it should not degrade the function of a device.
Recommended grease : G-746 (Shin-Etsu Chemical Co., Ltd.)
: G-747 (Shin-Etsu Chemical Co., Ltd.)
: SC102 (Dow Corning Toray Silicone Co., Ltd.)
In case the optional heat sink is screwed up, please solder after screwed.
In case of the lead frame bending, please keep the following minimum distance and avoid any mechanical
stress between the base of terminals and the molding resin.
4.4mm MIN.
Some of AC electromagnetic counters or solenoids have built-in rectifier such as the diode.
In this case, please use the device carefully since the load current waveform becomes similar with rectangu-
lar waveform and this results may not make a device turn off.
● Degradation
In general, the emission of the IRED used in SSR will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least
twice the minimum required triggering current from initial operation.
● Standard Circuit
S116S02
S216S02
R1
3
4
1
2
+VCC
Load
SSR
ZS
D1
AC Line
V1
Tr1
ZS : Surge absorption circuit (Snubber circuit)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D4-A02701EN
9
S116S02 Series
S216S02 Series
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering (No solder bathing)
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please solder within one time.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A02701EN
10
S116S02 Series
S216S02 Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D4-A02701EN
11
S116S02 Series
S216S02 Series
■ Package specification
Package materials
Packing case : Corrugated cardboard
Partition : Corrugated cardboard
Pad : Corrugated cardboard
Cushioning material : Polyethylene
Molt plane : Urethane
Package method
The product should be located after the packing case is partitioned and protected inside by 4 pads.
Each partition should have 5 products with the lead upward.
Cushioning material and molt plane should be located after all products are settled (1 packing contains 200
pcs).
Package composition
Molt plane
Cushioning material
Product
Pad
Partition
Packing case
Sheet No.: D4-A02701EN
12
S116S02 Series
S216S02 Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D4-A02701EN
13
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