S-24C016D [SII]

2-WIRE SERIAL E2PROM;
S-24C016D
型号: S-24C016D
厂家: SEIKO INSTRUMENTS INC    SEIKO INSTRUMENTS INC
描述:

2-WIRE SERIAL E2PROM

可编程只读存储器
文件: 总47页 (文件大小:2010K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
S-24C02D/04D/08D/16D  
www.sii-ic.com  
2-WIRE SERIAL E2PROM  
© SII Semiconductor Corporation, 2012  
Rev.3.0_01_U  
This IC is a 2-wire, low current consumption and wide range operation serial E2PROM. This IC has the capacity of 2 K-bit,  
4 K-bit, 8-K bit and 16 K-bit, and the organization is 256 words × 8-bit, 512 words × 8-bit, 1024 words × 8-bit and 2048 words  
× 8-bit, respectively. Page write and sequential read are available.  
Caution This product is intended to use in general electronic devices such as consumer electronics, office  
equipment, and communications devices. Before using the product in medical equipment or automobile  
equipment including car audio, keyless entry and engine control unit, contact to SII Semiconductor  
Corporation is indispensable.  
Features  
Packages  
Operation voltage range  
8-Pin SOP (JEDEC)  
SOT-23-5  
Read:  
1.7 V to 5.5 V  
5
Write:  
1.7 V to 5.5 V  
4
5
Operation frequency:  
1.0 MHz max. (VCC = 2.5 V to 5.5 V)  
8
3
4
400 kHz max. (VCC = 1.7 V to 5.5 V)  
5.0 ms max.  
1
1
Write time:  
Page write  
(2.8 × 2.9 × t1.3 mm)  
S-24C02D:  
8 bytes / page  
(5.0 × 6.0 × t1.75 mm)  
S-24C04D: 16 bytes / page  
S-24C08D: 16 bytes / page  
S-24C16D: 16 bytes / page  
DFN-8(2030)  
8-Pin TSSOP  
Sequential read  
Noise suppression:  
Schmitt trigger and noise filter on input pins (SCL, SDA)  
5
5
8
8
4
1
Write protect function during low power supply voltage  
Endurance:  
4
1
106 cycle / word*1 (Ta = +25°C)  
Data retention: 100 years (Ta = +25°C)  
Memory capacity  
(3.0 × 6.4 × t1.1 mm)  
(3.0 × 2.0 × t0.5 mm)  
S-24C02D:  
S-24C04D:  
S-24C08D:  
2 K-bit  
4 K-bit  
8 K-bit  
TMSOP-8  
SNT-8A  
S-24C16D: 16 K-bit  
5
8
Write protect:  
Initial delivery state:  
Operation temperature range:  
Lead-free (Sn 100%), halogen-free  
100%  
FFh  
Ta = 40°C to +85°C  
5
4
8
4
1
1
(2.9 × 4.0 × t0.8 mm)  
(2.5 × 2.0 × t0.5 mm)  
*1. For each address (Word: 8-bit)  
1
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D/16D  
Rev.3.0_01_U  
Block Diagram  
VCC  
GND  
WP  
SCL  
SDA  
Start / Stop  
Detector  
Voltage Detector  
High-Voltage Generator  
Serial Clock  
Controller  
LOAD  
Device Address  
Comparator  
COMP  
LOAD INC  
Data Register  
A0*1  
R / W  
Address  
Counter  
A1*2  
A2*3  
Memory Cell Array  
Selector  
X Decoder  
Y Decoder  
Data Output  
ACK Output  
Controller  
DIN  
DOUT  
*1. This pin is not available for the S-24C04D/08D/16D.  
*2. This pin is not available for the S-24C08D/16D.  
*3. This pin is not available for the S-24C16D.  
Remark The A0 pin, the A1 pin and the A2 pin are no connection in the product with SOT-23-5 package.  
2
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D/16D  
Rev.3.0_01_U  
Product Name Structure  
1. Product name  
S-24CxxD  
I
-
xxxx  
U
5
Environmental code  
U: Lead-free (Sn 100%), halogen-free  
Package name (abbreviation) and IC packing specification*1  
J8T1: 8-Pin SOP (JEDEC), Tape  
T8T1: 8-Pin TSSOP, Tape  
K8T3: TMSOP-8, Tape  
M5T1: SOT-23-5, Tape  
A8T1: DFN-8(2030), Tape  
I8T1: SNT-8A, Tape  
Operation temperature  
I:  
Ta = 40°C to +85°C  
Product name  
S-24C02D: 2 K-bit  
S-24C04D: 4 K-bit  
S-24C08D: 8 K-bit  
S-24C16D: 16 K-bit  
*1. Refer to the tape drawing.  
2. Packages  
Package Name  
Dimension  
Tape  
Reel  
Land  
8-Pin SOP (JEDEC)  
8-Pin TSSOP  
TMSOP-8  
FJ008-Z-P-SD  
FT008-Z-P-SD  
FM008-A-P-SD  
MP005-A-P-SD  
PP008-A-P-S1  
PH008-A-P-SD  
FJ008-Z-C-SD  
FT008-Z-C-SD  
FM008-A-C-SD  
MP005-B-C-SD  
PP008-A-C-SD  
PH008-A-C-SD  
FJ008-Z-R-SD  
FT008-Z-R-SD  
FM008-A-R-SD  
MP005-B-R-SD  
PP008-A-R-SD  
PH008-A-R-SD  
SOT-23-5  
DFN-8(2030)  
SNT-8A  
PP008-A-L-SD  
PH008-A-L-SD  
3
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D/16D  
Rev.3.0_01_U  
3. Product name list  
Product Name  
Capacity  
2 K-bit  
2 K-bit  
2 K-bit  
2 K-bit  
2 K-bit  
2 K-bit  
4 K-bit  
4 K-bit  
4 K-bit  
4 K-bit  
4 K-bit  
4 K-bit  
8 K-bit  
8 K-bit  
8 K-bit  
8 K-bit  
8 K-bit  
8 K-bit  
16 K-bit  
16 K-bit  
16 K-bit  
16 K-bit  
16 K-bit  
16 K-bit  
Package Name  
8-Pin SOP (JEDEC)  
8-Pin TSSOP  
TMSOP-8  
S-24C02DI-J8T1U5  
S-24C02DI-T8T1U5  
S-24C02DI-K8T3U5  
S-24C02DI-M5T1U5  
S-24C02DI-A8T1U5  
S-24C02DI-I8T1U5  
S-24C04DI-J8T1U5  
S-24C04DI-T8T1U5  
S-24C04DI-K8T3U5  
S-24C04DI-M5T1U5  
S-24C04DI-A8T1U5  
S-24C04DI-I8T1U5  
S-24C08DI-J8T1U5  
S-24C08DI-T8T1U5  
S-24C08DI-K8T3U5  
S-24C08DI-M5T1U5  
S-24C08DI-A8T1U5  
S-24C08DI-I8T1U5  
S-24C16DI-J8T1U5  
S-24C16DI-T8T1U5  
S-24C16DI-K8T3U5  
S-24C16DI-M5T1U5  
S-24C16DI-A8T1U5  
S-24C16DI-I8T1U5  
SOT-23-5  
DFN-8(2030)  
SNT-8A  
8-Pin SOP (JEDEC)  
8-Pin TSSOP  
TMSOP-8  
SOT-23-5  
DFN-8(2030)  
SNT-8A  
8-Pin SOP (JEDEC)  
8-Pin TSSOP  
TMSOP-8  
SOT-23-5  
DFN-8(2030)  
SNT-8A  
8-Pin SOP (JEDEC)  
8-Pin TSSOP  
TMSOP-8  
SOT-23-5  
DFN-8(2030)  
SNT-8A  
4
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D/16D  
Rev.3.0_01_U  
Pin Configurations  
1. 8-Pin SOP (JEDEC), 8-Pin TSSOP, TMSOP-8, DFN-8(2030), SNT-8A  
Top view  
Symbol  
S-24C02D S-24C04D S-24C08D S-24C16D  
Pin No.  
Description  
1
2
3
4
8
7
6
5
1
2
3
4
5
6
A0  
NC*2  
NC*2  
NC*2  
A2  
NC*2  
NC*2  
NC*2  
Slave address input  
Slave address input  
Slave address input  
Ground  
A1  
A1  
A2  
A2  
GND  
SDA*1  
SCL*1  
GND  
SDA*1  
SCL*1  
GND  
SDA*1  
SCL*1  
GND  
SDA*1  
SCL*1  
Serial data I/O  
Serial clock input  
Write protect input  
Connected to VCC  
:
7
8
WP  
WP  
WP  
WP  
Protection valid  
Open or connected to GND:  
Protection invalid  
VCC  
VCC  
VCC  
VCC  
Power supply  
2. SOT-23-5  
Top view  
Pin No.  
Symbol  
Description  
1
2
3
4
SCL*1  
GND  
SDA*1  
VCC  
Serial clock input  
Ground  
5
4
Serial data I/O  
Power supply  
Write protect input  
1
2
3
5
WP  
Connected to VCC  
:
Protection valid  
Open or connected to GND:  
Protection invalid  
*1. Do not use it in "High-Z".  
*2. The NC is no connection.  
Remark For DFN-8(2030) package, connect the heatsink of back side to the board, and set electric potential open or GND.  
However, do not use it as the function of electrode.  
5
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
Absolute Maximum Ratings  
Table 1  
Absolute Maximum Rating  
Item  
Symbol  
VCC  
VIN  
Unit  
V
Power supply voltage  
Input voltage  
0.3 to +6.5  
0.3 to +6.5  
0.3 to +6.5  
40 to +85  
65 to +150  
V
Output voltage  
VOUT  
Topr  
Tstg  
V
Operation ambient temperature  
Storage temperature  
°C  
°C  
Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical  
damage. These values must therefore not be exceeded under any conditions.  
Recommended Operating Conditions  
Table 2  
Ta = 40°C to +85°C  
Item  
Symbol  
VCC  
Condition  
Unit  
Min.  
Max.  
V
V
V
V
Read  
Write  
1.7  
1.7  
5.5  
5.5  
Power supply voltage  
VIH  
VIL  
High level input voltage  
Low level input voltage  
V
CC = 1.7 V to 5.5 V  
CC = 1.7 V to 5.5 V  
0.7 × VCC  
0.3  
5.5  
V
0.3 × VCC  
Pin Capacitance  
Table 3  
(Ta = +25°C, f = 1.0 MHz, VCC = 5.0 V)  
Item  
Symbol  
Condition  
Min.  
Max.  
Unit  
pF  
pF  
pF  
pF  
pF  
VIN = 0 V (S-24C02D: SCL, A0, A1, A2, WP)  
VIN = 0 V (S-24C04D: SCL, A1, A2, WP)  
VIN = 0 V (S-24C08D: SCL, A2, WP)  
VIN = 0 V (S-24C16D: SCL, WP)  
VI/O = 0 V (SDA)  
8
8
8
8
8
Input capacitance  
I/O capacitance  
CIN  
CI/O  
Endurance  
Table 4  
Item  
Symbol  
NW  
Operation Ambient Temperature  
Min.  
106  
Max.  
Unit  
cycle / word*1  
Endurance  
Ta = +25°C  
*1. For each address (Word: 8-bit)  
Data Retention  
Table 5  
Item  
Symbol  
Operation Ambient Temperature  
Min.  
100  
Max.  
Unit  
year  
Data retention  
Ta = +25°C  
6
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
DC Electrical Characteristics  
Table 6  
Ta = 40°C to +85°C  
VCC = 2.5 V to 5.5 V  
VCC = 1.7 V to 5.5 V  
SCL = 400 kHz  
Item  
Symbol  
Condition  
Unit  
mA  
f
SCL = 1.0 MHz  
f
Min.  
Max.  
Min.  
Max.  
Current consumption  
(READ)  
ICC1  
1.0  
0.8  
Table 7  
Ta = 40°C to +85°C  
VCC = 2.5 V to 5.5 V  
SCL = 1.0 MHz  
VCC = 1.7 V to 5.5 V  
Item  
Symbol  
Condition  
Unit  
mA  
f
fSCL = 400 kHz  
Min.  
Max.  
Min.  
Max.  
Current consumption  
(WRITE)  
ICC2  
2.0  
2.0  
Table 8  
Ta = 40°C to +85°C  
VCC = 2.5 V to 5.5 V  
VCC = 1.7 V to 2.5 V  
Item  
Symbol  
Condition  
Unit  
Min.  
Max.  
Min.  
Max.  
Standby current  
consumption  
ISB  
ILI1  
ILI2  
ILO  
IIL  
VIN = VCC or GND  
SCL, SDA  
1.0  
1.0  
μA  
μA  
μA  
μA  
μA  
μA  
kΩ  
kΩ  
Input leakage current 1  
Input leakage current 2  
Output leakage current  
Input current 1  
1.0  
1.0  
1.0  
50.0  
2.0  
1.0  
1.0  
1.0  
50.0  
2.0  
V
IN = GND to VCC  
A0, A1, A2  
IN > 0.7 × VCC  
SDA  
V
VOUT = GND to VCC  
WP  
VIN < 0.3 × VCC  
WP  
Input current 2  
IIH  
VIN > 0.7 × VCC  
WP  
Input Impedance 1  
Input Impedance 2  
ZIL  
ZIH  
30  
500  
30  
500  
VIN = 0.3 × VCC  
WP  
VIN = 0.7 × VCC  
I
OL = 3.2 mA  
0.4  
0.3  
0.2  
0.3  
V
V
V
Low level output voltage  
VOL  
IOL = 1.5 mA  
IOL = 0.7 mA  
0.2  
7
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
AC Electrical Characteristics  
Table 9 Measurement Conditions  
Input pulse voltage  
Output reference voltage  
0.7 × VCC  
Input pulse voltage  
0.2 × VCC to 0.8 × VCC  
0.8 × VCC  
Input pulse rising / falling time  
Output reference voltage  
Output load  
20 ns or less  
0.3 × VCC to 0.7 × VCC  
100 pF  
0.3 × VCC  
0.2 × VCC  
Figure 1 Input / Output Waveform during AC Measurement  
Table 10  
Ta = 40°C to +85°C  
Item  
Symbol  
fSCL  
VCC = 2.5 V to 5.5 V  
VCC = 1.7 V to 5.5 V  
Unit  
Min.  
0
Max.  
1000  
0.5  
Min.  
0
Max.  
400  
0.9  
SCL clock frequency  
SCL clock time "L"  
SCL clock time "H"  
SDA output delay time  
SDA output hold time  
Start condition setup time  
Start condition hold time  
Data input setup time  
Data input hold time  
Stop condition setup time  
SCL, SDA rising time  
SCL, SDA falling time  
WP setup time  
kHz  
μs  
μs  
μs  
ns  
μs  
μs  
ns  
ns  
μs  
μs  
μs  
μs  
μs  
μs  
μs  
μs  
ns  
ms  
tLOW  
tHIGH  
tAA  
0.4  
0.3  
0.1  
50  
0.25  
0.25  
80  
0
1.3  
0.6  
0.1  
50  
0.6  
0.6  
100  
0
tDH  
tSU.STA  
tHD.STA  
tSU.DAT  
tHD.DAT  
tSU.STO  
tR  
0.25  
0.6  
0.3  
0.3  
0.3  
0.3  
tF  
tWS1  
tWH1  
tWS2  
tWH2  
tBUF  
tI  
0
0
WP hold time  
0
0
WP release setup time  
WP release hold time  
Bus release time  
0
0
0
0
0.5  
1.3  
Noise suppression time  
Write time  
50  
50  
tWR  
5.0  
5.0  
8
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
tHIGH  
tLOW  
tF  
tR  
SCL  
tHD.STA  
tSU.DAT  
tHD.DAT  
tSU.STA  
tSU.STO  
SDA  
input  
tAA  
tDH  
tBUF  
SDA  
output  
Figure 2 Bus Timing  
Acknowledge  
Start Condition  
Stop Condition  
Write Data  
Start Condition  
tWR  
SCL  
SDA  
D0  
tWS1  
tWH1  
WP  
(valid)  
tWS2  
tWH2  
WP  
(invalid)  
Figure 3 Write Cycle Timing  
9
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
Pin Functions  
1. VCC (Power supply) pin  
The VCC pin is used to apply positive supply voltage. Regarding the applied voltage value, refer to "  
Recommended Operating Conditions". Set a bypass capacitor of about 0.1 μF between the VCC pin and the GND  
pin to make the power supply voltage stable.  
2. A0, A1 and A2 (Slave address input) pins  
In the S-24C02D, to set the slave address, connect each of A0 pin, A1 pin and A2 pin to the GND pin or the VCC pin.  
Therefore the users can set 8 types of slave address by a combination of A0, A1, A2 pins.  
In the S-24C04D, to set the slave address, connect each of A1 pin and A2 pin to the GND pin or the VCC pin.  
Therefore the users can set 4 types of slave address by a combination of A1, A2 pins.  
In the S-24C08D, to set the slave address, connect A2 pin to the GND pin or the VCC pin. Therefore the users can  
set 2 types of slave address.  
In the S-24C16D, the slave address can not be assigned.  
Comparing the slave address transmitted from the master device and one that you set, makes possible to select one  
slave address from other devices connected onto the bus.  
Each of A0 pin, A1 pin and A2 pin has a built-in pull-down resistor. In open, the pin is set to the same status as it  
connected to the GND pin.  
In the case of the products with SOT-23-5, set the slave address transmitting from the master device to "0".  
3. SDA (Serial data I/O) pin  
The SDA pin is used for the bi-directional transmission of serial data. This pin is a signal input pin, and an Nch open-  
drain output pin.  
In use, generally, connect the SDA line to any other device which has the open-drain or open-collector output with  
Wired-OR connection by pulling up to VCC by a resistor. Figure 4 shows the relation with an output load.  
4. SCL (Serial clock input) pin  
The SCL pin is used for the serial clock input. Since the signals are processed at a rising or falling edge of the SCL  
clock, pay attention to the rising and falling time and comply with the specification.  
5. WP (Write protect input) pin  
The write protect is enabled by connecting the WP pin to VCC. When not using the write protect, connect this pin to  
the GND pin or set in open.  
20  
18  
16  
14  
12  
10  
8
Maximum value of pull-up resistor  
f
SCL  
= 400 kHz  
[kΩ]  
6
4
f
SCL  
= 1000 kHz  
2
0
10  
100  
200  
Value of load capacity  
[pF]  
Figure 4 Output Load  
10  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
Initial Delivery State  
Initial delivery state of all addresses is "FFh".  
Operation  
1. Initialization operation after power-on  
By a power-on-clear circuit, this IC initializes the internal circuit at the time of power-on. Perform the beginning (start  
condition) of the instruction transmission to this IC after the initialization by the power-on-clear circuit. Regarding the  
datails of power-on-clear, refer to "5. Power-on-clear circuit" in "Usage".  
2. Start condition  
Start is identified by a "H" to "L" transition of the SDA line while the SCL line is stable at "H".  
Every operation begins from a start condition.  
3. Stop condition  
Stop is identified by a "L" to "H" transition of the SDA line while the SCL line is stable at "H".  
When a device receives a stop condition during a read sequence, the read operation is interrupted, and the device  
enters standby mode.  
When a device receives a stop condition during a write sequence, the reception of the write data is halted, and this IC  
initiates a write cycle.  
tINIT  
VCC  
tSU.STA  
tHD.STA  
tSU.STO  
SCL  
SDA  
Start condition  
Stop condition  
Figure 5 Start / Stop Conditions after Power-on  
11  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
4. Data transmission  
Changing the SDA line while the SCL line is "L", data is transmitted.  
Changing the SDA line while the SCL line is "H", a start or stop condition is recognized.  
tSU.DAT  
tHD.DAT  
SCL  
SDA  
Figure 6 Data Transmission Timing  
5. Acknowledge  
The unit of data transmission is 8 bits. During the 9th clock cycle period the receiver on the bus pulls down the SDA  
line to acknowledge the receipt of the 8-bit data.  
When an internal write cycle is in progress, the device does not generate an acknowledge.  
SCL  
(E2PROM input)  
1
8
9
SDA  
(Master output)  
Acknowledge  
output  
SDA  
(E2PROM output)  
Start condition  
tAA  
tDH  
Figure 7 Acknowledge Output Timing  
12  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
6. Device addressing  
To start communication, the master device on the system generates a start condition to the bus line. Next, the master  
device sends 7-bit device address and a 1-bit read / write instruction code on to the SDA bus.  
The higher 4 bits of the device address are the "Device Code", and are fixed to "1010".  
In the S-24C02D, successive 3 bits are the "Slave Address". These 3 bits are used to identify a device on the system  
bus and are compared with the predetermined value which is defined by the address input pins (A2, A1, A0). When  
the comparison result matches, the slave device responds with an acknowledge during the 9th clock cycle.  
In the S-24C04D, successive 2 bits are the "Slave Address". These 2 bits are used to identify a device on the system  
bus and are compared with the predetermined value which is defined by the address input pins (A2, A1). When the  
comparison result matches, the slave device responds with an acknowledge during the 9th clock cycle.  
The successive 1 bit (P0) is used to define a page address and choose the two 256-byte memory blocks (Address  
000h to 0FFh, 100h to 1FFh).  
In the S-24C08D, successive 1 bit is called the "Slave Addrdess". This 1 bit is used to identify a device on the system  
bus and is compared with the predetermined value which is defined by the address input pin (A2). When the  
comparison result matches, the slave device responds with an acknowledge during the 9th clocks cycle.  
The successive 2 bits (P1, P0) are used to define a page address and choose the four 256-byte memory blocks  
(Address 000h to 0FFh, 100h to 1FFh, 200h to 2FFh , 300h to 3FFh).  
In the S-24C16D, successive 3 bits (P2, P1, P0) are "Page Address". Choose the 8 memory blocks of 256-byte  
(Adress 000h to 0FFh, 100h to 1FFh, 200h to 2FFh, 300h to 3FFh, 400h to 4FFh, 500h to 5FFh, 600h to 6FFh, 700h  
to 7FFh).  
In the case of the product with SOT-23-5, set the slave address transmitting from the master device to "0".  
Slave / Page  
Device Code  
Address  
1
1
0
0
1
1
0
0
A1  
A1  
A0  
P0  
R / W  
R / W  
A2  
A2  
S-24C02D  
S-24C04D  
1
0
0
1
1
0
0
P1  
P1  
P0  
P0  
R / W  
R / W  
A2  
P2  
S-24C08D  
S-24C16D  
1
MSB  
LSB  
Figure 8 Device Address  
13  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
7. Write  
7. 1 Byte write  
When the master sends a 7-bit device address and a 1-bit read / write instruction code set to "0", following a start  
condition, this IC acknowledges it.  
This IC then receives an 8-bit word address and responds with an acknowledge. After this IC receives 8-bit write  
data and responds with an acknowledge, it receives a stop condition and that initiates the write cycle at the  
addressed memory.  
During the write cycle all operations are forbidden and no acknowledge is generated.  
W
R
I
T
E
S
T
A
R
T
S
T
O
P
DEVICE  
ADDRESS  
DATA  
WORD ADDRESS  
1
0 1 0  
A2 A1 A0  
0
SDA LINE  
W7 W6 W5 W4 W3 W2 W1 W0  
D7 D6 D5 D4 D3 D2 D1 D0  
M
S
B
L R  
A
C
K
A
K
C
A
C
K
S
B
/
W
Remark A0 is P0 in the S-24C04D/08D/16D.  
A1 is P1 in the S-24C08D/16D.  
A2 is P2 in the S-24C16D.  
Set A0, A1, A2 to "0" in the product with SOT-23-5 package.  
Figure 9 Byte Write  
14  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
7. 2 Page write  
The page write mode allows up to 8 bytes to be written in a single write operation in the S-24C02D.  
The page write mode allows up to 16 bytes to be written in a single write operation in the S-24C04D/08D/16D.  
Its basic process to transmit data is as same as byte write, but it operates page write by sequentially receiving  
8-bit write data as much data as the page size has.  
When this IC receives a 7-bit device address and a 1-bit read / write instruction code set to "0", following a start  
condition, it generates an acknowledge. Then this IC receives an 8-bit word address, and responds with an  
acknowledge. After this IC receives 8-bit write data and responds with an acknowledge, it receives 8-bit write data  
corresponding to the next word address, and generates an acknowledge. This IC repeats reception of 8-bit write  
data and generation of acknowledge in succession. This IC can receive as many write data as the maximum page  
size.  
Receiving a stop condition initiates a write cycle of the area starting from the designated memory address and  
having the page size equal to the received write data.  
S
T
A
R
T
W
S
T
O
P
R
I
T
E
DEVICE  
ADDRESS  
DATA (n + 1)  
DATA (n)  
DATA (n + x)  
WORD ADDRESS (n)  
SDA  
LINE  
D7 D6 D5 D4 D3 D2 D1 D0  
1
0
1
0
W7W6W5W4W3W2W1W0  
D7  
D0  
D7  
D0  
A2 A1 A0  
0
M
S
B
R A  
/ C  
W
L
S
B
A
C
K
A
C
K
A
C
K
A
C
K
K
Remark A0 is P0 in the S-24C04D/08D/16D.  
A1 is P1 in the S-24C08D/16D.  
A2 is P2 in the S-24C16D.  
Set A0, A1, A2 to "0" in the product with SOT-23-5 package.  
Figure 10 Page Write  
In the S-24C02D, the lower 3 bits of the word address are automatically incremented every time when the  
S-24C02D receives 8-bit write data. If the size of the write data exceeds 8 bytes, the higher 5 bits (W7 to W3) of  
the word address remain unchanged, and the lower 3 bits are rolled over and the last 8-byte data that the  
S-24C02D received will be overwritten.  
In the S-24C04D, the lower 4 bits of the word address are automatically incremented every time when the  
S-24C04D receives 8-bit write data. If the size of the write data exceeds 16 bytes, the higher 4 bits (W7 to W4) of  
the word address and page address (P0) remain unchanged, and the lower 4 bits are rolled over and the last 16-  
byte data that the S-24C04D received will be overwritten.  
In the S-24C08D, the lower 4 bits of the word address are automatically incremented every time when the  
S-24C08D receives 8-bit write data. If the size of the write data exceeds 16 bytes, the higher 4 bits (W7 to W4) of  
the word address and page address (P1, P0) remain unchanged, and the lower 4 bits are rolled over and the last  
16-byte data that the S-24C08D received will be overwritten.  
In the S-24C16D, the lower 4 bits of the word address are automatically incremented every time when the  
S-24C16D receives 8-bit write data. If the size of the write data exceeds 16 bytes, the higher 4 bits (W7 to W4) of  
the word address and page address (P2, P1, P0) remain unchanged, and the lower 4 bits are rolled over and the  
last 16-byte data that the S-24C16D received will be overwritten.  
15  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
7. 3 Write protect  
Write protect is available in this IC. When the WP pin is connected to the VCC pin, write operation to memory area  
is forbidden at all.  
When the WP pin is connected to the GND pin or set in open, the write protect is invalid, and write operation in all  
memory area is available.  
Fix the level of the WP pin from start condition in the write operation (byte write, page write) until stop condition. If  
the WP pin changes during this time, the address data being written at this time is not guaranteed. Regarding the  
timing of write protect, refer to "Figure 3 Write Cycle Timing".  
When not using the write protect, connect the WP pin to the GND pin or set in open. The write protect is valid in  
the range of operation power supply voltage.  
As seen in Figure 11 when the write protect is valid, this IC does not generate an acknowledgel after data input.  
W
R
I
T
E
S
T
A
R
T
S
T
O
P
DEVICE  
ADDRESS  
DATA  
WORD ADDRESS  
1
0 1 0  
A2 A1 A0  
0
SDA LINE  
W7 W6 W5 W4 W3 W2 W1 W0  
D7 D6 D5 D4 D3 D2 D1 D0  
M
S
B
L R  
A
C
K
A
K
C
N
A
C
K
S
B
/
W
WP  
Remark A0 is P0 in the S-24C04D/08D/16D.  
A1 is P1 in the S-24C08D/16D.  
A2 is P2 in the S-24C16D.  
Set A0, A1, A2 to "0" in the product with SOT-23-5 package.  
Figure 11 Write Protect  
16  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
7. 4 Acknowledge polling  
Acknowledge polling is used to know the completion of the write cycle in this IC.  
After this IC receives a stop condition and once starts the write cycle, all operations are forbidden and no  
response is made to the signal transmitted by the master device.  
Accordingly the master device can recognize the completion of the write cycle in this IC by detecting a response  
from the slave device after transmitting the start condition, the device address and the read / write instruction  
code to this IC, namely to the slave devices.  
That is, if this IC does not generate an acknowledge, the write cycle is in progress and if this IC generates an  
acknowledge, the write cycle has been completed.  
It is recommended to use the read instruction "1" as the read / write instruction code transmitted by the master  
device.  
Acknowledge polling during read  
NO ACK from  
Master Device  
S
T
A
R
T
S
T
A
R
T
S
T
A
R
T
S
T
O
P
S
T
O
P
R
E
A
D
R
E
A
D
DATA  
SDA  
LINE  
DEVICE  
ADDRESS  
DEVICE  
ADDRESS  
DEVICE  
ADDRESS  
DATA  
1
1
D2 D1 D0  
N
A
C
K
R
/
W
R
/
W
A
C
K
R A  
/ C  
W
K
tWR  
Acknowledge polling during write  
W
R
I
T
E
W
R
I
T
E
S
T
A
R
T
S
T
A
R
T
S
T
O
P
DATA  
WORD  
ADDRESS  
SDA  
LINE  
DEVICE  
ADDRESS  
DEVICE  
ADDRESS  
0
0
D2 D1 D0  
N
A
C
K
A
C
K
R
/
W
R
/
W
A
C
K
tWR  
Remark Users are able to read data after acknowledge output in acknowledge polling during read.  
Users are able to input word address and data after acknowledge output in acknowledge polling during write.  
However, after that users input the write instruction, a start condition may not be input during data output. Input a  
stop condition and the next instruction after data output and acknowledge output.  
Figure 12 Usage Example of Acknowledge Polling  
17  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
8. Read  
8. 1 Current address read  
Either in writing or in reading this IC holds the last accessed memory address. The memory address is maintained  
when the instruction transmission is not interrupted, and the memory address is maintained as long as the power  
voltage does not decrease less than the operating voltage.  
The master device can read the data at the memory address of the current address pointer without assigning the  
word address as a result, when it recognizes the position of the address pointer in this IC. This is called "Current  
Address Read".  
In the following the address counter in this IC is assumed to be "n".  
When this IC receives a 7-bit device address and a 1-bit read / write instruction code set to "1" following a start  
condition, it responds with an acknowledge.  
Next an 8-bit data at the address "n" is sent from this IC synchronous to the SCL clock. The address counter is  
incremented and the content of the address counter becomes n + 1. The master device outputs stop condition not  
an acknowledge, the reading of this IC is ended.  
NO ACK from  
S
T
A
R
T
R
E
A
D
S
T
O
P
Master Device  
DEVICE  
ADDRESS  
DATA  
SDA LINE  
1
0
1
0
A2 A1 A0  
1
D7 D6 D5 D4 D3 D2 D1 D0  
M
S
B
L
S
B
R
/
W
A
C
K
Remark In the S-24C04D/08D/16D, A0 = Don't care.  
In the S-24C08D/16D, A1 = Don't care.  
In the S-24C16D, A2 = Don't care.  
Set A0, A1, A2 to "0" in the product with SOT-23-5 package.  
Figure 13 Current Address Read  
Attention should be paid to the following point on the recognition of the address pointer in this IC.  
In Read, the memory address counter in this IC is automatically incremented after output of the 8th bit of the data.  
In Write, on the other hand, the higher bits of the memory address (the higher bits of the word address and the  
page address*1) are left unchanged and are not incremented.  
1. In the S-24C02D, the higher 5 bits (W7 to W3) of the word address.  
In the S-24C04D, the higher 4 bits (W7 to W4) of the word address and the page address (P0).  
In the S-24C08D, the higher 4 bits (W7 to W4) of the word address and the page address (P1, P0).  
In the S-24C16D, the higher 4bits (W7 to W4) of the word address and the page address (P2, P1, P0).  
18  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
8. 2 Random read  
Random read is used to read the data at an arbitrary memory address.  
A dummy write is performed to load the memory address into the address counter.  
When this IC receives a 7-bit device address and a 1-bit read / write instruction code set to "0" following a start  
condition, it responds with an acknowledge.  
This IC then receives an 8-bit word address and responds with an acknowledge. The memory address is loaded  
to the address counter in this IC by these operations. Reception of write data does not follow in a dummy write  
whereas reception of write data follows in byte write and in page write.  
Since the memory address is loaded into the memory address counter by dummy write, the master device can  
read the data starting from the arbitrary memory address by transmitting a new start condition and performing the  
same operation in the current address read.  
That is, when this IC receives a 7-bit device address and a 1-bit read / write instruction code set to "1", following a  
start condition signal, it responds with an acknowledge. Next, 8-bit data is transmitted from this IC in synchronous  
to the SCL clock. The master device outputs stop condition not an acknowledge, the reading of this IC is ended.  
W
R
I
T
E
S
T
A
R
T
S
T
A
R
T
NO ACK from  
Master Device  
S
T
O
P
R
E
A
D
DEVICE  
ADDRESS  
DEVICE  
ADDRESS  
S-24C02D  
SDA  
LINE  
WORD ADDRESS (n)  
DATA  
1
0
1
0 A2 A1 A0  
0
1
0
1
0
A2 A1 A0  
1
W7 W6 W5 W4 W3 W2 W1 W0  
D7 D6 D5 D4 D3 D2 D1 D0  
S-24C04D  
SDA  
LINE  
1
0
1
0 A2 A1 P0  
0
1
0
1
0
A2 A1  
A2 X  
X
1
W7 W6 W5 W4 W3 W2 W1 W0  
D7 D6 D5 D4 D3 D2 D1 D0  
S-24C08D  
SDA  
LINE  
1
1
0
0
1
1
0 A2 P1 P0  
0 P2 P1 P0  
0
0
1
1
0
0
1
1
0
0
X
X
1
1
W7 W6 W5 W4 W3 W2 W1 W0  
W7 W6 W5 W4 W3 W2 W1 W0  
D7 D6 D5 D4 D3 D2 D1 D0  
D7 D6 D5 D4 D3 D2 D1 D0  
S-24C16D  
SDA  
LINE  
X
X
M
S
B
L R A  
M
S
B
L R A  
A
C
K
S /  
B
C
K
S /  
B
C
K
W
W
DUMMY WRITE  
Remark 1. X = Don't care  
2. Set A0, A1, A2 to "0" in the product with SOT-23-5 package.  
Figure 14 Random Read  
19  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
8. 3 Sequential read  
When this IC receives a 7-bit device address and a 1-bit read / write instruction code set to "1" following a start  
condition both in current address read and random read, it responds with an acknowledge.  
When an 8-bit data is output from this IC synchronous to the SCL clock, the address counter is automatically  
incremented.  
When the master device responds with an acknowledge, the data at the next memory address is transmitted.  
Response with an acknowledge by the master device has the memory address counter in this IC incremented and  
makes it possible to read data in succession. This is called sequential read.  
The master device outputs stop condition not an acknowledge, the reading of this IC is ended.  
Data can be read in succession in the sequential read mode. When the memory address counter reaches the last  
word address, it rolls over to the first word address.  
NO ACK from  
Master Device  
S
T
O
P
R
E
A
D
A
C
K
A
C
K
A
C
K
DEVICE  
ADDRESS  
SDA  
LINE  
D7  
D0  
D7  
D0  
D7  
D0  
1
D7  
D0  
R A  
/ C  
W
DATA (n + 1)  
DATA (n + 2)  
DATA (n + x)  
DATA (n)  
K
Figure 15 Sequential Read  
20  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
Usage  
1. A pull-up resistor to SDA I/O pin and SCL input pin  
In consideration of I2C-bus protocol function, the SDA I/O pin should be connected with a pull-up resistor. This IC  
cannot transmit normally without using a pull-up resistor.  
In case that the SCL input pin of this IC is connected to the Nch open-drain output pin of the master device, connect  
the SCL pin with a pull-up resistor. As well, in case the SCL input pin of this IC is connected to the tri-state output pin  
of the master device, connect the SCL pin with a pull-up resistor in order not to set it in "High-Z". This prevents this IC  
from error caused by an uncertain output (High-Z) from the tri-state pin when resetting the master device during the  
voltage drop.  
2. Equivalent circuits of input pin and I/O pin  
The SCL pin and the SDA pin of this IC does not have a built-in pull-down or pull-up resistor. Each of A0 pin, A1 pin,  
A2 pin and WP pin has a built-in pull-down resistor. The SDA pin is an open-drain output. The followings are  
equivalent circuits of the pins.  
SDA  
SCL  
Figure 16 SCL Pin  
Figure 17 SDA Pin  
WP  
A0, A1, A2  
Figure 18 WP Pin  
Figure 19 A0, A1, A2 Pin  
Remark In the S-24C04D/08D/16D, A0 pin is not available.  
In the S-24C08D/16D, A1 pin is not available.  
In the S-24C16D, A2 pin is not available.  
The A0 pin, the A1 pin and the A2 pin are no connection in the product with SOT-23-5 package.  
21  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
3. Phase adjustment of the I2C-bus product  
The I2C-bus product does not have a pin to reset (the internal circuit). The users cannot forcibly reset it externally. If  
the communication interrupted, the users need to handle it as you do for software.  
In this IC, users are able to reset the internal circuit by inputting a start condition and a stop condition.  
Although the reset signal is input to the master device, this IC’s internal circuit does not go in reset, but it does by  
inputting a stop condition to this IC. This IC keeps the same status thus cannot do the next operation. Especially, this  
case corresponds to that only the master device is reset when the power supply voltage drops.  
If the power supply voltage restored in this status, input the instruction after resetting (adjusting the phase with the  
master device) this IC. How to reset is shown below.  
[How to reset this IC]  
This IC is able to be reset by a start and stop instructions. When this IC is reading data "0" or is outputting the  
acknowledgment signal, outputs "0" to the SDA line. In this status, the master device cannot output an instruction to  
the SDA line. In this case, terminate the acknowledgment output operation or the Read operation, and then input a  
start condition.  
Figure 20 shows this procedure.  
First, input a start condition. Then transmit 9 clocks (dummy clock) of SCL. During this time, the master device sets  
the SDA line to "H". By this operation, this IC interrupts the acknowledgment output operation or data output, so  
input a start condition*1. When a start condition is input, this IC is reset. To make doubly sure, input the stop  
condition to this IC. The normal operation is then possible.  
Start  
Stop  
Start  
Dummy Clock  
Condition  
Condition  
Condition  
1
2
8
9
SCL  
SDA  
Figure 20 Resetting Method  
*1. After 9 clocks (dummy clock), if the SCL clock continues to being output without inputting a start condition, this  
IC may go in the write operation when it receives a stop condition. To prevent this, input a start condition after 9  
clocks (dummy clock).  
Remark Regarding this reset procedure with dummy clock, it is recommended to perform at the system  
initialization after applying the power supply voltage.  
22  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
4. Acknowledge check  
The I2C-bus protocol includes an acknowledge check function as a handshake function to prevent a communication  
error. This function allows detection of a communication failure during data communication between the master  
device and this IC. This function is effective to prevent malfunction, so it is recommended to perform an acknowledge  
check with the master device.  
5. Power-on-clear circuit  
By power-on-clear circuit, this IC initializes at the same time when the power supply voltage is raised. After the  
initialization by the power-on-clear circuit is completed, this IC becomes standby state.  
In order to use this IC safely, raise the power supply voltage depending on the following conditions.  
5. 1 Initialization time  
This IC initializes at the same time when the power supply voltage is raised. Input instructions to this IC after  
initialization. This IC does not accept any instruction during initialization.  
Figure 21 shows the initialization time of this IC.  
100 m  
10 m  
1.0 m  
Initialization time  
(tINIT) max.  
[s]  
100 μ  
10 μ  
1.0 μ  
1.0 μ 10 μ 100 μ 1.0 m 10 m 100 m  
Rise time (tRISE  
[s]  
)
Figure 21 Initialization Time  
23  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
5. 2 Caution when raising the power supply voltage  
The internal circuit of this IC is reset by the power-on-clear circuit. In order for the power-on-clear circuit to  
operate normally, the condition showed in Table 11 must be obeyed for raising the power supply voltage.  
Due to the voltage drop, this IC may not perform normal communication if the power-on-clear operation condition  
is not fulfilled, even when the master device is reset.  
However, the interface of this IC is reset normally and the master device can make normal communication if  
phase adjustment is performed, even when the power-on-clear operation condition of this IC is not fulfilled.  
Table 11  
Item  
Power-off time  
Power-off voltage  
Symbol  
tOFF  
VBOT  
Min.  
100  
Max.  
Unit  
μs  
V
0.6  
VCC min.  
Power supply  
voltage  
VBOT  
0 V*1  
*2  
*2  
tINIT  
tINIT  
tOFF  
*1. 0 V means that there is no potential difference between the VCC pin and the GND pin of this IC.  
*2. tINIT is the time to initialize the internal IC. This IC does not accept any instruction during the initialization time.  
Figure 22 Caution When Raising the Power Supply Voltage  
6. Write protect function during the low power supply voltage  
This IC has a built-in detection circuit which operates with the low power supply voltage, cancels Write when the power  
supply voltage drops and power-on. Its detection and release voltages are 1.3 V typ. (refer to Figure 23).  
This IC cancels Write by detecting a low power supply voltage when it receives a stop condition. In the data trasmission  
and the Write operation, data in the address written during the low power supply voltage is not assurable.  
Power supply voltage  
Detection voltage (VDET  
)
Release voltage (+VDET  
)
1.3 V typ.  
1.3 V typ.  
Write instruction cancel  
Figure 23 Operation during Low Power Supply Voltage  
24  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
7. Data hold time (tHD.DAT = 0 ns)  
If SCL and SDA of this IC are changed at the same time, it is necessary to prevent a start / stop condition from being  
mistakenly recognized due to the effect of noise.  
This IC may error if it does not recognize a start / stop condition correctly during transmission.  
In this IC, it is recommended to set the delay time of 0.3 μs minimum from a falling edge of SCL for the SDA.  
This is to prevent this IC from going in a start / stop condition due to the time lag caused by the load of the bus line.  
tHD.DAT = 0.3 μs min.  
SCL  
SDA  
Figure 24 Data Hold Time  
8. SDA pin and SCL pin noise suppression time  
This IC includes a built-in low-pass filter at the SDA pin and the SCL pin to suppress noise. If the power supply  
voltage is 5.0 V, this suppression time can be suppressed noise with a pulse width of approx. 80 ns.  
For details of the assurable value, refer to noise suppression time (tl) in Table 10 in "AC Electrical  
Characteristics".  
300  
Noise suppression time  
200  
(tI) max.  
[ns]  
100  
2
3
4
5
Power supply voltage (VCC  
[V]  
)
Figure 25 Noise Suppression Time for SDA Pin and SCL Pin  
25  
2-WIRE SERIAL E2PROM  
S-24C02D/04D/08D16D  
Rev.3.0_01_U  
9. Operation when input stop condition during input write data  
This IC does the write operation only when it receives data of 1 byte or more and receives a stop condition  
immediately after acknowledge output.  
Refer to Figure 26 regarding details.  
Write valid  
Write valid  
Write valid  
by stop condition  
by stop condition  
by stop condition  
Write invalid  
Write invalid  
Write invalid  
by stop condition  
by stop condition  
by stop condition  
S
T
A
R
T
W
R
I
T
E
S
T
O
DEVICE  
ADDRESS  
P
DATA (n + 1)  
DATA (n + x)  
DATA (n)  
WORD ADDRESS (n)  
SDA  
LINE  
D7 D6 D5 D4 D3 D2 D1 D0  
1
0
1
0
W7W6W5W4W3W2W1W0  
D7  
D0  
D7  
D0  
A2 A1 A0  
0
M
S
B
R A  
/ C  
W
L
S
B
A
C
K
A
C
K
A
C
K
A
C
K
K
Remark A0 is P0 in the S-24C04D/08D/16D.  
A1 is P1 in the S-24C08D/16D.  
A2 is P2 in the S-24C16D.  
Set A0, A1, A2 to "0" in the product with SOT-23-5 package.  
Figure 26 Write Operation by Inputting Stop Condition during Write  
10. Command cancel by start condition  
By a start condition, users are able to cancel command which is being input. However, adjust the phase while this IC  
is outputting "L" because users are not able to input a start condition. When users cancel the command, there may be  
a case that the address will not be identified. Use random read for the read operation, not current address read.  
Precautions  
Do not operate these ICs in excess of the absolute maximum ratings. Attention should be paid to the power supply  
voltage, especially. The surge voltage which exceeds the absolute maximum ratings can cause latch-up and  
malfunction. Perform operations after confirming the detailed operation condition in the data sheet.  
Operations with moisture on this IC's pins may occur malfunction by short-circuit between pins. Especially, in  
occasions like picking this IC up from low temperature tank during the evaluation. Be sure that not remain frost on this  
IC's pin to prevent malfunction by short-circuit.  
Also attention should be paid in using on environment, which is easy to dew for the same reason.  
Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic  
protection circuit.  
SII Semiconductor Corporation claims no responsibility for any and all disputes arising out of or in connection with any  
infringement of the products including this IC upon patents owned by a third party.  
26  
+0.20  
-0.35  
5.02  
8
5
1
4
0.20±0.05  
+0.11  
-0.07  
0.4  
1.27  
No. FJ008-Z-P-SD-2.0  
SOP8J-Z-PKG Dimensions  
FJ008-Z-P-SD-2.0  
TITLE  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
4.0±0.1(10 pitches:40.0±0.2)  
2.0±0.05  
ø1.55±0.05  
0.3±0.05  
8.0±0.1  
ø1.5 min.  
2.1±0.1  
+0.30  
-0.25  
6.5  
8
5
1
4
Feed direction  
No. FJ008-Z-C-SD-1.0  
TITLE  
SOP8J-Z-Carrier Tape  
FJ008-Z-C-SD-1.0  
No.  
SCALE  
mm  
UNIT  
SII Semiconductor Corporation  
17.5±1.5  
13.4±1.0  
Enlarged drawing in the central part  
ø21±0.8  
2±0.5  
ø13±0.2  
No. FJ008-Z-R-SD-1.0  
SOP8J-Z-Reel  
TITLE  
FJ008-Z-R-SD-1.0  
No.  
SCALE  
UNIT  
QTY.  
4,000  
mm  
SII Semiconductor Corporation  
+0.3  
-0.2  
3.00  
5
8
1
4
0.15±0.07  
0.2±0.1  
0.65  
No. FT008-Z-P-SD-1.0  
TSSOP8-Z-PKG Dimensions  
FT008-Z-P-SD-1.0  
TITLE  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
4.0±0.1  
2.0±0.05  
0.3±0.05  
ø1.55±0.05  
+0.2  
-0.05  
8.0±0.1  
ø1.55  
+0.4  
-0.2  
6.6  
8
5
1
4
Feed direction  
No. FT008-Z-C-SD-1.0  
TITLE  
TSSOP8-Z-Carrier Tape  
FT008-Z-C-SD-1.0  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
13.4±1.0  
17.5±1.0  
Enlarged drawing in the central part  
ø21±0.8  
2±0.5  
ø13±0.2  
No. FT008-Z-R-SD-1.0  
TSSOP8-Z-Reel  
FT008-Z-R-SD-1.0  
TITLE  
No.  
SCALE  
UNIT  
QTY.  
4,000  
mm  
SII Semiconductor Corporation  
2.90±0.2  
8
5
1
4
0.13±0.1  
0.2±0.1  
0.65±0.1  
No. FM008-A-P-SD-1.1  
TMSOP8-A-PKG Dimensions  
FM008-A-P-SD-1.1  
TITLE  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
2.00±0.05  
4.00±0.1  
1.00±0.1  
4.00±0.1  
+0.1  
-0  
1.5  
1.05±0.05  
0.30±0.05  
3.25±0.05  
1
8
4
5
Feed direction  
No. FM008-A-C-SD-2.0  
TMSOP8-A-Carrier Tape  
FM008-A-C-SD-2.0  
TITLE  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
16.5max.  
13.0±0.3  
Enlarged drawing in the central part  
13±0.2  
(60°)  
(60°)  
No. FM008-A-R-SD-1.0  
TMSOP8-A-Reel  
FM008-A-R-SD-1.0  
TITLE  
No.  
SCALE  
UNIT  
QTY.  
4,000  
mm  
SII Semiconductor Corporation  
2.9±0.2  
1.9±0.2  
4
5
+0.1  
-0.06  
1
2
3
0.16  
0.95±0.1  
0.4±0.1  
No. MP005-A-P-SD-1.2  
TITLE  
SOT235-A-PKG Dimensions  
MP005-A-P-SD-1.2  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
4.0±0.1(10 pitches:40.0±0.2)  
+0.1  
-0  
2.0±0.05  
0.25±0.1  
ø1.5  
+0.25  
-0  
4.0±0.1  
ø1.0  
1.4±0.2  
3.2±0.2  
3
4
2 1  
5
Feed direction  
No. MP005-B-C-SD-1.0  
TITLE  
SOT235-B-Carrier Tape  
MP005-B-C-SD-1.0  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
12.5max.  
9.2±0.5  
Enlarged drawing in the central part  
ø13±0.2  
No. MP005-B-R-SD-1.0  
TITLE  
SOT235-B-Reel  
MP005-B-R-SD-1.0  
No.  
SCALE  
UNIT  
QTY.  
3,000  
mm  
SII Semiconductor Corporation  
2.0±0.1  
+0.05  
-0.02  
0.08  
0.23±0.1  
(1.70)  
No. PP008-A-P-S1-1.1  
0.5  
TITLE  
DFN-8/HSNT-8-A-PKG Dimensions  
PP008-A-P-S1-1.1  
The heat sink of back side has different electric  
potential depending on the product.  
No.  
SCALE  
UNIT  
Confirm specifications of each product.  
Do not use it as the function of electrode.  
mm  
SII Semiconductor Corporation  
+0.1  
-0  
2.0±0.05  
4.0±0.1  
0.25±0.05  
ø1.5  
+0.1  
-0  
0.60±0.05  
ø1.0  
4.0±0.1  
2.3±0.05  
4 3 2 1  
5 6 78  
Feed direction  
No. PP008-A-C-SD-1.0  
DFN-8/HSNT-8-A-Carrier Tape  
PP008-A-C-SD-1.0  
TITLE  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
+1.0  
- 0.0  
9.0  
11.4±1.0  
Enlarged drawing in the central part  
ø13±0.2  
(60°)  
(60°)  
No. PP008-A-R-SD-1.0  
DFN-8/HSNT-8-A-Reel  
PP008-A-R-SD-1.0  
TITLE  
No.  
SCALE  
UNIT  
5,000  
QTY.  
mm  
SII Semiconductor Corporation  
1.6  
0.50  
0.30  
No. PP008-A-L-SD-1.0  
DFN-8/HSNT-8-A  
-Land Recommendation  
TITLE  
No.  
PP008-A-L-SD-1.0  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
1.97±0.03  
6
5
8
7
+0.05  
-0.02  
0.08  
1
2
3
4
0.5  
0.48±0.02  
0.2±0.05  
No. PH008-A-P-SD-2.0  
SNT-8A-A-PKG Dimensions  
PH008-A-P-SD-2.0  
TITLE  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
+0.1  
-0  
4.0±0.1  
2.0±0.05  
0.25±0.05  
ø1.5  
0.65±0.05  
ø0.5±0.1  
4.0±0.1  
2.25±0.05  
5°  
4 3 2 1  
5 6 7 8  
Feed direction  
No. PH008-A-C-SD-1.0  
SNT-8A-A-Carrier Tape  
PH008-A-C-SD-1.0  
TITLE  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
12.5max.  
9.0±0.3  
Enlarged drawing in the central part  
ø13±0.2  
(60°)  
(60°)  
No. PH008-A-R-SD-1.0  
SNT-8A-A-Reel  
TITLE  
PH008-A-R-SD-1.0  
No.  
SCALE  
UNIT  
5,000  
QTY.  
mm  
SII Semiconductor Corporation  
0.52  
2
2.01  
0.52  
1
0.2  
0.3  
1.  
2.  
(0.25 mm min. / 0.30 mm typ.)  
(1.96 mm ~ 2.06 mm)  
1.  
2.  
0.03 mm  
3.  
4.  
SNT  
1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.).  
2. Do not widen the land pattern to the center of the package (1.96 mm to 2.06mm).  
Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package.  
2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm  
or less from the land pattern surface.  
3. Match the mask aperture size and aperture position with the land pattern.  
4. Refer to "SNT Package User's Guide" for details.  
(0.25 mm min. / 0.30 mm typ.)  
(1.96 mm ~ 2.06 mm)  
1.  
2.  
SNT-8A-A  
-Land Recommendation  
TITLE  
No. PH008-A-L-SD-4.1  
PH008-A-L-SD-4.1  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
Disclaimers (Handling Precautions)  
1. All the information described herein (product data, specifications, figures, tables, programs, algorithms and  
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without  
notice.  
2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of  
any specific mass-production design.  
SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or  
infringement of third-party intellectual property rights and any other rights due to the use of the information described  
herein.  
3. SII Semiconductor Corporation is not responsible for damages caused by the incorrect information described herein.  
4. Take care to use the products described herein within their specified ranges. Pay special attention to the absolute  
maximum ratings, operation voltage range and electrical characteristics, etc.  
SII Semiconductor Corporation is not responsible for damages caused by failures and/or accidents, etc. that occur  
due to the use of products outside their specified ranges.  
5. When using the products described herein, confirm their applications, and the laws and regulations of the region or  
country where they are used and verify suitability, safety and other factors for the intended use.  
6. When exporting the products described herein, comply with the Foreign Exchange and Foreign Trade Act and all  
other export-related laws, and follow the required procedures.  
7. The products described herein must not be used or provided (exported) for the purposes of the development of  
weapons of mass destruction or military use. SII Semiconductor Corporation is not responsible for any provision  
(export) to those whose purpose is to develop, manufacture, use or store nuclear, biological or chemical weapons,  
missiles, or other military use.  
8. The products described herein are not designed to be used as part of any device or equipment that may affect the  
human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems,  
combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment,  
aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle  
use or other uses. Do not use those products without the prior written permission of SII Semiconductor Corporation.  
Especially, the products described herein cannot be used for life support devices, devices implanted in the human  
body and devices that directly affect human life, etc.  
Prior consultation with our sales office is required when considering the above uses.  
SII Semiconductor Corporation is not responsible for damages caused by unauthorized or unspecified use of our  
products.  
9. Semiconductor products may fail or malfunction with some probability.  
The user of these products should therefore take responsibility to give thorough consideration to safety design  
including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing  
injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction.  
The entire system must be sufficiently evaluated and applied on customer's own responsibility.  
10. The products described herein are not designed to be radiation-proof. The necessary radiation measures should be  
taken in the product design by the customer depending on the intended use.  
11. The products described herein do not affect human health under normal use. However, they contain chemical  
substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips  
may be sharp. Take care when handling these with the bare hands to prevent injuries, etc.  
12. When disposing of the products described herein, comply with the laws and ordinances of the country or region where  
they are used.  
13. The information described herein contains copyright information and know-how of SII Semiconductor Corporation.  
The information described herein does not convey any license under any intellectual property rights or any other  
rights belonging to SII Semiconductor Corporation or a third party. Reproduction or copying of the information  
described herein for the purpose of disclosing it to a third-party without the express permission of SII Semiconductor  
Corporation is strictly prohibited.  
14. For more details on the information described herein, contact our sales office.  
1.0-2016.01  
www.sii-ic.com  

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